Tuesday, October 25, 2016 | |
Session 1 |
Market and Solutions |
Chair |
Steffen Kroehnert, Director of Technology, NANIUM S.A.
![]() ![]() Biography |
13:30 | Introduction |
13:35 | Welcome |
Yann Guillou, Membership Manager EMEA, Russia and CIS, SEMI Welcome![]() ![]() Abstract Biografie |
|
13:40 | Keynote |
Market Drivers and Packaging Trends for Automotive: Leveraging Mobile Device Packaging Technology |
|
Jan Vardaman, President, TechSearch International Market Drivers and Packaging Trends for Automotive: Leveraging Mobile Device Packaging Technology![]() ![]() Abstract Biografie |
|
14:10 | Advanced Laminate Substrate with Ultra-fine Wiring and High Density Interconnects |
Jeannette Koernert, Principal Technician Technology & Development, Globalfoundries Advanced Laminate Substrate with Ultra-fine Wiring and High Density Interconnects![]() ![]() Abstract Biografie |
|
14:35 | Challenges of Ultra-thin LGA Package for Fingerprint Sensors |
Jensen Tsai, Deputy Director, Siliconware Precision Industries Co., Ltd Challenges of Ultra-thin LGA Package for Fingerprint Sensors![]() ![]() Abstract Biografie |
|
15:00 | Advanced Die Attach Platform for Advanced Packages |
Hugo Pristauz, VP Technical Development & Advanced Technology, Besi Advanced Die Attach Platform for Advanced Packages![]() ![]() Abstract Biografie |
|
15:25 | Coffee Break |
Session 2 |
Technology and Modelling |
Chair |
Amandine Pizzagalli, Market & Technology Analyst, Yole Developpement
![]() ![]() Biography |
16:00 | Keynote |
Rapid introduction of new technologies for future automotive systems |
|
Gabriele Ernst, Engineering Director, Robert Bosch GmbH Rapid introduction of new technologies for future automotive systems![]() ![]() Abstract Biografie |
|
16:30 | Lifetime modeling for packages with galvanic isolation |
Rainer Schaller, Development Engineer, Infineon Technologies AG Lifetime modeling for packages with galvanic isolation![]() ![]() Abstract Biografie |
|
16:55 | Thin copper wire under extreme HTSL stress duration: Crack failure mechanism characterization |
Alberto Mancaleoni, Senior Member of Technical Staff (Principal Realibility Engineer), STMicroelectronics Thin copper wire under extreme HTSL stress duration: Crack failure mechanism characterization![]() ![]() Abstract Biografie |
|
17:20 | Heterogeneous Material Integration Enabled by Advanced Wafer Bonding |
Martin Eibelhuber, Business Development Manager, EV Group (EVG) Heterogeneous Material Integration Enabled by Advanced Wafer Bonding![]() ![]() Abstract Biografie |
|
17:45 | Plasma Dicing 4 Thin Wafers |
Reinhard Windemuth, Sales Director Microelectronics Europe, Panasonic Automotive & Industrial Sales Europe GmbH Plasma Dicing 4 Thin Wafers![]() ![]() Abstract Biografie |
|
18:10 | Networking Reception |
Wednesday, October 26, 2016 | |
Session 3 |
Testing and Qualification |
Chair |
Peter Cockburn, Senior Product Manager - TCI, Xcerra Corporation
![]() ![]() Biography |
09:00 | Introduction |
09:10 | Keynote |
Semiconductor Test: A moving target cost, A changing landscape |
|
Cedric Mayor, Chief Technology Officer, PRESTO ENGINEERING Semiconductor Test: A moving target cost, A changing landscape![]() ![]() Abstract Biografie |
|
09:40 | Looking on Modern Automotive Aspects for Chip Assembly, Chip Testing, and Chip Qualification |
Joachim Kusterer, Technical Manager SCM, RoodMicrotec Looking on Modern Automotive Aspects for Chip Assembly, Chip Testing, and Chip Qualification![]() ![]() Abstract Biografie |
|
10:05 | Wafer/ Package Test, WLCSP Test Contacting Performance and Reliability |
Bert Brost, Product Manager, Xcerra - Multitest Wafer/ Package Test, WLCSP Test Contacting Performance and Reliability![]() ![]() Abstract Biografie |
|
10:30 | Non-Equilibrium Gas-Dynamic Effects in Inertial Sensors |
Cristian Nagel, Ph.D. Student, Robert Bosch GmbH Non-Equilibrium Gas-Dynamic Effects in Inertial Sensors![]() ![]() Abstract Biografie |
|
10:55 | Coffee Break |
Session 4 |
Application and Processes |
Chair |
Klaus Pressel, Senior Manager, Infineon Technologies
![]() ![]() Biografie |
11:45 | Keynote |
Application-Driven Challenges in Automotive Packaging |
|
Tobias Helbig, Sen Director CTO Innovation Management & Programs, NXP Semiconductors Application-Driven Challenges in Automotive Packaging![]() ![]() Abstract Biografie |
|
12:15 | Effective EMI Shielding for Semiconductor Packages through Novel Conformal Coating Solutions |
Jinu Choi, Market Development Manager, Henkel Effective EMI Shielding for Semiconductor Packages through Novel Conformal Coating Solutions![]() ![]() Abstract Biografie |
|
12:40 | Silicones: a key material to support innovation in the Semiconductor Packaging industry |
Thomas Seldrum, Associate Application Engineer Specialist, Dow Corning Europe s.a. Silicones: a key material to support innovation in the Semiconductor Packaging industry![]() ![]() Abstract Biografie |
|
13:05 | Increasing Die Strength & Device Yields Using Plasma Dicing |
Jo Carpenter, Etch Product Management Engineer, SPTS Technologies Ltd Increasing Die Strength & Device Yields Using Plasma Dicing![]() ![]() Abstract Biografie |
|
13:30 | Closing Remarks |