Heinz Kundert
President
SEMI Europe

Biography
Heinz Kundert joined SEMI International, headquartered in San Jose, California as Vice President in 2005 and is acting as President of SEMI Europe with offices in Berlin, Brussels, Grenoble and Moscow. His main mission is to actively support the Microelectronics and related industry towards global competitiveness and sustainable growth. Activities include: industry advocacy, executive and technology conferences, Industry Research & Market Statistics, Roadmaps and Industry Standards. As part of the SEMI mission, Heinz is providing consultancy for SEMI members with the aim to strengthen the global and European-based Microelectronic food-chain. His support is given equally to large Caps and SMEs. Heinz has been in executive positions of stock-listed companies including Oerlikon-Buehrle, Balzers, Leybold and OC Oerlikon (former Unaxis) where he was CEO for several years. Kundert joined the Microelectronics Industry in 1981 and hold managerial functions in General Management, Operations, Sales and R&D. He lived 5 years in Asia. Heinz has a degree in mechanical engineering, education in large cap financing and business administration with a federal diploma from the FAH@University of St.Gallen, Switzerland. hkundert@semi.org

Manfred Kraxenberger
VP
ABB Semiconductors

Biography
Manfred Kraxenberger is currently factory manager for ABB's BiMOS wafer fab and assembly line in Lenzburg, Switzerland. Manfred Kraxenberger studied physical engineering and started working as process engineer at Siemens Semiconductor Munich in 1986. Over the last 25 years, he has held several engineering and management positions in manufacturing as well as R&D at Siemens/Infineon/Qimonda and Globalfoundries. Prior to his current position he was in charge of ABB's Bipolar factory.

Lean : the ST Manufacturing strategy for Efficiency

Rabouin Jean Pierre
Director Lean manufacturing STM Rousset
ST Microelectronics

Abstract
STMicroelectronics Rousset 8 inches fab, 0.18µm to 80 nm, 7800 wafers/week, smiffed and fully automated. In 2008, a comprehensive program of Lean transformation involving manufacturing and support teams started to enhance its industrial competitiveness. Lean principles deployed are summarized in 6 axes (Visual Management, go and see on the shop floor, global vision thinking flow of product, standardization, problem solving and recognition). After 5 years, the 200 lean workshops closed, the new management principles and the new organization improved KPI by of 42% in global equipment down-time, 28% in average lot cycle time, 83% on the external customer claim and 58% on people accident rate. To give a new dynamic, mid-2013, a new program is launched, new vision and new KPI, based on 5 key axes to reinforce lean principles and to go deeper in using tools.

CV of presenting author
1984 ESEO Angers Engineer 1977 - 1985 Incoming inspection manager Thomson Angers 1985 - 1987 QA Fab Manager Thomson Angers 1987 - 1992 EPROM EEPROM Test Engi SGS Thomson Rousset 1992 - 2011 EWS Manager ST Micro Rousset 2011 - 2014 Lean Program manager ST Micro Rousset

Increasing the Automation Level in running Fabs

Lutz Labs
Senior Director Production
Infineon AG

Abstract
Increasing productivity and reducing operational cost is essential for Semiconductor Fabs. Especially, Fabs located in Europe have to compete with Fabs in Asia with lower operator cost. Therefore, automation is one important factor for driving cost efficiency in European fabs. Automation is also seen as enabler for stabilization lot cycle times, flow factor and ensuring high product quality due to less manual intervention. Newest trends in robotics for manufacturing show potentials with regard to human-robot interaction. This allows for collaboration of robots and operators without endanger of human safety and provides flexibility in finding the appropriate degree of automation. State-of-the art automated material handling systems (AMHS) are available for 12" FOUP handling in Front End Factories. However, there is a lack of cost efficient and up-to-date AMHS solutions supporting 8" wafer carrier and box handling for retrofit projects in 8" Fabs. During the last years, Infineon has gathered experience in increasing the automation level in running 8" Fabs. One key question is the strategy how to bring a Fab to a higher automation level and where to start with automation projects - on equipment, work area or Fab level? This paper illustrates pros and cons of automation strategies for running 8" wafer size Fabs. It is shown that ongoing standardization effort is also required for 8" AMHS solutions in order to provide cost efficient automation retrofit projects in 8" wafer size Fabs.

CV of presenting author
EDUCATION: Diplom / M.S. of Physics, University of Jena, Germany, June 1987 EXECUTIVE SUMMARY: - Managing Director of FrontEnd Production in Regensburg/Germany - worked 27 years at Semiconductor R&D and Operations, includes 3 years at Elektromat Dresden and 5 years at DAS GmbH - experience in people management, covering line operating, maintenance engineering, engineering in production and development as well as in fostering cross functional cooperation PATENTS: 2 issued patent

Mobile robots in industrial service robotic applications

Alexander Bubeck
Project Manager
Fraunhofer IPA

Abstract
Today's mobile robots are used in more and more industrial applications. With their flexibility and the latest technical developments in robotics research, mobile robots can also be interesting for applications in semiconductor fabs. As an introduction into the topic the talk will cover the following topics: * Overview of the service robotic market * Concepts and functionalities of mobile robots * Application of mobile robots for handling and logistics * Synergies with the semiconductor industry

CV of presenting author
Alexander Bubeck is a project manager and research associate in the field of mobile manipulation, navigation and software engineering. Having experience in the service robotic industry since 2006, he joined IPA in 2008 after receiving his diploma in Mechatronics at the University Magdeburg, Germany. His research interests are the implementation and analysis of mobile manipulation control algorithms on complex service robot systems and the therefor required management of complex component based software projects. Moreover he is leading multiple national and European research projects at IPA.

Johannes Sturm
Productivity Management Frontend
Infineon Technologies AG

Biography
Physics Diploma at RWTH Aachen in 1991 Dr. rer. nat. at RWTH Aachen in 1993 Several positions at research institutes and companies including TU Berlin and Mühlbauer International, Roding 1998 until 2014 Manager at Infineon Technologies Dresden in different areas, e.g. Burn In, Furnace, WET, Communication and Automation Since 2014 at Infineon Technologies AG, Neubiberg, responsible for Frontend Productivity Management and Automation

Thorsten Widmer
Vice President
Robert Bosch GmbH

CV of presenting author
Dr. Thorsten Widmer was born and educated in Germany. His graduated in physics at TU Braunschweig in 1992. After PhD graduation in Paderborn in 1995 he worked for tree years as post doc at TU Braunschweig. In 1998 he started at Robert Bosch Reutlingen in diode manufacturing area. As section manager he was responsible for the process engineering and international customer support. Between 2003 and 2006 he worked as departmental Manager for Robert Bosch sensor manufacturing in Hatvan Hungary. From Septemer 2006 until 2010 he was the responsible Project Manager for the set up of the new 200 mm semiconductor production at Robert Bosch in Reutlingen. Since October 2010 he is Vice President Wafer Production in Reutlingen.

Operations decision - support for productivity enhancement in a mature Fabs

Peter Lendermann
Managing Director
D-SIMLAB Technologies GmbH

Abstract
In times of increasing competition, especially from Asia, semiconductor manufacturers in Europe have to continuously re-invent themselves with advanced products and new technologies to maintain their competitive edge. Over the years this has been leading to further increasing product mixes as well as decreasing volumes, a trend that is expected to continue in future. At the same time, it is equally important to manage and reduce cost effectively. The increased complexity in combination with fast changes in customer demand often leads to situations where it is not possible to pro-actively manage WIP waves on the production floor because they cannot be detected in advance as a result of short time horizons associated with dispatch rules and scheduling techniques which also are not able to sufficiently portray variability in the line. Moreover, the interdependency between capacity and cycle time also changes continuously, making it more and more difficult to understand capacity entitlements and commit order due-dates to increasingly demanding customers. At the same time, many fabs have already been in operation for decades and as such gone through many rounds of technology changes, modifications and upgrades, often resulting in rather heterogeneous IT infrastructure and data landscapes. This presentation will explain how in this kind of mature-fab environment dynamic decision support solutions for managing WIP flow that were developed in cooperation with Infineon Technologies can be implemented and maintained with reasonable effort and illustrate what kind of productivity enhancements can be achieved.

CV of presenting author
Peter Lendermann is the Co-Founder and CEO of D-SIMLAB Technologies, a Singapore-headquartered company providing simulation-based business analytics, decision support and optimisation solutions and services to Semiconductor Manufacturing, Aerospace and other asset-intensive industries. Peter has been engaged in the simulation community since the early 1990's when he worked in multinational research collaboration at the European Laboratory for Particle Physics CERN (Geneva, Switzerland) and Nagoya University (Japan). In 1996 he joined a German consulting firm where he was responsible for business process re-engineering projects with numerous process manufacturing, aviation and automotive clients in Europe, Canada and China. Since 2000 he led the simulation-related research activities at the Singapore Institute of Manufacturing Technology until spinning them off into D-SIMLAB Technologies in 2007. Peter holds a PhD in Applied High-Energy Physics from Humboldt-University in Berlin (Germany) and an MBA in International Economics and Management from SDA Bocconi in Milan (Italy).

Smart connected sensor devices for the Internet of Things and Services

Thorsten Mueller
CEO
Bosch Connected Devices and Solutions GmbH

Abstract
While the history of the internet was dominated by computer-to-computer communication (Web 1.0) and the emergence of social media (Web 2.0), the internet is currently undergoing its next big transformation. In 2015 three quarter of the world's population will have access to the internet. As both sensor and connectivity cost continuously decrease and wireless networks become pervasively available, the next logical step is to connect everyday objects to the internet. This trend is called Web 3.0 or Internet of Things and Services (IoTS). In order to unlock the full value of this fast growing market, three main elements are required: sensors, software and services - the so called "3S" of IoTS. The Bosch Group is active in all three areas, with Bosch Connected Devices and Solutions being a global provider of smart sensor devices and complete customer solutions. Being a pioneer of micro electromechanical system based sensors (MEMS), which were introduced to the automotive market in the 1990s and have find widespread use in consumer electronics since the mid 2000s, we now capitalize our extensive know how in emerging IoTS markets. Combined with a microprocessor, smart algorithms, use case specific radio technologies and a battery for autonomous operation, these sensor devices will find widespread application in domains like smart homes and buildings, transportation and logistics as well as smart factories and wearable devices. By using this technology Bosch Connected Devices and Solutions gives everyday objects senses. We call it the third wave of sensor application, which is projected to significantly exceed the first two waves (automotive and consumer electronics) in number of deployed devices.

CV of presenting author
Thorsten Mueller was born in Duisburg, Germany in 1977. He holds a Diploma in physics from Gerhard-Mercator-University and a PhD in solid state physics from University Duisburg-Essen. In 2013 he completed the Executive Transition Program at European School of Management and Technology in Berlin. He joined the Bosch Group in 2005. During his first assignments as project manager at Corporate Research, he worked on new types of semiconductor sensors as well as on new manufacturing processes for the size reduction of inertial sensors. In 2008 he joined the business development department of the Automotive Electronics division where he was responsible for strategic planning, mergers & acquisitions as well as the division's venture capital activities. In 2010 he was appointed director engineering for inertial sensors in automotive applications (airbag and ESP). He was one of the co-founders of the internal start-up "Connected Things". After successfully having managed the proof-of-concept phase, he was appointed CEO of the newly founded subsidiary Bosch Connected Devices and Solutions GmbH in December 2013.

Internet of things: Do we see opportunities?

Maarten Willems
Business Director
imec

Abstract
The Internet of Things - Do we see opportunities ? It is hard not to read about sensors and in the broader context about IoT these days. What evolved from internet of computers to internet of people is now being predicted to become the IoT. The IoT device market is predicted to grow from 9.5B$ today to 46B$ in 2024 and may represent about 15% of all data processing capacity globally and I represents 10% of the total market value (Yole). Again, business models will shift from the traditional paradigm which puts more pressure on building the right eco-systems and adopting open innovation models. Traditional HW players in the field of sensors may need to change business models to capture part of this market as it is generally believed that most of the added value in IoT solutions will come from the processing of the generated data. Clearly the value chain will have different players from the electronics industry, which will manufacture the sensing devices to the communication and cloud data storage industry, which will handle data transmission, storage and processing to the service companies, which will valorize the data either through processing or by selling to a third party. If we want to capture the value this opportunity brings to EU then we must be active at all levels of the value chain and bring the relevant eco-system together. I will show what role research and innovation can play by acting as a catalyst and provide a neutral ground for collaboration opportunities having an impact of the different segments of this industry. Collabrations from developing and integrating new sensing modules to new radio standards to new product formfactors and new data analytics are already established and are nice examples of how innovations in the IoT space. A few examples in this space will be described during the talk. These examples show the role a research group can play in an interdisciplinary field of innovation and how we can bring value to our partners.

CV of presenting author
Maarten Willems received the M.S. Degree in Electrotechnical Engineering in 1993 and subsequently the M.S. Degree in Artificial Intelligence in 1994 and an MBA, from the KULeuven. After a career as a solution design engineer at Alcatel Bell, director of engineering at Keyware Technologies, and VP Professional services at GlobalSign, Maarten co-founded Hypertrust in 2000, an internet service company. In 2005, Maarten joined imec as market intelligence group leader. Since 2008, Maarten holds his current position as Business Director in the Smart Systems segment focusing on business development and sales of new sensor technology development and product marketing in the domains of imaging, healthcare and power electronics.