Plasma etch and deposition solutions for SiC and GaN devices

Mark Dineen
Technical Marketing Manager
Oxford Instruments Plasma Technology

Abstract
Silicon Carbide (SiC) and Gallium Nitride (GaN) are becoming increasingly important materials for RF and Power devices.Find out how plasma process solutions are used to enable these devices and maximise their performance.

Biography
Dr Mark Dineen graduated from Cardiff University with a PhD on ‘Plasma etching of Gallium Nitride’ and joined Oxford Instruments in 2000. Firstly as a Process Engineer working on etching of III-V materials, then moving into Product Management and more recently marketing Mark has a wealth of experience related to Compound Semiconductor device processing.

Yield Improvement by Abrasion Reduction

Jorgen Lundgren
Senior Field Application Engineer
Entegris

Abstract
This presentation will describe different polymers and their technical attributes and functions in products used for bare die and wafer handling and processing applications. Polymers used in wafer handling and processing has to have a low level of organics which can potentially outgas (outgasing) and low level of anions, cations and metals. Some polymers are required to have ESD (electro static dissipative) properties where different forms of carbon is added to achieve the required ESD specification. Another critical physical attribute is abrasion resistance. Specific polymers have a high abrasion resistance to avoid particle generation. Temperature resistance is another important factor for many Semiconductor applications.

Biography
Senior Field Applications Engineer with electronic engineering degree from Sweden. Been working for Entegris for the last 21 years supporting the Semiconductor Industry in many different technical roles with focus on wafer and reticle contamination control during handling, processing and shipping of sensitive devices. Heading up projects and product qualification of 200mm and 300mm fabs in Europe. Contributor to Entegris/CEA–Leti collaboration FOUP polymer contamination/decontamination Project. Partner in the European TSV-Handy wafer handling Project. Active SEMI participant.

Extend the lifecycle of your industrial IT systems > 20 years

Robbert van Hagen
Business Development Manager
Detron Lifecycle Services

Abstract
IT components like servers, IPC systems and boards that are used in the semiconductor industry should be robust, secure and of high and constant quality. In addition, systems are used over a longer period of time and redesigning an alternative product results in additional cost and risks. During this presentation, Detron gives insight in its Lifecycle management strategy that helps customers like ASML, Philips and NTS choose/design-in the right IT components and extend the lifecycle of these products for more than 20 years.

Biography
Robbert van Hagen has a strong 20-year background in ICT managed services both in the IT and Telecom domain, acting as a sparring partner in the field of mobility, Internet of Things and Lifecycle Management.

Quality Assurance in High-End Semiconductor Production

Mathias Holzapfel
Business Development Manager Semiconductors
Precitec Optronik

Abstract
PRECITEC is worldwide the preferred supplier and partner of high-end standard and customized optical sensor solutions for quality control in production processes of semiconductor and consumer electronics. Using our non-contact and non-destructive technology, deviations in essential steps of the manufacturing process can be detected. Thus, we enable not only a significant increase in the quality of subsystems and finished goods, but also a reduction of time and cost in the assembly processes. PRECITEC equipment is currently used in application scenarios in the semiconductors such as: • In-process wafer thickness measurement (grinding, CMP, etc…) • Fast warpage inspection • Bumps and micro-bumps inspection • Laser dicing groove inspection • In process dicing laser autofocus • And many others

Biography
Mathias Holzapfel is a Business Development Manager at Precitec Optronik with a focus on the Semiconductor industry. His responsibility encompasses Precitec’s worldwide Semiconductor sales. Upon completing his engineering degree in "Photonics and Image Processing" Mathias began his career as a technical sales and applications engineer in the field of diode array spectroscopy. Later he moved on to industrial image processing were he further developed his software and application expertise. These skills and experiences lead him to his current position at Precitec Optronik.

Non-contact metal layer thickness and sheet resistance measurement on process wafers

Marcus Klein
Managing Director
SURAGUS GmbH

Abstract
Thickness measurement is a crucial yet challenging endeavor in many industries. Processes such as sputtering, plating, polishing or selective etching among others benefit from instant metal thickness measurement. To date, indirect measurements on test wafers often lead to uncertainties resulting from a selective measurement of samples. They also cause additional costs for processing test wafers and consuming tool time. Furthermore, high-resolution measurement near edges enables integrity assessment of near edge areas. These near edge areas receive broader attention these days as they still provide significant potential to increase the yield and decrease costs per chip. Novel tool integrable measurement technology is required to adapt to these challenges and to assure accurate, non-contact and reliable measurements of the layer thickness even at high wafer handling speed. Therefore, non-contact sensors for intool monitoring and detailed offline imaging have been developed based on eddy current technology, a well-known method for layer characterization, and have been adapted to the challenges of in process and edge area measurements. A sophisticated evaluation enables a precise interpretation of the obtained data, including near edge areas. It is shown that the received results are equivalent to destructive thickness and contact 4PP measurements. Eddy Current, though, is a much faster method. In contrast to other approaches, this non-contact method erases impacts of insufficient homogenous contact qualities and therefore leads to a higher repeatability. Examples will be given where the eddy current measuring method has been applied on top of structured multi-layer systems or obtaining precise thickness measurement near edges. This talk is dedicated to initiate a discussion on the shift from measurement on test wafer to measurement on process wafers.

Biography
Dipl.-Wi.-Ing. Marcus Klein has been managing director of SURAGUS GmbH since 2010. He got his master degree in Business and Engineering from University of Technology Dresden focusing on microelectronics and electronic packaging. Past working experiences include Siemens Pte Singapore, Wacker Chemie, Advanced Mask Technology Center and Fraunhofer Institute for non-destructive testing Dresden. He is member in several research projects and expert for eddy-current based measuring solutions for thin films, coated glass, carbon fiber and graphene.

Maintenance Management 4.0

Jochen Kinauer
Director Channel Sales
camLine GmbH

Abstract
Highly productive, profitable manufacturing must also focus on the automation of maintenance in order to work efficiently, flexibly and sustainably. The purpose of intelligent maintenance is more than just organizing the maintenance staff! - It must analyze process data for predictive maintenance, observe the material flow, keep spare parts, coordinate the maintenance staff and, of course, document maintenance activities. In addition, it is important in a complex production with large plant inventory that the maintenance measures and experiences are documented as best-known methods (BKM). There are different maintenance methods like corrective, predictive or preventive maintenance. Each maintenance type may be used at specific occasions, depending on the impact to the life time of the equipment and production. Predictive Maintenance as the most complex maintenance type requires that equipment data is analyzed with statistical methods like Western Electric rules. About camLine camLine (camLine.com) develops and markets its own software providing powerful solutions to the challenge of "Manufacturing Excellence" in the MOM sector. camLine’s IT-based infrastructure systems are used in the manufacturing of high-tech industries. camLine's priorities are quality assurance with SPC/APC/SQM, process integrity with a recipe management, production logistics, efficiency (OEE), shop floor integration, engineering analytics, machine maintenance, and innovation efficiency. Training and consulting is provided by camLine’s own academy. camLine has been offering its services worldwide for more than 29 years.

Biography
Jochen Kinauer currently serves as Director of Channel Sales and Public Relations at camLine GmbH. In his career, Jochen was responsible for SW Automation Projects for Semiconductor Manufacturing, which includes MES, Equipment Integration, Tool Controls, FDC, APC and SPC. In addition Jochen Kinauer serves as Cluster Manager at Silicon Saxony e.V. for the cluster Advanced Semiconductor Manufacturing Technologies and RFID. As part of his role Jochen organizes an annual RFID Symposium in Dresden, showing new developments and technologies in the area of RFID and Indoor Material Tracking that takes place every year at the beginning of December in Dresden, Germany.

Siconnex BATCHSPRAY Technology: Case studies for cost- and space improvements

Fabio Wörndl
Global Director Sales & Marketing
Siconnex customized solutions GmbH

Abstract
Siconnex BATCHSPRAY technology is used, if a high throughput on a small footprint, as well as a low chemical consumption matters. In a case study, that was done together with a European customer, the benefits of moving from a wetbench or single wafer track to a BATCHSPRAY equipment in terms of money and cost savings are shown.

Biography
Fabio Wörndl started at Siconnex in 2011 as Service Engineer. After a technical sales support role for the US market, he became Account Manager in 2016. Since July 2017, Fabio is Global Director of Sales & Marketing at Siconnex and manages the sales structure around the globe. Fabio has a degree in electronics and a diploma in industrial engineering and economics.

Scaling up to big data volumes

Doug Suerich
Product Evangelist
PEER Group

Abstract
The market is demanding faster throughput, smaller feature sizes, and higher quality. The fuel that drives these improvements is data – from more sensors, faster sampling, and greater integration of different sources. Collecting larger data volumes allows for deeper insight into critical process and production metrics, as well as the possibility of using advanced analytics and machine learning to speed defect analysis and reduce repair times. However, this explosion of big data can overwhelm traditional data sharing and storage mechanisms. Join us as we discuss cutting edge approaches to managing your data including new storage solutions, best practices for where your data should live, and methods for sharing that data with your analysis systems and global experts.

Biography
Doug Suerich is Product Evangelist at The PEER Group Inc., the semiconductor industry’s leading supplier of factory automation software for Smart Manufacturing and Industry 4.0. Doug focuses on big data and remote connectivity solutions that help manufacturers collaborate securely on tools and data in production environments. A passionate advocate for Smart Manufacturing, Doug serves as an active member of the SEMI® Smart Manufacturing Advisory Council and Smart Manufacturing SIG, Americas Chapter. Doug has over 20 years of experience leading software teams for a variety of industries including semiconductor, manufacturing, and transportation. Most recently, he was involved in architecting PEER Group’s remote connectivity solution, Remicus™, and he was a champion in promoting the use of cloud computing and latest-generation web technologies.

Liquid system component cleanliness testing at 20 nanometres

David Green
Applications Engineer
Particle Measuring Systems

Abstract
Fluid handling components such as valves, pumps, filters and degassing modules are common sources of contamination in high purity liquid distribution systems. This contamination can eventually reach the processing environment either in the form of solid particulates or, through chemical reactions, as a form of ionic contamination. Due to the significant cost associated with yield impacts, it is of vital importance to ensure that fluid handling components are sufficiently clean before they are used in the production environment. A simple testing program has been established that uses an optical particle counter to characterize the initial and long-term cleanliness of critical fluid handling components for particle sizes down to 20 nanometres. The testing program allows the relative cleanliness of components constructed out of different materials and from different manufacturers to be evaluated. This can save both time and money in the production environment by ensuring that the best components are selected for the designated task.

Biography
David Green graduated from University College London in 2002 with a bachelors degree in Physics. David has spent most of his career designing, building and testing novel particle analysis equipment. Since 2013 David has represented Particle Measuring Systems across the EMEA region as an Application Engineer.

How New Macro Defect Inspection Technologies Are Becoming Essential to Increasing Yield and Reducing Wafer Fab’s Costs

Mike LaTorraca
Chief Marketing Officer
Microtronic, Inc.

Abstract
As semiconductors and intelligent devices are adopted into all areas of modern society it’s critical that the inspection processes in manufacturing fabs keep pace. Traditionally, semiconductor wafer manufacturers rely on sampling - at both the die and wafer level. Although sampling speeds up the inspection process, there is obvious risk of missing defective wafers due to sampling. While fabs will probably always rely on sampling to some extent, there are now new macro defect inspection applications that can be added to the wafer production environment to deliver dramatic improvements in many areas. These areas include: recipe-less defect detection; reduction of manual inspection costs; root cause analysis; shipping die with latent defects, excursion control, customer returns, and comprehensive automotive zero-defect strategy enablement. This presentation focuses on why automated macro defect inspection is becoming essential to fabs as they are challenged to improve their quality in the already highly demanding semiconductor manufacturing environment. Exploding markets such as automotive and mobile devices make it necessary for fabs to provide better quality at lower costs. For example, detection of macro defects in-line, prior to final inspection, allows manufacturers to take corrective action at an earlier, less expensive point in time to address any defective die and to prevent die with a high probability of carrying reliability defects, from entering customer products – including automotive devices. Additionally, automated macro defect inspection is ultra-fast and can inspect 3,000 wpd while delivering an actual high-resolution full-wafer color image. The macro defect inspection approach creates a complete, trackable “waferbase” with defect lists and defect maps along with each wafer’s OCR number, image and slot position to help identify production problems fast and take corrective action quicker.

Biography
Mike LaTorraca is the Chief Marketing Officer of Microtronic, Inc., the US-based manufacturer of EagleView - the semiconductor industry's most yield enhancing macro defect inspection system and winner of the 2017 Semicon West Best of West new product of the year award.