2016-2019 FABulous Years: The Impact of Korea, China and the Surge in 200mm Demand

Lara Chamness
Senior Market Analyst Manager
SEMI

Abstract
Coming off of a record year in 2017, many are optimistic about the outlook for fab investments in 2018 and 2019 as well. If this forecast plays out, it will be the first time since the mid-1990's the industry has had four consecutive years of growth. This presentation will provide an overview of historical fab trends but will focus on the latest data from SEMI's World Fab Forecast highlighting regional trends, fab spending, including equipment, and fab capacity trends in 2018 and 2019. A discussion of 200mm fab trends will also be included.

Biography
Ms. Lara Chamness is a Senior Manager Market Analysis at SEMI® and is responsible for SEMI’s data collection programs for equipment and materials. This includes leading interactions with SEMI’s participating companies, partners and subscribers. Ms. Chamness has 18 years of industry experience and has BA/MS degrees in environmental sciences and a MBA degree from Santa Clara University.

Thomas Richter
Vice President of the Wafer Fab 150 / 200mm & MEMS
Robert Bosch GmbH

Biography
Thomas Richter, since July 2015 Vice President of the Wafer Fab 150 / 200mm & MEMS at BOSCH Reutlingen, was born 1974 in Chemnitz. Working for SIEMENS, INFINEON, QIMONDA and MELEXIS he now has about 23 years of experience in the semiconductor industry. He holds a Diploma in Micro Technology of the University of Applied Sciences Zwickau (WHZ).

MEMS – One Product one process?

Udo Gómez
Senior Vice President
Robert Bosch GmbH

Abstract
The demand and variety of applications for MEMS sensors has been growing steadily since the first series applications in the automotive sector in the early 1990s. Especially since the rise of fast-moving consumer markets, quick and efficient design has become increasingly important. However, in particular for MEMS, the strong interaction of product design and manufacturing processes is a major challenge. The growing number of applications for sensing of various physical and increasingly chemical parameters, often require specific solutions in MEMS production, chip level packaging and component testing as well. Fast and market-driven product development is only possible through innovative design concepts and the provision of modular process building blocks. A deep understanding of the interrelationships and the development of corresponding simulation tools are further key competencies. As market leader in MEMS sensor business and one of the first MEMS pioneers, BOSCH is continuously pushing forward the development of MEMS technology. The extension of our process platform originally defined for automotive applications to consumer products opens up new possibilities in the realization of complex 3D structures. This enables new product designs that are reflected in high-performance sensors for both automotive and consumer electronics applications. The presentation gives a short overview of the different requirements on MEMS technology compared to standard IC design and manufacturing. It provides insights into the future development in the field of surface micromechanics and highlights challenges and solutions of MEMS technology development and manufacturing as well as design methodology. In addition, we give examples of new design and product concepts and finally question: Does the old MEMS law "one product, one process" continue to apply?

Biography
Dr. Udo-Martin Gómez Senior Vice President Sensor Engineering, Robert Bosch GmbH Dr. Gómez is Senior Vice President of Robert Bosch GmbH. He is heading the Sensor Engineering at Bosch Automotive Electronics (AE/NE-SE) in Reutlingen, Germany, the world’s largest MEMS supplier serving the Automotive, Consumer Electronics and IoT industry. Having completed his doctorate in physics, Dr. Gómez started his career at Robert Bosch GmbH in 1999 at Corporate Sector Research and Advanced Engineering (MEMS technology). Before joining Bosch Automotive Electronics in April 2018, he worked in various management positions at Bosch and also held the position of Chief Expert for MEMS sensor technology. From 2013 to March 2018, he was Chief Technical Officer of Bosch Sensortec GmbH - a fully-owned subsidiary of Robert Bosch GmbH, responsible for research and development of micro-electro-mechanical sensors (MEMS) for consumer electronics, smartphones, security systems, industrial technology and logistics. Since 2014, Dr. Gómez is Deputy Chairman of the Board of VDE/VDI-Society Microelectronics, Microsystems and Precision Engineering (GMM). Since 2015, he is also member of the GSA (Global Semiconductor Alliance) EMEA Leadership Council.

The MEMS production challenge: How to manage an increasing MEMS production and complex R&D activities within a combined CMOS-MEMS foundry fab?

Volker Herbig
VP BU MEMS X-FAB Group
X-FAB MEMS Foundry GmbH

Abstract
How the CMOS foundry business model runs is well understood: a process technology is developed, a corresponding PDK is created and given to customers, followed by the product development at their side. At this point many customers can be served at the same time. This helps to achieve a high level of fab utilization and to minimize costs and risks. This model does not apply exactly for MEMS – the MEMS business model is different. Process as well as product development are very mostly customer specific and take place simultaneously for different customers within a running foundry production fab environment. On the one hand this is the key to short time to market and to robust production processes as no extra industrialization stage is needed after technology development. On the other hand this is generating various special challenges. This presentation especially talks about those challenges the fab team has to address besides the ongoing CMOS and MEMS production: - tool dedication and tool stability / matching in relation to production and empty costs - advanced metrology concepts including PCM and automatic optical outgoing inspection - process engineering support model in complex and fast running MEMS development projects … and many more. These challenges can be mastered by a deep process understanding and good process integration schemes, both based on intensive collaboration of production and development departments.

Biography
Volker Herbig, VP BU MEMS at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.

Next Generation of Powerful Intralogistics Automation for 200MM Semiconductor Fabs

Heinz Martin Esser
Managing Director
Fabmatics GmbH

Abstract
Existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics automation solutions. In the previous years many companies operating mature fabs understood that older does not mean obsolete and started or continued their journey towards higher automated production. For this reason a variety of automation solutions in the fields of material identification and tracking, storage, transport and handling were developed. After the first generation of these automation systems entered the fabs, left the prototype level and have been running in production for a couple of years the customer needs and requirements changed. Focused the first material handling automation solutions on general feasibility the trend now develops towards continuous improvement, stability, performance and cost of ownership, which creates new and different challenges for next generation automation systems. In his presentation Heinz Martin Esser will explain the newest trends of customer requirements for automation of mature fabs and how these challenges drive and influence the development of the 2nd generation of 200mm intralogistics automation systems, which will give customers the opportunity to further stretch the current limits of fab performance.

Biography
Managing Director of Fabmatics GmbH and President of Silicon Saxony e.V. Heinz Martin Esser, born in 1955, completed his studies of supply engineering at the university of applied science in Cologne with diploma in 1981. In 1985 he got an additional university degree in business administration. He gained a wide experience in detailed engineering and project management for large and complex investments for nuclear industry and beverage and food industry. Later he was assigned as branch manager to build production clean rooms and facilities in semiconductor and pharmaceutical industry. In 1999 he was appointed as CEO of Roth & Rau - Ortner GmbH, Dresden (formerly Ortner c.l.s. GmbH). The company provided automated transport, storage and handling systems, RFID components and special products for cleanroom applications as well as complex systems expertise in AHMS installation and qualified services for the international semiconductor industry. Since the merger of Roth & Rau - Ortner GmbH and HAP GmbH Dresden into Fabmatics GmbH in September 2016, Heinz Martin Esser has been managing the company together with Dr. Steffen Pollack. With Fabmatics Heinz Martin Esser is responsible for “Sales & Marketing”, “Customer Service” and “Administration”. Since 2001 Heinz Martin Esser has been a member of the board of directors of the high-tech network Silicon Saxony e.V. In 2009 he was assigned to be the speaker of the board. Since 2008 he has been a member of the European Advisory Board of the worldwide industry association SEMI as well.

Mario von Podewils
Fab Operations Manager
X-FAB

Biography
Mario von Podewils, since October 2007 Operations Manager of the Wafer Fab at XFAB Erfurt, was born 1963 in Thuringia Germany. Since more than 35 years he is working in the semiconductor industry. Meanwhile he held several positions as Engineer and Team as well as Department Leader e.g. in the Thesys GmbH and in the XFAB GmbH in Erfurt, Germany. He holds an Engineer Degree in Technology of Electronic Components and a Diploma in Industrial Engineering.

Innovation needs People Power

Glenn van der Burg
Founder
People Power

Abstract
What can make a real difference between you and your competitor? Cutting edge technology? A strong brand? Cost efficiency? Especially in this era of super fast tech development, the one thing that we need to thrive is People Power. Innovation, creativity, customer intimacy, they all rely on engaged people that cooperate to be better everyday. Probably nothing new, but why is it so hard to create a workplace that is bursting with energy? In this talk, Glenn van der Burg will take you on a trip into the drivers for human behavior. What motivates us to be the best version of ourselves? What's happening to people in meetings? What sparks people's creativity? And what takes away all the energy? With insights from science, examples of innovative organisations and actions to start innovating your workplace tomorrow. And at least one guaranteed laugh!

Biography
As founder of People Power, Glenn van der Burg is striving for people-centric organizations for better performance and happy people. He facilitates groups of leaders and professionals that want to make a leap forward in making their organization people centric. Every monday Glenn hosts his radioprogram "People Power" with experts and best practices in people-centric organizations. And he is the author of two management books. His favourite quote is by prof. Gary Hamel: “You can not build an organization fit for the future if it is not fit for human beings."

From Lean Manufacturing to Lean everywhere

Olivier Ardesi
Lean Office Director
ST Microelectronics

Abstract
ST Microelectronics started its Lean journey 10 years ago, in two of its main Front-End fabs. The approach covered the classical Lean tools & methods (that had to be adapted to cope with semiconductor manufacturing specificities) but also the Management system and practices in order to really bring a change in mindset & behaviors and deeper engage all employees. After 3 years,the results on the key industrial indicators were improved but more over the culture of the site had been transformed as recognized by main customers. The approach was thus expanded to all Front-End fabs, then Back-End plants, always taking into account the local context, specificities and culture. The question then arose whether this Lean approach could also be applied and bring similar improvements in non-manufacturing areas such as Technology and Product development, but also Business support functions and Sales ? How to convince organizations whose efficiency is less easily measurable and subject to continuous improvement that there really was an added-value for them to change their way-of-working with Lean ? And finally, how to make Lean a key ingredient of ST culture ? Today, 75% of ST organizations are engaged into Lean initiatives among which Technology R&D, Product development, HR, Purchasing, ICT, Sales & Marketing… In this talk, Olivier Ardesi, in charge of ST Lean office, will show how ST is following a proliferation strategy through experience sharing and a balanced mix of bottom-up and top-down approach to deploy Lean in every domain and make it part of its Leadership culture. What are the actual and foreseen benefits and what are the challenges will be part of the discussion.

Biography
Olivier Ardesi, Lean Office Director of STMicroelectronics, coordinates Lean proliferation all across ST organizations. After 10 years and various manufacturing roles in ST Rousset Front-End fab, he led the first Lean Manufacturing program in ST started in 2008. Three years later, he was in charge of deploying Lean approach among the other ST Front-end fabs. He then started to support Lean initiatives in non-manufacturing organizations, exploring how Lean principles could apply in R&D, Human Ressources, purchasing, etc.. He graduated with an engineering degree from Ecole Centrale Paris and holds an Executive MBA from EM Lyon business school.

Manfred Kraxenberger
Vice President
ABB Switzerland

Biography
Manfred Kraxenberger is currently factory manager for ABB’s BiMOS wafer fab and assembly line in Lenzburg, Switzerland. Manfred Kraxenberger studied physical engineering and started working as process engineer at Siemens Semiconductor in Munich in 1986. Over the last 30 years, he has held several engineering and management positions in manufacturing as well as R&D at Siemens/Infineon/Qimonda and Globalfoundries. Prior to his current position he was in charge of ABB’s Bipolar factory.

How Infineon Dresden attracts Generation Z

Torsten Quaas
Senior Engineer Maintenance
Infineon Technologies Dresden GmbH & Co. KG

Abstract
It is getting more and more difficult to attract young people for manufacturing jobs – not only in general, but especially for industrial and craft activities. Thus, Infineon Dresden improved its training concept and reinforces public participation. Our new training workshop offers a central training facility for our mechatronics trainees in the first year. Important basic knowledge and skills will be taught based on real repair orders. After the practical training the trainees are well prepared for their specialized training in the different departments. Also, our micro technology trainees have the possibility to practice soldering on circuit boards. Today, they produce their own test chip over the period of six weeks. Purpose is to introduce the upcoming micro technologists into production departments, facilities and processes. Hands-on facilities like our training workshop also make Infineon Dresden more attractive especially for pupils. We are now able to offer a trial internship if they are 14 years and older to give an insight into the semi-conductor industry. To attract pupil’s attention, we stage student’s internships, “SCHAU rein”, Girl’s Day, and “genialsozial” – work against poverty, at Infineon Dresden. Therefore, we are in close exchange with educational institutions. At the training, job and new business owner fair “KarriereStart” 2018, representatives of the HR department, training supervisors and trainees informed about training and career opportunities at Infineon Dresden. Visitors of the Dresden Science Night 2018 had the chance to find out more about our products and see or try them in real life. At our first career and training day about 850 visitors used the chance to get an insight into one of Infineon’s biggest production sites. Our visitors were able to find out more about nearly every step of semiconductor production.

Biography
Torsten Quaas is maintenance engineer and project manager at Infineon in Dresden and team leader for about 60 employees and 3 trainees. Torsten Quaas was born on September 2, 1968 in Dresden. As a trained maintenance mechanic, he finished his studies as a state-certified technician in Dresden in 1993 – specializing in electrical engineering majoring in data technology. Since September 1994 he is employed at Infineon Dresden in areas of equipment engineering, production controlling, and industrial engineering. 2002 he completed his studies to become a qualified industrial engineer. Since then, he took over the responsibilities for headcount planning operations and maintenance. In 2015 he became responsible for the Maintenance Engineering group at Infineon Dresden.

The cultural transformation of X-FAB to become a customer oriented company

Henryk Schoder
Vice President Human Resources
X-FAB Group

Abstract
In 2014 X-FAB started a global journey on a cultural transformation process to become a true customer oriented company. To show and live customer orientation as a core Value of X-FAB a comprehensive workshop program (Vision & Values Events) with each employee at each X-FAB location was established as a basis that everybody understand the Vision and Values of X-FAB. During the workshops the focus was on everybody´s personal responsibility in the job to make X-FAB a customer oriented company. The results in our employee engagement survey from 2016 showed significant improvements in several areas compared to 2013 which can be seen as an indicator of the success of the program.

Biography
Henryk Schoder, X-FAB’s global VP HR, was born and raised in the Thuringian town of Jena, where he also completed his Masters in Psychology. Prior to joining X-FAB in January 2014, Henryk worked as HR Manager at Infineon’s Dresden site, as Recruitment Consultant in Brighton (UK), Singapore and Dubai as well as HR and IT Manager for Masdar PV.

Workplace Innovation

Ellen van Schalkwijk
Program Manager Quality
NXP Semiconductors

Abstract
Workplace innovation focusses on our employees. We aim for more passionate, inspired and involved employees, increasing our productivity and improving our competitive position. Our secret to success is to create conditions which stimulate maximum level of empowerment and responsibilities. The Workplace Innovation team is a multi disciplinary team of enthusiastic people, willing to take the extra step to infect others. The main focus area’s are development of our leaders, creating opportunities for empowerment of employees and looking for ways to work smarter. Our poster will give you a flavor of our vision, our approach and our activities. We hope we will inspire you!

Biography
Ellen van Schalkwijk is Program Manager of the Quality program in ICN8, the 8inch factory of NXP semiconductors in Nijmegen, Netherlands. With a MSc in physics she began her career in Device Engineering. She held management positions in several engineering departments, she has built the program management business process in ICN8 and chairs the Workplace Innovation team since 5 years. She is people oriented, looking for ways to improve work processes and team collaboration. Running a competitive high volume manufacturing organization in Europe requires intense attention and engagement by all stakeholders towards highest quality and delivery expectations of customers.

Per aspera ad astra - innovation in a mature fab

Alexander Urban
Unit Manager
Texas Instruments

Abstract
It will be shown, that innovation in a mature fab needs a combination of neccessity, good leadership and people with the proper mindset. All items will be discussed in detail with examples.

Biography
Alexander started 1999 as a photo process engineer at Hitachi Semiconductor. He joined Texas Instruments in the same position in the year 2000. In 2009 he took over the position of an engineering section head for photo and yield enhancement. In 2016 Alexander extended his leadership to process engineering, equipment engineering and manufacturing of photo, epi and implant. Alexander holds several patents and is responsible for driving innovation in Texas Instruments Freising fab.

Leveraging a single collaboration platform to achieve higher efficiency and zero re-spins in developing IoT-ready systems-on-chip

Jean-François Hebert
VP Sales Director for BT Channel
Dassault Systèmes

Abstract
To keep up with dynamic consumer demands in the Age of IoT, Semiconductor companies need to deliver chips and SoCs in ever shorter timeframes. The challenge to meet revenue, profitability and growth targets puts design and manufacturing under increasing pressures in meeting technical demands and delivering devices on time. This presentation shows practical examples and leading practices how semiconductor companies can efficiently manage their products' hardware & software diversity, while protecting IP, mastering product compliance and Manufacturing-For-Design strategies by leveraging the 3D virtual twin for semiconductor manufacturing front-end and back-end processes.

Biography
Jean-Francois HEBERT joined Dassault Systèmes in October 2007. He held several Sales Management positions within BT Channel (serving Large Accounts) as EMEA High-Tech Sales Manager, Diversification and Geo Sales Leader for France/Spain/Portual/Middle-East for the ENOVIA brand. Since January 2016, he is responsible for helping High-Tech companies worldwide adapt to fast-paced market trends and deliver innovative electronic experiences for their end-customers by leveraging Dassault Systèmes’ 3DEXPERIENCE™ platform. He is also driving the impact of the company’s High-Tech Industry on sustainable innovation in multiple other industries through smart products and systems, embedded electronics and software, and IT and communications infrastructures that support cloud based transformation. Prior to joining Dassault Systèmes, Jean-Francois Hébert worked in EDA, Semiconductor and Optronics industries, where he held senior management positions including Alcatel Optronics and Windows Business Division. Before this, he worked in a number of senior-level sales, marketing and business development capacities at Bull EMEA Information Systems and at EDF. Jean-François HEBERT is a graduate of the Ecole National SEA in Cergy Pontoise, France, and completed courses for Sales at Texas Instruments and SAM.

Enabling Productivity, Performance and Organization Efficiency Through Equipment Intelligence™

Marcello Della Pia
Fab Productivity Director
Lam Research

Abstract
Industry 4.0 is the current trend of automation and data exchange in manufacturing technologies. It includes cyber-physical systems, the Internet of things and cloud computing. Industry 4.0 creates what has been called a "smart factory". Which implies computerization and digitalization of all processes. This changes makes manufacturing more attractive enabling a higher level of efficiency allowing more precise and faster decision. The impact is on human resources as well since the job content became more interesting and might require a higher level of qualification in some function. At the same time it might make the production less impacted by turn over. Lam Vision for Equipment Intelligence is to be the Customer Choice For “Smart Tools Of The Future, Lam’s existing capability (sensors, data management & analytics) enables most of the Industry 4.0 potential, enabling process tools to deliver market leading process & productivity with a significant optimization in human resources. Six main components constitute the essence of Lam Research path to enabling smart tools in the semiconductor industry, which have been addressed through: Big data Machine Learning Platform: an Integrated scalable distributed big data and machine learning platform supporting fast algorithm development and customization. Automation: New robotics and platform design to increase productivity and enable lights out operation, including Monitoring & Self-Tuning. Sensors & Process Control: In-Situ & Integrated sensors monitor system and wafer status during process at high sensitivity and data rate providing greater productivity, Improved variability and Expanded process window Virtual Processing: Computational etch and virtual fabrication SW enabling fast learning & process development reducing development cost & time Advanced Productivity Solutions: Ecosystem of software and services built designed to drive improved OEE and Productivity, leveraging data

Biography
Mr. Della Pia is a semiconductor professional with 23 years of experience in high tech industry. He started his career working for Texas Instrument. When Micron Technology acquired the DRAM division of TI, he joined Micron technology. In Year 2000 he moved to China, being among the first to join the foundation of the first cutting-edge IC Foundry in China (SMIC), actively participated to the construction of semiconductor industry in the Mainland. Mr Della Pia advanced to various leadership roles across multiple Fabs and corporate position for SMIC. In 2013 He joined Lam research and currently is working as Director in the Customer Support Business Group of Lam Research, leading a team focus on Productivity Solution for Semiconductor Fabs. Mr. Della Pia is also responsible for Big Data project for Lam Research in the EMEA region. Mr. Della Pia holds a master degree in Chemical Engineering.

Smart Manufacturing enabled by Silicondash

Stephane Iung
Customer Program Director
Qualtera

Abstract
With the increasing complexity of manufacturing processes and the multiplication of integrated multi-chip modules (MCM) and 3D stack, the amount of manufacturing and test data becomes overwhelming, making virtually impossible with traditional tools and methods the extensive and systematic analysis and detection of all quality and yield issues . At the same time, the need to respond in real-time, to detect, prevent, predict and control quality and yield issues throughout the supply chain and also bridge the gap between analytics and action has dramatically grown. Smart manufacturing, enabled by Big Data, promises to boost devices performances, industry productivity and ensure full and automatic control of the supply chain. The poster presents a large-scale industrial Big Data solution implemented at high-volume global manufacturing Supply Chains. The solution, called Silicondash, collects manufacturing and test data in real time from the entire supply chain and executes in real-time hundreds of algorithms to produce analytical results, reports, alerts and control signals that are automatically fed down-stream and up-stream in the supply chain to improve the critical operational KPIs. Keywords—Smart Manufacturing, big data analytics, machine learning, test and manufacturing data analysis, data mining, yield, quality, real-time data collection, multi-chip modules, 3D stack.

Biography
Stephane IUNG is currently Customer Program Director at Qualtera, in charge of overseeing existing projects and developing new opportunities. He began his carrier in the semiconductor industry 20 years ago after graduating from Ecole Supérieure d’Electricité (Paris, France). Starting in the foundry world as Yield and Characterization Engineer at IBM semiconductors, he then moved to STMicroelectronics, taking the role of Test and Product Engineering in charge of high volume products in advanced technologies for Set-Top-Boxes market. He joined Qualtera in 2011.

Predictive/Preventive Maintenance + Fab-Planning 4.0, via Augmented reality solutions

Tobias Bausch
Director Sales & Marketing
AP&S International GmbH

Abstract
Imagine the following situation: You need a new wet process tool and therefore a supplier is visiting you in your fab. But he doesn’t show you some catalogues and presentations, but instead brings you a realistic virtual model of the required wet process application and positions it directly in your production hall. From the very first moment during your first supplier meeting you see how the offered wet process tool fits into your fab and which local adjustments are necessary e.g. additional space creation, adaptation of the exhaust system or others. The result for you is an optimized fab planning before the production start or the tool ordering. This great process is offered to you by the AP&S Augmented reality solution. Through a realistic, detailed visualization integrated into the real environment of your fab, you get an outlook to your future fab view. Further advantage of this AP&S solution is an optimized construction process, as the verification of design plans is possible in a very early project phase and via a virtual design review, the system including all subsystems can be viewed and discussed in a comfortable and easy to understand manner. It happens thanks to various simulation options enabling optimized matching of customer needs and supplier suggestions before and during the developing process. But our Augmented reality solution doesn’t end with the delivery of the ordered tool. It continues in the area of predictive/preventive maintenance and brings you time and cost savings in this field. The benefits of our Augmented reality solution are varied, so come and see how it can improve the performance of your fab. I look forward to meet you at the Fab Management Forum.

Biography
Tobias Bausch has been involved in the semiconductor industry since 2005. In 2007 he joined AP&S International GmbH, an international active provider of wet process solutions. In 2015 he moved to his actual function as Director Sales & Marketing. He holds a Master Degree in Technical Management CCI.

Agile performance transformation in semiconductor and beyond

Christian Knochenhauer
Junior Partner
McKinsey & Company

Abstract
The semiconductor industry has always been one of the most innovative industries, driven by super compressed roadmaps and endless customer demand for new products and technologies. On the other hand, due to the maturing industry, and the increasing complexity of players, many organizations have by now become large, increasingly inflexible and sometimes slow. Agility today is the main theme of creating and transforming businesses, and therefore most organizational transformations. While agility is very natural in startup, business building, or digital environments, it is much less obvious to implement in large, complex operations like semiconductor manufacturing. However, a successful agile transformations can enable a sustainable performance and health improvement of the organizations. In this talk, we present our perspective on agile performance transformations. We believe that successful transformations need to combine a stable core of traditional processes with agile elements in selected core areas that are crucial to driving performance. Based on selected examples from successful agile transformation within and outside the semiconductor industry, we outline the key principles and success factors. We conclude with an outlook on further optimization potential and methods.

Biography
Christian Knochenhauer is an Junior Partner in McKinsey's Advanced Industries practice. He focuses on semiconductor and electronics industries, serving clients from the entire value chain, in particular on transformation and strategy topics. He has been co-authoring several of McKinsey's articles on the Internet of Things and the semiconductor industry. Christian holds a Dr.-Ing. degree in RF analog circuit design for optical communications technology, authoring several publications in major IEEE journals and a patent on high-speed integrated circuits for 40Gbit/s optical communications. He studied Electrical Engineering at TU Dresden and General Engineering at Ecole Centrale Paris.