Wednesday, November 13, 2019

Welcome & Introduction

09:30 Welcome
  Laith Altimime, President, SEMI Europe
09:35 Global GAAC overview
  Bettina Weiss, Chief of Staff, SEMI
09:55 Market Trend and future outlook
  TBA, Yole Développement

Session 1: Automotive Roadmap to 2030

10:15 Introduction
10:20 TBD
10:40 Electrification: HW, SW and boundaries requirements
  Berthold Hellenthal, Competence center Electronics and Semiconductors Semiconductor Strategy Progressive SemiConductor Program (PSCP), AUDI AG
11:00 Design solution for future Automotive applications
  Christian Malter, Director Automotive Business Management Worldwide, Cadence Design Systems
11:20 Coffee Break

Session 2: Comprehensive overview on disruptive technology requirements for smart driving

11:50 Introduction
  Andreas Aal, Semiconductor Strategy & Reliability, Volkswagen AG
11:55 Automotive Market Overview from Memory Perspective
  Federico Tiziani, Sr. Manager Automotive Marketing, Micron
12:15 Trends in Automotive: Fab Inspection and Metrology Changing Role in “Zero Defect”
  Oreste Donzella, Sr. Vice President, KLA-Tencor
A new collaborative approach to defectivity challenges in the automotive industry
  Antoine Amade, Senior Regional Director EMEA, Entegris SAS
A new collaborative approach to defectivity challenges in the automotive industry
Antoine Amade

Antoine Amade
Senior Regional Director EMEA
Entegris SAS

Antoine Amade

By 2030, 50% of the automotive costs are expected to be electronics related with the advent of driver assistance and automation technologies. Reaching new levels of automotive innovation poses a new challenge to the industry -reaching the ppb level in failure rate at the component level.The solution is in collaboration.The purity and performance of materials will play a key role in reducing latent defects. Non-visible “black box” contamination, which can be missed by the installed metrology tools, have the potential to negatively impact the reliability of the semiconductor chips later in the life of the automobile. If the industry wants to reach the goal of “zero defects,” a new collaborative approach is necessary.The semiconductor industry is here in the 3rd generation of the contamination control strategy where baseline and excursion control could be improved with an adequate particle and metal ion management strategy focused on materials. Besides the obvious options of filtration and purification, there is a vast list of potential solutions with the challenge to identify the ones that are the most impactful to yield and defectivity. Based on benchmark, case studies, technical meetings and process reviews, this approach is practical and cost effective to implement. A collaborative engagement model exists where device makers and material purity experts work together in task force mode to build the capabilities required to enable the reliable electrification, connectivity and automation of transportation ecosystem. This is the “New Collaborative Approach”.

Mr. Amade joined Entegris in 1995 as an Application Engineer in its Semiconductor business. In his current role as EMEA Sr. Regional Director, Mr. Amade’s primary responsibilities include growing the semiconductor business in Europe and Middle East through market strategies, and in the management of a sales, customer service and marketing team. Mr. Amade held leadership positions at Entegris which included: gas microcontamination market management, strategical account management and regional sales management. Mr. Amade has a degree in Chemical Engineering from ENS Chimie Lille and he is a member of Semi Electronic Materials Group and of the Global Automotive Advisory Council for Europe.

12:55 AI in smart Manufacturing for Automotive
  John Behnke, General Manager FPS Product Line, INFICON
13:15 Lunch Break

Enabling Autonomous Driving Panel Discussion

14:15 Panel Discussion
  Moderator: Alan Banks Chairman, AESIN
15:30 End