Thursday, November 14, 2024 | |
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Session 1: Market Dynamics: Landscape and Growth Strategies |
08:00 | Welcome Remarks |
Laith Altimime, President, SEMI Europe Welcome RemarksAbstract Biography |
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08:05 | Opening Remarks by MEMS and Imaging Committee Chair , Philippe Monnoyer, VTT Technical Research Center of Finland Ltd |
08:10 | Keynote |
Smart Sensors for Smart Life – How Advanced Sensor Technologies Enable Life-Changing Use Cases |
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Stefan Finkbeiner, CEO, Bosch Sensortec Smart Sensors for Smart Life – How Advanced Sensor Technologies Enable Life-Changing Use CasesAbstract Biography |
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08:30 | Keynote |
Sensing the World: Innovating for a More Sustainable Future |
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Simone Ferri, APMS Group Vice-President, MEMS sub-group General Manager, STMicroelectronics Sensing the World: Innovating for a More Sustainable FutureAbstract Biography |
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08:50 | From MEMS to Imaging Sensors, Global Trends and Market Opportunities |
Jean-Christophe Eloy, CEO and President, Yole Group From MEMS to Imaging Sensors, Global Trends and Market OpportunitiesAbstract Biography |
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09:10 | MEMS & Sensors Industry Group Update and Market Outlook |
Melissa Grupen-Shemansky, CTO & VP Technology Communities, SEMI MEMS & Sensors Industry Group Update and Market OutlookAbstract Biography |
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09:20 | Key Takeaways by MEMS and Imaging Committee Chair , Philippe Monnoyer, VTT Technical Research Center of Finland Ltd |
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Session 2: Sustainable Supply Chain Capabilities |
09:25 | Opening Remarks by Session Chair, Richard Barnett, Director, Etch Product Management, KLA |
09:30 | A Paradigm Shift From Imaging to Vision: Oculi Enables 600x Reduction in Latency-Energy Factor for Visual Edge Applications |
Charbel Rizk, Founder CEO, Oculi A Paradigm Shift From Imaging to Vision: Oculi Enables 600x Reduction in Latency-Energy Factor for Visual Edge ApplicationsAbstract Biography |
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09:50 | How AI driven 3D X-Ray Inspection Supports a Sustainable Inspection Strategy for AI Chips!, Daniel Stickler, Director Xray Technologies & Components, Comet AG – Industrial X-Ray System Division |
10:10 | Key Takeaways by Session Chair, Richard Barnett, Director, Etch Product Management, KLA |
10:15 | Networking Coffee Break |
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Session 3: MEMS - Exploring Future Trends for Technologies and Device Manufacturing |
10:45 | Opening Remarks by Session Chair |
Pierre Damien Berger, MEMS Industrial Partnerships Manager, CEA LETI
Biography |
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10:50 | Unlocking Novel Opportunities:How 300mm-capable MEMS Foundries will Change the Game |
Jessica Gomez, CEO, Rogue Valley Microdevices Unlocking Novel Opportunities:How 300mm-capable MEMS Foundries will Change the GameAbstract Biography |
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11:10 | Trends in Emerging MEMS |
Alissa Fitzgerald, CEO, A.M. Fitzgerald & Associates, LLC Trends in Emerging MEMSAbstract Biography |
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11:30 | MEMS & Sensors Packaging Innovation to Accelerate AI Everywhere |
Ryan Lai, Sr. Director, Advanced Semiconductor Engineering, Inc., ASE Inc MEMS & Sensors Packaging Innovation to Accelerate AI EverywhereAbstract Biography |
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11:50 | The Most Common Antistiction Films are PFAS, Now What? |
David Springer, Product Manager, MVD and Release Etch Products, KLA Corporation The Most Common Antistiction Films are PFAS, Now What?Abstract Biography |
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12:10 | Reserved for Infineon |
12:30 | Latest innovations in MEMS wafer bonding |
Thomas Uhrmann, Director Business Development, EV Group Latest innovations in MEMS wafer bondingAbstract Biography |
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12:50 | Key Takeaways by Session Chair |
Pierre Damien Berger, MEMS Industrial Partnerships Manager, CEA LETI
Biography |
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12:55 | Networking Lunch |
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Session 4: MEMS and Imaging Young Talent |
13:55 | Opening Remarks by Session Chair |
Dimitrios Damianos, Project Manager, Yole Group
Biography |
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14:00 | Unlocking Infrared Multispectral Imaging with Pixelated Metasurface Technology |
Charles Altuzarra, Chief Executive Officer and Cofounder, Metahelios Unlocking Infrared Multispectral Imaging with Pixelated Metasurface TechnologyAbstract Biography |
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14:05 | Electrically Tunable Dual-Band VIS/SWIR Imaging and Sensing |
Andrea Ballabio, CEO, EYE4NIR Electrically Tunable Dual-Band VIS/SWIR Imaging and SensingAbstract Biography |
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14:10 | FMCW Chip-Scale LiDARs Scales Up for Large Volume Markets thanks to Silicon Photonics Technology |
Simoens François, CEO, SteerLight FMCW Chip-Scale LiDARs Scales Up for Large Volume Markets thanks to Silicon Photonics TechnologyAbstract Biography |
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14:15 | Feasibility Investigation of Spherically bent Image Sensors |
Amit Pandey, PhD Student, Technische Hochschule Ingolstadt Feasibility Investigation of Spherically bent Image SensorsAbstract Biography |
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14:20 | Intelligence through Vision |
Stijn Goossens, CTO, Qurv Intelligence through VisionAbstract Biography |
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14:25 | Next Generation Quantum Dot SWIR Sensors |
Ronald Naber, Senior Process Development Engineer, QDI systems Next Generation Quantum Dot SWIR SensorsAbstract Biography |
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14:30 | Closing Remarks by Session Chair |
Dimitrios Damianos, Project Manager, Yole Group
Biography |
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Session 5: Imaging - Exploring Future Trends for Technologies and Device Manufacturing |
14:35 | Opening Remarks by Session Chair |
Stefano Guerrieri, Engineering Fellow, ams-OSRAM
Biography |
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14:40 | Seeing Beyond the Visible: High-Performance SWIR Machine Vision Solutions |
David Cheskis, Sr. Product Director, TriEye Seeing Beyond the Visible: High-Performance SWIR Machine Vision SolutionsAbstract Biography |
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15:00 | Active Hyperspectral Imaging Using Extremely Fast Tunable SWIR Light Source |
Jussi Soukkamaki, Lead, Hyperspectral & Imaging Technologies, VTT Technical Research Centre of Finland Ltd Active Hyperspectral Imaging Using Extremely Fast Tunable SWIR Light SourceAbstract Biography |
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15:20 | Shaping the Future of Mobile Cameras: Miniaturized Multispectral Imaging for Next-Gen Applications |
Jonathan Borremans, CTO, Spectricity Shaping the Future of Mobile Cameras: Miniaturized Multispectral Imaging for Next-Gen ApplicationsAbstract Biography |
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15:40 | Technologies and Embedded Intelligence developments for Future Smart Vision Systems |
Pierre Castelein, Parternship manager, Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France Technologies and Embedded Intelligence developments for Future Smart Vision SystemsAbstract Biography |
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16:00 | From Imaging to Optical Sensing, the road to machine dedicated sensors. |
Eric Mazaleyrat, Director of Technology Scouting and Innovation, STMicroelectronics From Imaging to Optical Sensing, the road to machine dedicated sensors.Abstract Biography |
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16:20 | Key Takeaways by Session Chair |
Stefano Guerrieri, Engineering Fellow, ams-OSRAM
Biography |
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16:25 | Networking Coffee Break |
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Session 6: Innovations for Next-Gen Applications : Smart Mobility |
16:55 | Opening Remarks by Session Chair |
Bernd Dielacher, Business Development Manager, EV Group
Biography |
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17:00 | Topic Coming Soon |
Patrice Ancel, In-Vehicle-Technologies Leader, BMW Topic Coming SoonAbstract Biography |
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17:20 | New Topology for MEMS Advances Performance and Speeds Manufacturing |
Eric Aguilar, CEO, Omnitron Sensors, Inc. New Topology for MEMS Advances Performance and Speeds ManufacturingAbstract Biography |
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17:40 | Key Takeaways by Session Chair |
Bernd Dielacher, Business Development Manager, EV Group
Biography |
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Session 7: Innovations for Next-Gen Applications : Health |
17:45 | Opening Remarks by Session Chair, Ran Ruby YAN, Director of HMI & HealthTech business line, GLOBALFOUNDRIES |
17:50 | Next generation photoacoustic imaging with xMUT technology: status and challenges |
Patrick Leisching, Chief Technology Officer, iThera Medical GmbH Next generation photoacoustic imaging with xMUT technology: status and challengesAbstract Biography |
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18:10 | Sensors for monitoring vital signs in wearable devices |
Markus Arzberger, Senior Director, ams-OSRAM International GmbH Sensors for monitoring vital signs in wearable devicesAbstract Biography |
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18:30 | Pioneering Non-invasive Wearable MIR Spectrometry for Key Health Biomarkers Analysis |
Jan F Kischkat, CEO, Quantune Technologies GmbH Pioneering Non-invasive Wearable MIR Spectrometry for Key Health Biomarkers AnalysisAbstract Biography |
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18:50 | Key Takeaways by Session Chair, by Session Chair, Ran Ruby YAN, Director of HMI & HealthTech business line, GLOBALFOUNDRIES |
18:55 | End of Conference Reflections by MEMS and Imaging Committee Chair , Philippe Monnoyer, VTT Technical Research Center of Finland Ltd |
19:00 | Networking Reception in ICM |