Thursday, November 16, 2023 | |
EU Digital Future Forum |
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12:40 | Welcome Remarks by Session Chair |
Christopher Frieling, Director for Advocacy and Public Policy, SEMI Europe
![]() Biography |
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12:45 | HiCONNECTS – An Introduction by NXP |
Andrea Sanfilippo, Senior Manager Public Funding, NXP Semiconductors Germany GmbH HiCONNECTS – An Introduction by NXP![]() ![]() Abstract Biography |
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12:55 | HiCONNECTS - Photonics Heterogeneous Integration Pilot Line |
Dimitrios Velenis, R&D Manager 3D and Silicon Photonics Devices and Components group, imec HiCONNECTS - Photonics Heterogeneous Integration Pilot Line![]() ![]() Abstract Biography |
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13:05 | HiCONNECTS - Advance Packaging, Ayad Ghannam, CEO and Founder, 3DiS Technologies |
13:15 | HiCONNECTS - Enhanced Chip manufacturing developments |
Daniele Pagano, Project Manager, STMicroelectronics HiCONNECTS - Enhanced Chip manufacturing developments![]() ![]() Abstract Biography |
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13:25 | Digital Twin Software for Finite Element Analysis. |
Rahul Tomar, Managing Director, DigitalTwin Technology GmbH Digital Twin Software for Finite Element Analysis.![]() ![]() Abstract Biography |
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13:40 | The Pack4EU Project - Booster Electronics Packaging, Assembly and Test in Europe |
Steffen Kroehnert, Senior Manager, Pack4EU-Project, SEMI Europe The Pack4EU Project - Booster Electronics Packaging, Assembly and Test in Europe![]() ![]() Abstract Biography |
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13:45 | Closing Remarks by Session Chair |
Christopher Frieling, Director for Advocacy and Public Policy, SEMI Europe
![]() Biography |