Welcome

Katrien Marent
EVP & Chief Marketing and Communications Officer
imec

Abstract
Coming Soon

Biography
Katrien Marent has an engineering degree in microelectronics. She joined imec in 1992 as analog design engineer and specialized in design of low-noise readout electronics for high-energy physics. In 1999, she became press responsible and scientific editor at imec's business development division and was responsible for authoring and editing the research organization's numerous company technical documents and publications. In 2001, she was appointed corporate communications director at imec. Her responsibilities expanded in August 2007, when she got the position of external communications director including corporate, marketing and outreach communications. In October 2016, she became VP corporate, marketing and outreach communication. Since April 2020 she is Executive Vice President & Chief Marketing and Communications Officer and member of the executive board of imec.

Opening Keynote

Luc Van den hove
President & CEO
imec

Abstract
The AI field is evolving at an incredibly fast pace, with major models and updates being released almost every month. As these models evolve beyond Large Language Models towards next-gen AI with advanced reasoning capabilities, compute systems struggle to handle the heterogeneous workloads in a performant and sustainable way. However, developing new, AI-optimized compute architectures and the enabling semiconductor technologies takes much more time than writing algorithms. To prevent bottlenecks slowing down AI-based advancements, we must reinvent compute architectures and semiconductor technology platforms. The presentation will shed light on the need for flexible, versatile compute architectures implemented in flexible, versatile technology platforms while addressing the increasing challenges of density, power and memory. To speed up both advanced semiconductor technology R&D and full stack innovation for future AI applications, imec is expanding its pilot line infrastructure under the EU Chips Act. Next to new infrastructure, imec aims to boost innovation through intensified collaborations with complementary knowledge partners and through further internationalization, attracting global talent and building strong, local ecosystems for diverse application domains, like health and automotive. Transformative innovations for humankind hinge on the innovation pace of the semiconductor industry. It’s time to supercharge our innovation engine, it’s time to futureproof our prosperity.

Biography
Luc Van den hove is President and CEO of imec since July 1, 2009. Before he was executive vice president and chief operating officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies.In 1988, he became manager of imec’s micro-patterning group (lithography, dry etching); in 1996, department director of unit process step R&D; and in 1998, vice president of the silicon process and device technology division. In January 2007, he was appointed as imec's EVP & COO. Luc Van den hove received his PhD in electrical engineering from the KU Leuven, Belgium.In 2023, he was honored with the Robert N. Noyce medal for his leadership in creating a worldwide research ecosystem in nanoelectronics technology with applications ranging from high-performance computing to health.He has authored or co-authored more than 200 publications and conference contributions.

Nanopores in Health: Where Silicon Meets Biology

Silvia Lenci
Principal Member of Technical Staf
imec

Abstract
The convergence of semiconductor innovation and biomedical science is unlocking a variety of opportunities in healthcare diagnostics and therapeutics. Solid-state nanopores—nanoscale apertures fabricated in silicon-based membranes—represent a compelling frontier where advanced logic, integration, and materials engineering intersect with molecular biology. These devices enable label-free, single-molecule detection with high throughput. Unlike biological nanopores, solid-state variants benefit from CMOS-compatible fabrication, tunable geometry, and integration with photonic and electronic readout systems. Recent advances in nanofabrication, surface functionalization, and machine learning-driven signal processing have significantly enhanced their sensitivity, selectivity, and robustness. Imec’s leadership in semiconductor process innovation and integrated photonics provides a strategic advantage in accelerating the deployment of solid-state nanopore technologies across healthcare ecosystems. By leveraging its existing infrastructure for advanced logic nodes and heterogeneous integration, imec is pioneering scalable, cost-effective biosensing platforms that address global challenges including early disease detection, antimicrobial resistance, and pandemic preparedness.This presentation will showcase how imec’s semiconductor R&D ecosystem—traditionally focused on computing and mobility—is now catalyzing innovation in health. By leveraging imec’s strengths in chip manufacturing and system integration, solid-state nanopores exemplify how deep-tech can be harnessed to address global healthcare challenges. The talk aims to inspire cross-sector collaboration and highlight pathways for industrial deployment of silicon-based biosensing technologies.

Biography
Silvia Lenci graduated in Electronic Engineering at the University of Pisa (Italy) with a Master Degree in 2006, and a PhD in 2010, focusing on MEMS and bioMEMS. After her PhD, she started her career in imec Leuven as device and process engineer in GaN power electronics and sensors. She continued as integration engineer and project manager in the field of microfluidics, photonics, optics and MEMS, fabricated in the CMOS-compatible imec fabs. She is today project manager in solid state nanopore technology, focusing on the chip fabrication in fab. Bringing technology to life is her passion. Multidisciplinary interaction with processing, design, tape out and characterization teams is the core of her daily work.

Microelectronic solutions for ultra low current – low noise - high bandwidth nanopore sensing

Federico Thei
CEO & Founder
Elements srl

Abstract
Solid-state nanopores, nanoscale apertures fabricated in silicon-based membranes, represent a promising breakthrough in next-generation biosensing technology. As analytes pass through nanopores, they generate weak electrical signals—unique current fingerprints that can be used for precise molecular identification. Capturing these signals without sacrificing sensitivity or bandwidth presents a significant microelectronic challenge.ELEMENTS SRL, an Italian company specializing in ASIC design for ultra-low current sensing, addresses this challenge by developing high-precision electronic systems capable of measuring currents in the sub-nanoampere and picoampere range. Their portfolio includes both turnkey instruments and OEM solutions tailored to demanding sensing applications.As a technology partner for imec’s solid-state nanopore system development, ELEMENTS provides the electronic infrastructure enabling high-throughput, high-bandwidth current sensing and real-time data processing for single-molecule protein sequencing.This presentation will explore the key design strategies and challenges in CMOS microelectronics for nanopore applications, focusing on low-noise analog front-ends, wide-bandwidth performance in the MHz range, and scalable data acquisition systems. We will highlight how optimized electronic design can unlock the full potential of nanopore technology for early disease detection and proteomic applications, paving the way for faster, more accurate molecular diagnostics.

Biography
Dr. Federico Thei is CEO and Founder at Elements srl (Italy) since 2014, responsible for strategic business development, new products concept design and industrial partnerships building, focusing on enabling nanopore technology to industrial applications.Graduated in Telecommunication Engineering in 2007, he received the Ph.D. in Information and Communication Technologies in 2011 at the University of Bologna, Italy, with a research activity focused on low noise microelectronics systems for nanopore and biosensors readout.He was visitor Ph.D. student at the University of Southampton (UK), University of Twente (NL) and several EU Companies in the electrophysiology field. For four years he was assistant professor for the electronic engineering course “Electronic digital systems” at the University of Bologna.He attended in 2015 the Technology Venture Launch Program Express in Menlo Park, Silicon Valley, winning the final pitch competition. In 2018 he attended The Business side of Biomedical Start-ups course at the University of Bocconi, Milan. In 2025 he received the American Innovation prize from the Italian – USA foundation.Coauthor of patents and papers in the microelectronic and nanopore field, he builds strong partnerships with Companies and research centers across the world, like EPFL, IMEC, Stanford NF, Bosch, offering the most advanced microelectronic solution for low noise and high bandwidth nanopore readout.

Driving European Semiconductor Leadership: A Chiplet-Based Approach for the Automotive Sector

Dieter Hoffend
Business Director Automotive Sector
imec

Abstract
Coming Soon

Biography
Dieter Hoffend is Business Director for the Automotive Sector at imec, where he leads strategic initiatives in chiplet technology and edge AI for the automotive industry. Based in Munich, he joined imec in February 2025, bringing more than 30 years of international experience in semiconductors, automotive electronics, and business leadership.Before joining imec, Hoffend built a distinguished career at Intel Corporation. He played a pivotal role in shaping Intel’s entry into the automotive market, serving on a three-person team that launched the company’s automotive strategy in 2005. This work set the foundation for Intel’s efforts in in-vehicle infotainment, advanced driver assistance systems (ADAS), and autonomous driving, and became a model for the broader semiconductor industry’s engagement with the automotive sector.Hoffend went on to lead Intel’s automotive sales in Europe, covering IT, connectivity, and Industry 4.0 and manufacturing solutions. He managed global relationships with major automotive OEMs and Tier-1 suppliers, driving significant growth and fostering long-term strategic partnerships. His leadership also extended to high-level collaborations with IT OEMs such as Hewlett Packard, Fujitsu Siemens Computers, and MEDION AG, as well as establishing Intel’s Foundry Services Business Development organization.Recognized for his ability to navigate complex markets and cultivate executive-level relationships, Hoffend has consistently delivered growth and innovation in highly competitive technology-based environments.

Space and Security Applications (title to be confirmed)

Nik Van den Wijngaert
VP Aerospace & Security
imec

Abstract
Coming Soon

Biography
Coming Soon

Enviromentally aware IC chip manufacturing

Emily Gallagher
Program Director
imec

Abstract
Coming Soon

Biography
Emily Gallagher is a director of the SSTS (Sustainable Semiconductor Technologies and Systems) program at imec, focusing on sustainability in semiconductor manufacturing processes. Emily earned her PhD in physics from Dartmouth College where she studied free electron lasers. After graduation, she joined IBM and became immersed in semiconductor technology. She held many roles at IBM from functional IC chip characterization to wafer process integration, to leading the EUV photomask development effort. She joined imec in 2014 to continue EUV development work. Emily has authored over 120 technical papers, holds ~30 patents, is an SPIE Fellow, cochairs the Scientific Advisory Board of the Advanced Research Center for Nanolithography (ARCNL) and is active in international organizations like SEMI's Semiconductor Climate Consortium and the PFAS Consortium.

Enabling the European Supply Chain

Philippe Soussan
Technology Portfolio Director
imec

Abstract
Coming Soon

Biography
For 20 years Philippe Soussan has held different position in R&D management in imec in the field of sensors, photonics, 3D packaging. Addressing these technologies from R&D up to manufacturing levels. His background deals with wafer scale technologies, authoring over 100 publications, and holding more than 20 patents in these fields.From 2007 till 2011, he has led the group “Packaging, Microsystems and Hybrid Technology”. The group dealt with complex process integration using 3D interconnects, advanced packaging and micro fabrication of scaling and non-scaling driven components. In 2011, he became program manager for the smart system division of IMEC, which mission is to enable novel product in the field of More than Moore, such as sensors, microsystems in the field of RF and opto-electronics. In 2019, he was program director in the field of integrated photonics for sensing applicationsSince 2024, Philippe is in charge of strategy definition for IC-link by imec. This imec business line provides an access to design and manufacturing services in the most advanced ASIC and specialty technologies.

Frank Holsteyns
VP R&D Unit Process & Modules
imec

Biography
Frank Holsteyns has been serving as the VP of R&D at imec, leading the Unit Process and Module Department since July 1, 2023. Before stepping into this role, he was the director of the same department, where he managed various process-development-focused groups, including surface and interface processing, etch, thin film deposition, epitaxy, plating, chemical mechanical polishing, layer transfer, and assembly.Frank's journey at imec began in 2000, where he concentrated on wet cleaning research for semiconductor devices. His work in this area culminated in a PhD in Bio Engineering (surface chemistry) from KU Leuven, Belgium. In 2006, he transitioned to Lam Research AG in Villach, Austria, as a research scientist. There, he coordinated a university and research network focused on fluid dynamics, particularly cavitation, droplet impact, wetting, and dewetting.In 2012, Frank returned to imec, taking on the role of manager for the Surface and Interface Processing Group. In this position, he specialized in wet clean and etch processes, as well as isotropic dry etches.