Wednesday, November 13, 2019
	CHAIRMAN: Anton Keppel, SCREEN Semiconductor Solutions Co., Ltd.
10:00	Introduction and Welcome
	Dr. Martin Hollfelder
	Session 1. More than Moore, Power, Beyond CMOS
10:10	1.2 AXCELIS – Dr. Dwight Roh
	Advanced Implant technology for More than Moore, Power and beyond CMOS
10:30	1.1 SCREEN LASSE - Dr. Fulvio Mazzamuto
	Ultrafast Laser Annealing for Power devices
10:50	1.3 SOITEC – Dr. Nicolas Daval
	SMART Cut™ applied for compound semiconductor
	Session 2. SCREEN R&D and JDP Collaboration
11:10	2.1 IMEC - Dr. Frank Holsteyns
	Wet Process Challenges for Advanced Logic Device Fabrication
11:30	2.2 CEA-Leti – Dr. Sebastien Kerdiles
	Nanosecond Laser Annealing for 3D integration
	Session 3. Equipment Presentation
11:50	3.1 SCREEN – Mark Goeke
	Polyimide Coat/Develop track DT-3000 for power application
12:03	3.2 SCREEN – Alessandro Rossi
	ZI-2000 for SiC and LT/LN wafer inspection
12:16	3.3 SCREEN – Dr. Martin Hollfelder
	New Si thinning Single Wafer Cleaner for power, CIS and 3D application