Welcome Remarks

Bettina Weiss
Chief of Staff & Corporate Strategy
SEMI

Abstract
Coming Soon

Biography
As Chief of Staff & Corporate Strategy, Bettina Weiss reports to SEMI’s President & CEO and manages a broad portfolio of responsibilities. Major focus areas include advancing specific global strategic initiatives such as SEMI’s Smart Mobility and Supply Chain initiatives and SEMI University, facilitate thought leadership (Think Tanks) activities in key strategic areas as well as improving organizational efficiency, alignment and financial sustainability. In addition, Weiss is the Sr. Liaison to the SEMI Board of Industry Leaders, leading strategic partnerships and M&A activity, and supporting the President & CEO in successfully creating a highly effective, agile global association.Weiss joined SEMI in 1996 and held a variety of positions in SEMI’s International Standards department, including department lead, global responsibility for SEMI's Photovoltaic/Solar Business Unit, business development including the integration of SEMI Strategic Association Partners FlexTech, MEMS & Sensors Industry Group, ESD Alliance and the SOI Consortium.Prior to joining SEMI, Weiss worked in sales and marketing positions at Metron Semiconductor and Varian Semiconductor in Munich, Germany. She holds a BA from the International School for Applied Languages in Munich, Germany, and is a certified translator for Anglo-American Law and Economics.

Opening Remarks

Andreas Aal
Semiconductor Strategy
Volkswagen AG

Abstract
Coming Soon

Biography
Andreas (IEEE SM / CRP) drove the semiconductor strategy & reliability assurance activities within the E/E development at Volkswagen, Germany, for many years, concentrating on technology capability enhancement of most advanced nodes incl. improved HW integration schemes as well as optimization of power electronics for automotive applications. He temporarily joint CARIAD SE between 2020 and 2022 as a system architect and product security officer focusing on semiconductor and SW driven innovations.Wearing always one shoe from the semiconductor industry and the other one from the car OEM, he became a strong representative of the through-the-supply-chain-joint-development and collaboration approach also being rewarded with the EDA Achievement award 2020. He has 24 years of experience with and within the semiconductor industry, has authored/co-authored over 40 publications on reliability and has given tutorials at IEEE IRPS and IIRW as well as invited and keynote speeches during various conferences and conventions.His early collaboration activities began already in 2007 becoming the chair of the German VDE ITG group MN 5.6 on (f)WLR, reliability simulations and qualification. He is currently also chair of the European chapter of the SEMI Global Automotive Advisory Council (GAAC), member of the coordination team of the corresponding “European platform for automotive semiconductor requirements along the supply chain” hosted by the VDE ITG and member of the Bmbf industry advisory board on cyber security. Driving the disruptive automotive transformation process on a collaborative supply chain basis is one of his major passions.

The Wolfspeed Way: ​Saving the World Energy

Missy Stigall
SVP Global Fab Operations
Wolfspeed

Abstract
Coming Soon

Biography
Coming Soon

Semiconductor Management from an OEM Perspective

Michael Schmid
Head of Procurement Semiconductor Management Group/Brand
Volkswagen AG

Abstract
New vehicle architectures, OTA-Updates, and the SW-defined vehicle in general are key drivers for OEMs to pursue further vertical integration. It is crucial to define key hardware guardrails early in the product development process. In addition, the semiconductor crisis has made OEMs more aware of the importance of electronic components, especially in the automotive industry.Volkswagen is actively shaping the future and has implemented key elements of a strategic semiconductor management program. A new top management committee decides on the company-wide semiconductor strategy from a technology and procurement perspective and reviews component sourcings at semiconductor level for conformity with strategy.Volkswagen is implementing a semiconductor category management for the most important semiconductor categories, analogous to major Tier-1s. This results in explicit specifications for each semiconductor category, all the way up to product portfolios, always with an eye towards the future and without hindering innovation. This gives the Group greater control over bills of materials and designs, proactively reducing complexity and improving component interchangeability, while ensuring the use of state-of-the-art technologies wherever possible.In addition, a risk monitor provides a clear basis for decision-making so that potential bottlenecks can be addressed at an early stage. Different dimensions such as end-of-life, probability of natural disasters or structural risks are combined in a score for each component. This tool can be used to identify risks and prepare mitigation measures such as technological alternatives or redesigns.Beyond to the internal transformation, Volkswagen is increasingly pursuing collaboration across the entire semiconductor supply chain – an approach from which both sides benefit, both technologically and in terms of plannability and security of supply in the supply chain. In this way, Volkswagen supports SEMIs goals of sharing best practices, creating standards and driving new and innovative solutions through close collaboration across the supply chain, also incorporating politics in those discussions.

Biography
- Head of Procurement Infotainment Group/Brand (2010-2013)- Head of Procurement Production Material VW India (2013-2016)- Head of Procurement Engineering Services Group/Brand (2016-2019)- Head of Procurement Infotainment, Telematics & HMI Group/Brand (2019-2022)- Head of Procurement Semiconductor Management Group/Brand (since 2022)

The Future of Advanced Packaging Inspection is X-Ray

Dionys van de Ven
President of the Industrial X-Ray Systems (IXS) Division
Comet Yxlon

Abstract
Key take aways:- Semiconductor industry is driven by miniaturization & efficiency- Next generation X-Ray as valuable inspection method for Advanced packaging- X-Ray as booster for faster time-to-market & increased yieldIn Summary:X-Ray technology is ready as a valuable inspection solution for Advanced Packaging to reduce time-to-market and increase yield.

Biography
Dionys van de VenPresident Industrial X-Ray Systems Born 1968, Dutch citizen; Master’s degree in mechanical engineering from the Eindhoven University of Technology, EindhovenBefore joining Comet in 2022, Dionys van de Ven has led Waygate Technologies’ x-ray business unit (part of Baker Hughes) as the unit’s Business Executive since 2020. In addition, he has been serving as Managing Director of Baker Hughes Digital Solutions GmbH and member of the board of management of GE Inspection Robotics.Dionys van de Ven began his career at Philips Assembléon in 1997. In 2005 he became Director of Customer Relationship Management at Philips Applied Technologies and, in 2007, Senior Director of Customer Programs, Service and R&D at Philips Healthcare. In 2017, he joined Waygate Technologies.

Andreas Aal
Semiconductor Strategy
Volkswagen AG

Biography
Andreas (IEEE SM / CRP) drove the semiconductor strategy & reliability assurance activities within the E/E development at Volkswagen, Germany, for many years, concentrating on technology capability enhancement of most advanced nodes incl. improved HW integration schemes as well as optimization of power electronics for automotive applications. He temporarily joint CARIAD SE between 2020 and 2022 as a system architect and product security officer focusing on semiconductor and SW driven innovations.Wearing always one shoe from the semiconductor industry and the other one from the car OEM, he became a strong representative of the through-the-supply-chain-joint-development and collaboration approach also being rewarded with the EDA Achievement award 2020. He has 24 years of experience with and within the semiconductor industry, has authored/co-authored over 40 publications on reliability and has given tutorials at IEEE IRPS and IIRW as well as invited and keynote speeches during various conferences and conventions.His early collaboration activities began already in 2007 becoming the chair of the German VDE ITG group MN 5.6 on (f)WLR, reliability simulations and qualification. He is currently also chair of the European chapter of the SEMI Global Automotive Advisory Council (GAAC), member of the coordination team of the corresponding “European platform for automotive semiconductor requirements along the supply chain” hosted by the VDE ITG and member of the Bmbf industry advisory board on cyber security. Driving the disruptive automotive transformation process on a collaborative supply chain basis is one of his major passions.