Wednesday, November 13, 2024 | |
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Session 1: Emerging Advanced Packaging Technologies |
08:30 | Welcome Remarks |
Laith Altimime, President, SEMI Europe Welcome RemarksAbstract Biography |
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08:40 | Opening Remarks by Session Chair, Jonathan Abdilla, Besi |
08:45 | Elevating Power Efficiencies Through Advanced Packaging Innovation |
Mark Gerber, Senior Director, Engineering, Marketing & Technical Promotion, ASE Elevating Power Efficiencies Through Advanced Packaging InnovationAbstract Biography |
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09:05 | Deep Pitch Scaling of Wafer-to-Wafer and Die-to-Wafer Cu/SiCN Hybrid Bonding |
Anne Jourdain, R&D Manager, Imec Deep Pitch Scaling of Wafer-to-Wafer and Die-to-Wafer Cu/SiCN Hybrid BondingAbstract Biography |
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09:25 | Advancing AI through Advanced Packaging |
Arvind Kumar, Principal RSM and Research Manager, AI Hardware Technologies, IBM Advancing AI through Advanced PackagingAbstract Biography |
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09:45 | Advanced Electrolytes Meeting Future Requirements in Microbump Technology |
Jessica Stubbe, Global Application Manager, MKS Instruments / Atotech Advanced Electrolytes Meeting Future Requirements in Microbump TechnologyAbstract Biography |
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10:05 | Challenges of new chiplet integration – how organic interposers challenge BEOL equipment |
Elisabeth Brandl, Business Development Manager, EVG Challenges of new chiplet integration – how organic interposers challenge BEOL equipmentAbstract Biography |
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10:25 | Key Takeaways by Session Chair, Jonathan Abdilla, Besi |
10:30 | Networking Coffee Break |
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Session 2: Power and Heat Management |
11:15 | Opening Remarks by Session Chair, Roland Rettenmeier, Evatec |
11:20 | Power and Thermal Management in Advanced Chiplet-Based Packaging |
YoungDo Kweon, Sr Director of Chiplets FCBGA Development, Amkor Technology Inc Power and Thermal Management in Advanced Chiplet-Based PackagingAbstract Biography |
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11:40 | Challenges in Advanced Packaging for High Performance Computing |
Cheng Yang, Corporate Fellow, STATS ChipPAC Challenges in Advanced Packaging for High Performance ComputingAbstract Biography |
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12:00 | Half-bridge GaN by Fan-out Panel Level Packaging |
Qingyuan Tang, Vice General Manager, Guangdong Fenghua Semiconductor Technology Co., Ltd. Half-bridge GaN by Fan-out Panel Level PackagingAbstract Biography |
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12:20 | Key Takeaways by Session Chair, Roland Rettenmeier, Evatec |
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Session 3: Testing and Inspection |
12:25 | Opening Remarks by Session Chair, Jan de Koning Gans, Managing Director - Sales & Marketing, RoodMicrotec GmbH |
12:30 | AI-Driven 3D X-Ray Inspection: A Game-Changer for Advanced Semiconductor Packages |
Isabella Drolz, Vice President Marketing & Product Strategy, Comet AI-Driven 3D X-Ray Inspection: A Game-Changer for Advanced Semiconductor PackagesAbstract Biography |
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12:50 | Importance of High-Performance Integrated Metrology for D2W and W2W Hybrid Bonding Applications |
Thomas Schmidt, Product Manager Bonder, SUSS MicroTec Solutions GmbH Importance of High-Performance Integrated Metrology for D2W and W2W Hybrid Bonding ApplicationsAbstract Biography |
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13:10 | Networking Lunch |
14:10 | Sinter Print Surface Condition Measurement for Power Electronics |
Axel Lindloff, Senior Process Specialist Pre-Sales, Koh Young Europe GmbH Sinter Print Surface Condition Measurement for Power ElectronicsAbstract Biography |
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14:30 | Pioneering Precision: AI Enhancements in Packaging Visual Inspection |
Bart Van Poucke, VP Market Strategy and Development, Robovision Pioneering Precision: AI Enhancements in Packaging Visual InspectionAbstract Biography |
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14:50 | Key Takeaways by Session Chair , Jan de Koning Gans, Managing Director - Sales & Marketing, RoodMicrotec GmbH |
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Session 4: Processes and Reliability |
14:50 | Opening Remarks by Session Chair, Frank Kuechenmeister, Global Foundries |
14:55 | Innovative Approaches to Improve Reliability in Microelectronics - The ECSEL JU project iRel40 |
Klaus Pressel, Assembly and Packaging, Infineon Technologies AG Innovative Approaches to Improve Reliability in Microelectronics - The ECSEL JU project iRel40Abstract Biography |
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15:15 | Quantum Failure Analysis for the Semiconductor Industry |
Marwa Garsi, Head of Hardware, QuantumDiamonds GmbH Quantum Failure Analysis for the Semiconductor IndustryAbstract Biography |
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15:35 | Key Takeaways by Session Chair, Frank Kuechenmeister, Global Foundries |
15:40 | Networking Coffee Break |
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Session 5: Sustainable Materials Enabling Performance |
16:25 | Opening Remarks by Session Chair, Mark Anthony Azzopardi, JCET |
16:30 | Driving Sustainability in Semiconductor Packaging |
Pierre Farbos de Luzan, Head of Sustainability, Electronics, Henkel Driving Sustainability in Semiconductor PackagingAbstract Biography |
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16:50 | Competitive and Sustainable Advanced Packaging (CSAP) - a new approach to FO-PLP |
Mark Luke Farrugia, General Manager, Chip Integration Technology Center (CITC) Competitive and Sustainable Advanced Packaging (CSAP) - a new approach to FO-PLPAbstract Biography |
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17:10 | Advanced Materials with Tailored Thermal Properties for Advanced Packaging Application |
Maria Vozarova, Material and 3D Printing Researcher, RHP-Technology GmbH Advanced Materials with Tailored Thermal Properties for Advanced Packaging ApplicationAbstract Biography |
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17:30 | Key Takeaways by Session Chair, Mark Anthony Azzopardi, JCET |
17:35 | End of Conference |
17:40 | Networking Reception in ICM |