Welcome

Katrien Marent
EVP & Chief Marketing and Communications Officer
imec

Abstract
Coming Soon

Biography
Katrien Marent has an engineering degree in microelectronics. She joined imec in 1992 as analog design engineer and specialized in design of low-noise readout electronics for high-energy physics. In 1999, she became press responsible and scientific editor at imec's business development division and was responsible for authoring and editing the research organization's numerous company technical documents and publications. In 2001, she was appointed corporate communications director at imec. Her responsibilities expanded in August 2007, when she got the position of external communications director including corporate, marketing and outreach communications. In October 2016, she became VP corporate, marketing and outreach communication. Since April 2020 she is Executive Vice President & Chief Marketing and Communications Officer and member of the executive board of imec.

It’s time to futureproof our prosperity by superfueling innovation, enabling next-gen AI

Luc Van den hove
President & CEO
imec

Abstract
The AI field is evolving at an incredibly fast pace, with major models and updates being released almost every month. As these models evolve beyond Large Language Models towards next-gen AI with advanced reasoning capabilities, compute systems struggle to handle the heterogeneous workloads in a performant and sustainable way. However, developing new, AI-optimized compute architectures and the enabling semiconductor technologies takes much more time than writing algorithms. To prevent bottlenecks slowing down AI-based advancements, we must reinvent compute architectures and semiconductor technology platforms.

Biography
Luc Van den hove is President and CEO of imec since July 1, 2009. Before he was executive vice president and chief operating officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies.In 1988, he became manager of imec’s micro-patterning group (lithography, dry etching); in 1996, department director of unit process step R&D; and in 1998, vice president of the silicon process and device technology division. In January 2007, he was appointed as imec's EVP & COO. Luc Van den hove received his PhD in electrical engineering from the KU Leuven, Belgium.In 2023, he was honored with the Robert N. Noyce medal for his leadership in creating a worldwide research ecosystem in nanoelectronics technology with applications ranging from high-performance computing to health.He has authored or co-authored more than 200 publications and conference contributions.

Nanopores in health: Where silicon meets biology

Silvia Lenci
Principal Member of Technical Staf
imec

Abstract
The convergence of semiconductor innovation and biomedical science is unlocking a variety of opportunities in healthcare diagnostics and therapeutics. Solid-state nanopores—nanoscale apertures fabricated in silicon-based membranes—represent a compelling frontier where advanced logic, integration, and materials engineering intersect with molecular biology. These devices enable label-free, single-molecule detection with high throughput. Unlike biological nanopores, solid-state variants benefit from CMOS-compatible fabrication, tunable geometry, and integration with photonic and electronic readout systems. Recent advances in nanofabrication, surface functionalization, and machine learning-driven signal processing have significantly enhanced their sensitivity, selectivity, and robustness. Imec’s leadership in semiconductor process innovation and integrated photonics provides a strategic advantage in accelerating the deployment of solid-state nanopore technologies across healthcare ecosystems. By leveraging its existing infrastructure for advanced logic nodes and heterogeneous integration, imec is pioneering scalable, cost-effective biosensing platforms that address global challenges including early disease detection, antimicrobial resistance, and pandemic preparedness.This presentation will showcase how imec’s semiconductor R&D ecosystem—traditionally focused on computing and mobility—is now catalyzing innovation in health. By leveraging imec’s strengths in chip manufacturing and system integration, solid-state nanopores exemplify how deep-tech can be harnessed to address global healthcare challenges. The talk aims to inspire cross-sector collaboration and highlight pathways for industrial deployment of silicon-based biosensing technologies.

Biography
Silvia Lenci graduated in Electronic Engineering at the University of Pisa (Italy) with a Master Degree in 2006, and a PhD in 2010, focusing on MEMS and bioMEMS. After her PhD, she started her career in imec Leuven as device and process engineer in GaN power electronics and sensors. She continued as integration engineer and project manager in the field of microfluidics, photonics, optics and MEMS, fabricated in the CMOS-compatible imec fabs. She is today project manager in solid state nanopore technology, focusing on the chip fabrication in fab. Bringing technology to life is her passion. Multidisciplinary interaction with processing, design, tape out and characterization teams is the core of her daily work.

Microelectronic solutions for ultra low current – low noise - high bandwidth nanopore sensing

Federico Thei
CEO & Founder
Elements srl

Abstract
Solid-state nanopores, nanoscale apertures fabricated in silicon-based membranes, represent a promising breakthrough in next-generation biosensing technology. As analytes pass through nanopores, they generate weak electrical signals—unique current fingerprints that can be used for precise molecular identification. Capturing these signals without sacrificing sensitivity or bandwidth presents a significant microelectronic challenge.ELEMENTS SRL, an Italian company specializing in ASIC design for ultra-low current sensing, addresses this challenge by developing high-precision electronic systems capable of measuring currents in the sub-nanoampere and picoampere range. Their portfolio includes both turnkey instruments and OEM solutions tailored to demanding sensing applications.As a technology partner for imec’s solid-state nanopore system development, ELEMENTS provides the electronic infrastructure enabling high-throughput, high-bandwidth current sensing and real-time data processing for single-molecule protein sequencing.This presentation will explore the key design strategies and challenges in CMOS microelectronics for nanopore applications, focusing on low-noise analog front-ends, wide-bandwidth performance in the MHz range, and scalable data acquisition systems. We will highlight how optimized electronic design can unlock the full potential of nanopore technology for early disease detection and proteomic applications, paving the way for faster, more accurate molecular diagnostics.

Biography
Dr. Federico Thei is CEO and Founder at Elements srl (Italy) since 2014, responsible for strategic business development, new products concept design and industrial partnerships building, focusing on enabling nanopore technology to industrial applications.Graduated in Telecommunication Engineering in 2007, he received the Ph.D. in Information and Communication Technologies in 2011 at the University of Bologna, Italy, with a research activity focused on low noise microelectronics systems for nanopore and biosensors readout.He was visitor Ph.D. student at the University of Southampton (UK), University of Twente (NL) and several EU Companies in the electrophysiology field. For four years he was assistant professor for the electronic engineering course “Electronic digital systems” at the University of Bologna.He attended in 2015 the Technology Venture Launch Program Express in Menlo Park, Silicon Valley, winning the final pitch competition. In 2018 he attended The Business side of Biomedical Start-ups course at the University of Bocconi, Milan. In 2025 he received the American Innovation prize from the Italian – USA foundation.Coauthor of patents and papers in the microelectronic and nanopore field, he builds strong partnerships with Companies and research centers across the world, like EPFL, IMEC, Stanford NF, Bosch, offering the most advanced microelectronic solution for low noise and high bandwidth nanopore readout.

Driving European semiconductor leadership: A chiplet-based approach for the automotive sector

Dieter Hoffend
Business Director Automotive Sector
imec

Abstract
The automotive industry is transitioning from combustion engines to: - Electrified powertrains- Safe, connected and autonomous driving-Enhanced in-cabin experiences.Advanced semiconductors are needed to support this transition in automotive applications.The compute performance required to enable autonomous driving is increasing, as are the development costs for advanced nodes. This is in sharp contrast to the number of cars produced annually (approx. 90 million units).Chiplets offer an opportunity to disaggregate large, monolithic semiconductor designs, making them more flexible and cost-effective. Specifically for automotive applications, most of today's semiconductors are legacy nodes that have been developed and hardened for automotive use over several decades. Integrating these semiconductors with the latest CPU and GPU technologies enables the required performance to be achieved while dealing with boundary conditions in terms of market size and specific automotive requirements.Chiplets are already widely used in various computing applications, ranging from client devices (e.g. notebooks) to HPC platforms.With 40 years of semiconductor R&D leadership, imec's Automotive Chiplet Program aims to reduce risk and accelerate semiconductor innovation in the automotive sector. The program will develop quality and reliability measures, drive standard interfaces between chiplets, and build reference architectures with the support of ACP partners. The aim is to develop chiplet-based reference designs that can be industrialised by the automotive ecosystem.

Biography
Dieter Hoffend is Business Director for the Automotive Sector at imec, where he leads strategic initiatives in chiplet technology and edge AI for the automotive industry. Based in Munich, he joined imec in February 2025, bringing more than 30 years of international experience in semiconductors, automotive electronics, and business leadership.Before joining imec, Hoffend built a distinguished career at Intel Corporation. He played a pivotal role in shaping Intel’s entry into the automotive market, serving on a three-person team that launched the company’s automotive strategy in 2005. This work set the foundation for Intel’s efforts in in-vehicle infotainment, advanced driver assistance systems (ADAS), and autonomous driving, and became a model for the broader semiconductor industry’s engagement with the automotive sector.Hoffend went on to lead Intel’s automotive sales in Europe, covering IT, connectivity, and Industry 4.0 and manufacturing solutions. He managed global relationships with major automotive OEMs and Tier-1 suppliers, driving significant growth and fostering long-term strategic partnerships. His leadership also extended to high-level collaborations with IT OEMs such as Hewlett Packard, Fujitsu Siemens Computers, and MEDION AG, as well as establishing Intel’s Foundry Services Business Development organization.Recognized for his ability to navigate complex markets and cultivate executive-level relationships, Hoffend has consistently delivered growth and innovation in highly competitive technology-based environments.

Essential chips made globally, trusted in Europe

Manfred Horstmann
General Manager and Senior Vice President
GlobalFoundries

Abstract
The presentation will tackle Global Foundries' diverse technology portfolio for essential chips; the idea of a European secure flow and the supply chain resilience by a multi-site concept.

Biography
Manfred Horstmann serves as General Manager and Senior Vice President at GlobalFoundries (GF), overseeing European fabs, including GF’s 300mm manufacturing facility in Dresden. He also leads the GlobalFoundries Engineering Services (GFES) teams in Singapore, Penang, Bangalore, and Malaysia, supporting GF’s global manufacturing operations.Since 2020, he has transformed the Dresden Fab cluster into Europe’s largest 300mm wafer facility, achieving a two and a half output increase in less than three years, boosting productivity and strategically optimizing operations. He and his team led the development and production of a highly differentiated technology portfolio (55nm-22nm) for applications in fast growing markets such as automotive, MCUs, display drivers, audio amplifiers, security chip cards, radio frequency (RF) and 5G technology.With over 27 years of experience in multiple leadership positions in spanning research, technology development, product engineering, and large-scale operations, Mr. Horstmann has held leadership roles at Advanced Micro Devices (AMD), Motorola, and IBM in Germany and the United States.Mr. Horstmann holds over 100 patents, has authored more than 200 scientific papers and serves on advisory boards for Forschungszentrum Jülich and Nanoelectronic Materials Laboratory. Mr. Horstmann earned his Diploma and PhD in Physics from Rheinisch-Westfälische Technische Hochschule (RWTH) Aachen.

Beyond Moore, into mission: imec innovations shaping next-gen resilience

Nik Van den Wijngaert
VP Aerospace & Security
imec

Abstract
As the security and defense industry accelerates into deep technology, it is essential to develop effective innovation pipelines that can transform early-stage research and dual-use technologies into industrial capabilities, with sufficient absorption capacity to realise their potential. Imec is in the initial stages of engaging with the security sector, yet our roadmap already indicates significant advances in resilience, including earlier detection, smarter computing, and improved communication under stress with tighter SWaP (Size, Weight, and Power). This talk surveys a few promising areas, focusing on what makes them disruptive, the step changes they target and their current level of maturity.

Biography
Coming Soon

Dual use semiconductor technologies for enhanced European defense capabilities

José Miguel Pascual Ruiz
Innovation Centres Director
INDRA

Abstract
This presentation reviews the role of semiconductor technology as a key enabler in defense applications. The critical needs and requirements for the application of this technology are examined, as well as the dual technologies approach, which is seen as an opportunity to enable access to the defense industry for these components. The relationship with the entire ecosystem, from tools and machinery to research, design and manufacturing, is also discussed, as is the need for talent in semiconductor technology and its system application to enable the development of innovative capabilities by leveraging the use of semiconductors and improving different approaches, such as RF, mixed signal, electronics, photonics and quantum, and their integration.

Biography
Telecom Engineer from the Madrid Polytechnic University (ETSIT-UPM), (Ingeniería Superior, 6 year degree, Msc), since 1989.He has developed his full professional career since then in Indra where he has developed technology innovations on the Sensor and Radar Signal Intelligence fields (SIGINT/ELINT). Among these technologies can be the introduction of ultrawideband Digital Reception capability UW-DRX, Digital Radiofrequency Memories (DRFM) and its application on countermeasures techniques, together with analysis systems currently deployed on the Indra’s EW/Intelligence systems.He has been involved in most of the national EW programs since the date including intelligence systems (large body aircraft ELINT, naval systems and ground base acting as System Engineer and Technical Director on the complete lifespan cycle from proposal to field testing, and maintenance). Also, on the development and deployment of RWR/SPJ systems on fighter aircraft as F18, ALR-400 RWR suite and ALQ-500 Self Protection Jammer, or rotary wing platforms, and on high performance naval ESM systems deployed on Spanish Navy and other countries.Also has participated in multiple international programs, on export and collaboration activities and as Technical Director on the ALR-400M version of RWR deployed on A400M.He has participated in NATO NIAG (NATO Industrial Advisory Group) studies on Future Electronic Support Systems and Geolocation Systems, and delivered speeches and courses on multiple universities, military academies and AOC Symposia (Association of Old Crows, member since 1999). Presently participating as contact between NIAG and Science & Technology Organization (STO).Long time on charge of the Technology Areas in Indra leading the development of technological Building Blocks for the Transport & Defense Product activities. Including dual use technologies as Electronics (microelectronics and electronic design), Radiofrequency, Antenna, Microwave and Signal Processing.Presently as Innovation Centres Director, in charge of the Technology Acquisition department working on the elaboration and review of technology roadmaps and activities with impact on the product roadmaps (as example impact of SIP/Microelectronics technologies, Quantum, Photonics and new materials and manufacturing processes are part of this strategy).Member of the Indra’s Innovation Board, also coordinating the technology strategy with digital technologies and other product/activity lines in the company.Areas of interest include Systems Engineering, Manufacturing methods, RF, MW, Signal Processing, IA, Quantum and Photonics.

Enviromentally aware IC chip manufacturing

Emily Gallagher
Program Director
imec

Abstract
Imec’s approach to embedding sustainability into semiconductor R&D is shared. imec has developed the imec.netzero platform to quantify environmental impacts at fab, technology and process levels, enabling data-driven decisions throughout the IC manufacturing value chain. More recently, imec introduced the e-score metric to enable simple communication of environmental impact without demanding a background in LCA (Life Cycle Analysis) or the ESG (Environmental, Social, and Governance) framework for evaluating a company's performance beyond traditional financial metrics. The e-score methodology will be used to illustrate how imec’s SSTS program prioritizes development activities in the fab. Starting with the identification of technology hotspots, examples of work on high impact processes, and the quantification of potential impact reduction will be described. Finally, the benefits of sustainable development beyond the environment will be described.

Biography
Emily Gallagher is a director of the SSTS (Sustainable Semiconductor Technologies and Systems) program at imec, focusing on sustainability in semiconductor manufacturing processes. Emily earned her PhD in physics from Dartmouth College where she studied free electron lasers. After graduation, she joined IBM and became immersed in semiconductor technology. She held many roles at IBM from functional IC chip characterization to wafer process integration, to leading the EUV photomask development effort. She joined imec in 2014 to continue EUV development work. Emily has authored over 120 technical papers, holds ~30 patents, is an SPIE Fellow, cochairs the Scientific Advisory Board of the Advanced Research Center for Nanolithography (ARCNL) and is active in international organizations like SEMI's Semiconductor Climate Consortium and the PFAS Consortium.

Enabling the European supply chain

Philippe Soussan
Technology Portfolio Director
imec

Abstract
The semiconductor industry has long operated within the realm of a fully global economy. This vision has led to major investments and cost rationalization on a global scale. This was made possible thanks to the technology segmentation, starting from design flow all the way up to packaging and test, via silicon manufacturing in specialized infrastructure and location. This pre-AI model, which is very consumer-centric, has prevailed for the last three decades. However, the emergence of the pandemic, geopolitical tensions, and access to energy, has made it increasingly evident that the risks and stakes are too high when it comes to supply chains and sovereignty. Furthermore, relentless innovation calls for a new type of complex products. New applications in AI and specialized sensing will demand a far more complex technology setting, where specialty technologies become as important as ASICs, where heterogenous integration is a must, and where low-volume manufacturing is as essential as a path to large-scale production. This is not how the industry looks like today, and it presents a significant opportunity for Europe. At imec, we believe that it is equally important to bridge the gap between academia and industry in terms of technology maturity but also in terms of access to all the necessary technologies and services to support future product design and manufacturing in a European context. Europe has historically proven to be a stronghold for industry and high-end equipment, but is that enough? What does it take to enable a fully integrated European supply chain? Please join us to gain insight into how technology can enable the European supply chain!

Biography
For 20 years Philippe Soussan has held different position in R&D management in imec in the field of sensors, photonics, 3D packaging. Addressing these technologies from R&D up to manufacturing levels. His background deals with wafer scale technologies, authoring over 100 publications, and holding more than 20 patents in these fields.From 2007 till 2011, he has led the group “Packaging, Microsystems and Hybrid Technology”. The group dealt with complex process integration using 3D interconnects, advanced packaging and micro fabrication of scaling and non-scaling driven components. In 2011, he became program manager for the smart system division of IMEC, which mission is to enable novel product in the field of More than Moore, such as sensors, microsystems in the field of RF and opto-electronics. In 2019, he was program director in the field of integrated photonics for sensing applicationsSince 2024, Philippe is in charge of strategy definition for IC-link by imec. This imec business line provides an access to design and manufacturing services in the most advanced ASIC and specialty technologies.

Introduction to the panel - Securing Europe’s future: Pilot lines at the heart of innovation

Pierre Chastanet
Head of the Unit for Microelectronics and Photonics
European Commission

Abstract
To help Europe maintain its leadership in semiconductor technology, the Chips for Europe initiative has launched a series of pilot lines. These pilot lines are instrumental in supporting Europe’s ambition to drive innovation across transformative domains such as artificial intelligence, machine learning, healthcare, and automotive, among others, each reshaping the future of semiconductor design and manufacturing. This high-level panel will highlight the strategic importance of pilot lines in enhancing competitiveness across key sectors, including health, automotive, and security, while aligning with European priorities and ensuring the effective use of public investment. Representatives from Chips JU, imec, Leti, and Fraunhofer will share key developments from Europe’s three flagship pilot lines, with a focus on enhancing accessibility, fostering cross-border collaboration, and increasing industry engagement. The discussion will also explore the broader innovation ecosystem, highlighting efforts in talent development, the role of competence centers, and the contributions of the EU project aCCCes to bridge Europe’s skills gap. This session brings together leading voices from research, industry, and policy to explore how pilot lines accelerate breakthrough technologies and serve as a cornerstone for Europe’s long-term technological sovereignty and global competitiveness.

Biography
Pierre Chastanet is Head of the Unit for Microelectronics and Photonics at the European Commission, where he manages the development of European semiconductor policy and the implementation of the European Chips Act.Mr. Chastanet has been working for over 18 years in the European Commission, supervising different digital policies in the areas of cloud, data flows, software, cybersecurity, privacy, green ICT, and telecom innovation.Prior to that, Mr. Chastanet gained more than 10 years of ICT experience, mostly in various IT management positions in a large multinational company.He graduated from Telecom ParisTech, the Free University of Brussels, and the London School of Economics and Political Science. He also earned a Leadership Executive Certificate from Harvard Kennedy School of Government.

Frank Holsteyns
VP R&D Unit Process & Modules
imec

Biography
Frank Holsteyns has been serving as the VP of R&D at imec, leading the Unit Process and Module Department since July 1, 2023. Before stepping into this role, he was the director of the same department, where he managed various process-development-focused groups, including surface and interface processing, etch, thin film deposition, epitaxy, plating, chemical mechanical polishing, layer transfer, and assembly.Frank's journey at imec began in 2000, where he concentrated on wet cleaning research for semiconductor devices. His work in this area culminated in a PhD in Bio Engineering (surface chemistry) from KU Leuven, Belgium. In 2006, he transitioned to Lam Research AG in Villach, Austria, as a research scientist. There, he coordinated a university and research network focused on fluid dynamics, particularly cavitation, droplet impact, wetting, and dewetting.In 2012, Frank returned to imec, taking on the role of manager for the Surface and Interface Processing Group. In this position, he specialized in wet clean and etch processes, as well as isotropic dry etches.