,
Wildfire suppression with real-time data flowAbstract Biography |
MEMS & Imaging Summit
ITF Chip into the Future EU Digital Forum European Projects for a Diverse Talent Pipeline End-to-end Cybersecurity Future of Work: Skills & DEIB Future Disruptions ELECTRIFICATION & POWER SEMICONDUCTORS Cultivating a Thriving SiC Market Smart Manufacturing Breakthroughs in Medical Technology European Skills & Diversity III-V Summit – Integrated Photonics Smart Mobility CxO Summit Advanced Packaging Conference Fab Management Forum SCC Heidi Advocacy and Geopolitics Future of Computing Materials Innovation SEMICON Europa SCREEN |
||
A | To top | ||
A.M. Fitzgerald & Associates, LLC |
Fitzgerald, Alissa
Trends in Emerging MEMSAbstract Biography |
MEMS & Imaging Summit | |
Aalto University |
Gabrelian, Artem
Not applicableAbstract Biography |
European Projects for a Diverse Talent Pipeline | |
Adeia |
Chai, Yan
Al Drives New Co-Integration and Co-Optimization of Semiconductor SystemsAbstract Biography |
Future Disruptions | |
Advantest Italy |
Renzella, Nunzio
Adaptive Probe Card Cleaning: How AI can add value to Smart Factory AutomationAbstract Biography |
SEMICON Europa | |
algorismic gmbh |
Hammer, Stefanie
Subfab360 ATC - Smart Control System for the reduction of emissions and energy consumption in the SubfabAbstract Biography |
Fab Management Forum | |
Amazec Photonics B.V. |
Kat, Pim
The Art of Integrated Photonics SensingAbstract Biography |
III-V Summit – Integrated Photonics | |
Amkor Technology Inc |
Kweon, YoungDo
Power and Thermal Management in Advanced Chiplet-Based PackagingAbstract Biography |
Advanced Packaging Conference | |
ams-OSRAM |
Guerrieri, Stefano
Session ChairAbstract Biography |
MEMS & Imaging Summit | |
ams-OSRAM International GmbH |
Arzberger, Markus
Sensors for monitoring vital signs in wearable devicesAbstract Biography |
MEMS & Imaging Summit | |
ams-OSRAM International GmbH |
Lex, Wolfgang
Automotive Photonic JourneyAbstract Biography |
Fab Management Forum | |
ams OSRAM AG |
Münther, Jan
Session ChairAbstract Biography |
End-to-end Cybersecurity | |
Angstrom Excellence ltd |
Chang, Athena
AI powered high sensitivity metrology boost yieldAbstract Biography |
SEMICON Europa | |
Anhalt University of Applied Sciences |
Romashchenko, Vladyslav
Performance Analysis and Implementation of Automated LLM-basedTechniques for Crosslanguage Code Conversion and Acceleration of HardwareSoC DevelopmentAbstract Biography |
Future of Work: Skills & DEIB | |
Applied Materials |
Eaton, Brad
Maximizing Equipment Productivity: Harnessing the Power of AIxAbstract Biography |
Smart Manufacturing | |
Applied Materials GmbH |
Hossbach, Christoph
Integrated (PE)ALD solutions for interface engineering in Power ElectronicsAbstract Biography |
Materials Innovation | |
ARM |
Frey, Christophe
PanelistAbstract Biography |
ITF Chip into the Future | |
ASE |
Gerber, Mark
Elevating Power Efficiencies Through Advanced Packaging InnovationAbstract Biography |
Advanced Packaging Conference | |
ASE Inc |
Lai, Ryan
MEMS & Sensors Packaging Innovation to Accelerate AI EverywhereAbstract Biography |
MEMS & Imaging Summit | |
ASM |
Arcamone, Julien
Staying Ahead of What’s Next, An Advanced Materials and Semiconductor Equipment PerspectiveAbstract Biography |
ITF Chip into the Future | |
ASML |
Reijmer, Aernout
Total Defense High TechAbstract Biography |
End-to-end Cybersecurity | |
ASML |
van de Kerkhof, Mark
Jumping the Barriers of Future LithographyAbstract Biography |
Future Disruptions | |
AT&S AG |
Schlaffer, Erich
Novel Interconnect Solutions for improved signal Integrity performanceAbstract Biography |
EU Digital Forum | |
B | To top | ||
Black Semiconductor GmbH |
Huyghebaert, Cedric
BLACK Semiconductor : a journey to connect chips.Abstract Biography |
III-V Summit – Integrated Photonics | |
BlueHalo |
Shanks, Stephaney
PanelistAbstract Biography |
Breakthroughs in Medical Technology | |
BMW |
Ancel, Patrice
Topic Coming SoonAbstract Biography |
MEMS & Imaging Summit | |
BMW Group |
Mayr, Matthias
Driving Collaboration and Digitalization: The Role of Virtual Factories in Production PlanningAbstract Biography |
Fab Management Forum | |
Bosch Sensortec |
Finkbeiner, Stefan
Smart Sensors for Smart Life – How Advanced Sensor Technologies Enable Life-Changing Use CasesAbstract Biography |
MEMS & Imaging Summit | |
C | To top | ||
Capgemini |
Aberbour, Mourad
PanelistAbstract Biography |
Smart Mobility | |
CEA-Leti |
Dauvé, Sébastien
Presentation of FAMES Pilot LineAbstract Biography |
ITF Chip into the Future | |
CEA LETI |
Berger, Pierre Damien
Session chairAbstract Biography |
MEMS & Imaging Summit | |
Celtro GmbH |
Teepe, Gerd
Bioelectrical Energy Harvesting and Human Tissue StimulationAbstract Biography |
Breakthroughs in Medical Technology | |
Census S.A. |
Papapanagiotou, Konstantinos
Product Security for Trusted Electronics: A Holistic ApproachAbstract Biography |
End-to-end Cybersecurity | |
Center for Hybrid Nanostructures, University of Hamburg |
Venugopal, Rakshith
Atomic Layer Etching of SiO2 using SF6Abstract Biography |
Future of Work: Skills & DEIB | |
Centria Research & Development |
Himanka, Mikko
Wildfire suppression with real-time data flowAbstract Biography |
EU Digital Forum | |
Chip Integration Technology Center (CITC) |
Farrugia, Mark Luke
Competitive and Sustainable Advanced Packaging (CSAP) - a new approach to FO-PLPAbstract Biography |
Advanced Packaging Conference | |
Chips Joint Undertaking (Chips JU), |
Kinaret, Jari
Chips Joint Undertaking: Working Together to Strengthen European IndustriesAbstract Biography |
ITF Chip into the Future CxO Summit |
|
CNR IMM |
La Via, Francesco
Wide Band Gap Pilot Line: a Major Boost for Europe’s Innovation and CompetitivenessAbstract Biography |
ITF Chip into the Future | |
CNRS-Grenoble INP-Sinano Institute |
Balestra, Francis
Horizon Europe ICOS (International Cooperation on Semiconductors): EU and Non-EU Strengths, Weaknesses, Dependencies, Opportunities for International CollaborationAbstract Biography |
EU Digital Forum | |
Comet |
Drolz, Isabella
AI-Driven 3D X-Ray Inspection: A Game-Changer for Advanced Semiconductor PackagesAbstract Biography |
Advanced Packaging Conference Future of Work: Skills & DEIB European Projects for a Diverse Talent Pipeline |
|
Comet Group |
Haferl, Stephan
Deep Tech Collaboration for Power-Efficient SemiconductorsAbstract Biography |
CxO Summit | |
Comet Yxlon International GmbH |
Driller, Christian
From Good to Great: How X-Ray Technology is driving yield in Advanced PackagingAbstract Biography |
Smart Mobility | |
Compound Semiconductor Applications Catapult |
Singh, Nick
Paving the Way for High-Performance Electronics: The Future of III-V Semiconductors in Integrated PhotonicsAbstract Biography |
III-V Summit – Integrated Photonics | |
D | To top | ||
DAS Environmental Expert GmbH |
Raithel, Stephan
Session ChairAbstract Biography |
Future Disruptions | |
DAS Environmental Expert GmbH |
Davies, Guy
Reduction of NOx Emission from Waste Gas TreatmentAbstract Biography |
SEMICON Europa | |
Dassault Systèmes |
Rei, Manuel
Virtual twin experiences for sustainability in semiconductor ecosystemAbstract Biography |
SEMICON Europa | |
DECISION Etudes & Conseil |
Saint-Martin, Léo
The EU Semiconductor Strategy: Adapting to a Changing Geopolitical LandscapeAbstract Biography |
Advocacy and Geopolitics | |
Delmic B.V. |
Coenen, Toon
Cathodoluminescence analysis of wide-bandgap semiconductors for power electronicsAbstract Biography |
SEMICON Europa | |
Dr. Ing. h.c. F. Porsche AG |
Frenkel, Barbara
Embracing the Paradigm Shift - Addressing Value Chain Challenges in a new LandscapeAbstract Biography |
CxO Summit | |
E | To top | ||
Edwards Vacuum |
Johnson, Paul
New Approaches and Innovations to Improve Effective Use of Vacuum Assets in Cleanroom and SubFabAbstract Biography |
Smart Manufacturing | |
Entegris GmbH |
Puttock, Mark
Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's PerspectiveAbstract Biography |
Cultivating a Thriving SiC Market | |
ESRF |
Bonino, Valentina
Nano-analysis of optoelectronic materials in structured semiconductorsAbstract Biography |
SEMICON Europa | |
Ethicronics |
Courbon, Franck
From Full Product to Nanometers: Risks and Mitigations of Hardware-Based AttacksAbstract Biography |
End-to-end Cybersecurity | |
EU Institute for Security Studies |
Teer, Joris
PanelistAbstract Biography |
Advocacy and Geopolitics | |
EudaOrg |
Maguire, Nessa
Attracting Diverse Talent to the Microelectronics IndustryAbstract Biography |
European Projects for a Diverse Talent Pipeline | |
European Innovation Council |
Kalbe, Gustav
The Chips Act and Europe’s Path to a Stronger, Resilient Semiconductor EcosystemAbstract Biography |
CxO Summit Advocacy and Geopolitics |
|
EV Group |
Dielacher, Bernd
Session ChairAbstract Biography |
MEMS & Imaging Summit | |
EV Group |
Uhrmann, Thomas
Latest innovations in MEMS wafer bondingAbstract Biography |
MEMS & Imaging Summit | |
EVG |
Brandl, Elisabeth
Challenges of new chiplet integration – how organic interposers challenge BEOL equipmentAbstract Biography |
Advanced Packaging Conference | |
Excillum |
Hållstedt, Julius
Sharper scans, faster ramp upAbstract Biography |
EU Digital Forum | |
EYE4NIR |
Ballabio, Andrea
Electrically Tunable Dual-Band VIS/SWIR Imaging and SensingAbstract Biography |
MEMS & Imaging Summit | |
F | To top | ||
Flexciton |
Potter, Jamie
Accelerating Your Journey to the Autonomous Fab: Opportunities and PitfallsAbstract Biography |
Fab Management Forum | |
Fraunhofer EMFT |
Kutter, Christoph
Topic Coming SoonAbstract Biography |
ITF Chip into the Future | |
Fraunhofer IIS, Division Engineering of Adaptive Systems EAS |
Schneider, Peter
PanelistAbstract Biography |
Smart Mobility | |
Fraunhofer IISB |
Jank, Michael
From Advanced Silicon Carbide to Ultra-Wide Bandgap Devices: A Research PerspectiveAbstract Biography |
ELECTRIFICATION & POWER SEMICONDUCTORS | |
Fraunhofer IPMS |
Kircher, Marco
What measures is the semiconductor industry taking to replace PFAS in production processes?Abstract Biography |
Future Disruptions | |
G | To top | ||
Gartner |
Gupta, Gaurav
Future of Energy-Efficient ComputeAbstract Biography |
SEMICON Europa | |
Genpact |
Thompson, George
Closing the Loop: A Circular Economy for the Semiconductor IndustryAbstract Biography |
SEMICON Europa | |
Guangdong Fenghua Semiconductor Technology Co., Ltd. |
Tang, Qingyuan
Half-bridge GaN by Fan-out Panel Level PackagingAbstract Biography |
Advanced Packaging Conference | |
H | To top | ||
Hasso Plattner Institute |
Alder, Nicolas
Energy-Efficient AI Using Stochastic Magnetic Tunnel JunctionsAbstract Biography |
Future of Computing | |
HCLTech |
Lisci, Philipp
Empowering the semiconductor industry with advanced cybersecurityAbstract Biography |
End-to-end Cybersecurity | |
Head of Technology - Advanced Packaging, Compound Semiconductor Applications Catapult |
Chandrappan, Jayakrishnan
Next-Gen Telecom: Leveraging Advanced Packaging and Compound SemiconductorsAbstract Biography |
III-V Summit – Integrated Photonics | |
Henkel |
Farbos de Luzan, Pierre
Driving Sustainability in Semiconductor PackagingAbstract Biography |
Advanced Packaging Conference | |
Honeywell |
Donaghy, Mark
Fire Risks & Challenges in Semiconductor Manufacturing EnvironmentsAbstract Biography |
Smart Manufacturing | |
https://www.tno.nl |
Verberk, Rogier
Towards accessible, European hybrid quantum-HPC compute systemsAbstract Biography |
Future of Computing | |
I | To top | ||
IBM |
Kumar, Arvind
Advancing AI through Advanced PackagingAbstract Biography |
Advanced Packaging Conference | |
IBM Research |
Riel, Heike
IBM Quantum System OneAbstract Biography |
III-V Summit – Integrated Photonics Smart Mobility |
|
ICT GmbH - Applied Materials |
Schmid, Ralf
Advanced packaging industry trends driving the need for new eBeam based metrology and inspection solutionsAbstract Biography |
EU Digital Forum | |
imec |
Marent, Katrien
Welcome and Closing RemarksAbstract Biography |
ITF Chip into the Future | |
imec |
Van den hove, Luc
The Versatile Future of Semiconductor SystemsAbstract Biography |
ITF Chip into the Future CxO Summit |
|
imec |
De Boeck, Jo
NanoIC Pilot Line: Accelerating Beyond-2nm Innovation Across the EcosystemAbstract Biography |
ITF Chip into the Future | |
imec |
Charley, Anne-Laure
New Metrology and Inspection Era : 1+1=3?Abstract Biography |
Fab Management Forum | |
imec |
Luo, Cheng-Jhih
Demonstration of High-Speed Silicon Photonics I/O for Co-Packaged Pilot LineAbstract Biography |
EU Digital Forum | |
imec |
Massar, Shana
A Day as Superconducting Qubit Integration EngineerAbstract Biography |
Future of Work: Skills & DEIB | |
imec |
Collaert, Nadine
Advancing Connectivity with III-V MaterialsAbstract Biography |
III-V Summit – Integrated Photonics | |
imec |
Jourdain, Anne
Deep Pitch Scaling of Wafer-to-Wafer and Die-to-Wafer Cu/SiCN Hybrid BondingAbstract Biography |
Advanced Packaging Conference | |
imec |
Placklé, Bart
Challenges in the land of Automotive High-Performance Computing: Chiplets to the RescueAbstract Biography |
Smart Mobility | |
imec |
Hoofman, Romano
Topic Coming SoonAbstract Biography |
ITF Chip into the Future | |
imec |
Gallagher, Emily
Climate-aware semiconductor manufacturing and what that means to lithographyAbstract Biography |
SCREEN SCC Heidi |
|
INFICON |
Behnke, John
INFICON: Your Path to Tomorrow’s Autonomous Smart FactoryAbstract Biography |
Fab Management Forum CxO Summit |
|
INFICON |
Smith, Holland
From Insight to Action: Elevating Employee Efficiency with Smart Detection and Targeted Data DeliveryAbstract Biography |
Smart Manufacturing | |
Infineon Technologies |
Boll, Michael
Topic Coming SoonAbstract Biography |
ITF Chip into the Future | |
Infineon Technologies AG |
Pressel, Klaus
Innovative Approaches to Improve Reliability in Microelectronics - The ECSEL JU project iRel40Abstract Biography |
Advanced Packaging Conference | |
Infineon Technologies Austria AG |
Wolfgruber, Martina
European Projects for a Diverse Talent PipelineAbstract Biography |
European Projects for a Diverse Talent Pipeline | |
Infineon Technologies Dresden GmbH & Co. KG |
Lindner, Franziska
Green Building Standard LEED – Sustainability in Semiconductor Fab Design and ConstructionAbstract Biography |
Fab Management Forum | |
Institute of Microelectronics – A*STAR |
Mazure, Carlos
Accelerating Innovation with Industry-grade PlatformsAbstract Biography |
CxO Summit | |
Intel |
Gossner, Harald
Semiconductor-X – Creating a Coherent Dataspace for the Semiconductor Supply ChainAbstract Biography |
Materials Innovation | |
Invest in Pomerania |
Trunin, Mikołaj
CEE: Future Location of Semiconductor InvestmentsAbstract Biography |
Future Disruptions Future of Work: Skills & DEIB |
|
IoT Security Foundation |
Moor, John
Taming the IoT Cybersecurity Wicked ChallengeAbstract Biography |
End-to-end Cybersecurity | |
iThera Medical GmbH |
Leisching, Patrick
Next generation photoacoustic imaging with xMUT technology: status and challengesAbstract Biography |
MEMS & Imaging Summit | |
J | To top | ||
Jacobs |
Kreidel, Tim
Smart Design & Construction for the Semiconductor IndustryAbstract Biography |
SEMICON Europa | |
K | To top | ||
Kanken Techno Co., Ltd. |
Morihara, Atsushi
Roadmap for Semiconductor Exhaust Gas Treatment Equipment Towards Carbon NeutralityAbstract Biography |
Smart Manufacturing | |
KLA Corporation |
Springer, David
The Most Common Antistiction Films are PFAS, Now What?Abstract Biography |
MEMS & Imaging Summit | |
KLA Corporation |
Collins, Dan
Future of Work PanelAbstract Biography |
Future of Work: Skills & DEIB | |
Koh Young Europe GmbH |
Lindloff, Axel
Sinter Print Surface Condition Measurement for Power ElectronicsAbstract Biography |
Advanced Packaging Conference | |
Kontron AIS GmbH |
Schulze, Natalie
Making the Fab Fit for the Future: Retrofit for Modern Technology, Security, and Maintenance CapabilityAbstract Biography |
Fab Management Forum | |
L | To top | ||
Lam Research |
Vincent, Benjamin
Virtual Fab for advanced semiconductor engineeringAbstract Biography |
Future of Computing | |
Lynceus AI |
Meyer, David
AI Enabled Precision MaintenanceAbstract Biography |
Fab Management Forum | |
M | To top | ||
Melexis |
Chombar, Françoise
PanelistAbstract Biography |
European Projects for a Diverse Talent Pipeline | |
Merck Electronics KGaA |
Ernst, Benedikt
Supply Chain Collaboration & Resilience: Building and Enabling the European EcosystemAbstract Biography |
Materials Innovation | |
Merck Electronics KGaA |
Tolksdorf, Miriam
Sustainable Innovation Needs CollaborationAbstract Biography |
Future Disruptions | |
Merck Electronics KGaA |
Muesch, Anja
Advancing Sustainability in the Semiconductor Value Chain: A Data-Driven ApproachAbstract Biography |
SCC Heidi | |
Merck KGaA |
Beckmann, Kai
Empowering Tomorrow: Materials Intelligence Driving Sustainable InnovationAbstract Biography |
CxO Summit | |
Metahelios |
Altuzarra, Charles
Unlocking Infrared Multispectral Imaging with Pixelated Metasurface TechnologyAbstract Biography |
MEMS & Imaging Summit | |
minds.ai |
van Heugten, Jasper
Supporting Fab Operations Using Multi-Agent Reinforcement LearningAbstract Biography |
Fab Management Forum | |
MKS Instruments / Atotech |
Stubbe, Jessica
Advanced Electrolytes Meeting Future Requirements in Microbump TechnologyAbstract Biography |
Advanced Packaging Conference | |
Munich University of Applied Sciences |
Ganser, Richard
Mechanism of antiferroelectricity in polycrystalline ZrO2Abstract Biography |
Future of Work: Skills & DEIB | |
O | To top | ||
Oculi |
Rizk, Charbel
A Paradigm Shift From Imaging to Vision: Oculi Enables 600x Reduction in Latency-Energy Factor for Visual Edge ApplicationsAbstract Biography |
MEMS & Imaging Summit | |
Okmetic Oy |
Vuorikari-Antikainen, Anna-Riikka
Innovation and Collaboration: Powering Sustainable Exponential GrowthAbstract Biography |
European Projects for a Diverse Talent Pipeline | |
Omnitron Sensors, Inc. |
Aguilar, Eric
New Topology for MEMS Advances Performance and Speeds ManufacturingAbstract Biography |
MEMS & Imaging Summit | |
onsemi |
Carson, Felicity
Powering Sustainable AIAbstract Biography |
SCC Heidi | |
Oy Arbonaut Ltd. |
Kauranne, Tuomo
Wildfire suppression with real-time data flowAbstract Biography |
EU Digital Forum | |
P | To top | ||
PhotonDelta Foundation |
Rahim, Abdul
Advancements in Photonic Integration Technologies: Meeting the Challenges and Expanding OpportunitiesAbstract Biography |
III-V Summit – Integrated Photonics | |
Porsche Consulting |
Notarnicola, Giovanni
Session ChairAbstract Biography |
Smart Manufacturing | |
Porsche Consulting GmbH |
Kirr, Klaus
Addressing Nature-Related Risks and Regulations in Semiconductor Landscape: Circular Economy as Key to Transforming the Semiconductor IndustryAbstract Biography |
SCC Heidi | |
Porsche Consulting S.A.S. |
Ruhnau, Marius
Turbocharged Transistors: Silicon Carbide Shifting to Next GearAbstract Biography |
Cultivating a Thriving SiC Market | |
PTvT |
Coates, Matthew
Attracting Diverse Talent to the Microelectronics IndustryAbstract Biography |
European Projects for a Diverse Talent Pipeline | |
Q | To top | ||
QDI systems |
Naber, Ronald
Next Generation Quantum Dot SWIR SensorsAbstract Biography |
MEMS & Imaging Summit | |
QuantumDiamonds GmbH |
Garsi, Marwa
Quantum Failure Analysis for the Semiconductor IndustryAbstract Biography |
Advanced Packaging Conference | |
Quantune Technologies GmbH |
Kischkat, Jan F
Pioneering Non-invasive Wearable MIR Spectrometry for Key Health Biomarkers AnalysisAbstract Biography |
MEMS & Imaging Summit | |
Quobly |
Daval, Nicolas
A quantum leap in the relationship with sustainable computingAbstract Biography |
SCREEN | |
Qurv |
Goossens, Stijn
Intelligence through VisionAbstract Biography |
MEMS & Imaging Summit | |
R | To top | ||
Racyics GmbH |
Döll, Patrick
Explore the Journey of a Young Engineer Driving Innovation in the Semiconductor IndustryAbstract Biography |
Future of Work: Skills & DEIB | |
RHP-Technology GmbH |
Vozarova, Maria
Advanced Materials with Tailored Thermal Properties for Advanced Packaging ApplicationAbstract Biography |
Advanced Packaging Conference | |
Riga Technical University (RTU) |
Juhna, Talis
The Building Blocks for Latvia as a Regional Hub of Excellence in Integrated PhotonicsAbstract Biography |
III-V Summit – Integrated Photonics | |
Rigetti Computing |
Kulkarni, Subodh
Superconducting Quantum Computing: Building on Decades of Semiconductor Innovation for Transformative Computational PowerAbstract Biography |
Future of Computing | |
Robert Bosch GmbH |
Hansen, Uwe
Session ChairAbstract Biography |
ELECTRIFICATION & POWER SEMICONDUCTORS | |
Robert Bosch GmbH |
Joeres, Stefan
Requirements on the pilotlines under the ChipsAct for the IndustryAbstract Biography |
ITF Chip into the Future | |
Robert Bosch GmbH |
Koyuncu, Metin
TRANSFORM: Trusted European SiC Value Chain for a greener EconomyAbstract Biography |
ELECTRIFICATION & POWER SEMICONDUCTORS | |
Robert Bosch GmbH |
Bornefeld, Ralf
PanelistAbstract Biography |
Cultivating a Thriving SiC Market | |
Robert Bosch GmbH |
Schwaiger, Stephan
SiC Technology – Transfer to 200mm Wafer SizeAbstract Biography |
ELECTRIFICATION & POWER SEMICONDUCTORS | |
Robert Bosch Semiconductor Manufacturing Dresden GmbH |
Fischbach, Sarah
Data, Standards, People – Enabler of a Smart 300 mm FabAbstract Biography |
Fab Management Forum | |
Robovision |
Van Poucke, Bart
Pioneering Precision: AI Enhancements in Packaging Visual InspectionAbstract Biography |
Advanced Packaging Conference | |
Rogue Valley Microdevices |
Gomez, Jessica
Unlocking Novel Opportunities:How 300mm-capable MEMS Foundries will Change the GameAbstract Biography |
MEMS & Imaging Summit
Breakthroughs in Medical Technology |
|
RWTH Aachen University |
Esteki, Ardeshir
Damage-Free Plasma Enhanced Atomic Layer Deposition of AlOX Dielectrics for Tunable Doping of 2D MaterialsAbstract Biography |
Future of Work: Skills & DEIB | |
S | To top | ||
Schneider Electric |
Godemel, Frederic
Green Growth: Guiding the Future of the Global Semiconductor IndustryAbstract Biography |
CxO Summit | |
SCREEN |
Snow, Jim
SCREEN water management initiativesAbstract Biography |
SCREEN | |
SCREEN |
Stokes, Harold
SCREEN single wafer Life-Cycle CO2 AnalysisAbstract Biography |
SCREEN | |
SCREEN |
Rossi, Alessandro
SCREEN’s Sustainable Cost-of-Ownership (CoO) Portfolio for Wafer Inspection and Thickness Measurement Tools and experience on High Volume Manufacturing of Power and AutomotiveAbstract Biography |
SCREEN | |
SCREEN |
Belmiloud, Naser
Use of Molecular dynamics for collapse free cleaning through surface modification treatmentAbstract Biography |
SCREEN | |
SCREEN |
Hollfelder, Martin
Introductory NoteAbstract Biography |
SCREEN | |
SEMI |
Grupen-Shemansky, Melissa
MEMS & Sensors Industry Group Update and Market OutlookAbstract Biography |
Breakthroughs in Medical Technology MEMS & Imaging Summit |
|
SEMI |
Manocha, Ajit
Opening RemarksAbstract Biography |
CxO Summit III-V Summit – Integrated Photonics |
|
SEMI |
Tseng, Clark
Fab Investment Outlook and the Dynamics of Regional Semiconductor ManufacturingAbstract Biography |
Fab Management Forum | |
SEMI Europe |
Frieling, Christopher
Welcome RemarksAbstract Biography |
EU Digital Forum European Projects for a Diverse Talent Pipeline |
|
SEMI Europe |
Srivastava, Kartikey
HiCONNECTS IntroductionAbstract Biography |
EU Digital Forum | |
SEMI Europe |
Melvin, Cassandra
ChairAbstract Biography |
Future of Work: Skills & DEIB | |
SEMI Europe |
Perez, Maria Daniela
Non-applicableAbstract Biography |
Future of Work: Skills & DEIB | |
SEMI Europe |
Cummings, Victoria
European Chips Skills AcademyAbstract Biography |
European Skills & Diversity European Projects for a Diverse Talent Pipeline |
|
SEMI Europe |
Altimime, Laith
Welcome RemarksAbstract Biography |
III-V Summit – Integrated Photonics Smart Mobility CxO Summit MEMS & Imaging Summit Advanced Packaging Conference Fab Management Forum |
|
SEMI Europe |
Ramundo Orlando, Stefano
<em>Chips, Checks and Balances: The Geopolitics of Semiconductors</em>Abstract Biography |
Advocacy and Geopolitics | |
SEMI Europe |
Gani, Reviliani
European Chips Diversity AllianceAbstract Biography |
European Projects for a Diverse Talent Pipeline European Skills & Diversity |
|
Semilab |
Bölcskei-Molnár, Anna
Ellipsometry in Photonics Industry: Advancing Integrated Photonic DevicesAbstract Biography |
III-V Summit – Integrated Photonics | |
siconnex customized solution GmbH |
Mittermayr, Moritz
Post plasma dicing clean in batch spray equipment with adapted sulfuric ozone mixturesAbstract Biography |
SEMICON Europa | |
Siemens AG |
Westrich, Katharina
Beyond Simulation: Bridging the Real & Digital WorldAbstract Biography |
SCC Heidi CxO Summit |
|
Siemens AG |
Sanap, Mangesh
Ensuring Fire Safety and Security in Clean Room Environments: Key Requirements and Best PracticesAbstract Biography |
Smart Manufacturing | |
Siemens EDA |
Heurung, Thomas
PanelistAbstract Biography |
ITF Chip into the Future | |
SMART Photonics |
Maat, Peter
An independent InP foundry in the integrated photonics supply chainAbstract Biography |
III-V Summit – Integrated Photonics | |
Soitec |
Sabonnadière, Emmanuel
PanelistAbstract Biography |
Cultivating a Thriving SiC Market | |
Soitec |
Schwartzmann, Jerome
150-200mm Fab ModernizationAbstract Biography |
Smart Manufacturing | |
Soitec |
Barnabé, Pierre
Designing Sustainable Semiconductor Materials: Engineering the Future through Breakthrough Innovation and Strategic CollaborationAbstract Biography |
CxO Summit | |
Soitec |
Poulet, Franck
Innovation and Collaboration: Powering Sustainable Exponential GrowthAbstract Biography |
Future Disruptions | |
SOITEC Belgium NV |
Germain, Marianne
Topic Coming SoonAbstract Biography |
ITF Chip into the Future | |
Sony Semiconductor Solutions Europe |
Landgraf, Jens
Advanced Imaging and Sensing Technologies in ADAS SystemsAbstract Biography |
Smart Mobility | |
Spectricity |
Borremans, Jonathan
Shaping the Future of Mobile Cameras: Miniaturized Multispectral Imaging for Next-Gen ApplicationsAbstract Biography |
MEMS & Imaging Summit | |
ST Microelectronics |
Quinio, Philippe
Artificial Intelligence and Eco-Design: Pioneering Sustainable Innovation in a Dynamic Global MarketAbstract Biography |
Fab Management Forum | |
ST Microelectronics |
Riva, Luca
SiC End to End Manufacturing Fab ManagementAbstract Biography |
ELECTRIFICATION & POWER SEMICONDUCTORS Cultivating a Thriving SiC Market |
|
ST Microelectronics Crolles |
Villieu, Cyril
Embedding a culture of sustainability into our daily fab operationsAbstract Biography |
Fab Management Forum | |
STATS ChipPAC |
Yang, Cheng
Challenges in Advanced Packaging for High Performance ComputingAbstract Biography |
Advanced Packaging Conference | |
SteerLight |
François, Simoens
FMCW Chip-Scale LiDARs Scales Up for Large Volume Markets thanks to Silicon Photonics TechnologyAbstract Biography |
MEMS & Imaging Summit | |
STMicroelectronics |
Ferri, Simone
Sensing the World: Innovating for a More Sustainable FutureAbstract Biography |
MEMS & Imaging Summit | |
STMicroelectronics |
Le Grevès, Frédérique
PanelistAbstract Biography |
ITF Chip into the Future Advocacy and Geopolitics |
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STMicroelectronics |
Mazaleyrat, Eric
From Imaging to Optical Sensing, the road to machine dedicated sensors.Abstract Biography |
MEMS & Imaging Summit | |
STMicroelectronics |
Garnier, Philippe
Sulfuric Acid Reduction in Post-Ash CleansAbstract Biography |
SCREEN | |
STMicroelectronics |
Orsati, Laurent
SCC Panel DiscussionAbstract Biography |
SCC Heidi | |
SUSS MicroTec Solutions GmbH |
Schmidt, Thomas
Importance of High-Performance Integrated Metrology for D2W and W2W Hybrid Bonding ApplicationsAbstract Biography |
Advanced Packaging Conference | |
Synopsys |
Bjerregaard, Tobias
AI – Enabling a Revolution in Chip Design ProductivityAbstract Biography |
Future of Work: Skills & DEIB | |
Synopsys, Inc. |
Le Lan, Catherine
Powering the Future of European Semiconductors by Building and Nurturing a Talent EcosystemAbstract Biography |
Fab Management Forum | |
T | To top | ||
TECHCET CA LLC |
Scott, Diane
Tracking the Supply Chain for Compound Semiconductor MaterialsAbstract Biography |
III-V Summit – Integrated Photonics | |
Technical University of Munich (TUM) |
Amrouch, Hussam
Tailored Intelligence: The Art of Customized Processors for AI AccelerationAbstract Biography |
Future of Computing | |
Technische Hochschule Ingolstadt |
Pandey, Amit
Feasibility Investigation of Spherically bent Image SensorsAbstract Biography |
MEMS & Imaging Summit | |
Teradata |
McDonnell, Monica
Proven Strategies to Speed AI Cycles, Delivering Millions in Value to Semiconductor FabsAbstract Biography |
SEMICON Europa | |
Tokyo Electron Europe |
Lösel, Maximilian
Increasing Sustainability and Efficiency in Furnace Deposition ProcessesAbstract Biography |
Fab Management Forum | |
TotalEnergies |
Fournier, Aude
The Energy Needs of the Semiconductor Industry and how to Meet themAbstract Biography |
SCC Heidi | |
TriEye |
Cheskis, David
Seeing Beyond the Visible: High-Performance SWIR Machine Vision SolutionsAbstract Biography |
MEMS & Imaging Summit | |
Tyndall National Institute |
Wakeel, Saif
Packaging of micro-optical components for light coupling in silicon photonicsAbstract Biography |
III-V Summit – Integrated Photonics | |
U | To top | ||
U.S. Department of State |
Kent, Virginia
PanelistAbstract Biography |
Advocacy and Geopolitics | |
Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France |
Castelein, Pierre
Technologies and Embedded Intelligence developments for Future Smart Vision SystemsAbstract Biography |
MEMS & Imaging Summit | |
University of Cyprus |
Marnerides, Angelos
Cybersecurity for Next Generation Critical Instructure SystemsAbstract Biography |
End-to-end Cybersecurity | |
University of Helsinki |
Mattinen, Miika
Atomic Layer Deposition of 2D Materials For Electronics and EnergyAbstract Biography |
Materials Innovation | |
V | To top | ||
Volkswagen |
Mueller, Maike
PanelistAbstract Biography |
Cultivating a Thriving SiC Market | |
VTT |
Annamaa, Petteri
Integrated photonics in 6GAbstract Biography |
III-V Summit – Integrated Photonics | |
VTT Technical Research Centre of Finland Ltd |
Soukkamaki, Jussi
Active Hyperspectral Imaging Using Extremely Fast Tunable SWIR Light SourceAbstract Biography |
MEMS & Imaging Summit | |
VW Commercial Vehicles |
Aal, Andreas
PanelistAbstract Biography |
Smart Mobility | |
X | To top | ||
X-FAB MEMS Foundry Itzehoe |
Iranzadeh, Ayda
Driving Fab AutomationAbstract Biography |
Future of Work: Skills & DEIB | |
X-FAB Semiconductor Foundries GmbH |
Kittler, Gabriel
Convergence of Electronics and Photonics TechnologiesAbstract Biography |
Fab Management Forum | |
XFAB Group |
Mellin, Joni
More than Photonics:SOI photonics platform with InP-chiplet heterogenous integration for multi-terabit datacom and telecom applicationsAbstract Biography |
III-V Summit – Integrated Photonics | |
Y | To top | ||
Yole Group |
Damianos, Dimitrios
Session 6: MEMS and Imaging Young Talent (Session Chair)Abstract Biography |
MEMS & Imaging Summit | |
Yole Group |
Mouly, Jerome
From centralized to decentralized: The next era of smart healthcareAbstract Biography |
Breakthroughs in Medical Technology | |
Yole Group |
Yeghoyan, Taguhi
Semiconductor Equipment, the enabler of the semiconductor industryAbstract Biography |
SCREEN | |
Yole Group |
Eloy, Jean-Christophe
From MEMS to Imaging Sensors, Global Trends and Market OpportunitiesAbstract Biography |
MEMS & Imaging Summit | |
Yole Group |
Vallo, Martin
Photonic Integrated Circuits: Industry Insights, Market Trends, and Technological AdvancesAbstract Biography |
III-V Summit – Integrated Photonics |