Jim Jackman

Semi

Biography
As Vice President of Finance and Administration, Jim Jackman is responsible for SEMI’s accounting, HR, and IT functions worldwide. He has more than 20 years of progressively responsible experience in public accounting, financial reporting, accounting systems implementation, human resources, and financial planning and analysis. Prior to joining SEMI, he acquired vast experience at leading regional and global firms, including Gallina LLP, Octel Communications, Lucent Technologies, ATMI, and RoseRyan.Jackman holds a BBA from California State University, Hayward, and has been a CPA in California since 1996.

Simplifying your tool automation

Doug Suerich
Product Evangelist
PEER Group

Abstract
Fabs are under continuous pressure to increase throughput, maximize yield, and reduce costs. These demands produce demanding equipment purchase specifications and place strict requirements on OEMs to provide more advanced automation and data management capabilities. Additionally, these requirements create an increasing burden on OEMs to provide best-in-class automation software to complement their process expertise. The best OEMs are making strategic decisions to ensure they can meet these factory needs efficiently today and in the future.Join us as we discuss how you can streamline the delivery of your tool automation, allowing your engineers to focus on your core capabilities, while ensuring rapid deployment of SEMI standards-compliant equipment automation software, enabling fast fab acceptance of your tools.

Biography
Doug Suerich is Product Evangelist at The PEER Group Inc., the semiconductor industry’s leading supplier of factory automation software for smart manufacturing and Industry 4.0. Doug focuses on big data and remote connectivity solutions that help manufacturers collaborate securely on tools and data in production environments. A passionate advocate for smart manufacturing, Doug serves as an active member of the SEMI® Smart Manufacturing Advisory Council and SEMI SMART Manufacturing Technology Community, Americas Chapter.Doug has over 20 years of experience leading software teams for a variety of industries including semiconductor, manufacturing, and transportation. Most recently, he was involved in architecting PEER Group’s remote connectivity solution, Remicus™, and he was a champion in promoting the use of cloud computing and latest-generation web technologies.Prior to joining PEER Group, Doug was a software development manager, automation engineer, information systems specialist, and consultant. He has extensive experience designing and integrating robust automation software solutions. Doug holds a Bachelor of Applied Science with Honours in System Design Engineering from the University of Waterloo.

Towards Research 4.0 - Automating R&D with Flextura PVD and Integrated Advanced Analytics

Christian Kjelde
International Sales
Polyteknik AS

Abstract
Polyteknik AS designs and manufactures sputtering and evaporation systems for industry and R&D. Here presenting a recent delivery of a state-of-art Flextura PVD cluster tool with in-system analysis for ambitious research within semiconducting oxides.We aim at increasing R&D throughput, reliability, quality and record massive amounts of data for further interpretation. This is done by automating and coupling smart material-/process development with in-system characterisation. With other words we are looking into RESEARCH 4.0!

Biography
Christian holds a M.Sc Eng. in Nanomaterials from Aalborg University and is responsible for sales of PVD systems at Polyteknk AS.This includes a strong impact to the development of processes and solutions for customers working in a diversified area of business fields covering semicon, mems, optoelectronics, sensors, RF, EMI etc. Furtmore the customer pallette of Polyteknik AS is ranging from volume production to almost fundamental research. A strong team of colleages has succeded in transfering customer input to a robust platform which is able to bridge R&D and production in a seldom seen manner.

Measurement of oversize particles in the CMP process.

Antonis Pantazis
EMEA Sales Consultant
Entegris

Abstract
Chemical Mechanical Polishing/Planarization (CMP) is a process widely used in the microelectronic industries to smooth surfaces with the combination of chemical and mechanical forces. The particle size distribution of the slurry is a critical parameter controlling the success of the planarization process. A few large particles can scratch the surface of wafers or disc drives, reducing yields and profits.Single particle optical sizing (SPOS) technology measures the particles one at a time as they pass through a narrow measurement chamber, providing both an accurate size and concentration (particles/mL) result. Since the particles are measured individually, this technique is inherently very high resolution, and can detect even very few individual particles removed from the main distribution. It is therefore the ideal technique for detecting the Large Particle Counts (LPCs) that cause the most trouble with CMP slurries.

Biography
Antonis Pantazis is currently working as Sales Consultant managing the sales in EMEA region for Entegris Particle Sizing Equipment.Antonis obtained a BENG in Computer Systems Engineering from the University of Sussex in 2003 and a Masters Degree (MSc) in Telecommunications from University College London in 2005. He has worked for more than 10 years as a Systems Engineer, product specialist and Sales Manager positions in a variety of companies in the fields of Telecommunications, IT and Test and Measurement.Currently Antonis is working as a Sales Consultant for Entegris Inc. managing the Particle Sizing Equipment Sales and Support in Europe, Middle East and Africa regions.

Sub-Angström controlled Sputtering Process for Magnetic Sensor

Berthold Ocker
Head of Business Unit Semiconductor NDT
Singulus Technologies AG

Abstract
Over a long period the Hall sensor dominated the magnetic field measurement. In the last years more advanced magnetic sensors are under development for consumer, industrial and automobile applications. The magnetic sensors, which are using the Tunnel Magnetic Junctions, are showing the highest resitance change with a TMR of ~ 250%. For this technology it is essential to controll the film layer thickness in a sub Anström level. Singulus developed a production technology which shows a high repeatability and an excellent uniformity for a substrate size of 200 or 300 mm.

Biography
Berthold Ocker studied physics at the Johann-Wolgang-Goethe University in Frankfurt and has more than 25 year experience in the vaccum deposition technology. He started his carreer 1991 at Leybold and leaded since 2001 the R&D activitivies for spintronic apllications. Since 2015 he took over the responsiblity of the Business Unit Semiconductor NDT. He is author and co-author of more than 50 scientific articles.

Carrier Wafers for thin wafer handling using temporary bonding technologies

Carsten Wesselkamp
Sales Manager
Plan Optik AG

Abstract
Microelectromechanical systems (MEMS) and Sensors provide the magic that makes today’s devices from our everyday life smart. MEMS consist of tiny mechanical and electrical devices such as membranes, mirrors and valves, as well as sensors, actuators and integrated circuits. Without MEMS or sensors, we would not have smartphones, smart homes and wearable smart watches, as well as a huge range of industrial and medical devices that require the functionality provided by MEMS and sensors.Smaller package sizes require extremely thin substrates to build up devices. For this thin and ultra-thin substrates need to be processed, that put new challenges on handling them throughout the process. For this carrier wafers are used, that support the thin device wafer during processing.Temporary bonding and de-bonding is used to fix the device wafer onto the carrier prior to processing and releasing it afterwards. There are different bonding and de-bonding technologies available, that require different material properties as well as patterns and features.Glass and quartz are excellent materials for carrier wafers because of their thermal stability and resistance against acids and other chemicals. Bonding to and de-bonding from glass and quartz carrier wafers can be monitored since they are transparent. Furthermore, glass carrier wafers can be cleaned and re-used, thus contributing to cost reduction and environmental protection.This presentation shows possibilities for using Carriers from Glass and Quartz with different bonding and de-bonding technologies as laser, chemical or thermal release.

Biography
Mr. Carsten Wesselkamp got a degree in Industrial Engineering with a study emphasis on operating technology and production engineering in 1995. He additionally achieved a certifcate in work system and process organization by REFA (organization for work study and company organization).After working as assistant production manager for a multinational steel and aluminum producer he joined Plan Optik AG, one of the leading manufacturers of wafers for MEMS and carriers for semiconductor applications in 1996 as one of their sales engineers.Since many years, Mr. Wesselkamp acts as the international sales manager of Plan Optik AG and (together with his team) manages the accounts of Plan Optik AG including all technical and commercial tasks.

Two-photon absorption in semiconductors design and manufacturing

Paulius Naujalis
Sales Manager
Fyla laser

Abstract
Two-Photon absorption technique for semiconductors and circuits inspection allows precise voxel analysis in semiconductors, wafers or circuits. High flexibility new fiber laser design allows to reduce costs from existing techniques and increases flexibility in measurement capabilities.

Biography
Experienced Sales Manager/Applications Specialist with a demonstrated history of working in the photonics industry. Skilled in Relationship management, commercial department management, design and development of photonics solutions and Research and Development (R&D). Strong engineering and commercial professional with a Master in Physics, Diploma in Engineering and Certificates in Business Management.

Line Confocal Sensors for Industrial Inspection

Murat Deveci
Sales Manager
FocalSpec Ltd

Abstract
Line Confocal Imaging (LCI) is an optical technology for high speed 2D and 3D topography and tomography measurements.Line Confocal Imaging sensors measure millions of accurate data points per second, also from moving surfaces. The LCI sensors provide sub-micron resolution and can be used for all kind of surface types, including glossy, curved and transparent materials that have been challenging for industry standard laser sensors. Simultaneously with the 3D data, the LCI sensors produce also high dynamic range pixel synchronised intensity images of the surface which can be used to 2D defect detection and pattern recognition.The applications of LCI sensors include roughness measurement of transparent surfaces, defect detection in multilayer transparent materials, high speed dimensional control of 3D curved glasses, various surface and sub-surface analysis of flexible, hybrid, and organic electronics, BGAs, MEMS.The LCI sensors can be integrated to factory automation using Ethernet interface.In this talk, the LCI will be explained in detail and several industrial applications will be given as examples.Keywords: optical 3D sensors; surface metrology; film tomography, high-speed in-line inspection; submicron

Biography
Murat Deveci is responsible for market development and sales operations in Europe, the Middle East, and Africa as a sales manager. He has been working in sales and marketing of advanced metrology systems since 2012 within different companies. He holds a Master of Science degree in Materials Engineering from the Tampere University of Finland.

UV Cure – an Enabling Process Technology for Efficient Thick Photoresist Drying

Christian Schaefer

Trymax-semiconductor

Abstract
Completely dried photoresists (“PR”) masks are a necessary precondition to avoid undesired effects in subsequent manufacturing steps like high dose implant, metal/oxide etch and ash. But in particular for medium or thick PR commonly used in Power Device, MEMS or Advanced Packaging (TSV) this becomes increasingly difficult using just the standard thermal hard bake.A solution for achieving crosslinked PR films is the so-called UV Cure - a state-of-the-art technology combining UV exposure with precise low-high-low temperature cycling. This leads to 100% deep dried PR films due to crosslinking of the resin and the photo active compounds by UV radiation and thereby efficient solvent evaporation. The presentation will explain above physical-chemical phenomena, show the effects in key applications and will further explain the Trymax NEO 2000UV system requirements and features

Biography
Christian Schaefer is since January 2016 Sales Director North Europe for Trymax Semiconductor Equipment, the Netherlands. He has a MS in Process Engineering and a PhD in Material Science - both of the Technical University of Aachen, Germany. Before he joined Trymax he held positions in the semi equipment industry as BU Manager at PVA TePla AG in Munich (10y), as VP Sales & Board Member at EV Group in Austria (7y) and as Product Group and General Manager at Leybold Systems in Hanau, Germany (14y).

3D Automatic X-Ray Inspection System

Yoo Yeob Jung
CEO
Nanotech Digital GmbH (SEC Europe Head Office)

Abstract
TOPIC: 3D X-ray Inspection for defects in Multi Layers for the Mass production application of IC, PCB, PCBA, BGA, etc.Motivation:What is 3D AXI? It uses X-rays as its source to automatically inspect features, which are typically hidden from optical view. 3D AXI is automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defect of double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue. Inspection speed of 4.5 sec/FOV from loading to automatic Good/NG judgement.Description:• X-Ray Tube; 160kV/500uA• Min. Resolution; 0.8~15 um• Table Size; Max.330x250mm, Min 50x50mm• Detector; 12inch FPXD• Inspection Object; BGA, Though Hole, Chip, QFN, QFP, PoP, connector, Components• Equipment Dimension; 1,360(W) x 1,880(D) x 1,700(H)/ 4,200KgInnovation:• World Fastest speed 3D In-Line Inspection• Hybrid Open Tube; - realize Best resolution of 0.8um Focal spot - realize Pulse beam and it remove CT afterimage - reduce radiation damage - realize long life span for in-line purpose• Best Solution for both-side layered PCB(HIP:Head in Pilaw)Results:Cover AVI Inspection limit -> Multi-Layer InspectionShorten 3D Inspection Time; 4.0 sec/FOV -> High Speed Inspection for Mass production Reduction of radiation damage; Max. 1/100 -> Damage Free Tube life span; 10,000hrs/Filament -> Long Life Maintenance

Biography
The founder/CEO of the company has a Master’s Degree in semiconductor and displayengineering as well as an AICPA MBA degree.He has worked as an semiconductor & display mass production equipment engineer. He hasextensive knowledge in the thin film process, and equipment process.With his expertise in various display and semiconductor equipment process, he established“Nanotech Digital GmbH,” to develop various Roll to roll CVD graphene and applied graphenetechnology products, semiconductor equipment & components. Also he has worked as an general manager of 'SEC Co.,Ltd''SEC Co.,Ltd' is the best inspection system company developing industrial X-ray inspection , SEM(Scanning Electron Microscope) and linear accelerator technology. SEC is specialized in 2D & 3D automatic X-ray inspection for semiconductor packaging, PCB, electronic components.