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Body Biography |
MEMS & Imaging Summit
ITF Chip into the Future European Projects for a Diverse Talent Pipeline Future of Work: Skills & DEIB Future Disruptions European Skills & Diversity CxO Summit Advanced Packaging Conference Fab Management Forum III-V Summit – Integrated Photonics EU Digital Forum End-to-end Cybersecurity Future of Computing ELECTRIFICATION & POWER SEMICONDUCTORS Cultivating a Thriving SiC Market Smart Manufacturing Materials Innovation SEMICON Europa |
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A | To top | ||
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A.M. Fitzgerald & Associates, LLC |
Fitzgerald, Alissa
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MEMS & Imaging Summit |
Adeia |
Kang, Seung
Body Biography |
Future Disruptions | |
Advantest Italy |
Renzella, Nunzio
Body Biography |
SEMICON Europa | |
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Amkor Technology Inc |
Kweon, YoungDo
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Advanced Packaging Conference |
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ams-OSRAM International GmbH |
Arzberger, Markus
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MEMS & Imaging Summit |
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ams-OSRAM International GmbH |
Lex, Wolfgang
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Fab Management Forum |
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Angstrom Excellence ltd |
Chang, Athena
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SEMICON Europa |
Applied Materials |
Eaton, Brad
Body Biography |
Smart Manufacturing | |
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ASM |
Arcamone, Julien
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ITF Chip into the Future |
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ASML |
Reijmer, Aernout
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End-to-end Cybersecurity |
ASML |
van de Kerkhof, Mark
Body Biography |
Future Disruptions | |
AVL |
Yazar, Musa Nurullah
Body Biography |
EU Digital Forum | |
B | To top | ||
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BMW |
Ancel, Patrice
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MEMS & Imaging Summit |
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BMW Group |
Wittmann, Jürgen
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Fab Management Forum |
Bosch Sensortec |
Finkbeiner, Stefan
Body Biography |
MEMS & Imaging Summit | |
C | To top | ||
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CEA-Leti |
Dauvé, Sébastien
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ITF Chip into the Future |
CEA LETI |
Berger, Pierre Damien
Body Biography |
MEMS & Imaging Summit | |
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Census S.A. |
Papapanagiotou, Konstantinos
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End-to-end Cybersecurity |
Center for Hybrid Nanostructures, University of Hamburg |
Venugopal, Rakshith
Body Biography |
Future of Work: Skills & DEIB | |
Chip Integration Technology Center (CITC) |
Smits, Edsger
Body Biography |
Advanced Packaging Conference | |
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Chips Joint Undertaking (Chips JU) |
Kinaret, Jari
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ITF Chip into the Future |
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CNR IMM |
La Via, Francesco
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ITF Chip into the Future |
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CNRS-Grenoble INP-Sinano Institute |
Balestra, Francis
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EU Digital Forum |
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Comet Group |
Haferl, Stephan
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CxO Summit |
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Comet Yxlon |
Drolz, Isabella
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Advanced Packaging Conference Future of Work: Skills & DEIB |
D | To top | ||
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DAS Environmental Expert GmbH |
Raithel, Stephan
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Future Disruptions |
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DAS Environmental Expert GmbH |
Davies, Guy
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SEMICON Europa |
Dassault Systèmes |
Rei, Manuel
Body Biography |
SEMICON Europa | |
Delmic B.V. |
Coenen, Toon
Body Biography |
SEMICON Europa | |
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Dr. Ing. h.c. F. Porsche AG |
Frenkel, Barbara
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CxO Summit |
E | To top | ||
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Edwards Vacuum |
Johnson, Paul
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Smart Manufacturing |
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Entegris GmbH |
Puttock, Mark
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Cultivating a Thriving SiC Market |
ESRF |
Bonino, Valentina
Body Biography |
SEMICON Europa | |
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EudaOrg |
Maguire, Nessa
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European Projects for a Diverse Talent Pipeline |
EV Group |
Dielacher, Bernd
Body Biography |
MEMS & Imaging Summit | |
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EV Group |
Uhrmann, Thomas
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MEMS & Imaging Summit |
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EVG |
Brandl, Elisabeth
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Advanced Packaging Conference |
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EYE4NIR |
Ballabio, Andrea
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MEMS & Imaging Summit |
F | To top | ||
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Flexciton |
Potter, Jamie
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Fab Management Forum |
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Fraunhofer EMFT |
Kutter, Christoph
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ITF Chip into the Future |
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Fraunhofer IPMS |
Fraunhofer IPMS, Marco
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Future Disruptions |
G | To top | ||
Gartner |
Gupta, Gaurav
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SEMICON Europa | |
Genpact |
Moran, Mark
Body Biography |
SEMICON Europa | |
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Guangdong Fenghua Semiconductor Technology Co., Ltd. |
Tang, Qingyuan
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Advanced Packaging Conference |
H | To top | ||
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Hasso Plattner Institute |
Alder, Nicolas
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Future of Computing |
Henkel |
Farbos de Luzan, Pierre
Body Biography |
Advanced Packaging Conference | |
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Honeywell |
Donaghy, Mark
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Smart Manufacturing |
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https://www.tno.nl |
Verberk, Rogier
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Future of Computing |
I | To top | ||
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IBM |
Kumar, Arvind
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Advanced Packaging Conference |
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imec |
Marent, Katrien
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ITF Chip into the Future |
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imec |
Hoofman, Romano
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ITF Chip into the Future |
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imec |
Van den hove, Luc
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ITF Chip into the Future CxO Summit |
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imec |
De Boeck, Jo
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ITF Chip into the Future |
imec |
Charley, Anne-Laure
Body Biography |
Fab Management Forum | |
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imec |
Luo, Cheng-Jhih
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EU Digital Forum |
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imec |
Massar, Shana
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Future of Work: Skills & DEIB |
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imec |
Collaert, Nadine
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III-V Summit – Integrated Photonics |
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INFICON |
Behnke, John
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Fab Management Forum Smart Manufacturing |
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INFICON HOLDING AG |
Wyrsch, Oliver
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CxO Summit |
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Infineon Technologies |
Boll, Michael
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ITF Chip into the Future |
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Infineon Technologies AG |
Pressel, Klaus
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Advanced Packaging Conference |
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Infineon Technologies Dresden GmbH & Co. KG |
Lindner, Franziska
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Fab Management Forum |
Intel |
Chau, Robert
Body Biography |
Materials Innovation | |
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Invest in Pomerania |
Trunin, Mikołaj
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Future Disruptions Future of Work: Skills & DEIB |
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IoT Security Foundation |
Moor, John
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End-to-end Cybersecurity |
iThera Medical GmbH |
Leisching, Patrick
Body Biography |
MEMS & Imaging Summit | |
J | To top | ||
Jacobs |
Kreidel, Tim
Body Biography |
SEMICON Europa | |
K | To top | ||
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Kanken Techno Co., Ltd. |
Morihara, Atsushi
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Smart Manufacturing |
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KLA Corporation |
Springer, David
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MEMS & Imaging Summit |
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Koh Young Europe GmbH |
Lindloff, Axel
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Advanced Packaging Conference |
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Kontron AIS GmbH |
Schulze, Natalie
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Fab Management Forum |
M | To top | ||
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Melexis |
Chombar, Françoise
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European Projects for a Diverse Talent Pipeline |
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Merck Electronics KGaA |
Ernst, Benedikt
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Materials Innovation |
Merck Electronics KGaA |
Tolksdorf, Miriam
Body Biography |
Future Disruptions | |
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Merck KGaA |
Beckmann, Kai
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CxO Summit |
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Metahelios |
Altuzarra, Charles
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MEMS & Imaging Summit |
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minds.ai |
van Heugten, Jasper
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Fab Management Forum |
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MKS Instruments / Atotech |
Stubbe, Jessica
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Advanced Packaging Conference |
Munich University of Applied Sciences |
Ganser, Richard
Body Biography |
Future of Work: Skills & DEIB | |
O | To top | ||
Oculi |
Rizk, Charbel
Body Biography |
MEMS & Imaging Summit | |
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Okmetic Oy |
Vuorikari-Antikainen, Anna-Riikka
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European Projects for a Diverse Talent Pipeline |
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Omnitron Sensors, Inc. |
Aguilar, Eric
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MEMS & Imaging Summit |
P | To top | ||
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Porsche Consulting S.A.S. |
Ruhnau, Marius
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Cultivating a Thriving SiC Market |
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PTvT |
Coates, Matthew
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European Projects for a Diverse Talent Pipeline |
Q | To top | ||
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QDI systems |
Shulga, Artem
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MEMS & Imaging Summit |
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QuantumDiamonds GmbH |
Bruckmaier, Fleming
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Advanced Packaging Conference |
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Quantune Technologies GmbH |
Kischkat, Jan F
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MEMS & Imaging Summit |
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Qurv |
Goossens, Stijn
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MEMS & Imaging Summit |
R | To top | ||
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Racyics GmbH |
Döll, Patrick
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Future of Work: Skills & DEIB |
RHP-Technology GmbH |
Vozarova, Maria
Body Biography |
Advanced Packaging Conference | |
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Riga Technical University |
Ozolins, Oskars
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III-V Summit – Integrated Photonics |
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Rigetti Computing |
Kulkarni, Subodh
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Future of Computing |
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Robert Bosch GmbH |
Joeres, Stefan
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ITF Chip into the Future |
Robert Bosch GmbH |
Koyuncu, Metin
Body Biography |
ELECTRIFICATION & POWER SEMICONDUCTORS | |
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Robert Bosch GmbH |
Bornefeld, Ralf
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Cultivating a Thriving SiC Market |
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Robert Bosch Semiconductor Manufacturing Dresden GmbH |
Fischbach, Sarah
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Fab Management Forum |
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Robovision |
Van Poucke, Bart
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Advanced Packaging Conference |
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Rogue Valley Microdevices |
Gomez, Jessica
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MEMS & Imaging Summit |
RWTH Aachen University |
Esteki, Ardeshir
Body Biography |
Future of Work: Skills & DEIB | |
S | To top | ||
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SEMI |
Manocha, Ajit
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CxO Summit III-V Summit – Integrated Photonics |
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SEMI Europe |
Melvin, Cassandra
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Future of Work: Skills & DEIB |
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SEMI Europe |
Cummings, Victoria
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European Skills & Diversity European Projects for a Diverse Talent Pipeline |
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SEMI Europe |
Altimime, Laith
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CxO Summit MEMS & Imaging Summit Advanced Packaging Conference Fab Management Forum III-V Summit – Integrated Photonics |
SEMI Europe |
Srivastava, Kartikey
Body Biography |
EU Digital Forum | |
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SEMI Europe |
Gani, Reviliani
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European Projects for a Diverse Talent Pipeline European Skills & Diversity |
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Semilab |
Bölcskei-Molnár, Anna
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III-V Summit – Integrated Photonics |
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siconnex customized solution GmbH |
Mittermayr, Moritz
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SEMICON Europa |
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Siemens EDA |
Heurung, Thomas
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ITF Chip into the Future |
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Soitec |
Bernard, Fanny
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Future Disruptions |
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Soitec |
Sabonnadière, Emmanuel
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Cultivating a Thriving SiC Market |
Soitec |
Schwartzmann, Jerome
Body Biography |
Smart Manufacturing | |
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SOITEC Belgium NV |
Germain, Marianne
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ITF Chip into the Future |
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Spectricity |
Borremans, Jonathan
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MEMS & Imaging Summit |
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ST Microelectronics |
Nicoleau, Serge
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Fab Management Forum |
ST Microelectronics Crolles |
Villieu, Cyril
Body Biography |
Fab Management Forum | |
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STATS ChipPAC |
Yang, Cheng
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Advanced Packaging Conference |
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SteerLight |
François, Simoens
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MEMS & Imaging Summit |
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STMicroelectronics |
Ferri, Simone
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MEMS & Imaging Summit |
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STMicroelectronics |
Le Grevès, Frédérique
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ITF Chip into the Future |
SUSS MicroTec Solutions GmbH |
Schmidt, Thomas
Body Biography |
Advanced Packaging Conference | |
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Synopsys |
Bjerregaard, Tobias
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Future of Work: Skills & DEIB |
T | To top | ||
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TECHCET CA LLC |
Shon-Roy, Lita
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III-V Summit – Integrated Photonics |
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Technical University of Munich (TUM) |
Amrouch, Hussam
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Future of Computing |
Technische Hochschule Ingolstadt |
Pandey, Amit
Body Biography |
MEMS & Imaging Summit | |
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Teradata |
McDonnell, Monica
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SEMICON Europa |
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Tokyo Electron Europe |
Lösel, Maximilian
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Fab Management Forum |
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Transformative Optics Corporation |
Rhoads, Geoff
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MEMS & Imaging Summit |
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TriEye |
Bakal, Avi
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MEMS & Imaging Summit |
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TU Dortmund |
Schindler, Janina J.
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Future of Work: Skills & DEIB |
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Tyndall National Institute |
Wakeel, Saif
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III-V Summit – Integrated Photonics |
U | To top | ||
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Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France |
Castelein, Pierre
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MEMS & Imaging Summit |
University of Cyprus |
Marnerides, Angelos
Body Biography |
End-to-end Cybersecurity | |
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University of Helsinki |
Mattinen, Miika
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Materials Innovation |
V | To top | ||
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Volkswagen Group Components |
Blum, André
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Cultivating a Thriving SiC Market |
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VTT |
Annamaa, Petteri
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III-V Summit – Integrated Photonics |
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VTT Technical Research Centre of Finland Ltd |
Soukkamaki, Jussi
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MEMS & Imaging Summit |
Y | To top | ||
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Yole Group |
Damianos, Dimitrios
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MEMS & Imaging Summit |