Thursday, November 20, 2025
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Sovereignty Through Skills

15:30
Opening remarks
  Victoria Cummings, Senior Manager, Workforce Development and EU Projects, SEMI Europe
Opening remarks
Victoria Cummings

Victoria Cummings
Senior Manager, Workforce Development and EU Projects
SEMI Europe

Abstract
Europe’s semiconductor industry will face a talent gap of 75,000 professionals by 2030. Addressing skills shortages, attracting and retaining talent, and fostering diversity are essential to sustaining innovation and competitiveness. At the same time, global collaboration is key to building resilient supply chains and advancing technological leadership through the Pilot Lines. This session will explore practical approaches to education, workforce development, cross-border cooperation, and inclusive talent strategies to secure Europe’s position in the semiconductor ecosystem.

Biography
Since joining SEMI Europe in 2023, Victoria manages projects that support workforce development, including the development of educational materials, awareness raising, and programs to improve DEI in the semiconductor sector. Currently, she oversees the European Chips Skills Academy (ECSA) and European Chips Diversity Alliance projects and is involved in several European projects related to skills development and education in microelectronics. Through these projects, Victoria contributes to the creation of targeted programs to attract and upskill talent for the most critical job shortages, assess employment trends and identify barriers to entry for underrepresented groups. Prior to entering the semiconductor industry, Victoria worked as a policy adviser for regulation on financial services and energy markets. She received a master’s degree in political science from Boston University in 2018.

15:35
Horizon Europe ICOS : International Cooperation on Semiconductors for European Economic Resilience
  Francis Balestra, Director of Research, Grenoble INP-CNRS-SiNANO Institute
Horizon Europe ICOS : International Cooperation on Semiconductors for European Economic Resilience

Francis Balestra
Director of Research
Grenoble INP-CNRS-SiNANO Institute

Francis Balestra

Abstract
This presentation will deal with the ICOS CSA project dedicated to International Cooperation On Semiconductors. International cooperation is key for speeding up technological innovation, reducing cost by avoiding duplicated research, boosting the resilience of the semiconductor value and supply chains, and is one of the objectives of the EU Chips Act. The final ICOS results will be highlighted, including the analysis of the semiconductor economic and technological landscapes in Europe and leading semiconductor countries, the identification of the most promising emerging technologies, the proposal of areas for potential cooperation and the opportunities for bilateral or multilateral research collaborations in the fields of advanced functionalities and computing.

Biography
BALESTRA Francis, CNRS Research Director at CROMA, is Director Emeritus of the European SiNANO Institute and Chair of IEEE Electron Device Society France, and has been Director of several Research labs. He coordinated many European Projects (ICOS, NEREID, NANOFUNCTION, NANOSIL, etc.) that have represented unprecedented collaborations in Europe in the field of Nanoelectronics. He founded and organized many international Conferences, and has co-authored more than 500 publications. He is member of several European Scientific Councils, of the Advisory Committees of International Journals and of the IRDS (International Roadmap for Devices and Systems) International Roadmap Committee as representative of Europe.

15:50 Panel discussion

Chips JU & Pilot Lines

Panelists
  • Stephan Guttowski, Managing Director of the Research Fab Microelectronics Germany (FMD), Research Fab Microelectronics Germany (FMD)
  • Stephan Guttowski
    Managing Director of the Research Fab Microelectronics Germany (FMD)
    Research Fab Microelectronics Germany (FMD)

    Stephan Guttowski

    Biography
    Stephan Guttowski studied electrical engineering at TU Berlin and subsequently earned a doctorate in the field of electromagnetic compatibility. This was followed by a postdoctoral position at Massachusetts Institute of Technology (MIT) in Cambridge, USA. After his return, he initially worked in the Electric Drives Research Laboratory of DaimlerChrysler AG before moving to the Fraunhofer Institute for Reliability and Microintegration IZM in 2001. At IZM, he was initially head of the Advanced System Development Group before taking over at the System Design & Integration department. From June 2017 to December 2020, he was Technology Park Manager for Heterointegration at the Research Fab Microelectronics Germany (FMD). Since January 2021, he has led the joint office of the Fraunhofer Group for Microelectronics and FMD.

  • Dominique Noguet, FAMES Pilot Line Project Coordinator, CEA-Leti
  • Dominique Noguet
    FAMES Pilot Line Project Coordinator
    CEA-Leti

    Dominique Noguet

    Biography
    Dominique Noguet holds an engineering degree of the National Institute of Applied Sciences (INSA) in electrical engineering in 1992, and a PhD from National Polytechnic Institute of Grenoble (INPG) in 1998 (awarded best INPG PhD of the year). He started his carrier as a digital IC designer for telecommunication applications and then project manager in the same field. He led many projects at a national level (coordination of ANR projects) and in several European frameworks (FP5, FP6, FP7) He has been a key member of several IEEE standard groups and was subsequently elevated to the grade of IEEE Senior Member for his contributions. In parallel he held managerial positions at CEA-Leti as lab manager and department manager. In January 2023, he was appointed project manager for the French ‘France 2030’ flagship project NextGen on FD-SOI advanced nodes and reports to CEA-Leti’s CEO since then. He is currently the project coordinator of the Chips JU FAMES Pilot Line. Dominique has authored or co-authored more than 100 scientific papers (several best paper awards), book chapters and holds 20 patents.

  • Inge Asselberghs, Strategic Development Director, IMEC
  • Inge Asselberghs
    Strategic Development Director
    IMEC

    Inge Asselberghs

    Biography
    Coming Soon

  • Valerio Pruneri, Director, PixEurope
  • Valerio Pruneri
    Director
    PixEurope

    Valerio Pruneri

    Biography
    Soon

  • Francesco La Via, SiC Epitaxial Growth
  • Francesco La Via

    SiC Epitaxial Growth

    Francesco La Via

    Biography
    Soon

16:35
European Chips Skills Academy
  Victoria Cummings, Senior Manager, Workforce Development and EU Projects, SEMI Europe
European Chips Skills Academy
Victoria Cummings

Victoria Cummings
Senior Manager, Workforce Development and EU Projects
SEMI Europe

Abstract
The European Chips Skills Academy (ECSA) continues to play a pivotal role in addressing Europe’s microelectronics talent and skills challenges. In 2024, ECSA released its landmark Skills Strategy, providing the most comprehensive analysis to date of current and emerging skills needs across the semiconductor value chain. The report identifies critical gaps in advanced manufacturing, design, and systems integration, and outlines actionable strategies to strengthen Europe’s semiconductor workforce pipeline. Now in 2025, DECISION has updated the report to follow up on emerging trends and streer ECSA's strategic vision. Building on these insights, ECSA is expanding its collaborative ecosystem through the European Chips Skills (ECS) Alliance—a growing network of over 200 members from industry, academia, and public bodies. The Alliance operates through three dedicated working groups focused on (1) skills intelligence, (2) education and training innovation, and (3) DEI which will launch at the end of 2025. Together, these initiatives aim to create a sustainable, competitive, and inclusive European semiconductor skills landscape that supports the ambitions of the EU Chips Act and ensures Europe’s technological sovereignty.

Biography
Victoria Cummings joined SEMI Europe in 2023, where she leads initiatives in workforce development and coordinates European projects in the semiconductor sector. In her current role, Victoria acts as the Coordinator for the European Chips Skills Academy (ECSA) project—overseeing its implementation, stakeholder engagement, and alignment with industry and institutional actors across Europe. She is also involved in multiple complementary efforts linked to skills development and diversity in microelectronics. Before joining SEMI, Victoria served as a policy adviser working on EU regulation in areas such as financial services and energy markets. She holds a Master’s degree in Political Science from Boston University (2018).

16:55
Embedding Inclusion in Europe’s Semiconductor Strategy: Insights from ECDA
  Kartikey Srivastava, Senior Specialist, Communications, SEMI Europe
Embedding Inclusion in Europe’s Semiconductor Strategy: Insights from ECDA

Kartikey Srivastava
Senior Specialist, Communications
SEMI Europe

Abstract
Europe’s ambition to lead in semiconductors depends not only on growing the talent pool, but on ensuring that talent reflects the full diversity of Europe’s population. The European Chips Diversity Alliance is tackling this challenge by working to build a more inclusive and equitable semiconductor ecosystem. Through collaboration between academia, industry, and underrepresented communities, ECDA is helping to dismantle barriers to entry, drive culture change, and ensure that opportunities in chips are open to all.This talk will share findings from ECDA’s first DEI Report, highlighting the current state of this topic in Europe’s semiconductor industry and areas for action. It will also explore how ECDA is embedding inclusion into the future of chips, and how these efforts complement broader skills and sovereignty goals across the European semiconductor landscape.

Biography
Kartikey Srivastava is a Senior Specialist - Communications at SEMI Europe, where he focuses on strategic dissemination and exploitation efforts for several high-impact Erasmus+ and Horizon Europe projects, including HiCONNECTS, the European Chips Skills Academy, the European Chips Diversity Alliance, and METIS4Skills. His work has a strong emphasis on increasing the visibility, outreach, and long-term impact of EU-funded initiatives in the semiconductor and microelectronics sectors. At SEMI Europe, Kartikey develops and implements comprehensive communication strategies, creates compelling narratives for stakeholder engagement, and ensures alignment with project objectives and European Commission guidelines. He holds an MBA from ESMT Berlin, and a Master’s degree in International Political Economy from King’s College London.

17:10 Reserved
17:25 Closing remarks by Session Chair, Senior Manager, Workforce Development and EU Projects, SEMI Europe