![]() |
,
Driving Heterogeneous Integration for AI and Beyond![]() Abstract Biography |
Future Fabs CxO Summit Advanced Packaging Conference AI Chip Design Future of Computing III-V Summit Future Disruptions Electrification and Power Semiconductors New Fab Ramp-up Vertical Excellence Smart Manufacturing Materials Innovation EU Projects |
|
3 | To top | ||
![]() |
3D-Micromac AG |
Clair, Maurice
Laser-based Annealing of Nickel Contacts for SiC Devices: Towards Thermally Robust Power Interfaces in 3D Integration![]() Abstract Biography |
Advanced Packaging Conference |
A | To top | ||
![]() |
Advanced Technologies and Solutions |
Park, Gyuhyeon
Development and manufacturing of Co-Packaged optics demonstrator on IC Substrate technology for the beyond state-of-the-art smart NICs and Switches![]() Abstract Biography |
EU Projects |
![]() |
Advantest Europe |
Pizza, Fabio
The Acceleration of Test Requirements Driven by Advanced Packaging![]() Abstract Biography |
Advanced Packaging Conference |
![]() |
Arago |
Muller, Nicolas
Arago: Practical Optical Computing![]() Abstract Biography |
AI Chip Design |
![]() |
Arm France |
Frey, Christophe
Topic Coming Soon![]() Abstract Biography |
CxO Summit AI Chip Design |
Axelera AI |
Bond, Andy
Ubiquitous AI Computing - AI EverywhereAbstract Biography |
AI Chip Design | |
B | To top | ||
![]() |
Bayern Innovativ GmbH |
Schulze, Joerg
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
C | To top | ||
![]() |
Comet |
Haferl, Stephan
From Atoms to Algorithms: European Suppliers’ Technological Race to Stay Ahead in the Semiconductor Market![]() Abstract Biography |
CxO Summit |
![]() |
Comet AG |
Stickler, Daniel
High-End Dose Management: X-ray Inspection protecting Next-Generation Advanced Packaging![]() Abstract Biography |
Advanced Packaging Conference |
D | To top | ||
![]() |
DAS Environmental Expert GmbH |
Osten, Pascal
Optimizing water usage footprint: Direct water recycling from abatements![]() Abstract Biography |
Future Fabs |
Dassault Systèmes |
Joshi, Smriti
Leveraging Virtual Twins and AI/ML in semiconductor industry using 3DEXPERIENCE platformAbstract Biography |
Advanced Packaging Conference | |
Delo Industrial Adhesives |
Hartwig, Alexander
Adhesives for highly efficient optical coupling of Photonic Integrated CircuitsAbstract Biography |
Advanced Packaging Conference | |
E | To top | ||
![]() |
Edwards Vacuum |
Heger, Tim
Topic Coming Soon![]() Abstract Biography |
Future Fabs |
ELEMENT 3-5 GmbH |
Barbar, Ghassan
A Novel Approach for the Volume Production of Wide-Bandgap SemiconductorAbstract Biography |
Electrification and Power Semiconductors | |
![]() |
Entegris |
Amade, Antoine
Optimizing Fab Performance: Proven Strategies from Materials to Manufacturing![]() Abstract Biography |
New Fab Ramp-up Vertical Excellence |
![]() |
European Semiconductor Manufacturing Company (ESMC) |
Koitzsch, Christian
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
![]() |
Excillum AB |
Hansson, Björn
High-Resolution Inspection of Hybrid Bonds, Microbumps, and TSVs - Are X-ray Methods Ready for the challenges of Advanced Packaging?![]() Abstract Biography |
Advanced Packaging Conference |
![]() |
Exyte |
Blaschitz, Herbert
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
F | To top | ||
![]() |
Fractile |
Bithell, Ed
Sovereignty Comes from the Strongest Link in the Chain: Why Europe's technological strategy should be all in on areas of comparative advantage![]() Abstract Biography |
AI Chip Design |
![]() |
Fraunhofer IZM |
Aschenbrenner, Rolf
The APECS pilot line is powering the evolution of chiplet technologies![]() Abstract Biography |
Advanced Packaging Conference |
G | To top | ||
![]() |
GLOBALFOUNDRIES |
Horstmann, Manfred
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
GLOBALFOUNDRIES |
Clarius, Tom
Topic Coming SoonAbstract Biography |
Future Disruptions | |
![]() |
GLOBALFOUNDRIES |
Kamineni, Himani
Topic Coming Soon![]() Abstract Biography |
Advanced Packaging Conference |
H | To top | ||
Heraeus Electronics GMBH |
Joerger, Michael
„Materials, Innovations for Generations”Abstract Biography |
Materials Innovation | |
I | To top | ||
![]() |
Imec |
Van den hove, Luc
It’s Time to Futureproof our Prosperity by Superfueling Innovation, Enabling Next-Gen AI![]() Abstract Biography |
CxO Summit |
![]() |
Imec |
Hoofman, Romano
The EU Chips Design Platform: a catalyst for fabless startups in Europe![]() Abstract Biography |
AI Chip Design |
![]() |
Imec |
Pourtois, Geoffrey
Accelerating nanoelectronic device innovation through atomistic simulation–driven material screening![]() Abstract Biography |
Materials Innovation |
![]() |
imec VZW |
Novoselov, Evgenii
Sub-THz HR SOI interposer with integrated hybrid thermal TSV and liquid micro-cooling![]() Abstract Biography |
Advanced Packaging Conference |
INFICON |
Smith, Holland
From Insight to Action: Elevating Employee Efficiency with Smart Detection and Targeted Data Delivery (joint presentation with ST Microelectronics)Abstract Biography |
Smart Manufacturing | |
Infineon Technologies AG |
Luber, Sebastian
From Semiconductors to Quantum: Infineon's Multi-Technology ApproachAbstract Biography |
Future of Computing | |
![]() |
Institute of Microelectronics |
Gan, Terence
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
![]() |
Institute of Microelectronics |
Singh, Navab
Topic Coming Soon![]() Abstract Biography |
Electrification and Power Semiconductors |
![]() |
Intel |
Gossner, Harald
Digitalization in Semiconductor Manufacturing Supply Chain – Need of Global Collaboration![]() Abstract Biography |
Future of Computing |
IQM Quantum Computers |
Hassel, Juha
Superconducting Quantum Chips as the Foundation for Quantum ComputingAbstract Biography |
Future of Computing | |
K | To top | ||
![]() |
Kuehne+Nagel |
O'Dowd, Barry
Strengthening Semiconductor Supply Chains in an Era of Disruption![]() Abstract Biography |
Future Disruptions |
L | To top | ||
![]() |
Lam Research |
Dekkers, Matthijn
Advances in AlScN Thin Films Deposited by Lam Research Pulsed Laser Deposition Platform![]() Abstract Biography |
Materials Innovation |
![]() |
Lam Research |
Oetzlinger, Herbert
Driving Heterogeneous Integration for AI and Beyond![]() Abstract Biography |
Advanced Packaging Conference |
![]() |
Lidrotec Gmbh |
Keil, Christian
A Sustainable Dicing Innovation for Cutting-Edge Semiconductor Challenges![]() Abstract Biography |
Advanced Packaging Conference |
![]() |
Lumiphase AG |
Mohn, Fabian
BTO-enhanced Silicon Photonics for Next-Generation Optical Transceivers![]() Abstract Biography |
III-V Summit |
M | To top | ||
![]() |
Mann+Hummel Molecular GmbH |
Zoermer, Manfred
Innovative AMC Filtration solutions for future semiconductor production challenges![]() Abstract Biography |
Materials Innovation |
![]() |
ManpowerGroup |
Barberis, Riccardo
Closing Europe’s Greentech Talent Gaps![]() Abstract Biography |
Future Fabs |
N | To top | ||
![]() |
Nokia Solution and Networks GmbH & Co. KG |
Wunderer, Stefan
Chipstainability - A Megatrend to Strengthen Europe's Leading Role for Global Collaborations![]() Abstract Biography |
Future Disruptions |
![]() |
NXP Semiconductors |
Mavinkurve, Amar
Some Material-Related Reliability Challenges that go with Package Roadmap Needs![]() Abstract Biography |
Advanced Packaging Conference |
O | To top | ||
Onto Innovation |
Pau, Monita
Glass Core Substrates: Driving Scalability for HVM Through A Versatile Process Control SolutionAbstract Biography |
Advanced Packaging Conference | |
P | To top | ||
PHIX Photonics Assembly |
Sundararajan, Anneirudh
Integration and Assembly of Co-Packaged Optics (CPO) for smart Networks and SwitchesAbstract Biography |
EU Projects | |
![]() |
Pointcloud |
Nicolaescu, Remus
Photonic Integrated Circuits for LiDAR: Enabling 4D Machine Vision with PICs![]() Abstract Biography |
Future of Computing |
Porsche Consulting |
Notarnicola, Giovanni
From Complexity to Advantage: Strategic Levers for Future Ready FabsAbstract Biography |
New Fab Ramp-up Vertical Excellence | |
R | To top | ||
![]() |
Robert Bosch GmbH |
Schwaiger, Stephan
Robust SiC MOSFET Devices for Drive Train Applications![]() ![]() Abstract Biography |
Electrification and Power Semiconductors |
S | To top | ||
![]() |
Schneider Electric |
Avice Huet, Gwenaelle
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
![]() |
SEMI |
Manocha, Ajit
Opening Remarks![]() Abstract Biography |
CxO Summit |
![]() |
SEMI Europe |
Altimime, Laith
Welcome Remarks![]() Abstract Biography |
CxO Summit Advanced Packaging Conference |
![]() |
Semikron Danfoss |
Puukko, Joonas
Silicon Carbide in AC Motor Drives![]() Abstract Biography |
III-V Summit |
![]() |
Shellback Semiconductor Equipment |
Sundin, Phillip
Production-Proven Chemical-Free Green Alternative to Solvent and Piranha Wafer Processing using Ozone![]() Abstract Biography |
Advanced Packaging Conference |
Siemens AG |
Westrich, Katharina
Plan Virtual, Build Sustainable: Combining the Real and the Digital WorldAbstract Biography |
Future Fabs | |
Siemens EDA |
Dudek, Heiko
Digital Twin-Enabled Heterogeneous Package Assembly: AI-Driven Yield Optimization Through Early Design and Equipment ModelingAbstract Biography |
Advanced Packaging Conference | |
![]() |
STMicroelectronics |
Gualandris, Fabio
Topic Coming Soon![]() Abstract Biography |
CxO Summit |
![]() |
SUSS MicroTec SE |
Schmidt, Thomas
Droplet assisted D2W bonding – introducing fluidics for improved bond front control for low-defect sequential D2W hybrid bonding![]() Abstract Biography |
Advanced Packaging Conference |
T | To top | ||
Technical University Eindhoven |
Williams, Kevin
JePPIX: The joint European platform for photonic integrated components and circuitsAbstract Biography |
III-V Summit | |
![]() |
time:matters GmbH |
Schoenzetter, Remy
The Role of Time Critical Logistics in Complex Global Supply Chains![]() Abstract Biography |
Future Disruptions |
![]() |
TUM Venture Labs |
Machold, Michael
From Lab to Leadership - Europe’s bet on Semiconductor Startups![]() Abstract Biography |
Future of Computing |
U | To top | ||
United Monolithic Semiconductors (UMS) |
U'Ren, Gregory
Strategic advances in III-V RF Technologies for energy-efficient 5G infrastructureAbstract Biography |
III-V Summit | |
V | To top | ||
![]() |
VERTICAL COMPUTE |
Dubois, Sylvain
Shifting boundaries: Advancing Memory and Compute, Together.![]() Abstract Biography |
AI Chip Design |