Stephan Raithel
Director Business Unit Gas Treatment
DAS Europe

Biography
Stephan Raithel successfully completed his studies of Business Administration with a German Diploma degree and a bachelor of arts with honors in 2004. Prior to his career at SEMI he was working for a professional service provider where he was in total responsible for 4 different products focusing on consumer goods, financial services and creative industries. In 2007 he joined SEMI, the global semiconductor trade association, in the Brussels office as Senior Manager Operations where he became a key staff in implementing SEMI Europe’s strategy and enlarging SEMI’s presence within Europe. In 2009 he opened the SEMI branch in Berlin, Germany, where he was acting as Managing Director for SEMI Europe as well as fulfilling the role as a CFO for all European activities. Starting July 2016 he moved to DAS Europe - a globally leading supplier of point-of-use abatement concepts – where he holds the position as Director Business Unit Gas Treatment.

The Future of Mobility and Mobility of the Future – potentials and implications due to more powerful Automotive electronics

Andre Blum
Project Manager Progressive Semiconductor Program
AUDI AG

Abstract
The value share of electronics in Automotive is increasing and will rise even more in the next decade. An outlook is given onto the manifold possibilities emerging with the next generations of Automobiles. Conventional Automotive electronics requirements do no longer fit for unprecedented use cases of the future. This can be considered as a threat or as a chance…

Biografie
Dr. André Blum joint Audi in 2004, starting as a developer for EMC capabilities of ECUs. In 2008 he finished his PhD work in electrical engineering (power electronics). In the following years he managed several projects and small teams in different production departments. Since the beginning of 2016 Dr. Blum is a team member of the Audi Semiconductor Strategy and works with semiconductor companies on a daily basis. Dr. Blum was promoted to Audi Management in 2015. Based on his long history within Audi, working in the product development as well as in the production & logistics and production planning divisions, Dr. Blum is an expert in automotive electronics as well as in industry 4.0 electronics.

Connected Vehicles – Part of the connected world and foundation of the 3d living space

Michael Strugala
Senior Expert
Bosch Management Support GmbH

Abstract
Since vehicles got connected by cellular technology associated services, so called “connected services” are of key interest to vehicle users, automotive industry, internet service providers and other stakeholders of the internet. Consumers, who are familiar with service offerings by smart phones and spend an ever longer time of their day in their vehicles, request similar kind of applications in their car to support their daily work and empower their leisure activities with safe, comfortable and reliable services. Besides passenger cars there is an attractive area for fleet managers and logistic providers with commercial vehicles, who typically look for services optimizing the Total Cost of Ownership (TCO) of the vehicle or vehicle fleet. Finally, due to connected vehicles and exchange of data between vehicles and infrastructure, new possibilities of traffic management and multi-modal traffic scenarios become reality increasing safety, flexibility and comfort of individual mobility. This presentation wants to give an overview on the various opportunities of connected services, starting not from the technological drivers but more from the user point of view. Therefore we would not like to focus on technology first, but create an overall view on driver and passenger requirements, including private as well as commercial users, stretching from leisure to work scenarios. Based on this user centric view specific examples for services will highlight the vehicle becoming part of the connected world and forming the 3rd living space. Such examples at the end will give chance to focus on some technological challenges, like security issues or automated driving.

Biografie
Starting his career at Robert Bosch Group in 1988 Michael Strugala took responsibility for development and engineering functions in various business divisions of Bosch comprising semiconductor design, telecommunications, navigation and safety systems. Most recently from 2010 until 2016 he was responsible for the project Car-2-X-Communication and Connected Vehicle in the Car Multimedia division of Robert Bosch GmbH. The project developed and evaluated concepts and infrastructure set up for connected services together with the divisions of the Bosch Mobility Business Division. This included demonstrators and their development by means of agile development approaches like scrum and pilot projects with selected partners. Since beginning of 2017 Michael is retired, but works as a Senior Expert for Bosch Management Support GmbH supporting Bosch Mobility Business Divisions in select-ed topics of data access to vehicles and associated acquisition strategies. Michael was born in Dortmund 1956. He studied Electrical Engineering at the University of Dortmund and finished his diploma thesis in 1982. 1988 he received his Ph.D. from Johann-Wolfgang Goethe University, Frankfurt am Main for his work on VLSI-Integration and Application of associative SIMD computer architectures.

Functional safety aspects in the development of automotive control units with focus on power semiconductors.

Gregor Bugla
Manager Functional safety
Lear Corporation

Abstract
Energy management in vehicles and the control of energy consumption is one of the challenges in the development of energy-efficient vehicles. One of the key components are power semiconductors , switching and controlling all different kind of car body loads from low to medium rated electrical power and controlling the onward power distribution to further peripheral ECUs. The semiconductors have to meet several automotive requirements on electrical performance, temperature range, EMC, etc. but also important are protection mechanism (Overload, short current, reverse polarity protection) and diagnostic features (open load, short circuit, overvoltage). These topics are related to the functional safety of the control units, a field that becomes more and more important especially in connection with driver assistant systems and autonomous driving According to definitions in IEC 61508 standard functional safety is the part of the overall safety that depends on a system or equipment operating correctly in response to its inputs. The objectives are detection of a potentially dangerous condition and activation of a protective or corrective mechanism to prevent hazardous events arising or providing mitigation to reduce the consequence of the hazardous event. The adaption of the IEC 61508 standard is the ISO 26262 standard, that defines functional safety for automotive equipment. With focus on power semiconductor this presentation illustrates some methods and techniques in the development of safety related automotive systems. It shows the SysML modeling process for safety architecture and safety related path and introduces analyses techniques like FTA or FMEA for an effective technical safety solution. Typical requirements for the power semiconductor devices are addressed. The presentation concludes with a discussion of quantitative safety analysis methods to verify the safety development.

Biografie
Gregor Bugla graduated in Electrical Engineering and Physics and has more than 20 years of experience with Hard- Software and System engineering. Since 13 Years he is working at Lear Corporation and is currently responsible for functional safety and system safety engineering with focus on lighting systems and gateways.

Challenges for Non Volatile Memory (NVM) for Automotive High Temperature Operating Conditions

Alexander Muffler
Busines Line Manager Automotive
X-FAB Semiconductor Foundries AG

Abstract
This presentation will show the challenges seen from the viewpoint of a silicon foundry for Non-Volatile Memory (NVM) IPs developed for automotive high-temperature applications. NVMs used in harsh automotive environments need to be robust and reliable. Especially ICs which are qualified for high-temperature applications with operating temperatures up to 175°C have additional challenges which need to be fulfilled by the used NVM IPs as well. This includes not only long data retention and a certain endurance cycling, but also ESD robustness which can only be measured on silicon by different layout variants of the same NVM IP. Depending on NVM application requirements, different memory principles such as SONOS or floating gate bitcells can be used and optimized to achieve best results. Especially for integrated circuits developed for safety critical applications based on ISO TS 26262, there is a need to ensure comprehensive testability, critical signal observability and monitoring during the application. Test capability means that for example that the measurement of the ‘high’ and ‘low’ window of each memory cell is considered. Signal monitoring includes access to charge pump, bandgap and memory reference voltage levels whereas and fault tolerance refers to the usage of parity bits, single or even double bit error detection and correction.

Biografie
As Business Line Manager Automotive, Alexander Muffler is responsible for the development of product marketing strategies for Automotive semiconductor processes as well as NVM IP for integrated circuit technologies. Prior to joining X-FAB, he worked for Chartered Semiconductor as EDA Manager Europe. Earlier, Alexander worked as an ASIC design engineer at Thesys GmbH. Alexander has more than 24 years of semiconductor technology and design experience. He holds a Master’s degree in Telecommunication Engineering from the University of Applied Science in Konstanz, Germany.

Aspects on failure modes and reliability assessment in automotive power microelectronics

Gerald Dallmann
Division Manager Microelectronics
SGS INSTITUT FRESENIUS

Abstract
System and chip qualification and production release procedures are based today on the AEC Q100 standard. These documents describe a set of tests which are specific to certain failure mechanisms, induced f.e. by higher temperature. However, these tests are today very limited for the estimation of failure rates or even to demonstrate a zero failure rate, as required by the automotive industry. First, the tests are performed on a very limited number of samples (e.g. 77) not allowing to show a low ppm failure level. Second, the tests assume a certain failure mode acceleration by f.e. high application temperature. These models are very often not known and failures show a fully other behavior and acceleration in the field (due to combination of technology excursions, defects, combined voltage, current, temperature, humidity and mechanical stress). Third, the component validation after test is performed only by electrical testing. The talk will show examples of failures not covered by qualification and production tests as well as some approaches to improve reliability assessment process. The physical and chemical analysis methods and tools (like XPS, AES, TOF-SIMS) are highly developed to analyze materials and failure modes in semiconductor and system level technologies. The application of these analysis techniques after climate, voltage or mechanical stress application can create a much deeper view inside chip and system weaknesses and failure modes. The talk shows some typical failure mechanisms found in a lab as service provider for many different companies. Some weak spots are discussed with recommendations for improvements.

Biografie
Division Manager at SGS Institut Fresenius GmbH in Dresden, Germany, since 2009. Main focus on material and failure analysis of semiconductor devices of client companies. 1995 Director for technology development at Siemens, Infineon, Qimonda, responsible for process integration, yield enhancement and material and technology development of DRAMs. 1990 Product manager microelectronics at Institut Fresenius in Dresden. Main Focus on failure analysis of semiconductor devices. Department manager electron microscopy at Zentrum Mikroelektronik Dresden (ZMD). 1986 Diploma in Microelectronics Technology and Semiconductor Devices.

The Technologically Transformational Automotive Electronics Market and the Implications for Material Supply

Klaus Hege
Global Key Account Manager
Linde Electronics GmbH & Co. KG

Abstract
The automotive electronics market is growing fast and is undergoing radical transformation. Until now, electronics components for vehicles were based on rather mature technologies and produced by specialist manufacturers. The most advanced semiconductor technologies will make possible the computing power and memory requirements necessary to analyze data provided by advanced sensors. Quality management is foremost in importance to automotive electronics. Given the safety issues at stake when electronic components are in use in a vehicle in movement, failure of these components is unacceptable; hence, the stringent quality programs being developed. The automobile industry has developed strict regulations to follow, which includes traceability of all manufacturing processes. In particular, modification of materials used must be documented. From a material (e.g. gases or chemicals) supplier perspective, this implies specific quality measures, which include alignment to the quality management techniques used by semiconductor manufacturers. In particular, quality and supply chain robustness are increasingly critical. In this talk, we will discuss the different steps being taken to improve the quality of materials delivered to automotive semiconductor manufacturers through global monitoring of the entire supply chain. Furthermore, we will present examples of long-term supply strategies for specific materials in order to support customers’ product development and commercialization. Finally, with the introduction of electronic components built on advanced technologies by large semiconductor manufacturers, but relatively new to the automotive electronics industry, we will reflect on the global impact on material quality and supply chain.

Biografie
Klaus Hege is Global Key Account Manager for Linde Electronics. In this role, he is responsible for managing a number of Linde’s global key customers in the semiconductor industry. Prior to this role, Klaus hold several other positions in the gas industry, mainly as Program Manager Electronics, Applications & Commercialization Manager, and Product Manager. Klaus holds a Diploma in Physics from the University of Erlangen, Germany, and a Postgraduate Diploma in Business Administration of the University of Barcelona, Spain. Klaus is located in Pullach (nearby Munich, Germany), and can be reached at klaus.hege@linde.com or +49.172.260.7091.