Monday, October 5, 2015

Networking Dinner

19:30 only for attendees of the Fab Managers Forum
Tuesday, October 6, 2015

08:00 Welcome Coffee
08:30 Opening Remarks
  Laith Altimime, President, SEMI Europe
Laith Altimime

Laith Altimime
SEMI Europe

Laith Altimime joins SEMI as president of SEMI Europe, as of October 1, 2015.

Laith Altimime has more than 25 years of international experience in the semiconductor industry. Most recently, he held senior director position in business development at imec. Prior to this, Laith Altimime held leadership positions at Infineon/Altis, Qimonda, KLA-Tencor, Communicant Semiconductor AG, and NEC Semiconductors.
Laith Altimime holds an Honors Bachelor's Degree in Applied Physics and Semiconductors Electronics from Heriot-Watt University in Scotland.



Semiconductors as a key enabler for the transition of the automotive industry
  Reinhart Ploss, CEO, Infineon
Semiconductors as a key enabler for the transition of the automotive industry
Reinhart Ploss

Reinhart Ploss

The automotive industry has great opportunities which require tackling significant challenges. Our society is constantly growing and so too is industrialization, leading to an increased demand for mobility. At the same time, we need to find ways to provide this mobility in a clean and energy-efficient way. New technologies like the electrification of the drive train and (semi-)autonomous driving are key enablers to solve these challenges.

Electronics has been the driver for innovation in cars in the last years. On the way to the highly efficient and autonomous car it will play an even more important role. Systems and components have to be extremely reliable at affordable cost. This will drive new ways of development, but will also have an impact on manufacturing.

Connectivity will enable further options. Overall traffic management can help increase fuel efficiency with a smoother traffic flow. There are high expectations on emerging services and business models. However, IT security will become a major challenge.

Automotive is one of Europe's key industrial strengths. To maintain this position a significant increase in competency is needed - both in the traditional areas and also in completely new fields.

Reinhard Ploss joined Siemens/Infineon in 1986, working in Munich as a process
engineer with focus on chip manufacturing.
In 1992 he moved on to Villach, Austria, where he started in chip manufacturing and
took over the position as Head of Technology in 1993. He returned to Munich in 1996
and took charge of the Power Semiconductor Business Unit, focusing on development
and manufacturing. In 1999, Reinhard Ploss was appointed Head of the Industrial Power
Business Unit as well as President of eupec GmbH Co. KG, a subsidiary of Infineon.
In 2000, Reinhard Ploss took over as President of the Automotive & Industrial Business
Group of Infineon. From 2005 on, he held responsibility for manufacturing, development
and operational management in the Automotive, Industrial & Multimarket Business
In June 2007, Reinhard Ploss was appointed to the Management Board of Infineon, with
responsibilities for manufacturing activities. In addition, he became Labor Director and
Head of Research & Development. He remains responsible for these three areas to the
present day.
Since October 1, 2012, Dr. Reinhard Ploss is Chief Executive Officer of Infineon
Technologies AG.

Session 1

How to increase OEE without spending a lot of money

Chair Riccardo Martorelli, COO, LFoundry
Riccardo Martorelli

Riccardo Martorelli

Riccardo completed his degree in Chemical Engineering at the "La Sapienza" University of Rome and started his career in semiconductor industry on 1995 as Process and Equipment Engineer at Texas Instrument in the Avezzano Plant.

He gained several technical and managerial positions, first in Texas Instruments and later in Micron Technology, main focus being on planning, organizing and directing the manufacturing and maintenance operations. He effectively assures attainment of business objectives and productions schedules, improving the production methods, quality and safety attitude, controlling and reducing cost in a high tech environment, requiring frequent and high cost technology's evolution. In 2008 he took over the responsibility of Fab Manager in the Italian Fab and since 2011 he took the role of Site Manager.

Since May 2013 he is appointed as Chief Operating Officer of LFoundry.

MOOI, a method to maximize the output of installed Fab capacity without additional investment
  Ulrich Schulz, Manufacturing Development Manager, Texas Instruments Germany
MOOI, a method to maximize the output of installed Fab capacity without additional investment
Ulrich Schulz

Ulrich Schulz
Manufacturing Development Manager
Texas Instruments Germany

High costs of production are a key differentiator and a continuous challenge between Semiconductor factories in Europe compared to the rest of the world. A substantial method to reduce the cost per wafer is to increase the capacity without or with minor investment.
Capacity installation and expansion plans over the years never assumed the technology & product mix of today. Minor changes in certain tool categories can result in significant increases of the overall Fab capacity.
In a first step a project leader was assigned to systematically compare and analyzes the actual demand with the Fab capacity. After identifying the top operational gaps, a task force is initiated with all stakeholders to find actions to increase that specific capacity applying a standardized toolkit which was developed for this purpose. The project ends with the implementation and verifications of the defined actions. In addition to expansion projects, MOOI ('M'ore 'o'ut 'o'f 'I'nstalled tools) can also be used to reduce the number of (legacy) tools in the Fab or gain additional clean room area.

Eva Schaefer

Diploma in Mechanical Engineering from the University of Erlangen Germany

- Capacity Management, Texas Instruments Freising
- 2002 - 2009 Manufacturing Operation Section Manager responsible for photolithography, epitaxy and ion implant
- Started at Texas Instruments in 2000 as Line Supervisor in epitaxy and ion implant in Freising FAB.

Diploma / PHD in Physics, University of Göttingen, Germany.

- Manufacturing Development Manager, Texas Instruments Freising
- worked 27 years in Semiconductor Operations, Engineering and Process Integration as
Photo Section Manager, Process Yield manager, Branch Manager for Engineering & electrical Yield

Managing Variability in Complex Production Systems
  Reiner Moll, Director for Manufacturing Excellence and Production Planning, Robert Bosch GmbH
Managing Variability in Complex Production Systems
Reiner Moll

Reiner Moll
Director for Manufacturing Excellence and Production Planning
Robert Bosch GmbH

In complex production systems, as the semiconductor industry, variability is one of the main contributors to high cycle times, high inventory and limited throughput.
To extend existing market share and gain organizational growth, short cycle times, low inventory and high service levels are vital. The most effective way to reach these goals, without investing in capacity, is to consistently reduce variability in all processes and therefore to optimize the fab-wide operating curve.

Robert Bosch Reutlingen introduced a new approach of variability measurement and variability reduction in its Wafer- and Sensorfab, which will be presented in this keynote. This systematic and proactive approach enables the organization to reveal equipments, which are responsible for high variability, that have not been on focus yet. By applying the systematic approach on regular basis in operations, sustainable throughput improvements and cycle time reductions can be achieved.

Co-author: Tobias Weissgaerber, Senior Manager for Industrial Engineering, Dispatching and Line Control, Bosch

Reiner Moll
Academic education in Electronics at the technical university of Munich
Since 1988 working for Robert Bosch GmbH in several Business Units and Countries
Professional Experience in
-Production Planning & Logistics
-Design & application of Production Systems
-Industrial Engineering

Tobias Weissgaerber
is the Senior Manager for Industrial Engineering, Line Control and Real Time Dispatching of the Robert Bosch Wafer- and Sensorfab in Reutlingen. Prior to joining Robert Bosch GmbH, Tobias Weissgaerber has been the Group Leader for Production and Lean Management at a SME.
He holds a Master of Business Administration from the ESB Business School at Reutlingen University and a Diploma Degree of industrial engineering from the Cooperative State University in Stuttgart.

Deployment of Human Performance in High Volume Semiconductor Manufacturing : The next step in Improving Manufacturing Excellence
  Daniel Decroix, Engineering Manager for New Technologies, STMicroelectronics
Deployment of Human Performance in High Volume Semiconductor Manufacturing : The next step in Improving Manufacturing Excellence
Daniel Decroix

Daniel Decroix
Engineering Manager for New Technologies

STMicroelectronics' 200mm manufacturing facility in Rousset France is a leading supplier of semiconductor electronic components for the automotive industry. With automotive manufacturers looking to reduce their sourcing footprint, the increasing pervasion of electronic components inside each vehicle, and the strict quality requirements of the industry, it is imperative to be absolutely perfect in manufacturing quality to remain a viable competitor.

In Rousset operations, human errors causing scrap were a detractor to manufacturing quality, and, reducing human errors was difficult. We had already implementing many technical programs and we still had major quality excursions due to human error, many minor quality excursions, and near misses. We tried many different improvement techniques, methods, and organizational changes: we were able to temporarily make improvements, but we were unable to sustain the results over the long term.

In 2010 we benchmarked with AREVA, a French leader in the nuclear power industry. During this benchmark, we discovered techniques and methods to reduce human errors during operations. We developed specific training for all our technical and management teams and we created management and technical opportunities to implement and deploy these best practices. We started with maintenance but later deployed to other organizations like Process Engineering, and Information Technology. We called this program the Human Performance Program and we introduced this program into our global initiatives called "Excellence in Manufacturing".

Subsequent to the deployment of this program, we have seen a dramatic reduction in Scraps and the number of major quality excursions caused by human error. We have also seen a subsequent reduction in minor quality excursions and near misses. We have concluded we have established a sound foundation and management culture to continuously improve and proactively manage human related errors.

Daniel Decroix received his PhD In Sciences des Matériaux from Paris VII university.

In 1986, he joined GaAs Department of Thomson-CSF Orsay France as Molecular Beam epitaxy Process Engineer.
Then, in 1989, he took over the position of Optical & Electronic Lithography Process Manager.

In 1996, he moved to Ulm Germany as Lithography Section Head, for the start up of UMS, a Thales & EADS joint venture.

He joined ST Microelectronics Rousset France in 1997, working, first, as Lithography Engineering Manager, then as Etch Engineering Manager.
Since 2010, he is working as Engineering Manager for New Technologies Industrialization

Fab performance increase by using solver solutions
  Sebastian Werner, Senior Manager Industrial Engineering, Infineon Dresden Technologies GmbH
Fab performance increase by using solver solutions
Sebastian Werner

Sebastian Werner
Senior Manager Industrial Engineering
Infineon Dresden Technologies GmbH

Who does not know the complexity of WIP flow management in a semiconductor fab? There are many problems to be solved: Primary resource allocation is subject to different tool speeds, dedication, secondary resource availability, setup and batching constraints, inappropriate recipe sequences, process capability, time limits, due dates, lot transport, priority classes and others.
Where state-of-the-art dispatching is getting to its limits, math can help. Solvers are becoming more powerful and nowadays able to solve complex problems as described before. The advantage is obvious. Instead of making dispatching rules, fitting to a certain operating point, mathematical approaches can calculate an optimal schedule regarding a target function under different conditions.
Infineon applies solver solutions to different machine groups, where optimized schedules have a valuable impact on performance. Of course, this is where complexity is high in areas like litho, batch tool groups, test, and implant. By classifying the above mentioned constraints, one can state: The constraint classes are recurring in each single problem, but in different combinations. This helps us to create a flexible framework holding a model kit applicable to all kind of problems. Each application uses the same model and the constraint classes are enabled in combinations as needed.
The results are convincing, efficiency increase by two-digit percentage points is visible. The presentation will give an overview of solutions to point out different aspects like performance gains and levers, generic model setup, data quality, shop floor execution, automation, and system reliability.

Sebastian Werner is Site Head of Industrial Engineering at Infineon's Dresden fab, where he is mainly responsible for equipment asset productivity. He is holding a degree in electrical engineering from several universities in Germany and abroad. After product design in medical engineering he changed to manufacturing simulation and optimization with a wide experience in research and industry in numerous manufacturing branches before he moved to Infineon.
Contact him via

10:30 Coffee Break
Session 2

EHS challenges, opportunities and implantation strategies

Chair Jos van den Broek, VP & GM Front end Operations NXP, NXP Semiconductors
Jos van den Broek

Jos van den Broek
VP & GM Front end Operations NXP
NXP Semiconductors

Mr. van den Broek joined Philips Semiconductors in 1984 as a process engineer in the field of Ion-Implantation and Lithografie supporting the 4 inch waferfacility developments. In 1987, Mr. van den Broek became member of the new 6inch wafer facility start-up team and took additional responsibility in the area of supply chain management & production planning. From then onwards he held various positions with increasing responsibility in engineering and operations with Philips

In 1996, Mr. van den Broek joined EM Microelectronics Marin SA in Switzerland as Director Manufacturing responsible for the entire 6wafer facility operations. He managed volume ramp-up, improving overall factory operational performances and managed the entire supply chain.

In February 2000, Mr. van den Broek joined Philips Semiconductors again as Operations Manager for the 6 inch Logic wafer facility in Nijmegen supporting the Business Unit Multi Market Semiconductors, during the years he focused on efficiency and productivity improvements, successfully merged the 4 inch Discrete factory and 6 inch Logic factory into one organization and transferred the 4 inch portfolio into 6 inch. In 2008 Mr. van den Broek was appointed as General Manager for NXP's 8 inch facility in Nijmegen, the Netherlands, managing flexibility, capacity, allocation and contingency planning.

In September 2011 Mr. van den Broek was promoted to the current position of General Manager and Vice President Front-end Operations, in this role he is responsible for NXP's Wafer fabs (Europe and Asia) and in charge of global facility management and is also the NXP Nijmegen Site manager in which he is maintaining strong relationships with the the local and regional authorities.

Mr. van den Broek holds a Bsc Industrial Management and Business Economics from Nijmegen University, the Netherlands.

Innovative and environmental friendly Fluorine F2 based cleaning process to replace C2F6, CF4 and NF3 as cleaning gas
  Robert Wieland, Nano Materials, Devices & Si Technologies, Fraunhofer EMFT
Innovative and environmental friendly Fluorine F2 based cleaning process to replace C2F6, CF4 and NF3 as cleaning gas
Robert Wieland

Robert Wieland
Nano Materials, Devices & Si Technologies
Fraunhofer EMFT

Since the beginning of the 1980's per fluorinated carbons (PFC's) such as C2F6 and CF4 have been used as cleaning gases in thin film technology and since the 1990's NF3 has been used in the same way. PFC's and NF3 have long atmospheric lifetimes and therefore high global warming potentials. The main applications of these gases are to remove residual films left behind after a chemical vapor deposition process (CVD). The most important materials to be removed are dielectric layers like silicon oxides (SiO2), silicon nitrides (Si3N4) and, to a certain extent, conducting films like doped poly-silicon and silicide layers. According to the World Semiconductor Council the semiconductor industry in 2013 used 7512 t NF3, 1133 t CF4 and 708 t C2F6 on a global basis. Approximately 72% of all semiconductor industry emissions are based on these three gases (C2F6, CF4 and NF3). Fraunhofer EMFT and Solvay Special Chem have developed an alternative cleaning process, which can be a "drop in" replacement for the PFC's and NF3 used in semi. tools.
The target of this work was to find viable alternative gas mixtures for the semiconductor industry which could be used as a "drop in" to avoid additional high investment costs from equipment modification. Crucially our study has demonstrated that these more environment friendly gas mixtures also provide a more efficient and faster cleaning behavior. A shorter cleaning time can lead directly into a higher equipment throughput and more cost effective usage of these expensive thin film tools. Higher throughput of the existing equipment will lead to an immediate decrease in the cost per wafer and an increase in the profitability of a FAB.
A first "mini marathon" test run has been performed to generate data on particle and tool attrition. The test reactor, a 200mm wafer size CVD tool, was equipped with a mass spectrometer, to verify the end point of the chamber cleaning and to gain an overview of the waste gases going into the abatement system.

CV Robert Wieland:
Robert Wieland received his degree in physical engineering, TH Ravensburg-Weingarten, and is responsible for plasma deposition and plasma etch processes at Fraunhofer EMFT, Hansastraße 27d, 80686 Munich, Germany.
Phone: +49 89 54759 373 mail:

CV Dr. Jamila Boudaden:
Jamila Boudaden received her PhD degree in physical from the University of Basel. Since 2011, I am responsible of CVD processes at Fraunhofer EMFT, Hansastraße 27d, 80686 Munich, Germany.
Phone: +49 89 54759 161 mail:

CV Michael Pittroff
Michael Pittroff is Global Marketing Manager for electronic gases and worked for Solvay in several functions like research& innovation, technical service in several countries (Belgium, Korea and Germany).

Phone +49 511 857 3448 mail :

REACH as an opportunity for Semiconductor Industry
  Augusto Di Bastiano, Senior Scientific Officer Risk Management, European Chemicals Agency (ECHA)
REACH as an opportunity for Semiconductor Industry
Augusto Di Bastiano

Augusto Di Bastiano
Senior Scientific Officer Risk Management
European Chemicals Agency (ECHA)

The Regulation 1907/2006 of the European Union(referred as the REACH Regulation) on Registration, Evaluation, Authorisation and Restriction of Chemicals entered into force in 2007 in the EU.
The Regulation has been adopted to improve the protection of human health and the environment from the risks that can be posed by chemicals, while enhancing the competitiveness of the EU chemicals industry. REACH applies to all chemical substances; not only those used in industrial processes but also in our day-to-day lives, for example in cleaning products, paints as well as in articles such as clothes, electronic devices, vehicles, equipment and machineries, furniture and electrical appliances. Therefore, the regulation has an impact on most companies across the EU but also on non EU companies with an EU business.
This presentation aims to raise awareness on key REACH processes with potential impact for the semiconductor industry i.e. Supply Chain communication, Substances of Very High Concern, Authorisation, Restriction and Substances in Articles. It aims also to provide some practical information on how the Semiconductor Industry can support the Authorities' decision making process and to demonstrate that the burden for Industry can be significantly eased by early actions that anticipate regulatory decisions.

Augusto Di Bastiano joined the European Chemicals Agency (ECHA) on 2009. He currently held the position of Senior Scientific Officer in the Risk Management Implementation Unit. In his position at ECHA, Mr Di Bastiano has been involved in various projects related to the development and implementation of the Exposure Scenario Concept in the supply chain, assessment of Intermediates, identification and implementation of Regulatory Risk Management Options for substances of very high concern. Prior to joining the Agency Mr Di Bastiano worked for 13 years in the semiconductor industry in Europe and in the United States holding several technical and managerial positions in the field of Facilities Operation and EHSS at local and corporate level.
In his corporate role he coordinated the identification, development and implementation of EHSS programs at local and global scale. He has also worked in the Chemical Industry as process engineer, and in the Mechanical Industry as head of quality control.
Mr Di Bastiano holds a degree in Chemical Engineering from University of Rome and is a licenced professional engineer.

Mr Di Bastiano is Italian.



EHS Challenges, Opportunities and Implementation Strategies
  Hans Vloeberghs, Business Director Europe, Fujifilm Electronics Materials
EHS Challenges, Opportunities and Implementation Strategies
Hans Vloeberghs

Hans Vloeberghs
Business Director Europe
Fujifilm Electronics Materials

Electronic devices play a key role in our daily life, and will continue to take a major role in the coming years. This will fuel a continued drive for increased functionality in semiconductor devices with improved energy efficiency. Historical these device evolutions have been driven by Moore's law and in addition, more recently, by More than Moore's law. In order to continue to drive these laws, it becomes increasingly important to introduce new innovative materials in IC manufacturing processes to stay in line with the device functionality requirements. With this comes the challenges of lower cost, higher performance expectations, increasing quality standards and equally important the more stringent Environment, Health and Safety (EHS) requirements.
Compliance to the EHS regulatory, like REACH, is a major challenge for chemical suppliers to the semiconductor industry in order to continue the supply of current chemicals to the semiconductor industry and to maintain the supply at competitive price. For new innovative chemicals, the cost is even higher due to additional testing required by new EHS legislation in order to bring them on the market. In addition, some of the EHS regulatory requirements, like ROHS, require extensive chemical analyzes and control of the supply chain which comes not for free.
This presentation will discuss the key EHS challenges which the chemical suppliers to the semiconductor industry faces and will introduce some ideas on how to effectively deal with these challenges.

Hans Vloeberghs is Business Director Europe at Fujifilm Electronic Materials Europe which is the European headquarters of Fujifilm Electronic Materials, a division of Fujifilm, and a worldwide manufacturer and supplier of photoresists, polyimides, thin film systems, CMP and other high purity chemicals to the semiconductor industry. In addition to his role as Business Director for Europe, he is the Global Business Director of Fujifilm Electronic Materials Polyimide product line.
He joined Fujifilm Electronic Materials Europe at that time OCG (Olin-Ciba-Geigy) Microelectronic Materials Europe in 1993 as an Application Engineer and as a Collaborator of OCG R&D programs. At OCG which changed name to Arch Chemicals and finally acquired by Fujifilm, he held several positions from Product Manager photoresist to Business Manager Europe for all electronic materials.
He received his Ph. D. in Physics from the University of Leuven (Belgium) in 1992. At that time, he was a research assistant of the Belgian National Fund for Scientific Research in the Laboratory of Solid State-Physics and Magnetism.

12:10 Networking Lunch