Wednesday, November 15, 2023 | |
Session 1: Fab Expansion Landscape: Opportunities and Challenges |
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08:30 | Welcome Remarks |
Laith Altimime, SEMI Europe Welcome RemarksAbstract Biography |
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08:50 | Opening Remarks |
Joerg Recklies, Infineon Technologies AG Opening RemarksAbstract Biography |
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08:55 | Topic Coming Soon |
Missy Stigall, SVP Global Fab Operations, Wolfspeed Topic Coming SoonAbstract Biography |
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09:15 | Building the new Smart Power Fab in Dresden: A Strong Signal for the Future |
Holger Hasse, Infineon Technologies Dresden GmbH Building the new Smart Power Fab in Dresden: A Strong Signal for the FutureAbstract Biography |
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09:35 | Key Takeaways by Session Chair |
Joerg Recklies, Infineon Technologies AG Key Takeaways by Session ChairAbstract Biography |
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Session 2: Industrial Collaboration Models |
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09:40 | Opening Remarks |
Mario von Podewils, X-FAB Semiconductor Foundries GmbH Opening RemarksAbstract Biography |
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09:45 | Challenges of Capacity Doubling Under Brownfield and Full Load Conditions |
Michael Woittennek, X-FAB Dresden GmbH & Co. KG Challenges of Capacity Doubling Under Brownfield and Full Load ConditionsAbstract Biography |
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10:05 | Coffee break |
10:45 | The advanced APC application to enable the geometric scaling by DTCO in sub-5nm SoC manufacturing |
Leo Kim, Qualcomm Korea The advanced APC application to enable the geometric scaling by DTCO in sub-5nm SoC manufacturingAbstract Biography |
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11:05 | Reserved Presentation |
Reserved Slot, _ _ Reserved PresentationAbstract Biography |
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11:25 | Key Takeways from Session Chair, Mario von Podewils, X-Fab |
Session 3: New Innovators – Poster Session |
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11:30 | Poster Session – Industry meets Innovative Ideas |
12:00 | Networking Lunch |
Session 4: Cultivating the Workforce of Tomorrow |
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13:00 | Opening Remarks |
Cassandra Melvin, SEMI Europe Opening RemarksAbstract Biography |
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13:05 | Reserved Presentation |
Reserved Slot, _ _ Reserved PresentationAbstract Biography |
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13:25 | Panel discussion |
13:55 | Key Takeways from Session Chair, Cassandra Melvin, SEMI Europe |
Session 5: Solutions Enabling the Path to Net-Zero |
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14:00 | Opening Remarks |
Klaus Schimpf, Texas Instruments Opening RemarksAbstract Biography |
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14:05 | TI’s Path to Net Zero Activities |
Alexander Stur, Texas Instruments TI’s Path to Net Zero ActivitiesAbstract Biography |
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14:25 | Topic Coming Soon |
Andreas Neuber, Applied Materials Topic Coming SoonAbstract Biography |
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14:45 | Reserved Presentation |
Reserved Slot, _ _ Reserved PresentationAbstract Biography |
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15:05 | Watlow’s approach towards energy efficiency and achieving net-zero |
Blake Parkinson, Watlow Electric Manufacturing Company Watlow’s approach towards energy efficiency and achieving net-zeroAbstract Biography |
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15:25 | Key Takeways from Session Chair, Klaus Schimpf, Texas Instruments |
15:30 | Coffee break |
Session 6: Smarter Manufacturing for a Connected Ecosystem |
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16:10 | Opening Remarks |
Simone Alba, AG300 Fab - CVD and Dry Etch Area Manager, STMicroelectronics Opening RemarksAbstract Biography |
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16:15 | Topic Coming Soon |
Peter Buseck, Robert Bosch GmbH Topic Coming SoonAbstract Biography |
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16:35 | The Future of Advanced Packaging Inspection is X-Ray |
Dionys van de Ven, Comet The Future of Advanced Packaging Inspection is X-RayAbstract Biography |
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16:55 | Squeezing more wafers out of a fab: Can this be done without driving cycle times through the roof? |
Peter Lendermann, D-SIMLAB Technologies Squeezing more wafers out of a fab: Can this be done without driving cycle times through the roof?Abstract Biography |
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17:15 | Topic Coming Soon |
John Behnke, INFICON Topic Coming SoonAbstract Biography |
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17:35 | Reserved Presentation |
Reserved Slot, _ _ Reserved PresentationAbstract Biography |
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18:00 | Key Takeaways by Session Chair |
Simone Alba, AG300 Fab - CVD and Dry Etch Area Manager, STMicroelectronics Key Takeaways by Session ChairAbstract Biography |
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18:05 | End of Conference |
Thursday, November 16, 2023 | |
Coffee Break |