Tuesday, November 14, 2023
 

ITF Towards Netzero - Powered by imec

13:30 Welcome by imec
13:35 Reserved
13:55 Topic Coming Soon, Lars-Ake Ragnarsson, Program Director Sustainable Semiconductor Technologies and Systems, imec
14:15
Topic Coming Soon - joint presentation with ASML
  Emily Gallagher, Principal Member of Technical Staff, imec
Topic Coming Soon - joint presentation with ASML
Emily Gallagher

Emily Gallagher
Principal Member of Technical Staff
imec

Emily Gallagher

Abstract
Coming Soon

Biography
Emily Gallagher is a Principal Member of Technical Staff at imec, focusing on sustainability in semiconductor manufacturing, EUV pellicle membrane development, and advanced patterning. Emily earned her PhD in physics from Dartmouth College where she studied free electron lasers. After graduation, she joined IBM and became immersed in semiconductor technology. She held many wafer fabrication roles at IBM from functional characterization to process integration; the last was leading the EUV mask development effort. She joined imec in 2014 to continue EUV development work. Emily has authored over 100 technical papers, holds over 20 patents, is an SPIE Fellow and co-leads the SEMI SCC Scope1 Working Group.

14:35 Topic Coming Soon, Claire Seo, Vice President of the DS Corporate Sustainability Management Office, Samsung
14:55 Topic Coming Soon, Chris Bailey, Vice President Engineering, Systems, and Solutions, Edwards Vacuum
15:15 Networking Break
 

Panel Discussion

Moderation Jan-Hinnerk Mohr, Managing Director and Partner, Boston Consulting Group
Jan-Hinnerk Mohr

Jan-Hinnerk Mohr
Managing Director and Partner
Boston Consulting Group

Jan-Hinnerk Mohr

Biography
Coming Soon

15:45
The Future of Advanced Packaging Inspection is X-Ray
  Dionys van de Ven, Comet
The Future of Advanced Packaging Inspection is X-Ray
Dionys van de Ven

Dionys van de Ven

Comet

Dionys van de Ven

Abstract
Key take aways:- Semiconductor industry is driven by miniaturization & efficiency- Next generation X-Ray as valuable inspection method for Advanced packaging- X-Ray as booster for faster time-to-market & increased yieldIn Summary:X-Ray technology is ready as a valuable inspection solution for Advanced Packaging to reduce time-to-market and increase yield.

Biography
Dionys van de VenPresident Industrial X-Ray Systems Born 1968, Dutch citizen; Master’s degree in mechanical engineering from the Eindhoven University of Technology, EindhovenBefore joining Comet in 2022, Dionys van de Ven has led Waygate Technologies’ x-ray business unit (part of Baker Hughes) as the unit’s Business Executive since 2020. In addition, he has been serving as Managing Director of Baker Hughes Digital Solutions GmbH and member of the board of management of GE Inspection Robotics.Dionys van de Ven began his career at Philips Assembléon in 1997. In 2005 he became Director of Customer Relationship Management at Philips Applied Technologies and, in 2007, Senior Director of Customer Programs, Service and R&D at Philips Healthcare. In 2017, he joined Waygate Technologies.

15:55
Topic Coming Soon
  John Behnke, INFICON
Topic Coming Soon
John Behnke

John Behnke

INFICON

John Behnke

Abstract
Coming Soon

Biography
Mr. Behnke has over 35 years of semiconductor industry experience including: logic and memory manufacturing, technology/product development and fab operational excellence. As the GM of Final Phase Systems an INFICON Product Line, John leads a team that develop and deploy SMART software solutions that enable fabs to improve their manufacturing efficiency. FPS’s suite of software solutions are built upon a common Datawarehouse which enables advanced Fab Scheduling and optimized WIP movement as well as other related capabilities. He is also a Co-Chair of the Semi North America Smart Manufacturing Special Interest Group. Prior to FPS John served as the CEO and President of Novati Technologies, the SVP and GM of the Semiconductor Group of Intermolecular, the CVP for Front End Manufacturing, Process R&D and Technology Transfers at Spansion and the Director of AMD’s Fab 25’s Engineering and Operations groups where he was a founding member of AMD’s Automated Precision Manufacturing (APM) initiative which led the Semiconductor industry’s development and use of APC and other advanced factory systems. He also led the successful conversion of Fab 25 from Logic to Flash memory which was enabled through the virtual automation of the fab.Mr. Behnke earned a B.S. degree in Mechanical Engineering with an Industrial Engineering Minor from Marquette University. Mr. Behnke holds five U.S. patents.

16:25 Topic Coming Soon, Dallal Slimani, Vice President Semiconductor and Electrical Vehicle Battery, Schneider Electric
16:45 Topic Coming Soon, Rebecca Dobson, Corporate Vice President EMEA, Cadence
17:05 Reserved
17:25 Topic Coming Soon, Pierre Barnabe, CEO, Soitec
17:40 Reserved
18:00 Key Takeaways and Closing Remarks, imec