Smart MedTech, a SEMI global initiative
Melissa Grupen-Shemansky
CTO & VP Technology Communities
SEMI
Abstract
Smart MedTech is a SEMI global corporate initiative that has broad market and societal impact. Microelectronics (semiconductor chips) are ubiquitous in today’s society from PCs, mobile phones and automobiles. Our reliance on microelectronics is exponentially increasing as it propels the world into the Data Age fueling autonomy, 5G and IoT, AI and high-performance computing, and digital medicine. We are on the cusp of a healthcare revolution shifting from a provider-centric model to a personalized health care model that is outcome-based, decentralized, specific to personal health and medical needs, and executed by a team of providers connected like never before.Microelectronics play an increasingly critical role in the advancement of medical technologies. They drive critical tools and displays in diagnostics and therapeutics, from sophisticated imaging like magnetic resonance to everyday vital signs measuring devices like pulse oximeters. Continuous advancements from physical fitness (steps), vital signs monitoring (heartbeat, pulse, blood pressure), wound healing, smart fabrics, intelligent clothing for diabetes & cardiovascular disease monitoring and smart drug delivery further promotes the rise of the SMART MedTech expansion. Smart, connected and wearable medical devices are now technologically and economically feasible. As health care shifts from institutional to outpatient and home settings, the next decade will be critical in linking data from SMART MedTech devices with data from traditional systems and integrating that information into everyday practice.We will review the progress SEMI’s Smart MedTech initiative has made to date and help set the stage to discuss the future of electronic medical technology, data, and AI. The objective is to explore how SEMI may help the industry to address challenges that are best addressed collectively.
Biography
Melissa Grupen-Shemansky, PhD, Dr. Melissa Grupen-Shemansky currently serves as Chief Technical Officer (CTO) at SEMI / FlexTech. She is responsible for the technical advisory councils and program oversight of consortium R&D projects that are in-part funded by the Department of Defense. These programs support development in flexible hybrid electronics (FHE) and nano-bio applications. Two consortia, the FlexTech FHE and the Nano-Bio Manufacturing Consortium (NBMC), collectively represent over $160M in federal and industrial investment over the span of 8 years furthering the advancement of FHE technologies and ecosystem development. In addition, Dr. Grupen-Shemansky is CEO of the FlexTech Alliance, Inc., a not-for-profit subsidiary of SEMI responsible for the Manufacturing Innovations Institute, NextFlex.Prior to joining SEMI, Dr. Grupen-Shemansky held various executive management roles in the semiconductor industry. With over 25 years in the industry, she has both Fortune 100 company and start-up innovation experience in research and development, manufacturing, business development and technology strategy. Dr. Grupen-Shemansky began her career at Motorola in semiconductor research and development. Over the course of 10 years, she held various management positions in silicon and gallium arsenide device fabrication, packaging, interconnect and system integration. Following Motorola, she was the Director of Interconnect Technology and Design Engineering in Lucent, Bell Labs, microelectronics division. She later joined Spansion, the flash memory division of AMD, as Vice President of Packaging and Interconnect Technology. And before joining SEMI, Dr. Grupen-Shemansky was the Senior Vice President of Engineering for Advanced Nanotechnology Solutions, Inc., a startup in 3D ICs and cybersecurity.Dr. Grupen-Shemansky holds both bachelor’s and master’s degrees in Chemical Engineering from Pennsylvania State University and a Ph.D. in Chemical Engineering from Arizona State University. She has received various corporate and educational awards, has seven issued patents, numerous technical publications, and is a contributing author to Failure-Free Integrated Circuit Packages.