Panelist

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Abstract
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Biography
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From Megawatts to Microseconds: Enabling Sustainable AI Through Power Semiconductor Innovation and Test

Marino, Fabio
Managing Director
Advantest Italia S.r.l

Abstract
Modern test systems are no longer simply production tools; they are strategic enablers of innovation. As AI reshapes the world's energy landscape, Advantest power test solutions help unlock next-generation power semiconductors full potential by ensuring uncompromising efficiency, reliability, and performance.

Biography
MARINO FABIOBorn in Italy in 1971. Hold a MS degree (1997) in electronics and a MBA (2012).Joined semiconductor industry in 1998 as designer and application engineer for analog and mixed signal devices. Since 2007 moved to management level with responsabilities in leading application engineer teams and account management.Joined Advantest in 2011 where currently holds the roles of MD for Advantest Italia S.r.l. and for CREA S.r.l.

Chip-scale, Software-Defined Hyperspectral Intelligence

Liapis, Andreas C.
CTO
Agate Sensors

Abstract
Coming Soon

Biography
Coming Soon

The Optical Interface Between Human and AI: Rethinking the Power Problem for AI Eyewear.

Koch, Tanja
Chief Business Officer
AlphaLum SA

Abstract
Every smart glasses maker is fighting the same battle: power. A display drains the battery. Running AI to understand what the user wants drains it further, typically through power-hungry cameras and inference pipelines that can't realistically stay on all day, and even when they do run continuously, low frame rates miss the fast, subtle signals that actually carry intent. Most solutions optimize one side of this equation, a more efficient display, or a lower-power sensor, but treat the other as someone else's problem. AlphaLum optimizes both, on a single optical platform.Our holographic combiner architecture delivers a step-change in display efficiency, easing the power cost of getting information in front of the eye. At the same time, our optical micromotion sensing platform reads subtle eye and skin signals directly, combining always-on operation with high temporal resolution, capturing fast micromotions continuously rather than trading one for the other, at a fraction of the power of camera-based AI interaction. The result is a combiner that cuts power on both the output and the input side of the human-AI loop, without forcing a choice between staying on and seeing enough.This talk covers why power has to be solved on both sides of the interaction, not just the display, why the combination of always-on and high temporal resolution is the precondition for genuinely useful AI interaction on the face, and what that means for how AR glasses get designed, built, and scaled toward true all-day wear.

Biography
Tanja Koch is the co-founder and Chief Business Officer of AlphaLum, a deep-tech photonics startup based in Lausanne developing next-generation optical systems for smart glasses. She brings over nine years of experience across startup founding, venture capital, and innovation strategy, with a particular focus on the AR hardware space.Before AlphaLum, Tanja served as Senior Product Manager at ams OSRAM, one of the world's leading optical semiconductor companies, where she gained direct experience bringing complex photonic and sensing technologies from R&D to market. That industry grounding, combined with her background as both a founder and a venture capitalist, gives her an unusual vantage point: she understands what it takes to build deep-tech products from the inside, and what it takes to scale and commercialize them.Tanja holds a Master of Science in Management from the Technical University of Munich (TUM) and has continued her education at Stanford University. Her academic foundation in design thinking and user-driven innovation shapes how AlphaLum approaches product development: starting from real user constraints, including power, form factor, and all-day wearability, rather than from technology capabilities alone.At AlphaLum, she leads business development, partnerships, and go-to-market strategy as the company advances its two core platforms: an ultra-efficient holographic waveguide display and an always-on optical micromotion sensing system, together forming a bidirectional interface layer between humans and AI.

Coming Soon

Matthias Schilz, Christof
Vice President
ams-OSRAM

Abstract
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Biography
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Panelist

Rothrock, Stephen
CEO
ATREG

Abstract
Panelist

Biography
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Panelist

Del Maffeo, Fabrizio
CEO & Co-Founder
Axelera AI

Abstract
Coming Soon

Biography
Fabrizio Del Maffeo is the CEO and co-founder of Axelera AI, the Netherlands-based startup delivering the world’s most powerful and advanced solutions for AI at the Edge. In his role at Axelera AI, Fabrizio leads a world-class executive team, board of directors and advisors from top AI Fortune 500 companies. In 2025 Fabrizio was named in the Top 25 AI CEOs globally, he is a frequent industry speaker, and a sought after expert on decentralized compute. Before establishing Axelera AI, Fabrizio Del Maffeo served as Head of AI at the Bitfury Group, a globally recognized emerging technologies company. Prior to joining Bitfury, Fabrizio was Vice President and Managing Director of AAEON Technology Europe, the AI and internet of things (IoT) computing company within the ASUS Group.

Panelist

Huyghebaert, Cédric
CTO
Black Semiconductor

Abstract
Panelist

Biography
Coming soon.

Beyond Perception: How MEMS Sensors Redefine Our Experience

Domdey, Desislava
Director Sensor Development
Bosch Sensortec

Abstract
What if sensors could not only perceive the world but help define how humans and machines experience it? From wearables and smart devices to next-generation robotics and immersive digital realities, MEMS technology is emerging as a key enabler of future innovation. This presentation discover how Bosch Sensortec’s diverse sensing roadmap combines breakthrough hardware, software, and AI to create tailored solutions for an ever-expanding universe of applications, featuring the latest generation of high-performance IMUs that push the boundaries of motion perception and contextual intelligence. Together, we will explore how tiny silicon structures are becoming the foundation of tomorrow’s connected, intelligent, and increasingly autonomous world.

Biography
Desislava Domdey is Director of MEMS Consumer Sensor Development at Bosch Sensortec, where she leads global teams developing and bringing to scale next-generation Inertial Measurement Units (IMUs).She began her career at Bosch in 2008 as a MEMS design engineer, specializing in modeling and system simulation, and quickly progressed through leadership roles spanning customer projects, application support, and product management in the automotive sector. Today, she combines deep technical expertise with a strong business perspective to drive innovation from concept to high-volume production.Her work focuses on translating cutting-edge MEMS technologies into scalable solutions for real-world applications. A recent highlight is the successful 2024 launch of the world’s smallest accelerometer. Originally from Sofia, Bulgaria, Desislava has lived in Germany since 2001 and resides with her family in Reutlingen.

Welcome & Introduction

Tchagaspanian, Michael
EVP, Strategic Partnership
CEA-Leti

Abstract
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Biography
Michael Tchagaspanian is now EVP Sales & Marketing at CEA-Leti since 2017. During his last 12 years at CEA-Leti, he launched collaborative programs with industrial partners in the field of smart sensing and imaging , embedded systems and integrated circuits. He manages several strategic developments with US Silicon Valley. Previously, he held the position of Business Development Manager for the Integrated Circuits and Embedded Systems Division, where he was previously head of the Image Sensor Design Laboratory, dedicated to intelligent integrated circuits for imaging applications and display. Advanced algorithms have been created and integrated into the circuit architecture for several applications (defense and security, smart home and building, medical). Prior to CEA, during the previous 11 years in the semiconductor industry, as ASIC design manager for ST Microelectronics and On Semiconductor, he built on-chip integrated circuits for radio frequency and management applications Energy. He has led strategic projects for automotive and mobile phone applications.

Opening keynote: Building the Physical Foundations of the AI Era

Dauvé, Sébastien
CEO
CEA-Leti

Abstract
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Biography
Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).

Reinventing the AI Compute Engine: Embedded Memory, 3D Integration and Beyond-CMOS Materials

Faynot, Olivier
GM of Silicon Component Division
CEA-Leti

Abstract
Coming soon

Biography
Olivier Faynot received the M.Sc and Ph.D. degrees from the Institut National Polytechnique de Grenoble, France in 1991 and 1995, respectively. His doctoral research was related to the characterization and modeling of deep submicron Fully Depleted SOI devices fabricated on ultrathin SIMOX wafers.He joined CEA (CEA-Grenoble, France) in 1995, working on Partially Depleted and Fully Depleted SOI technologies development in the frame of Industrial Partnerships.From 2008 to 2017, he managed various teams focussed on advanced CMOS, memories and 3D technology integration and was assigned on manufacturing sites to implement FDSOI technologies.During that period, he was engaged in the transfer to production of 28nm and 22nm FDSOI technologies with industrial partners. Those technologies are now available in production.From 2017 to 2019, he managed the Patterning department at CEA-LETI, within the Silicon Technology division.Since 2019, he is managing the whole Silicon Component division at CEA-LETI.He is author and co-author of more than 400 scientific publications in journals and international conferences, and was successively in the committees of the main international Semiconductors conferences like International Electron Device Meeting (IEDM), the symposium on VLSI Technology, the IEEE International SOI conference, the EUROSOI network, the Solid State Device and Materials (SSDM) conference and the International S3S conference.He received the ‘Général Férié’ award in 2012 and the ‘Electron d’Or’ award with CEA-Leti, ST Microelectronics and SOITEC in 2017.He has been elected as an IEEE Fellow in 2024 for leadership in CMOS technology development.

Rewiring AI Systems with Light: Silicon Photonics, Optical Interconnect and Co-Packaged Optics

Fellous, Cyril
GM of Optics and Photonics Division
CEA-Leti

Abstract
Coming soon

Biography
Cyril Fellous has joined CEA-Leti in 2024 as head of Optics and Photonics Division. He holds a PhD and Engineering degree in Physics and material science.Industry, business and technology enthusiast. he has developed a 25 years experience in high tech sector, enjoying many positions from process and Device engineer, R&D manager, quality manager, product and program manager and Business unit Director.Cyril has worked in various semiconductor companies like STMicroelectronics, Teledyne e2v, SOITEC.Cyril’s ambition is to develop long term partnerships, creating business opportunities and being customer focused.Within CEA-Leti he has the chance to lead a team of highly skilled experts and professionals providing breakthrough technologies and solutions to partners.Together we bring high differentiation in the image sensors, optical sensors, Silicon photonics, optical packaging and displays for sensing, imaging, IA, data communication, computing, AR/VR, health and we help our customers to transform these R&D technologies into industrial solutions.

Powering the AI Factory: Advanced Power Delivery, Thermal Management and Packaging

Clermidy, Fabien
GM of System Division
CEA-Leti

Abstract
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Biography
Fabien Clermidy is currently heading the system Division of CEA-LETI. He was previously leading the digital architecture and IC design division.The main activities of his division spread from power modules development to hardware cybersecurity, including sensors system design and new telecommunication scheme. The main applicative domains are automotive, factory of future, energy, telecommunications, security and defense.Fabien holds a PhD, a thesis supervisor degree and is a CEA research director. He has published more than 100 papers including in the greatest conferences such as ISSCC, VLSI, DAC, DATE or IEDM. He is also author or co-author of 15 patents. Fabien is in the board of directors of the open Hardware Group leveraging on RISC-V open-source initiative

When Chips Start Talking with Light: Live Journey into Optical Network On Chip

Thonnart, Yvain
Chief Scientist, Digital Integrated Circuits and Systems Division
CEA-Leti

Abstract
Coming soon

Biography
Yvain Thonnart graduated from Ecole Polytechnique and Telecom Paris, France in 2005. He then joined the Technological Research Division of CEA, the French French Alternative Energies and Atomic Energy Commission, within the CEA-Leti institute until 2019, then within the CEA-List institute. He has led the development of several large research projects for on-chip communications, focusing on the maturation of novel concepts towards industrial adoption, such as communication between multiple voltage and frequency domains, 3D-stacked circuits, and optical on-chip interconnects. He is now a CEA fellow, and chief scientist for the digital ICs and systems division of CEA-List.

Inside the Drone Brain: Sensing, Positioning, Connectivity and Cybersecurity for Trusted Autonomy

Despesse, Philippe
Deputy Director of Programs, Systems Division
CEA-Leti

Abstract
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Biography
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Closing keynote: RESOLVE: Engineering Sustainable Compute for Europe

Lequepeys, Jean-René
CTO
CEA-Leti

Abstract
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Biography
Jean-René Lèquepeys received an engineering degree in 1983 from CentraleSupélec, a top French graduate engineering school at Paris-Saclay University, France. He taught physics during 2 years in Ouarzazate, Morocco.He joined CEA, a French Research and Technology Office focusing on applied research, in Paris Saclay in 1985. He first worked at the laboratory of the Central Security Office, on the evaluation of means of detection and intrusion. Two years later, he was promoted head of this laboratory.In 1993, he moved to Grenoble, France, and joined the System Division of CEA-Leti. He worked on different projects in the field of image processing and telecommunication technologies. In particular, he was responsible for the "Telecom, Communicating Objects and Smart Card" programs from 1999 to 2004.In 2005, he took the responsibility of the Circuits Design Division at CEA-Leti (200 people). He launched new research activities at CEA such as a new laboratory in Aix-en-Provence, France, on the development of secured chips. In 2000, Jean-René Lèquepeys received the prestigious award from the french Société de l'Electricité, de l'Electronique et des technologies de l'information et de la communication (SEE) "Grand Prix de l'électronique Général Ferrié" for his work in the telecommunications field (he holds 15 patents).In 2010, he launched a new division at CEA focusing on Electronic Architectures, Integrated Circuit Design and Embedded Software. He established the structure on two sites (Paris and Grenoble) and led the division twice in his career.He rapidly got involved in the creation of the Silicon Components Division at CEA-Leti, and took the lead of it in 2011 managing 350 people. Division encompasses micro and nanoelectronics (SOI, nanodots, quantum, memories, 3D technologies, substrates), Micro Systems (sensor, actuator, radiofrequency components) and Power Components. He established the French Nano2022 Program for research funding in microelectronics.In 2019, he was appointed Chief Technology Officer of CEA-Leti, overseeing Science, relations with the European Commission, Industrial Partnership and Strategic Program Management in the scope of the institute (2,000 people, ~€350m budget). He took the responsibility of the Microelectronic Program at CEA level, spearheading technological and upstream research in the field of semiconductor technologies. For the past 2 years, he has been strongly involved in the CEA-Leti Next Gen FD-SOI project in the frame of France2030 and has played a key role in European chips Act pilot line promoting FD-SOI and Gate All Around technologies.Having dedicated his career to applied research, he is regularly invited as a keynote speaker in international semiconductor conferences.Jean-René is also Vice President of ACSIEL, a professional trade union gathering industrial companies in the French electronic value chain, member of the Board of EPOSS, the European Technology Platform on Smart Systems Integration, a member of the Board of AENEAS, the Association for Europoean NanoElectronics Activities, and an expert consultant for the European Commission and French Research Agency

Boosting MEMS through technological development: from improved transduction to optomechanics

Sansa, Marc
Project Manager in Optomechanics
CEA, Leti

Abstract
Electrical microsensors (MEMS) have been gaining maturity and performance over the last 40 years, and they are nowadays ubiquitous in our everyday life. Recently, the integration of MEMS with silicon photonics gave birth to optomechanical MEMS (optically transduced microsensors), enabling a jump in performance in terms of readout sensitivity and frequency of operation. This combination opens the door to new sensing paradigms across various fields, and is rapidly maturing in terms of integration.In this talk I will present the advantages of optomechanics for high-efficiency sensing, and showcase how CEA-Leti’s developments have enabled novel applications in fields such as biosensing, environmental and biological monitoring, high-speed atomic-force microscopy (AFM) and precision timing with clocks.

Biography
Marc Sansa received his M.Sc. in Micro and Nanotechnologies from the Universitat Autònoma de Barcelona in 2009 and his Ph.D. in Electronic Engineering from the same institution in 2013. He joined CEA-LETI in 2014 as a research engineer and currently serves as a project manager at the Sensors and Actuators Laboratory. He is an expert in microelectromechanical systems (MEMS) and optomechanics, he has authored over 65 publications and holds more than 18 patents. His research focuses on developing novel MEMS technologies by leveraging multiphysical approaches and collaborative efforts among multidisciplinary teams and experts from diverse fields.

Europe's first semiconductor VC fund

Kromhof, Rene
Founding Partner
Cloudberry VC

Abstract
Introduction to Cloudberry VC: Europe's First Semiconductor-Dedicated VC FundEurope leads the world in semiconductor research yet captures a fraction of the value when that research becomes a company. Too many promising deep tech teams stall in the gap between the lab and a first commercial cheque, and most generalist funds are not built to underwrite hardware risk on physics, fabrication, and long development cycles.Cloudberry VC was founded to close that gap. As Europe's first venture fund dedicated to semiconductors, photonics, and advanced materials, we back founders at pre-seed and seed, the earliest and hardest stage to fund, and bring deep operator experience and strategic industry partners to help them reach the market. Our strategic LP base includes industry leaders such as GlobalFoundries and Radiant Opto-Electronics, giving portfolio companies direct access to manufacturing expertise, supply chain reach, and commercial relationships from day one.This talk introduces who we are, why a specialist fund matters for European deep tech, what we look for in a team and a technology, and how we work alongside founders from first cheque onward. It is aimed at founders, researchers, and partners building the next generation of European semiconductor companies.

Biography
René Kromhof is Founding Partner of Cloudberry VC, Europe's first venture fund dedicated to semiconductors, photonics, and advanced materials. He brings more than two decades in the semiconductor and consumer electronics industry to backing deep tech founders at the earliest stages.René spent seven years at ASML, where he worked at the heart of the lithography systems that underpin modern chipmaking. He later helped build Heptagon, a developer of optical sensing and micro-optics technology, through to its acquisition by ams AG in 2017. These experiences shaped his conviction that Europe's world-class semiconductor research deserves capital and partners that understand hardware.At Cloudberry VC, René invests at pre-seed and seed in founders building the next generation of European chip, photonics, and materials companies, backed by strategic industry partners including GlobalFoundries. He is based in Helsinki and works with founders across Europe to take ambitious technology from the lab to the market.

Coming Soon

Lobo, Francisco
CEO
Critical Manufacturing

Abstract
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Biography
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Closing Remarks

Raithel, Stephan
COO Gas Treatment
DAS Environmental Expert GmbH

Abstract
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Biography
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Jarre, Alain

DIP-View

Abstract
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Biography
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Designing Sustainable, Energy-Efficient and High-Performance Semiconductor Fabs

Turtschan, Silvia
Dipl. Ing. (FH), Director
Drees & Sommer SE

Abstract
Topic coming soon

Biography
Topic coming soon

Materials Matter: Enabling Advanced Packaging Performance at Scale

Parry, Gilbert
Director | Advanced Innovation & Technology
Entegris

Abstract
As advanced packaging becomes the primary path to system-level performance, success increasingly depends on how well materials and interfaces are controlled throughout the integration flow. The shift to heterogeneous integration, high-density interconnects, and advanced bonding schemes places new requirements on material purity, stability, and interaction at various technology nodes.Performance is now tightly linked to interface integrity, where contamination, defects, or variability can directly impact yield and long-term reliability. At the same time, increasing thermal loads and new architectures require materials with enhanced thermal conductivity, electrical performance, and compatibility with emerging integration schemes.Scaling these technologies from development to high-volume manufacturing introduces additional challenges in handling, cleaning, planarization, and process consistency – particularly with the transition toward larger formats such as panel-level packaging.Entegris supports this evolution through materials-driven solutions and process-enabling technologies spanning Cu deposition, cleaning, CMP, high-viscosity material handling, thermal management, contamination control, and filtration – ensuring that performance achieved at the design stage is preserved through industrial-scale manufacturing.

Biography
Gilbert Parry joined Entegris in 1995 as an application engineer in its semiconductor business. He then held various technical and product management positions in gas purification, liquid and specialty chemicals filtration.Over the past 20 years, Mr. Parry has been responsible for cross-divisional Business Development activities in a variety of industries, including energy production and storage, graphic arts, water treatment or life sciences. Now involved in analyzing semiconductor technology trends to guide the company's investments and research directions, M. Parry explores the opportunities presented by the most critical applications of Advanced Packaging, particularly those requiring new materials.Mr. Parry is a graduate engineer (Master of Science) in chemistry, polymers and materials from ECPM, Strasbourg, France.

Panel Discussion Moderator

Yang, Wenge
VP of Marketing
Entegris Inc.

Abstract
Panel Discussion Moderator

Biography
Coming soon.

Unlocking Public Funding for Strategic Semiconductor Projects

Isabelle, Marc
CEO & Founder
european economics

Abstract
The semiconductor industry is one of the largest beneficiaries of public funding in the EU. This momentum is reinforced by the EU Chips Act 2.0 and IPCEI AST, which place semiconductor technologies and investments at the heart of Europe’s renewed industrial policy. Grants support R&D activities, first industrial deployment of breakthrough innovations, and first-of-a-kind manufacturing facilities across the value chain. Securing State aid and EU funding remains highly competitive and requires a clear understanding of available opportunities, processes and regulations. Based on several use cases, Marc Isabelle’s presentation will provide a practical first dive into public funding opportunities for the semiconductor industry in the EU.

Biography
Marc ISABELLE, engineer and PhD in Economics, is the founder and CEO of european economics.Marc is a recognised expert in the public funding of strategic projects. Since 2009, he has helped 210 companies secure €46 billion in public funding for more than 250 major projects. These initiatives tackle key societal challenges - including disruptive innovation, decarbonisation, resilience and infrastructure - across a wide range of industrial sectors including microelectronics, software, telecoms, automotive, energy and environment, batteries, pharmaceuticals and biotech.Through his extensive work with the European Commission and national authorities, Marc has actively contributed to shaping the methodologies and best practices used to assess public funding applications and their compatibility with EU regulations.

Panelist

Uhrmann, Thomas
VP of Sales
EV Group

Abstract
Panelist

Biography
Coming soon.

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Kneitz, Stefan

GlobalFoundries

Abstract
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Biography
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The evolvement of the largest and most complex structure built by humans and its influence on Power Semiconductors

Keller, Tobias
Vice President, Head of global Product Management, Portfolio & Marketing
Hitachi Energy Ltd

Abstract
The electrical power grid has been built up over decades and many previously isolated sub-grids are connected to each other. The integration of renewable energy sources now leads to a sharp increase in power semiconductors in the distribution network with technologically very interesting prospects.

Biography
Tobias Keller graduated in 2004, from University of applied science Aargau, the Electrical Engineering Faculty, with a degree in power electronics, thermodynamics and electrical machines. At the end of 2004, he joined ABB Excitation systems and Synchronizing equipment business (Turgi, Switzerland) and held various engineering position until 2008. He holds the first patent on MEGATROL, ABB’s smart power package solution for reliable starts of gas turbines or any synchronous machine and another patent quenching arc faults in excitation systems. In 2008 he became the Head of global Technology and Support for ABB’s Excitation systems and Synchronizing equipment business. Between 2009 and 2015 he was the Vice President global Products and Marketing ABB Excitation systems and Synchronizing equipment and High Power Rectifier business. Starting from 2016 until 2019 he held the Vice President position for Vehicle Integration Engineering business in ABB railway traction. Since April 2019, he is the Vice President of global Product Management in ABB Semiconductors (Lenzburg, Switzerland) now HITACHI ENERGY Semiconductors and a strong supporter of SiC used in power electronics based on his application know how from traction and industrial applications. Tobias is responsible for the global Product Management and Marketing of any Power Semiconductor from Hitachi Energy as well as responsible for BIMOS power semiconductors R&D (Chips and packages, Si and SiC). Tobias Keller is a senior member of IEEE (20127) and co-author of various papers.

Moderator

Vanhoutte, Tom
Partner - imec.xpand
imec

Abstract
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Biography
Tom Vanhoutte is founding partner of imec.xpand, an independently managed early stage and growth fund that invests in start-ups where knowledge, expertise, network and/or infrastructure of imec, the world-renowned semiconductor R&D center, plays a differentiating role in the success of the company. The two imec.xpand funds raised over 400 million EUR and are amongst the best performing venture capital funds globally.

Panelist

Miller, Andy
Department Director, 3D and Silicon Photonics Technology
imec

Abstract
Panelist

Biography
Coming soon.

Closing Remarks

Marent, Katrien
EVP & Chief Marketing and Communications Officer
imec

Abstract
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Biography
Katrien Marent has an engineering degree in microelectronics. She joined imec in 1992 as analog design engineer and specialized in design of low-noise readout electronics for high-energy physics. In 1999, she became press responsible and scientific editor at imec's business development division and was responsible for authoring and editing the research organization's numerous company technical documents and publications. In 2001, she was appointed corporate communications director at imec. Her responsibilities expanded in August 2007, when she got the position of external communications director including corporate, marketing and outreach communications. In October 2016, she became VP corporate, marketing and outreach communication. Since April 2020 she is Executive Vice President & Chief Marketing and Communications Officer and member of the executive board of imec.

Orchestrating a scalable AI revolution

Vandenameele, Patrick
CEO
imec

Abstract
Artificial intelligence is becoming the defining technology of our era, but its long-term impact depends on one critical challenge: scalability. As AI evolves toward complex, agentic systems operating from cloud to edge, demands on compute, memory, and connectivity are growing at an unprecedented pace. This keynote explores how sustaining the AI revolution requires innovation across the entire technology stack, from advanced CMOS and heterogeneous integration to photonic interconnects and system-level co-optimization. Looking further ahead, emerging paradigms such as quantum and brain-inspired computing may unlock new forms of efficient intelligence. Ultimately, scalable AI will not emerge from a single breakthrough, but from orchestrating a global ecosystem of technologies, disciplines, and innovators.

Biography
Patrick Vandenameele is Chief Executive Officer at imec - a globally recognized R&D center specializing in nanoelectronics and digital technologies - since April 1, 2026. His leadership underpins imec’s commitment to addressing market-driven application challenges while advancing its world-class technology platforms through targeted internal investments and external collaborations.Prior to this appointment as CEO, he served as Executive Vice President and Co-Chief Operating Officer at imec, where he was overseeing and shaping the organization's R&D strategy and its execution. In this position, Patrick was responsible for shaping and driving the center’s innovation agenda, ensuring the alignment of research initiatives with emerging market needs, partner priorities and technological frontiers. Previously, as chief portfolio officer at imec until early 2024, he spearheaded strategic initiatives spanning business development, portfolio management, and venture creation. Holding a PhD from KU Leuven, Patrick began his journey with imec in 1996, contributing to the wireless communications program. In 2000, he transitioned to entrepreneurship, founding and leading several deep-tech ventures, three of which were built on imec technology. Patrick also held senior positions at top semiconductor firms like Qorvo and Hisilicon/Huawei, leading 11 product launches and overseeing over 100 million units shipped. After returning to imec in 2017, Patrick has been instrumental in expanding imec’s venture development activities, working closely with the deep-tech venturing fund imec.xpand to strengthen imec’s position as a pioneer in technology-driven solutions.

What does an AI Workload actually need from silicon? imec's cross stack view

Latré, Steven
VP AI
imec

Abstract
As AI workloads increasingly dictate hardware requirements, the semiconductor industry needs a common, vendor-neutral language to connect process and packaging decisions to real-world AI performance. This talk introduces imec's AI Stack: a benchmarking platform and layered framework that maps AI workloads — from inference to training — down through system architecture, device integration, and ultimately to process and materials choices such as lithography parameters and node scaling. Drawing on early results, including a GPU total-cost-of-ownership analysis, we show how fab-level decisions ripple through to workload economics, and outline imec's ambition to build an open ecosystem where hardware and AI software communities can jointly optimise the stack.

Biography
Steven Latré is Vice President AI at imec, the worldwide leading research centre on semiconductors. In this role, he’s responsible for imec’s AI portfolio, focusing mainly on the intersection of hardware and software and how next generation AI workloads drive the semiconductor roadmap. Steven has a 20+ year career in AI, leading and scaling highly technical teams on the intersection of AI and hardware. Previously he was a professor in AI at the University of Antwerp, Chief AI Officer at OpenChip, a full stack chip player in HPC and AI, and was already previously Vice President AI at imec.

From Vision to Impact: Three Years of NanoIC Enabling Future Semiconductor Technologies

Holsteyns, Frank
VP R&D Unit Process & Modules
imec

Abstract
Three years after its launch, NanoIC grows into a collaborative European innovation ecosystem that accelerates the development of the chips of the future. Driven by a shared ambition to strengthen the semiconductor innovation and expand manufacturing capabilities, NanoIC brings together industrial and research partners around advanced technology platforms and infrastructure. By highlighting key achievements in Logic, Memory and Heterogeneous Integration, we showcase how collaborative R&D and shared infrastructure can accelerate innovation and reduce barriers to technology development. Engagement with companies, leveraging this new ecosystem, allows to jointly shape the next generation of semiconductor technologies together.

Biography
Frank Holsteyns has been serving as the VP of R&D at imec, leading the Unit Process and Module Department since July 1, 2023. Before stepping into this role, he was the director of the same department, where he managed various process-development-focused groups, including surface and interface processing, etch, thin film deposition, epitaxy, plating, chemical mechanical polishing, layer transfer, and assembly.Frank's journey at imec began in 2000, where he concentrated on wet cleaning research for semiconductor devices. His work in this area culminated in a PhD in Bio Engineering (surface chemistry) from KU Leuven, Belgium. In 2006, he transitioned to Lam Research AG in Villach, Austria, as a research scientist. There, he coordinated a university and research network focused on fluid dynamics, particularly cavitation, droplet impact, wetting, and dewetting.In 2012, Frank returned to imec, taking on the role of manager for the Surface and Interface Processing Group. In this position, he specialized in wet clean and etch processes, as well as isotropic dry etches.

Design enablement services - lowering the barrier for IC design companies

Hoofman, Romano
Strategic Development Director
imec

Abstract
As part of the EU Chips Act, the EU Chips Design Platform (EuroCDP) has been launched. EuroCDP's mission is to lower the barrier for fabless IC design companies, in particular startups. This will be done by lowering the technical barriers and the cost of the design process, plus in addition dedicated venture development together with private investors. EuroCDP is designed as a one-stop marketplace for startups, SMEs, and research teams, offering streamlined access to advanced design tools, manufacturing, IP, training, and funding.

Biography
Romano Hoofman is Strategic Development Director at imec since 2016. He is responsible for the coordination of both the EU Chips Design Platform and the EUROPRACTICE Service. In addition, his team is responsible for providing technology access and design enablement for the NanoIC pilot line, 2D-PL and SPINS (Quantum pilot line). He started his career in industry, where he worked as a Principal Scientist at Philips Research and later on NXP Semiconductors. He covered many different R&D topics, ranging from CMOS integration, advanced packaging, thin film batteries, photovoltaics and (bio)sensors. Romano received his PhD from the Technical University of Delft in 2000, where he investigated charge transport in semi-conducting polymers. He has authored more than 30 publications and holds more than 10 patents in various research areas.

Beyond Automotive: Chiplets as the Foundation for Autonomous Edge Platforms

Sommer, Grit
Regional Managing Director
imec

Abstract
Edge High Performance Compute is becoming the “brain” of autonomous systems, enabling the rapid growth of L2+ and future autonomous mobility capabilities. However, the automotive industry faces a fundamental dilemma: compute requirements are increasing exponentially, driven by AI and advanced perception workloads, while the global automotive market remains relatively flat and cannot absorb the rising costs associated with leading-edge semiconductor technologies.Imec believes interoperable chiplet architectures provide the path forward. By decomposing complex system-on-chip designs into modular building blocks, chiplets enable heterogeneous integration of compute, AI, safety, and memory functions, each optimized on the most appropriate technology node. This approach improves scalability, yield, cost efficiency, supply-chain resilience, and platform reuse while supporting the transition toward software-defined vehicles.To accelerate adoption, imec is bringing together complementary initiatives across the chiplet value chain. The Automotive Chiplet Forum (ACF) aligns industry stakeholders around open, interoperable chiplet standards, while the Automotive Chiplet Program (ACP) advances pre-competitive research and technology development. Complementing these efforts, the new Chiplet Acceleration Center (CAC) at imec Germany supports design enablement, prototyping, and the path toward industrial deployment. Together, they help de-risk development, advance quality and reliability, and accelerate the transition from chiplet innovation to real-world automotive applications.Building on the success of ACP, imec is expanding its vision beyond automotive with the launch of the Autonomous Edge Chiplet Program (AECP), addressing shared compute needs across robotics, humanoids, aerospace, and security applications. Complemented by the development of a reference autonomous edge platform, this cross-industry strategy aims to accelerate innovation, reduce costs, strengthen resilience, and establish interoperable chiplets as the foundation for next-generation autonomous systems.

Biography
Dr. Grit Sommer is the Regional Managing Director of imec Germany, a position she has held since July 2026. With almost three decades of experience in the semiconductor industry, she is recognized as a strategic technology leader, transformative executive, and accomplished people manager, combining deep technical expertise with a strong track record of building high-performing global organizations. Prior to joining imec, Dr. Sommer spent 20 years with Infineon Technologies, where she held a series of international leadership positions across Germany and Singapore. Most recently, she served as Senior Director Global Product Engineering Digitalization, leading the digital transformation of end-to-end product engineering across a global network of manufacturing and R&D sites. In this role, she drove the adoption of advanced analytics and artificial intelligence, enabling significant improvements in product development efficiency, yield optimization, and quality management. Throughout her career, Dr. Sommer has successfully led multicultural teams across Europe, Asia, and the Americas, managing organizations with of up to 50 experts and influencing more than 1,000 employees worldwide. Her expertise spans semiconductor technology, advanced packaging, product engineering, manufacturing excellence, digitalization, and innovation management. She has consistently delivered business impact through strategic program leadership, operational excellence initiatives, and technology-enabled transformation. Before her tenure at Infineon, Dr. Sommer held research and leadership roles at the Fraunhofer Institute for Reliability and Microintegration (IZM), where she established and led advanced RF modelling and simulation activities and managed numerous industry and publicly funded research programs. Dr. Sommer holds a PhD (Dr.-Ing.) in Electrical Engineering and Computer Science from TU Berlin, specializing in RF modelling and design optimization. She also earned her Engineering Degree (Diplom-Ingenieur) in Electrical Engineering from TU Berlin with distinction. In addition to her executive responsibilities, she has served as a board member supporting the strategic development of Fraunhofer IZM and has contributed to industry governance and leadership selection processes. Driven by curiosity, innovation, and an entrepreneurial mindset, Dr. Sommer is passionate about advancing semiconductor technologies and strengthening Germany's role in the global microelectronics ecosystem.

Chips Act 2.0 and SSTS: Building Europe's Next Semiconductor Advantage

Shamuilia, Sheron
ESG Program Director
imec

Abstract
As Europe moves from capability creation to competitiveness, the success of Chips Act 2.0 will depend not only on research infrastructure, pilot lines and manufacturing capacity, but also on the intelligence, innovation and ecosystem collaboration required to sustain them. This presentation explores how imec's Sustainable Semiconductor Technologies & Systems (SSTS) program combines its Assess and Improve activities to create competitiveness intelligence across the semiconductor value chain. By connecting manufacturers, suppliers, researchers, system companies and emerging design ecosystems, SSTS helps address challenges related to sustainability, resilience, resource security and future design enablement. The presentation discusses how such ecosystem intelligence can contribute to Europe's long-term competitiveness and support the ambitions of Chips Act 2.0.

Biography
Sheron Shamuilia leads imec's ESG strategy, embedding sustainability across semiconductor R&D, operations, governance, and strategic partnerships. Her work focuses on positioning sustainability as a driver of responsible innovation, ecosystem resilience, circularity, and long-term value creation. With over 15 years of experience spanning the European Commission, corporate public affairs, and the semiconductor industry, including Cadence, she has worked at the intersection of technology, policy, innovation, and business strategy. Holding a Ph.D. in semiconductor physics, Sheron brings a unique combination of technology expertise, policy insight, and sustainability leadership, helping bridge research, industry, and government to accelerate sustainable innovation and competitiveness across the semiconductor ecosystem.

Panelist

Van den Bosch, Anne
VP Strategic Public Policy & Invest for R&D Ecosystems
imec

Abstract
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Biography
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NEMS-Based Inertial Sensors: Enabling Navigation-Grade Performance for High-Volume Autonomous Applications

Robert, Philippe
CEO
INGAGE

Abstract
Reliable navigation remains a critical challenge for autonomous systems operating in environments where GNSS signals are unavailable or degraded. From autonomous vehicles and drones to industrial robots, accurate positioning requires inertial sensors capable of maintaining navigation performance during extended GNSS outages.While MEMS inertial sensors have become ubiquitous thanks to their compact size, low power consumption and low manufacturing cost, their performance remains insufficient for many navigation-grade applications. Conversely, existing high-end inertial solutions deliver the required accuracy but are often too bulky and expensive for deployment in high-volume markets.This presentation introduces a new generation of MEMS inertial sensors based on ultra-sensitive nano-strain-gauge transduction technology. Developed over more than 15 years of research at CEA-Leti and protected by an extensive patent portfolio, this breakthrough sensing approach significantly enhances the detection of mechanical motion and enables performance levels beyond the limits of conventional capacitive MEMS technologies.The talk will present the fundamental principles of nano-strain-gauge sensing, its integration into MEMS accelerometers and gyroscopes, and the expected benefits in terms of bias stability, noise performance, scale-factor stability and overall inertial navigation accuracy. Particular attention will be given to the challenges associated with transferring advanced laboratory technology into a manufacturable industrial solution compatible with high-volume semiconductor processes.The presentation will also provide an overview of the technology industrialization roadmap pursued by iNGage, a fabless Deeptech company founded in 2025 to bring this innovation to market. By combining navigation-grade performance with MEMS scalability, nano-strain-gauge inertial sensors have the potential to unlock a new generation of cost-effective navigation systems for autonomous mobility, robotics and other demanding positioning applications.

Biography
Philippe Robert is CEO and co-founder of iNGage, a deeptech startup developing a new generation of high-performance MEMS sensors. He holds a PhD in Microtechnologies and began his career at the startup SILMAG, developing advanced magnetic sensor technologies for data storage, before joining THALES to work on high-end MEMS inertial sensors for aerospace and defense applications.He joined CEA-Leti in 2001, where he held successive leadership roles, including Head of the MEMS Sensors Laboratory and Head of the Microsystems Department (120+ people), before leading Business Development for Microsystems.In 2025, he founded iNGage as CEO & CTO, leading corporate strategy, fundraising, and execution.He has authored over 50 scientific publications and holds more than 60 patents, including more than 20 related to the M&NEMS architecture at the core of iNGage’s innovation.Philippe also contributes to the international MEMS community through expert evaluations (HCERES, EIC) and leadership roles in major conferences such as IEEE MEMS, IEEE Transducers, and Eurosensors.

Ultra miniaturized rechargeable solid-state micro battery technology for new generation of implantable medical devices

Andreucci, Philippe
Chief Executive Officer
Injectpower

Abstract
Powering the Future of Digital Health: Ultra-Miniaturized All-Solid-State Microbatteries for Next-Generation Implantable Medical DevicesThe rise of digital health and personalized medicine has fueled an unprecedented demand for autonomous, smart implantable medical devices (IMDs). Monitoring and treating chronic pathologies—such as glaucoma in ophthalmology, intracranial pressure in neurosurgery, or arrhythmia in cardiology—require continuous, highly reliable physiological data tracking. However, traditional battery technologies represent a critical bottleneck, as their size, rigid form factors, and chemical leakage risks severely limit the miniaturization and safety of long-term implants.This paper introduces INJECTPOWER’s breakthrough energy solutions based on wireless rechargeable, all-solid-state microbatteries tailored specifically for high-density, ultra-miniaturized IMDs. Leveraging over 20 years of foundational R&D at CEA-Leti and protected by a robust portfolio of more than 40 patents, these microbatteries achieve dimensions as thin as a human hair while delivering unrivaled volumetric energy density and hermetic safety.By eliminating liquid electrolytes, this all-solid-state chemistry eliminates the risk of toxic leakage, ensuring high biocompatibility and excellent thermal stability during wireless charging cycles (such as RF or inductive powering). This technology enables a new paradigm of completely autonomous, micro-scaled implants capable of providing continuous, representative medical data over years of implantation.We will present the electrochemical performance, cycling stability, and integration architecture of these microbatteries. Finally, we will discuss the scaling-up strategy and industrial roadmap within the framework of the European IPCEI Health (Tech4Cure) program, leading toward a first certified commercial product on the market by 2029.

Biography
Philippe AndreucciCo-founder & CEO of INJECTPOWER | Deep Tech Entrepreneur & Board MemberBiographyPhilippe Andreucci is a seasoned deep-tech entrepreneur and executive leader with over 25 years of experience driving breakthrough innovations from laboratory research to global markets. Throughout his career, he has successfully operated at the intersection of micro-technologies, nanosystems, and life sciences, combining strong technical expertise with a proven track record in fundraising, corporate governance, and international business development.Philippe began his leadership journey at CEA-Leti, a world-renowned microelectronics research institute, where he served as Head of Nanosystems Programs. During this tenure, he co-founded the Alliance for Nanosystems VLSI—a prestigious, multi-year international research collaboration between the CEA and the California Institute of Technology (Caltech), established alongside Professor Michael Roukes.Driven by an entrepreneurial vision, Philippe transitioned from institutional leadership to venture creation. He co-founded and led APIX Analytics, a company specializing in miniaturized gas chromatography systems for industrial and environmental applications. Under his leadership as CEO, APIX successfully industrialized its technology, raised significant venture capital and additional fundings, and established a strong international footprint.Following this success, Philippe co-founded INJECTPOWER in 2020, a pioneering deep-tech company disrupting the implantable medical device sector. The company manufactures ultra-miniaturized, wireless rechargeable all-solid-state microbatteries that provide autonomy to a new generation of monitoring and treatment solutions for chronic diseases (such as glaucoma, cardiovascular, and neurological disorders). Under his guidance, INJECTPOWER secured a strategic position within the prestigious European IPCEI Health (Tech4Cure) program, established key commercial partnerships in the US, and is currently on track for its first product certification by 2029.An active figure in the tech ecosystem, Philippe serves as a Board Member for several high-growth startups, where he provides strategic counsel on corporate scaling, venture financing, and intellectual property management.Core ExpertiseDeep Tech Entrepreneurship & Leadership: Proven ability to build, fund, and scale companies with highly complex, hardware-and-software integrated technologies.International Ecosystem Building: Established track record of forging high-level academic and industrial alliances between Europe and the United States (e.g., Caltech, US clinical partners).Venture Capital & Corporate Finance: Expert in structuring mixed financing strategies, combining multi-million dollar equity rounds (VC) with non-dilutive sovereign funding (IPCEI, state grants).Governance & Advisory: Experienced board member guiding early-stage and scaling startups through critical pivots, IP valorization, and growth phases.Vision Statement: "Miniaturized, reliable energy is the true gateway to tomorrow's digital health. By giving implantable devices the power to monitor chronic conditions autonomously, we are shifting medicine from reactive treatments to proactive, life-saving data intelligence."

Autonomous Factory with Physical AI

Jang, Young Jae
Professor
KAIST

Abstract
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Biography
Young Jae Jang received his Ph.D. in Mechanical Engineering from the Massachusetts Institute of Technology (MIT) in 2007, and dual M.S. degrees in Mechanical Engineering and Operations Research from MIT in 2001. He earned his B.S. in Aerospace Engineering from Boston University in 1997. He is currently a Professor in the Department of Industrial and Systems Engineering at the Korea Advanced Institute of Science and Technology (KAIST) and the Founding Director of the Center for KAIST Manufacturing Physical AI, where he leads research on next-generation autonomous manufacturing systems. In parallel, he is the CEO and Co-founder of DAIM Research Corp., the leading startup commercializing AI-based manufacturing powered by Physical AI technology. DAIM’s platforms have been successfully deployed by major global manufacturers, including Samsung Electronics, LG Electronics, SK On, and LG Energy Solution, demonstrating large-scale industrial adoption and real-world impact.

Innovation in MEMS-industry, where do we come from and where are we going

Vilenius, Tommi
Senior Manager, Business Development Automotive
Murata Electronics Oy

Abstract
Small reflexion on how has innovation in MEMS business changed over the past 30 years. Starting from innovating how to realize a function on silicon, then how to make it for less than $100 and miniaturizing the sensors to fit inside a smartphone.What is MEMS innovation today and how we need to innovate in future to create value for the whole supply chain & industry.

Biography
Tommi Vilenius has been working in Automotive MEMS business for 30 years in various roles from R&D, Quality, Testing and Customer interface. Currently Mr Vilenius is focusing on new automotive applications for inertial MEMS and fitting together physical MEMS devices to ever improving capabilities of data processing & AI.

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Fabrowsky, Jens
COO
Neura Robotics GmbH

Abstract
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Biography
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Topic Coming Soon

Traverso, Andrew
Chief Scientist
Neurophos Inc.

Abstract
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Biography
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Design and Manufacturing by NIL of a Meta-Optics Camera

Kamino, Brett
Manager Business Development and Strategy
NIL Technology

Abstract
Meta-optics are emerging as a powerful technology platform for next-generation imaging and sensing systems, enabling optical performance and form factors that are difficult to achieve with conventional refractive optics. By controlling light through engineered nanoscale structures, meta-optics offer new opportunities for applications such as augmented reality, eye tracking, machine vision, and advanced optical sensing. However, translating these high-performance designs into scalable, manufacturable products still remains an open challenge.This presentation will describe how NIL Technology (NILT) addresses this challenge through meta-optics lens architectures and a manufacturing platform built for industrial-scale production. As a dedicated meta-optics foundry, NILT provides a complete pathway from prototyping to high-volume manufacturing, supported by vertically integrated capabilities including electron beam lithography, nanoimprint lithography, etch processing, metrology, testing, and optical integration.The presentation will examine the relationship between design, manufacturing, and optical performance, demonstrating how mature design-for-manufacturing methodologies enable close agreement between simulation, prototype results, and volume production. NILT's nanoimprint-based manufacturing approach is critical to achieving state-of-the-art performance in scalable meta-optics products. Using this unique manufacturing process, NILT has demonstrated excellent process stability, wafer-to-wafer reproducibility, and scalability to production volumes in the millions of units.A case study of the commercially available metaEye™ ultra-compact eye-tracking camera will highlight how meta-optics can reduce system size, improve thermal stability, simplify optical assemblies, and deliver robust imaging performance in demanding real-world environments.Finally, the presentation will outline NILT's foundry model for commercializing meta-optics. NILT's mature and proven design rules for meta-optical elements ensure predictable optical performance from initial design through prototyping to high-volume production. Adding to this are NILT’s open-access module architectures, which enable customers to build custom meta-optic modules based on proven designs. Whether customers bring their own designs, want to customize module solutions based on NILT’s architectures, or seek a complete custom solution, NILT provides the infrastructure and manufacturing expertise required to take meta-optical products from concept to volume production.

Biography
Brett Kamino is Manager, Business Development and Strategy at NILT, where he works on commercializing meta-optics technology. Brett has a background in thin-film semiconductors, next-generation solar cells, and nanophotonics, and has spent his career working across both the technical and commercial sides of emerging technology, first developing the underlying technology and now focusing on the business strategy, partnerships, and market positioning needed to bring it from the lab to commercial products.

Key building blocks for sustainable 6G networks (draft)

Kaib, Harry
Sustainability and Communication Manager
Nokia Solutions and Networks GmbH & Co. KG

Abstract
The presentation will cover energy‑aware radio units and power amplifiers, AI‑native baseband platforms for intelligent RAN, and smart software to reduce network power consumption while preserving performance and security (draft)

Biography
• Advocate for telecom's positive impact on people and planet.• Over 30 years' experience in telecommunications in Europe, South America, and China in R&D, Business Development, Sales & Marketing.• Dipl.-Ing. (FH) Allgemeine Elektrotechnik• Dipl.-Wirt.Ing. (FH) Marketing (post-grad)• Currently leads Sustainability and Communication, IPCEI ME/CT, Nokia Germany.

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José Carimatto, Augusto

Pi Imaging Technology

Abstract
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Biography
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From Back-End Commodity to Performance Driver: The Strategic Role of Advanced Semiconductor Packaging in Automotive and ADAS Systems

Müller, Marvin
Senior Consultant | Advanced Products
Porsche Consulting

Abstract
Advanced semiconductor packaging has emerged as a critical bottleneck and differentiator in the global semiconductor industry at a time when demand for compute, bandwidth, and energy efficiency is rising across multiple sectors. While front-end scaling is slowing and becoming increasingly capital-intensive, advanced packaging enables continued system-level performance gains through heterogeneous integration, chiplets, and multi-die architecture.From a macroeconomic perspective, this shift intersects with several structural trends:• the global race for semiconductor competitiveness and supply-chainresilience,• increasing geopolitical concentration of advanced packaging capacity,• and accelerating digitalization of industries such as automotive, AI, andindustrial automation.In automotive in particular, the transition toward software-defined vehicles and higher levels of driver assistance concentrates computing power into fewer, more capable electronic control units. This amplifies the importance of packaging technologies that can deliver high bandwidth, low latency, robust thermal behavior, and automotive-grade reliability—making advanced packaging a strategic topic not only for engineers, but also for executives responsible for sourcing, operations, and long-term competitiveness.

Biography
Marvin Müller is a Senior Consultant at Porsche Consulting, specializing in semiconductor strategy, innovation and industrialization. His work spans smart-factory transformation, emerging semiconductor technologies - including wide-bandgap semiconductors and advanced packaging - and the semiconductor requirements of AI-enabled physical systems in automotive and robotics. He represents Porsche Consulting on the SEMI Global Automotive Advisory Council and has authored industry perspectives on semiconductor strategy, silicon carbide and advanced packaging. Marvin holds an M.Sc. in Materials Science and Engineering and combines technical depth with a strategic perspective on translating emerging technologies into scalable industrial and business impact.

Closing Remarks

Notarnicola, Giovanni
Partner and Head of Semiconductor Industry
Porsche Consulting S.r.L.

Abstract
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Biography
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Closing Remarks

Hansen, Uwe
VP Power Component Development
Robert Bosch GmbH

Abstract
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Biography
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Welcome Remarks

Altimime, Laith
President
SEMI Europe

Abstract
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Biography
Laith Altimime, as President of SEMI Europe, leads SEMI’s activities in Europe and the Middle East and Africa (EMEA). Altimime has P&L responsibility as well as ownership of all Europe region programs and events, including SEMICON Europa. He is responsible for establishing industry standards, advocacy, community development, expositions, and programs. He provides support and services to SEMI members worldwide that have supply chain interests in Europe. He manages and nurtures relationships with SEMI members in the region and globally as well as with local associations and constituents in industry, government, and academia. Altimime has more than 30 years of international experience in the semiconductor industry. Prior to joining SEMI in 2015, He held senior leadership positions at NEC, KLA-Tencor, Infineon, Qimonda, and imec. Altimime holds an MSc from Heriot-Watt University, Scotland.

When the physical world meets AI: ST intelligent sensing at the core

Trollo, Lisa

STMicroelectronics

Abstract
The next wave of AI is not confined to the cloud or the screen — it is becoming physical, embedded in the objects, machines and environments that surround us. This is where ST’s intelligent sensing sits at the core, transforming raw signals from the real world into actionable insights in real time.Sensors enable a new class of physical AI applications: from predictive maintenance and smart mobility to robotics, industrial automation, and consumer devices that understand context and intention. Combining high‑performance, low‑power sensing with on‑device AI and secure connectivity allows customers to move from data collection to local decision-making at the edge.

Biography
Lisa Trollo – Marketing and Communication manager, MEMS Sensors Subgroup STMicroelectronics After joining ST in 2012, Lisa contributed to several success stories in consumer, automotive and industrial markets, such as the massive Inertial Measurement Unit (IMU) product deployment in the smartphone industry. Always working to help developers find the best solution for their applications, Lisa is currently in charge of our MEMS Ecosystem as well as Marketing Communication where she plays a key role in defining ST’s Artificial Intelligence strategy for MEMS and sensors. Lisa graduated with a Master’s degree in Telecommunication Engineering in 2006 from The University of Trento, Italy.

Panelist

Le Grevès, Frédérique
President France & EVP Europe and France Public Affairs
STMicroelectronics

Abstract
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Biography
Frédérique Le Grevès is STMicroelectronics’ Executive Vice President, Europe and France Public Affairs. She has also held the position of President of STMicroelectronics France since March 2021.In 1990, Le Grevès started her career in marketing and communication for various international companies in Europe and in the US. From 1995 to 2003, she worked at Aptiv (ex-Delphi Automotive) as EMEA Communication Director. In 2003, Le Grevès joined Nissan Motors as VP Communication for Europe and in 2004, she moved to Los Angeles as VP Communications for Nissan Americas. Le Grevès returned to France in 2008 and joined the Renault Group as Global VP for Corporate Communication. Two years later, she expanded her role to Global VP of Communications and Deputy to the Chief Marketing and Communication officer. In 2011, Le Grevès was appointed Chief of Staff for the Renault Nissan Mitsubishi Alliance Chairman and CEO. More recently, she worked as senior advisor for several companies helping on corporate effectiveness, operations efficiency, and brand reputation.Le Grevès has been an independent board member of the Supervisory Board of TRIGO Holding from May 2021 to December 2024 and sat on the Strategic Board of Clinatec since October 2021. She is also an independent Director of the Supervisory Board of North Atlantic (formerly Esso SAS) and became a member of their audit committee in June 2024. In 2022, Le Grevès was appointed President of the Strategic Committee for the Electronics Industry sector in France, and in June 2025 became President of the newly created French Electronics Federation (FdEF). She has also been Vice President of the European Semiconductor Industry Association (ESIA) since 2023. Le Grevès was promoted Knight of the Legion of Honor by the French Ministry of Economy and Finance in January 2023.Born in Suresnes, France, in 1967, Frédérique Le Grevès graduated with a master’s degree in business management from the Paris School of Business (1991) and graduated from the Senior Executive Program at the London Business School (2019).

Engineering for cyber resilience: Through-life modelling and analysis

Shaikh, Siraj

Swansea University

Abstract
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Biography
Siraj Shaikh is a Professor in Systems Security at Swansea University (UK), where his research interests sit at the interface of automotive cybersecurity, systems engineering and cyber-physical systems security. Siraj is well published in automotive cybersecurity, and he currently is a Member of the College of Experts part of the UK’s Department for Transport (DfT) Scientific Advisory Council (SAC).Previously, he has been an Industrial Fellow to HORIBA MIRA, funded by the Royal Academy of Engineering (RAEng). More recently he served as an Independent Scientific Adviser to The Alan Turing Institute under the BridgeAI initiative. He serves as Chair for the Security Workstream of the Global Automotive Advisory Council at SEMI.

Panelist

Dubois, Sylvain
CEO
Vertical Compute

Abstract
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Biography
Sylvain Dubois, a business executive with 25 years of experience in the compute and memory fields, has extensive knowledge of the deep tech ecosystem and a strong understanding of the memory bottleneck problem, which he explored during his time at Google. Before founding Vertical Compute, Sylvain Dubois held the position of Advanced Technology Sourcing & Partnerships for the Google Cloud Infrastructure group in Sunnyvale, CA. His responsibilities included identifying, analyzing, and developing emerging technology trends, with a focus on Artificial Intelligence hardware acceleration compute chips, memory, and chiplet integration. Prior to his role at Google, he served as Vice-President of Business at Crossbar, a California-based deep tech startup specializing in novel memory development, where he played a key strategic role with several fundraising rounds.

Breaking the Volume Barrier in Mid-IR Photonics: From Specialized Sensors to Scalable Semiconductor Integration

Piotrowski, Adam
CEO
VIGO Photonics S.A.

Abstract
The Mid-Infrared (Mid-IR, 2–20 µm) spectral range holds immense promise for high-precision gas sensing, semiconductor metrology, environmental monitoring, and industrial IoT due to the distinct molecular "fingerprint" absorption bands located in this region. Despite its transformative potential, widespread commercial adoption of Mid-IR photonic devices has historically been constrained by fundamental industry barriers: high manufacturing costs, complex III-V and II-VI compound material engineering, the need for bulky cryogenic cooling, and a lack of standardized Photonic Integrated Circuit (PIC) platforms and micro-optical packaging.This presentation outlines the key technological and manufacturing breakthroughs required to scale Mid-IR photonics from niche, high-cost applications to high-volume semiconductor manufacturing. We explore advances in High Operating Temperature (HOT) detector architectures, plasmonic-enhanced absorbers, and wafer-level epitaxy (MBE/MOCVD) transition to 4-inch and 6-inch fabrication lines. Furthermore, we address strategies for heterogeneous integration with CMOS platforms and scalable packaging methods aimed at reducing Size, Weight, and Power (SWaP). By bridging the gap between complex compound optoelectronics and mainstream semiconductor manufacturing workflows.

Biography
A graduate of Warsaw University of Technology in 2002 with a master’s degree in electronics engineering. Holder of a Ph.D. degree in technical sciences obtained at the Military University of Technology in 2008.Since 2002, Adam Piotrowski has been working at VIGO Photonics S.A., introducing novel semiconductor production technologies to the company and managing its production. Since 2015, he has been acting as the President of the Board of VIGO Photonics S.A. and the President of the Polish Technological Platform on Photonics, being an Employer Association. Since 2017, he has been a member of the Board of Stakeholders of the Photonics21 Partnership, taking an active participation in the European technological development of photonics and microelectronics.He is the author of many publications on the methods of manufacture and application of the infrared detectors. He is responsible for the application development of novel sensor systems, especially laser-based, affordable gas detectors and analyzers. He took part in multiple national, European and pure industrial projects.

Coming Soon

Aal, Andreas

Volkswagen Commercial Vehicles

Abstract
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Biography
Andreas (SM/CRP) drove the semiconductor strategy activities at VW for many years, focusing on technology capability enhancements for the most advanced node-based chip products, including improved integration schemes, as well as optimisation of power electronics module qualification (both in funding projects and direct collaboration with industry players). In 2023, he joined VW Commercial Vehicles as system architect and project manager for Mobility-as-a-Service computing system solutions. He has 26 years of experience in the semiconductor industry, has authored over 50 publications on reliability, has given tutorials at IEEE IRPS and IIRW, as well as invited/keynote speeches at various conferences/conventions. Andreas is chair of the German VDE ITG MN 5.6 WG on (f)WLR, reliability simulations and qualification, chair of the European chapter of the SEMI Automotive Advisory Council and serves the Federal Ministry of Education and Research (BMBF) industry advisory board on cybersecurity. He is also a founding member of the Fraunhofer Chiplet Centre of Excellence (CCoE) and active within JEDEC and DKE.

Organic Image Sensors for Smart Rings and Medical Devices

Joimel, Jerome
CEO
VSTech Sensors

Abstract
Wearable health monitoring and SWIR-based imaging share a common bottleneck: today's photoplethysmography (PPG) and image sensors are built on rigid silicon or III-V substrates that constrain form factor, cost, and spectral coverage. This talk presents organic photodiode (OPD) technology as a route past that bottleneck and shows how a single thin-film sensor platform is being developed across two applications — a flexible PPG sensor for smart rings, and a low-cost SWIR camera originally developed for drone vision that also opens a path toward SWIR fluorescence imaging in medical devices.TechnologyOrganic photodiodes rely on a solution-processed, coatable active layer — a blended donor/acceptor bulk heterojunction sandwiched between hole- and electron-transport layers, an anode and a cathode, and a barrier encapsulation. This active layer can be deposited directly onto thin-film-transistor (TFT) backplanes on glass or polyimide, or onto CMOS read-out circuits, using standard coating equipment already used in the display and semiconductor industries. Because the photoactive stack is only a few hundred nanometers thick, the resulting sensor is sub-millimeter and mechanically flexible down to single-digit-millimeter bend radii. By tuning the absorber chemistry across three organic formulations, the same architecture covers the visible (380–700 nm), near-infrared (700–900 nm) and short-wave infrared (900–2500 nm, SWIR) bands without changing the backplane or camera design. VSTech holds an IP portfolio of 75 patents across 33 families covering the photoactive materials, device architecture and integration processes.Application 1 — Smart ringsContinuous PPG monitoring inside a ring is limited by available surface area and by the rigidity of conventional silicon-photodiode-plus-LED packages, which push most rings on the market today toward an 8 mm width. VSTech's OPD sensor strip integrates three photodiode channels (4.75 mm² each) tuned to green, red and near-infrared wavelengths (530/660/940 nm) alongside an embedded LED, on a single flexible substrate only 3.3 mm wide and conformable down to a 6 mm bend radius. The multi-channel, multi-wavelength architecture is designed to improve measurement robustness, while the flexible thin-film substrate follows the ring's curvature without the mechanical stack-up of rigid dies. This sensor has been introduced as a demonstration of how organic photodiodes can reduce ring width while keeping three independent PPG channels.Application 2 — SWIR camera: from drone vision to fluorescence imagingThe same coatable active layer, tuned into the SWIR band (1100–1500 nm), is being developed for a low-cost, cooling-free camera for drones, where SWIR vision improves usability in fog, rain and low-visibility conditions but has so far been limited by the cost of InGaAs sensors (commonly above $10k per unit). By replacing the InGaAs detector with an OPD active layer coated onto a CMOS read-out circuit, the same pixel architecture can be produced at a fraction of the cost per unit area, at the expense of some performance relative to cooled InGaAs — a trade-off acceptable for single-mission or high-volume deployment.This drone-vision camera architecture is directly relevant to a second, medical use case: SWIR fluorescence imaging. Fluorescence agents such as indocyanine green (ICG) emit into the SWIR/NIR-II window (roughly 1000–1300 nm), where reduced tissue scattering and autofluorescence give sharper contrast and deeper penetration than the NIR-I (700–900 nm) window used by most current fluorescence-guided surgery cameras. A low-cost, uncooled SWIR sensor built on the same OPD-on-CMOS architecture developed for drone vision could lower the barrier to adopting SWIR fluorescence imaging in surgical and diagnostic instruments, an application VSTech is now exploring as an extension of its drone camera work.Manufacturing and scale-upBoth applications rely on the same manufacturing logic: OPD active layers are applied by standard coating processes compatible with existing TFT and CMOS supply chains, allowing the same core sensor architecture to move from pilot-line production toward higher-volume manufacturing without requalifying the underlying device stack for each substrate or application.What attendees will take awayThis talk will cover the device physics and layer stack that give OPDs their spectral tunability, the design choices behind the smart ring and drone-vision SWIR camera described above, and the technical rationale for extending the same SWIR sensor toward fluorescence imaging applications.

Biography
Jerome Joimel is CEO and co-founder of VSTech Sensors, a French deep-tech company developing organic photodiode (OPD) sensors for smart rings, medical imaging, and low-cost SWIR cameras. He has spent more than 20 years in high-tech industries, taking technology from lab to pilot line to mass production and building international technical and operational teams.Before co-founding VSTech in 2024, Jerome spent a decade at Isorg, the pioneer of OPD-based image sensors, where he held four successive roles: R&D Process Manager, Chief Technology Officer, VP Strategic Partnerships, and Chief Operating Officer. He built Isorg's OPD process and IP strategy from the ground up, co-authored seven patents on OPD processes and applications, led its Series C fundraising with two major Japanese investors, set up its China business development office in Shenzhen, and directed production and quality through the launch of the first OPD-based wearable sensor.Earlier in his career, Jerome led development of the first fully flexible OTFT/OPD photodetector at Plastic Logic (Cambridge, UK) and worked on the technology transfer from its pilot line to mass production in Dresden, Germany. He began his career at Hewlett Packard's Printed Electronics Group in Ireland, working on thin-film testing and characterization on plastic substrates.Jerome holds an Engineering degree (Master's level) in Electronics and Industrial Computing, from IFITEP / Université Pierre et Marie Curie – Paris 6. He has spoken at CES, SID Display Week, SEMI FLEX, LOPE-C, IDTechEx and other leading industry events.