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E. Neubauer¹, Z.Kovacova¹, Lea Babejova¹, Maria Vozarova¹, Carmen Vladu¹, M.Kitzmantel¹, D.Dewire², J.Vriens²¹RHP-Technology GmbH, A-2444 Seibersdorf²Hi-Rel Alloys – A Qnnect Company, Niagara Falls, ON L2H 0Y5, CanadaLightweight dissipative materials with tailored Coefficient of Thermal Expansion (CTE) is a focal point in materials used in electronic packaging applications. This research aims on materials possessing not only high thermal conductivity, but also allowing to provide significant CTE reduction to conventional Aluminum, Copper and Silver alloys widely employed in electronics. A second material category comprises aluminum alloys reinforced with carbon fibers or with Silicium Carbide (Al-SiC). Especially the fiber reinforced composites allow to tailor the anisotropy of thermal properties. New concepts for the manufacturing have been applied, including methods such as direct hot pressing which allows a precise control of the SiC or Carbon fiber content and facilitates the production of large plates with uniform microstructure up to 400 mm in diameter. This approach allows minimizing energy consumption, while ensuring customizable properties and enhanced thermal and mechanical performance tailored for specific applications. Thermophysical analysis have been carried out showing the positive impact of the inserts on the reduction of the coefficient of thermal expansion as well as the improvement of the thermal diffusivity/conductivity value. Examples of different shapes and heat sink components, which were realized, will be presented.

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Fitzgerald, Alissa
CEO
A.M. Fitzgerald & Associates, LLC

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End uses for MEMS are expanding into new areas beyond consumer electronics. These include ADAS and autonomous piloting systems, microfluidics for genomic analysis, portable ultrasonic devices, metaverse applications, and environmental monitoring.In view of these increasingly demanding MEMS applications for which high precision, robustness and small size are essential, new device architectures are emerging, particularly the use of piezoelectric thin films.Drawing from her company’s product development work, as well as from her view of current trends in MEMS and sensor R&D, Dr. Fitzgerald will provide a perspective on emerging MEMS architectures and materials for near-term business and growth opportunities.

Biography
Alissa M. Fitzgerald, PhD, has 30+ years of experience in MEMS design, fabrication methods, multiphysics simulation, and product development. She has personally developed over a dozen distinct MEMS devices such as piezoresistive cantilevers, pressure sensors, ultrasound transducers, and infrared imaging arrays, and she holds 11 US patents.Dr. Fitzgerald advises clients on the entire cycle of microelectronic product development, from business and IP strategy to supply chain and manufacturing operations. In addition to her primary focus on industrial and commercial activities, she continues to engage in collaborative scientific research, serve on academic conference abstract review committees, participate in peer reviewed academic journal articles, and offer guest lectures at academic institutions such as UC Berkeley and Stanford University.Dr. Fitzgerald is a member of the SEMI-MSIG Standards Committee and served as a board director on the MEMS Industry Group (MIG) Governing Council from 2008-2014. In 2013, she was inducted into the MIG Hall of Fame. She serves as a board director for Rigetti Computing (NASDAQ:RGTI), a full stack quantum computing company. Dr. Fitzgerald received her bachelor's and master's degrees from MIT and her PhD from Stanford University in Aeronautics and Astronautics.

Kweon, YoungDo
Sr Director of Chiplets FCBGA Development
Amkor Technology Inc

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Chiplet-based packaging has several benefits, such as yield enhancement through logic die partitioning, system form factor reduction, and on-time to market through heterogeneous integration. However, chiplet-based packaging requires an optimized interconnection among semiconductor device dies for high bandwidth, low latency, and low power in the small form factor as advanced chiplet-based packaging. Thus, there are several challenges, such as PDN (Power Distribution Network) optimization, TDP (Thermal Dissipation Path) creation, and thermal stress minimization in the complexed chiplet-based heterogeneous integration. To solve these challenges, it needs to consider power delivery optimization while managing thermal dissipation.Amkor can support an efficient thermal dissipated chiplet-based packaging solution to succeed customers business. As known, semiconductor IC (Intergrated Circuits) power densities are still increasing yearly; moving to high performance colling systems, such as boiling liquid carries away heat generated by computer servers. Based on this kind of advanced cooling method at Data Center, packaging thermal resistance portion of Θ_JA is increased. Thus, it is important to make a better thermal performed FCBGA packages with TIM (Thermal Interfacial Materials) of Data Center application, and advanced chiplet-based packaging requires higher thermal dissipation performance continuously. For example, polymer TIMs have a limit to perform a low Θ_JC on the thermal dissipation requirement because of a higher interfacial thermal resistance as TIM I. Therefore, advanced chiplet-based heterogeneous integrated FCBGA with Indium alloy TIM is one of solution because there are many positive customers experimental data. This means that Indium alloy TIM as TIM I could provide 2x longer semiconductor device lifetime relatively. In addition, a molded FCBGA can support to create a new thermal dissipation path and to reduce semiconductor device ILD (Interlayer Dielectric) thermal stress for advanced 2.5D and 3D chiplet-based heterogeneous integrated packages.

Biography
Mr. YoungDo Kweon is currently working for Amkor Technology HQ in USA as R&D program manager. He has been working in development of several packages and assembly new platforms since 1988. Recently, he is focusing on higher thermal dissipation solutions of advanced chiplet-based heterogeneous integrated FCBGA packaging.Mr. Kweon received BS degree in Metallurgical Engineering from Hanyang University in 1987, MS in Semiconductor Engineering from Samsung Semiconductor Technology Institute in 1995, and MS with CALCE Electronics Package Research Center in Mechanical Engineering from University of Maryland at College Park in 1998. He has held several patents and published papers.

Arzberger, Markus
Senior Director
ams-OSRAM International GmbH

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It started with step counting. Activity tracker wristbands first brought the concept of daily lifestyle monitoring to public attention: the early adopters rapidly acquired the habit of counting the number of steps they walked each day – and of sharing their count with friends, family and colleagues. The capabilities of the first wearable devices were limited. Thanks to massive improvements in the performance of the components that enable activity measurement, products such as smart watches, smart rings and smart wristbands on the market today can measure far more physical parameters and measure them much more accurately.The adoption of wearable technology has given rise to the idea of the ‘quantified self’. This marks a profound shift in the way people think about personal health. Previously, people could follow a set of guidelines or principles that were associated with good health outcomes. This advice generally revolved around healthy eating, taking regular exercise, sleeping well and so on. People could take occasional health checks at a clinic, but there was no way for a person to measure continuously the effect of their lifestyle on their health.The introduction of wearable devices offered the promise of more information and created a demand from consumers to know more about their health status in real-time: actual measurements that show whether their lifestyle is making them either more or less healthy. This is part of a trend, supported by the increased use of data analytics, artificial intelligence and other advanced technologies in western healthcare systems, called ‘4P healthcare’: participative, predictive, preventive and personalized.The key measurements of health are the vital signs that medical practitioners have long relied on: factors such as heart rate, blood oxygen saturation (SpO2), blood pressure, body temperature, and heart activity as measured electrically by an electrocardiogram (ECG). Thanks to sophisticated optical and electrical semiconductor systems and software from ams OSRAM and others, wearable devices can perform these vital sign measurements well – in some cases, almost as accurately as the specialist equipment in hospitals. We will show the recent developments of the sensors and sensor components enabling this progress.

Biography
Markus Arzberger is Senior Director and Head of the Automotive and Vital Signs Product Line at ams OSRAM. He has more than 20 years of experience in product and business development in the optoelectronic industry. Markus is passionate about understanding customer needs and solving them by generating new solutions that take advantage of leading-edge optoelectronics technologies. He holds a Ph.D. in Physics from the Technical University of Munich, with research focusing on low-dimensional semiconductor physics including laser devices.

Arcamone, Julien
Vice-President of Corporate R&D
ASM

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As Europe strives to assert its leadership in the global digital economy, the semiconductor industry plays a vital role in driving innovation, sustainability, and growth.Advanced materials and deposition processes are the foundation for electrification & digitalization in a sustainable manner as part of the EU twin green & digital transition.The presentation will discuss how ASM’s technological innovations in Europe and globally are enabling growth through materials innovation, and will also highlight the necessity to collaborate along the electronics value chain as well as through public private partnerships.

Biography
Since 2023, Julien Arcamone is the Vice-President of the Corporate R&D of ASM, the leading semiconductor equipment supplier in ALD and Epitaxy. Based in Leuven at imec, he leads teams in Belgium and Finland that develop ASM’s novel ALD and epi processes that will enable future advanced logic and memory devices.Prior to that, he was 15 years with CEA-Leti, where he started as staff research scientist in NEMS. Then he held several positions, notably VP of Business Development for Asia, his last one with Leti being Head of the Connectivity & Computing Devices Department. In that position, he managed R&D teams dedicated to active RF and quantum devices, advanced CMOS and memories devices, and their related advanced computing approaches (Edge AI, In-Memory Computing), as well as the teams in charge of developing 3D integration technologies.He graduated in 2003 from INSA Lyon in Materials Engineering, with a focus on semiconductor materials & devices. Then, he received a PhD in Electronic Engineering in 2007 from the Autonomous University of Barcelona (Spain), and the HDR (Habilitation à Diriger des Recherches) from Grenoble-Alpes University in 2017. He is an IEEE Senior Member, and was part of IEEE MEMS conference’s TPC in 2016 and 2017. Dr. Arcamone has authored or co-authored more than 80 peer-reviewed scientific publications and 1 book, and is the co-inventor of 9 patents.

Finkbeiner, Stefan
Generalmanager
Bosch Sensortec

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Smart and tiny sensors are catalysts for addressing major modern challenges like enhancing environmental health and elevating human well-being.The rapid development of hearables and wearables promise entirely new fields of applications improving the user’s well-being and lifestyle by integrating many different functions in multiple connected devices. MEMS sensors play a crucial role in the realization of such innovative devices. The presentation shows how cutting-edge sensor technology enables innovative devices for advanced use-cases. There will be a special focus on connected devices and the extended usage of algorithms on the sensor which enable even more complex applications. This leads to completely new use-cases such as full-body motion tracking, indoor navigation and air quality tracking.The examples underscore the synergy between MEMS sensors and smart algorithms, unlocking vast potential across diverse fields. The presentation concludes with an outlook on innovative use cases ahead.

Biography
Dr. Stefan Finkbeiner has been CEO and General Manager at Bosch Sensortec GmbH since 2012.In 2015, Dr. Finkbeiner was awarded with the prestigious lifetime achievement award from the MEMS & Sensors Industry Group. In 2016, 2022 and 2023 Dr. Finkbeiner has been elected Manager of the Year by the Markt & Technik Magazine.He joined Robert Bosch GmbH in 1995 and has been working in different positions related to the research, development, manufacturing, and marketing of sensors for more than 20 years. Senior positions at Bosch have included Director of Marketing for sensors, Director of Corporate Research in microsystems technology, and Vice President of Engineering for sensors.Dr. Stefan Finkbeiner received his Diploma in Physics from University of Karlsruhe in 1992. He then studied at the Max-Planck-Institute in Stuttgart and there received his PhD in Physics in 1995. He was born in 1966 in Freudenstadt, Germany.

Dauvé, Sébastien
CEO
CEA-Leti

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Sébastien Dauvé was named CEO of CEA-Leti effective on July 1, 2021, after more than twenty years of experience in microelectronics technologies and their applications, including clean mobility, medicine of the future, cybersecurity, and power electronics.Sébastien Dauvé started his career at the French Armament Electronics Center, where he worked on developing synthetic-aperture radar. In 2003, he joined CEA-Leti as an industrial transfer manager and supervised several joint research laboratories, in particular with the multinational Michelin.In 2007, Sébastien Dauvé became a laboratory manager, then head of an R&D department in the area of sensors applied to the Internet of things and electric mobility. During this time, he supported the dissemination of new technologies in industry, including the automotive industry (Renault), aeronautics, national defense (SAFRAN), and microchips with the industry leader Intel. He played an active role in the creation of start-ups in application fields ranging from health to infrastructure security, leading to dozens of new jobs. In 2016, he became Director of the CEA-Leti Systems Division.From sensors to wireless communication, Sébastien Dauvé has played an active role in the digital transformation, focused on coupling energy frugality and performance. He has made cross-disciplinary approaches central to innovation by harnessing the expertise of talented teams with diverse backgrounds. Their goal is to provide technological tools for meeting the major societal challenges of the future.Sébastien Dauvé is a graduate of the French Ecole Polytechnique and the National Higher French Institute of Aeronautics and Space (ISAE-SUPAERO).

Berger, Pierre Damien
MEMS Industrial Partnerships Manager
CEA LETI

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Smits, Edsger
Program Manager
Chip Integration Technology Center (CITC)

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Fan-out wafer level packaging (FO-WLP) is a well-established technology, enabling high-resolution redistribution layers and complex electrical routing. An emerging variation, fan-out panel level packaging (FO-PLP), offers further advantages in processing area and cost. Scaling FO-PLP to larger areas reduces production costs per product, making it appealing for diverse applications. However, FO-WLP and FO-PLP face challenges in discrete power devices. Power devices, like silicon and silicon carbide diodes and MOSFETs, rely on vertical geometries, necessitating high-performance vertical interconnects through the molding compound (TMV). While fan-out technologies show promise—lower RdsON, improved thermal dissipation, and compatibility with thinner dies—commercial adoption lags due to higher package costs.We present CSAP technology: Competitive and Sustainable Advanced Packaging . This technology merges advanced packaging processes with printed electronics. CSAP replaces conventional compression molding with laser-drilled vias by a cost-effective, fully additive printing processes. In our proof-of-concept work, we create packages for silicon MOSFET dies and initial electrical results demonstrate the viability of this innovative approach. In particular, the clip and vertical contacts are realized by printing the vias and the seed layer. An electroplating process is used to grow a thicker layer of Cu to ensure good electrical and thermal conductivity. The seed layer is printed into the desired shape and added only at the locations where metallization is required, thereby reducing the material use in the fabrication process.By quantifying the package costs using a model, we demonstrate that CSAP significantly reduces packaging costs compared to traditional Fan-Out Panel Level Packaging (FO-PLP), making it an attractive technology option for devices that require feature size larger than 60 um.

Biography
Edsger Smits received his Ph.D. from the University of Groningen in the field of organic electronics. He joined TNO Holst Centre working oxide based thin film transistors for displays, flexible and stretchable sensors and electronics for bio-medical applications. He currently leads the Power Packaging activities at CITC. Topics of interests include mini and micro led dispays, laser transfer, flexible and stretchable electronics and chip packaging.

Kinaret, Jari
Executive Director
Chips Joint Undertaking (Chips JU)

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Jari Kinaret was born in Finland and holds M.Sc. degrees in Theoretical Physics and Electrical Engineering from the University of Oulu in 1986 and 1987, respectively, and a Ph.D. in Physics from the Massachusetts Institute of Technology (MIT) in 1992.Prof. Kinaret has worked in various roles at research institutes and universities in Copenhagen, Denmark, and Gothenburg, Sweden. From 2013 to 2023, he served as the Director of the Graphene Flagship, a one-billion-euro research project dedicated to exploring the potential of graphene.In October 2023, Prof. Jari Kinaret assumed the role of Executive Director at Chips Joint Undertaking (Chips JU), a European public-private partnership that supports research, development, innovation, and future manufacturing capacities in the European semiconductor ecosystem.

La Via, Francesco
Research Director
CNR IMM

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Francesco La Via was born in Catania, Italy, in September 1961. He received the M.S. degree in physics from Catania University, Catania, Italy, in 1985. From 1985 to 1990, he had a fellowship at STM, Catania. In 1990, he joined the CNR IMM in Catania as a researcher. During this time, he was a Visiting Scientist at Philips NatLab, Eindhoven, The Netherlands. In 2001 he became senior researcher of the CNR IMM and he is responsible of the research group that work on the new metallization schemes for silicon and silicon carbide. From 2003 he is responsible of the division of CNR-IMM that developed new processes for silicon carbide epitaxy and hetero-epitaxy. From 2020 he become Research Director. He is responsible of several industrial research projects and coordinator of two European projects: CHALLENGE (http://h2020challenge.eu/) and SiC Nano for picoGeo (http://picogeo.eu/). In this period, he has published more than 350 papers on JCR journals and 4 edited books. He has presented several invited contributions to international conferences and has organized several conferences and tutorials. He has 6 patents on SiC technology and growth. The main research interests are in the field of silicon carbide growth, power devices, detectors and MEMS.

Haferl, Stephan
Chief Executive Officer
Comet Group

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Born 1972, Swiss and Norwegian citizen; Master's degree in mechanical and process engineering from the Swiss Federal Institute of Technology (ETH), Zurich, PhD with work on thermodynamics and fluid dynamics.Stephan Haferl has been working for the Comet Group successfully in various management positions since 2007. His strong track record includes proven performance in business development, innovation, technology, and product management, among other areas.Before, he held the positions of General Manager at Bartec-Meta Physics SA and Chief Operating Officer at Bartec Bacab SA.

Drolz, Isabella
Vice President Product Marketing
Comet Yxlon

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Isabella Drolz is the Vice President Product Marketing at Comet Yxlon, which is the industrial X-ray & CT inspection system division of Comet. Comet Yxlon provides X-ray & CT inspection solutions for R&D labs & production environments, especially for Semiconductor customers to enhance their productivity. In her role, she is responsible for product management, business development, global application solution centers, and marketing at Comet Yxlon. Isabella has next to her industrial engineering education, a Bachelor of Science in International Business Administration, and an MBA degree from Southern Nazarene University in Oklahoma City, USA. She has held several management positions in the mechanical and plant engineering industry driving market-oriented product development.

Frenkel, Barbara
Member of the Executive Board Purchase
Dr. Ing. h.c. F. Porsche AG

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1963 Born in Hof (Saale), Germany1982 A-Level Certificate of education (Abitur) in Hof 1982 Studies in chemistry at Bayreuth University and rubber technology at Hannover University1984 Various posts in development, production, sales and quality assurance, Helsa-Werke, Gefrees1997 Quality Auditor, Valeo Thermal Systems, Rodach 1999 Manager Supplier Development Europe, TRW Automotive, Alfdorf2001 Head of Quality Systems and Methods of Dr. Ing. h.c. F. Porsche AG2006 Head of Central Training of Dr. Ing. h.c. F. Porsche AG 2013 Head of Sales Network Management & Development of Dr. Ing. h.c. F. Porsche AG 2017 Head of Region Europe of Dr. Ing. h.c. F. Porsche AG 2019 Member of the Supervisory Board of Dr. Ing. h.c. F. Porsche AG 2021 Member of the Executive Board Purchases of Dr. Ing. h.c. F. Porsche AG

Uhrmann, Thomas
Director Business Development
EV Group

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MEMS and sensors play a crucial role in many of today´s applications. As their complexity and integration continues to increase, innovative manufacturing technologies become essential to fulfil the requirements of next-generation applications. Wafer bonding is a key technology for MEMS and sensors encapsulation but also for advances in system integration. This presentation will discuss the latest developments in high-vacuum oxide-free wafer bonding, a technology that enables not only conductive bond interfaces but is also well suited for heterogenous material integration at low- or even room-temperature. In addition, recent innovations in high-volume 300 mm MEMS wafer bonding will be highlighted in this talk.

Biography
Dr. Thomas Uhrmann is director of business development at EV Group (EVG) where he is responsible for overseeing all aspects of EVG’s worldwide business development. Specifically, he is focused on 3D integration, MEMS, LEDs and a number of emerging markets. Prior to this role, Uhrmann was business development manager for 3D and Advanced Packaging as well as Compound Semiconductors and Si-based Power Devices at EV Group. He holds an engineering degree in mechatronics from the University of Applied Sciences in Regensburg and a PhD in semiconductor physics from Vienna University of Technology.

Brandl, Elisabeth
Business Development Manager
EVG

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The innovations of chiplet integrations took interesting turns in the last few years as this platform promises high performance application system at low-cost and faster-to market solution in comparison to SoC integration. Several approaches for the modular chiplet implementation have been introduced, where performance requirements, cost considerations and scalability need differ. Although the chiplet integration on Si interposers is a very important technology, a trend towards the utilization of organic materials, for example in high density build up organic substrates can be observed.As in all advanced packaging technologies, form factor is crucial. Temporary bonding offers support for organic interposers during thinning to reduce the formfactor in z-direction and allow for better heat management as these organic interposers have limited heat dissipation capability.Already established chiplet packaging technologies like chip-first or RDL first FoWLP are still facing the manufacturing challenge of high warped wafers originating in the CTE difference of chiplets and mold. This challenge is also valid for high density build up organic substrates and needs to be addressed. There are two major approaches for handling high warpage wafers. Either the wafers are forced flat, which works with thinner, flexible organic wafers or the equipment must comply with the wafer warpage. The later approach is used with thick and stiff wafers and is linked to a higher process complexity. We will show the manufacturing considerations of each warpage handling approach with their advantages and challenges in respect to the temporary bonding, debonding and further downstream processes with process and equipment compatibility.In this presentation, we will also give a short overview on the different chiplet integration platforms with their advantages and challenges. In more detail the integration of organic materials as in RDL/ organic interposers will be shown and the equipment challenges, especially wafer warpage in temporary bonding and debonding equipment and possible solutions will be introduced.

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Elisabeth Brandl is business development manager at EV Group for temporary bonding and metrology. She holds a Master degree (DI) in technical physics from the Johannes Kepler University Linz specialized on nanoscience and - technology.During her master thesis at the institute of semiconductor and solid state physics she gained experience for semiconductor processing and nanofabrication.

Ballabio, Andrea
CEO
EYE4NIR

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Short-wave infrared (SWIR) imaging and sensing sees an increase in commercial interest, given the wide range of use cases that are possible to implement, from automotive, to industrial automation, agri-food and many more. Silicon has an absorption cut-off at 1100nm in wavelength, therefore to detect SWIR other materials are needed. Germanium given its direct band gap of 0,8eV is a suitable material to be used to detect SWIR, however to exploit lower cost and potential scalability, epitaxial Ge-on-Si is considered to be used in devices. Ge-on-Si photodiodes have been firstly reported more than twenty years ago opening the way for the integration of IR photodetectors on Si. A tremendous development has been done, moving from vertically illuminated, stand-alone devices, to waveguide integrated arrays of photodetectors and CMOS integrated imagers. Usually, the Ge epilayer act as the absorbing material for the SWIR radiation, while Si acts only as a substrate. Here we report on a dual-band Ge-on-Si photodetector where light detection can take place both within the Ge epilayer and the underlying Si substrate: the device responsivity can thus be tuned from the VIS to the SWIR spectral range by means of an external bias. This principle of operation has been transferred into a CMOS process in order to fabricate CMOS image sensor, capable of detecting selectively visible and SWIR light. Sensing applications are also where the device was used to discriminate among different chemicals and plastics by exploiting the device spectral response in the two bands and the specific absorption spectra of the materials.

Biography
Andrea Ballabio graduated cum Laude in M. Sc. in Material Sciences (2014) at the University of Milano-Bicocca. He received his Ph.D. in Physics cum Laude (2018) from Politecnico di Milano working on optoelectronic and photonic applications. He as been a post-doc fellow at the Politecnico di Milano working on the growth and morphological characterization of germanium single-photon devices for SWIR applications. In 2021 co-founded EYE4NIR, where he is currently the CEO, with the aim to develop Ge based SWIR image sensors for the automotive and industrial markets.

Kutter, Christoph
Director of Fraunhofer EMFT
Fraunhofer EMFT

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Christoph Kutter is director of Fraunhofer EMFT, an institute of the Research Fab Microelectronics Germany (FMD), of which he is currently co-spokesperson. He also holds a professorship specializing in solid-state technologies at the University of the Federal Armed Forces in Munich. His focus at Fraunhofer EMFT is on silicon technologies, MEMS, flexible electronics, biosystem integration and heterogeneous integration of various solid-state technologies.Christoph Kutter is currently Vice President of the VDE (Association for Electrical, Electronic & Information Technologies), a member of acatech (National Academy of Science and Engineering) and the BBAW (Berlin-Brandenburg Academy of Sciences BBAW).From 1995 to 2012, Christoph Kutter held various management positions at Infineon Technologies AG and Siemens AG, including Head of Communications Product Development, Head of Chip Card Development and Head of Central Research. Christoph Kutter was responsible for several central improvement projects to increase efficiency in research and development as well as for the management of the company-wide innovation initiative.From 1990 to 1995, Christoph Kutter worked as a research assistant at the High Magnetic Field Laboratory (Max Planck Institute for Solid State Physics) in Grenoble, France.Christoph Kutter received his Dipl. Phys. from the Technical University of Munich and his Dr. rer. nat. from the University of Constance in 1995.

Tang, Qingyuan
Vice General Manager
Guangdong Fenghua Semiconductor Technology Co., Ltd.

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Gallium nitride (GaN) power devices have been widely used in the fields of fast charging with their high voltage and high frequency performance. However, high-power industrial applications such as motor control and inverters have still not been developed. Fan-out panel level packaging (FOPLP) is an attractive packaging technology which brings many benefits, such as low inductance, thin package height, and ease for multi-die integration. In order to give full play to the advantages of GaN power devices and expand the application of GaN in other aspects, it is important to improve the power density, reduce the parasitic inductance, and reliability of the packages.In this paper, Silicon (Si) chips and GaN field-effect transistors (FETs) were integrated into a quad flat no lead (QFN) package. The GaN FETs and Si chips were interconnected through re-distribution layer (RDL) Cu plating process and formed a half-bridge GaN module. Chip positioning, RDL layout and warpage behavior were optimized by package stress simulation. Thermal performance of different designs was studied by finite element analysis (FEA) tools. One watt heat dissipation was applied on the GaN chip to simulate package heat performance, and balancing of the heat dissipation was optimized by RDL design. In addition, thermal stress was optimized as well based on the Von Mises stress analysis on bumping area. Warpage and package stress on chips were minimized by tuning the package structure. A suitable Cu thickness was identified with consideration of current carrying capability and heat dissipation. The reliability performances including temperature cycling and high temperature accelerated test (HAST), were evaluated based on Joint Electron Device Engineering Council (JEDEC) requirements.By overcoming the technical challenges faced during the GaN FOPLP process, we successfully fabricated a small GaN half-bridge package with dimensions of 6mm×7mm×0.45 mm. By using only three layers of Cu RDL, the required electrical performance of the device was achieved, and the package warpage (46 micrometers) was controlled to minimize the mechanical stress. 30% of printed circuit board (PCB) area reduction was achieved by compared to the discrete package circuit layout.

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Qingyuan Tang earned his Ph.D. from City University of Hong Kong, P.R. China, in 2011 in Electronic Engineering. After graduated, he worked in Sierra Wireless, Nexperia, and Facebook before for different technical positions. He is now working as a Leader in Guangdong Fenghua Semiconductor Technology Co., Ltd. for R&D management.

Farbos de Luzan, Pierre
Head of Sustainability, Electronics
Henkel

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Henkel Adhesive Technologies aims to be the leader in sustainable adhesive solutions for the electronics industry, fostering climate action, circularity, and safety worldwide.Within our wirebond and advanced packaging solutions portfolio, we innovate to reduce greenhouse gas emissions through sustainable use of raw materials and enhanced adhesive efficiency.Moreover, we prioritize responsible chemistry, avoiding or replacing harmful substances to ensure a toxic-free product portfolio that benefits both people and the planet.At the keynote, Pierre Farbos de Luzan, Head of Sustainability at Henkel Electronics, will discuss Henkel's ongoing efforts, solutions, and challenges in promoting sustainability in semiconductor packaging.

Biography
Pierre is the Head of Sustainability for global Electronics business at Henkel, leading the development and implementation of sustainability strategies with the aim to deliver innovative and sustainable solutions for climate action, circularity and safety.Prior to that, he was driving the development of sustainability services for Accenture across APAC, Middle-East and Latin America regions, delivering complex and high-value projects for international clients across strategy, sustainability, supply chain and operations.Pierre holds a bachelor degree from HEC Montreal (Canada) and master degree from ESSEC Business School (France).

Kumar, Arvind
Principal RSM and Research Manager, AI Hardware Technologies
IBM

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The era of generative AI is accompanied by an unprecedented increase in compute, memory, and bandwidth requirements of AI workloads. Chiplet architectures and advanced packaging offer a promising path to meeting these demands through much more tightly integrated compute and memory units, enabling higher compute densities and bandwidths with lower latency and power. Heterogeneous integration coupled with open interface standards can also enable targeted architectures to accelerate specific use cases through co-packaging of diverse chiplets from different sources. I will discuss how IBM’s deep investments in AI and advanced packaging can lead to new opportunities through the emerging chiplet ecosystem.

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Dr. Arvind Kumar is a Principal Researcher at the IBM Research where he leads a team focusing on next generation AI Hardware and heterogeneous integration. He has presented several invited talks and served as a panelist and short-course instructor in this area at major conferences. He holds over 60 patents and is an IBM Master Inventor. Dr. Kumar earned SB, SM, and PhD degrees in Electrical Engineering and Computer Science, all from MIT.

Marent, Katrien
EVP & Chief Marketing and Communications Officer
imec

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Katrien has an engineering degree in microelectronics. She joined imec in 1992 as analog design engineer and specialized in design of low-noise readout electronics for high-energy physics. In 1999, she became press responsible and scientific editor at imec's business development division and was responsible for authoring and editing the research organization's numerous company technical documents and publications. In 2001, she was appointed corporate communications director at imec. Her responsibilities expanded in August 2007, when she got the position of external communications director including corporate, marketing and outreach communications. In October 2016, she became VP corporate, marketing and outreach communication. Since April 2020 she is Executive Vice President & Chief Marketing and Communications Officer and member of the executive board of imec.

Van den hove, Luc
President & CEO
imec

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Luc Van den hove is President and CEO of imec since July 1, 2009. Before he was executive vice president and chief operating officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies.In 1988, he became manager of imec’s micro-patterning group (lithography, dry etching); in 1996, department director of unit process step R&D; and in 1998, vice president of the silicon process and device technology division. In January 2007, he was appointed as imec's EVP & COO. Luc Van den hove received his PhD in electrical engineering from the KU Leuven, Belgium.In 2023, he was honored with the Robert N. Noyce medal for his leadership in creating a worldwide research ecosystem in nanoelectronics technology with applications ranging from high-performance computing to health.He has authored or co-authored more than 200 publications and conference contributions.

De Boeck, Jo
EVP & CSO
imec

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Jo De Boeck received his engineering degree in 1986 and his PhD degree in 1991 from the University of Leuven. Since 1991 he is a staff member of imec (Leuven). He has been a NATO Science Fellow at Bellcore (USA, 1991-92) and AST-fellow in the Joint Research Center for Atom Technology (Japan, 1998).In his research career, he has been leading activities on integration of novel materials at device level and new functionalities at systems level. In 2003 he became Vice President at imec for the Microsystems division and in 2005 started Holst Centre (Eindhoven) as General Manager of imec the Netherlands.From 2010 he headed imec’s Smart Systems and Energy Technology Business Unit. He is part-time professor at the Engineering department of the KU Leuven and held a visiting professorship at the TU Delft, Kavli Institute for Nanoscience (2003–2016). In 2011 he became Chief Technology Officer and in 2018 he was appointed Chief Strategy Officer. He is member of imec’s Executive Board.

Hoofman, Romano
Director imec.IC-link
imec

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Romano Hoofman is Strategic Development Director at imec.IC-link since 2016. He is currently responsible for the innovation programs of the unit and for the coordination of the EUROPRACTICE Service.He started his career in industry, where he worked as a Principal Scientist at Philips Research and later on NXP Semiconductors. He covered many different R&D topics, ranging from CMOS integration, advanced packaging, thin film batteries, photovoltaics and (bio)sensors.Romano received his PhD from the Technical University of Delft in 2000, where he investigated charge transport in semi-conducting polymers. He has authored more than 30 publications and holds more than 10 patents in various research areas.

Wyrsch, Oliver
President and Chief Executive Officer
INFICON HOLDING AG

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Oliver Wyrsch became President and Chief Executive Officer of INFICON HOLDING AG on January 1, 2023.He joined INFICON in 2018 as President and General Manager of the US business.Mr. Wyrsch is a Swiss citizen and holds a Master's degree in Computer Science and Business Administration from the Swiss Federal Institute of Technology in Zurich (ETH). He began his career in 2004 as a management consultant at Accenture and Booz & Co before becoming Head of Engineering at a pharmaceutical-focused software startup. He then spent seven years at Mettler Toledo in Germany and the US in various roles - most recently as Head of the Machine Vision Inspection Strategic Business Unit.

Boll, Michael
Vice President Public Policy
Infineon Technologies

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Michael Boll is a seasoned professional with a strong background in law, economics, and public policy. Born near Münster, Germany, he pursued higher education in Economics and Law at the University of Münster, earning his First State Examination in 2000 and his Second State Examination in Law in 2003.Michael furthered his academic credentials by obtaining a Master's degree in International and European Business Law (LL.M.) from the University of Exeter in 2003-2004.Michael's professional journey began in the consulting sector, where he held various leadership positions at EUTOP and Gauly Advisors. His client base was mainly from the Tech and Financial sector. He served as Director at EUTOP from 2005 to 2014, followed by a stint as Senior Manager and Partner at Gauly Advisors from 2014 to 2017. He later rejoined EUTOP, taking on roles such as Director & Syndic of EUTOP International GmbH, Member of the EUTOP Asia Executive Board, and Member of the EUTOP Executive Board in Berlin from 2017 to 2020.In 2021, Michael brought his expertise to Infineon, a leading semiconductor company, as Vice President of Public Policy. In this role, he leverages his knowledge of law, economics, and public policy to drive strategic decision-making and advocacy efforts. Throughout his career, Michael has demonstrated a unique blend of academic rigor, professional expertise, and leadership acumen. His diverse experience in consulting, academia, and the corporate world has equipped him to navigate complex policy landscapes and drive meaningful impact.

Pressel, Klaus
Assembly and Packaging
Infineon Technologies AG

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Dr. Klaus Pressel studied Physics at the University of Würzburg and with a scholarship of the German DAAD at S.U.N.Y. Albany (New York, U.S.A.). Klaus received his PhD in Physics from the University of Stuttgart for research on point defects in III/V semiconductors. He then joined IHP Frankfurt (Oder), where he focused on Si CMOS and SiGe design and technology. In 2001 Klaus joined Infineon Technologies at Regensburg, where he is focusing on innovations in assembly and packaging technology. His special interests are System-in-Package solutions, high frequency applications, chip-package-board/system co-design, as well as understanding reliability and quality. Klaus has been project leader of many European funded projects, e.g. the recent ECSEL JU iRel40 project. Klaus is representing Infineon in various international technical committees, e.g. SEMI Advanced Packaging Conference, ESTC, the Eureka XECS program, IEEE Heterogeneous Integration Roadmap. Klaus is author/co-author of more than 200 publications in semiconductor physics and technology, circuit design, assembly and interconnect technology and owns/co-owns more than 20 patents.

Springer, David
Product Manager, MVD and Release Etch Products
KLA Corporation

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Antistiction coatings are widely used in MEMS applications to improve device performance and enhance overall device lifetime. The most widely used chemicals are fluoropolymers like FDTS and FOTS, which are members of the large group of PFAS substances. MEMS integrators and manufacturers are increasingly seeking alternative antistiction coatings that do not use PFAS chemicals. The obvious solutions include hydrocarbon analogs of FDTS and FOTS, but these don’t have the required thermal or mechanical stability. This talk will discuss the various alternatives to FDTS, explore their strengths and weaknesses, and introduce a new proprietary fluorine free antistiction coating.

Biography
David Springer is a Product Manager at KLA in charge of MEMS applications of MVD coatings, and XeF₂ release etch products. He joined SPTS in June of 2013 when SPTS acquired Xactix Inc. where he was President for 11 years. Previous to XACTIX, David was president of a design automation startup company and received his PhD. in Computer Engineering from Carnegie Mellon University.

Lindloff, Axel
Senior Process Specialist Pre-Sales
Koh Young Europe GmbH

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Altuzarra, Charles
Chief Executive Officer and Cofounder
Metahelios

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All camera sensors made to take pictures in color require the integration of color filter arrays (CFAs). However, CFA technology has a fatal flaw, they are not made to filter light in the infrared range, in particular in the shortwave infrared (SWIR) range specific to InGaAs and QD sensors. However, obtaining spectral information in the SWIR range is crucial across almost all industries including consumer, earth observation, national security/defense and automotive.In this presentation, we introduce Metahelios' Infrared filter arrays (IFAs) developed with our signature pixelated metasurface technology. More to that, we discuss the implied opportunities for applications of compact SWIR multispectral cameras that require no moving parts.

Biography
Dr. Charles Altuzarra graduated from the Nanyang Technological University (NTU) with a PhD in physics with a focus on experimental quantum optics and metamaterials. During that time he was a researcher under the CNRS/Thales/NTU alliance. He then held positions at Heriot-Watt University, Texas A&M University's Institute for Quantum Science & Engineering (position funded by the Air Force Office of Scientific Research), and University of Glasgow in Scotland. He then cofounded Metahelios with his business partner Dr. Yash Shah in 2022. Metahelios develops cutting-edge pixelated metasurface technology for the consumer, defense and space industries.

Stubbe, Jessica
Global Application Manager
MKS Instruments / Atotech

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In this study, we investigate the challenges and advancements associated with meeting emerging bump requirements in advanced packaging technologies through optimized Electrochemical Deposition (ECD) plating processes. Tracing the historical evolution from Flip Chip to 3-D stacking, the industry's demand for smaller bump sizes and pitches is emphasized. We address the complexities of ECD Cu, Ni(-alloy), and Tin(-alloy) processes, focusing on microbump development and evaluating NiFe alloy as a superior diffusion barrier. The study concludes by highlighting empirical results, offering experimental solutions for miniaturization challenges in advanced packaging, with a particular focus on the promising performance of NiFe as a barrier material.

Biography
I studied chemistry in Berlin, where I earned my PhD in coordination chemistry with a focus on electrochemistry. My career started at Atotech as a scientist in the semiconductor department. Through hard work and dedication, I advanced to lead the electrochemical deposition team in the semiconductor division, overseeing our application processes and ensuring optimal performance in our projects.

Rizk, Charbel
Founder CEO
Oculi

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Remarkable progress has been achieved in AI, particularly in the use of deep neural networks, which has significantly enhanced the reliability of face detection, eye / hand tracking, & people detection. However, performing these tasks still demands substantial computational power & memory resources, making it a resource-intensive endeavor that remains to be solved. Consequently, power consumption & latency pose significant challenges for many systems operating in always-on edge applications. The OCULI SPUTM (Sensing & Processing Unit), ideal for smart vision applications, represents an intelligent, programmable vision sensor capable of configuration dynamically to output select data in various modes depending on use case needs. These modes include video, polarity events, smart events, regions of interest (ROI), sparse random access, & actionable information that make the vision sensor efficient. Moreover, the SPU allows real-time programmability of spatial & temporal resolution, as well as dynamic range & bit depth. By enabling continuous optimization, visual AI solutions deploying the SPU can reduce the latency-energy factor by more than 600x at a fraction of the cost. Smart events, ROI, random access, & actionable information output modes are unique to the OCULI SPU. Because the SPU is fully programmable, it can be dynamically optimized between latency & power consumption. It will enable the first truly wireless battery-operated always-on Visual AI products in the market. We will provide an overview of Oculi’s novel vision architecture for edge applications, as well as key results for latency & energy results for multiple use cases of interest. Applicability to various markets including presence/people/pedestrian/object, face, hand, & eye detection will be reviewed. Finally, our results include a comparison with conventional solutions that demonstrate significant advantages in adopting a paradigm shift from imaging to vision for visual edge applications.

Biography
Charbel is Founder and CEO of Oculi. Prior to this venture, Charbel was an Associate Research Professor at Johns Hopkins University, where he was recognized as a top innovator, thought leader, and successful Principal Investigator of multiple innovative and far-reaching concepts and technologies. He has had numerous publications and intellectual property filings, and received 12 achievement/recognition awards. Dr. Rizk was a pioneer in UAV technology, AI & machine learning, and autonomy. He has been a visionary for the optimized signal-to-information architecture that embodies dynamic software-defined multi-modal sensing and fusion and true edge processing.

Aguilar, Eric
CEO
Omnitron Sensors, Inc.

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For too long, complex, expensive and laborious ways of manufacturing MEMS deviceshave slowed the growth of a critically important microscale technology.Omnitron Sensors has introduced a new topology for MEMS — its process IP — whichrearranges existing modules to streamline the assembly process and improvecapacitance per unit area. This approach increases device performance andaccelerates the production of MEMS devices for price-sensitive, high-volume markets.Omnitron’s first product, a 3D MEMS step-scanning mirror for long-range LiDAR, is aproof point of its topology. Omnitron’s device is a large 15mm in diameter mirror withtens of degrees of motion and the ability to do step scanning. It’s the first MEMS mirrorto meet the full requirements of FMCW, addressing the mechanical-articulation needs ofmodern LiDAR in autonomous navigation and ADAS.The speaker will provide an overview of Omnitron’s topology for MEMS and will explainhow it may be applied to precision applications such as LiDAR, augmented reality, andimage stabilization.

Biography
Eric Aguilar is a visionary leader in advanced sensor systems for complexapplications such as robotics and autonomous platforms.Eric’s expertise includes leading teams at Tesla, where he managed a crew of 300engineers on the firmware for Model 3, and at X, where he spearheaded thedevelopment of Google Project Wing, an autonomous drone delivery service.Eric led sensor integration at Argo AI. He previously steered product development for asensor company later acquired by Google for $85M.Eric earned a BS in Electrical Engineering from California State Polytechnic University.

Shulga, Artem
CEO & Founder
QDI systems

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Short-wave infrared (SWIR) image sensors play an important role in various defence and security applications, including low-light-level imaging, laser detection and range finding. Pixelated detectors made of indium gallium arsenide (InGaAs) have shown excellent performance for SWIR imaging, however, the cost remains the major barrier for adaptation. In this talk we will present a low-cost, next-generation SWIR sensor. We have developed an alternative technology which relies on lead sulfide quantum dot (PbS QD) photon absorber, which is monolithically and directly deposited on a CMOS readout chip via solution-based process. The uncooled sensor achieves the QE of >20% at 1550 nm with the dark current of 50 nA/cm2. Additionally, the sensitivity range can be extended further to 2.1 um. The technology is suitable for wafer-level manufacturing, thus driving the sensor cost more than an order of magnitude lower. We will present a comprehensive characterization of QD-based imager and demonstrate real-life use cases.

Biography
Dr. Artem Shulga was born in 1988, in the Lugansk region in Ukraine. He completed his Bachelor degree in Applied Physics at the National University of Kyiv. He spent a year working as a Research Engineer in Chernobyl NPP.In 2011, he decided to move to Groningen to complete his Master's degree in Nanoscience. In the same year, he joined the Photophysics and Optoelectronics group, in order to work on colloidal quantum dots in field-effect transistors. Artem defended his PhD thesis, dedicated to the engineering of devices based on quantum dots in 2019. His dissertation, entitled 'Colloidal Quantum Dot Field-Effect Transistors - From Electronic Circuits to Light Emission and Detection' was awarded with the 'Best GEC PhD Thesis Award'. Inspired by a trip to Japan a few years earlier, Artem started the company QDI systems B.V. in 2019. With his strong background in semiconductor electronics and know-how of the fabrication of optoelectronic devices based on QDs, Artem's ambition is to continue running a successful company and to commercialise the discoveries he's made throughout his extensive research.

Bruckmaier, Fleming
CTO
QuantumDiamonds GmbH

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Advanced packaging solutions such as 2.5/3D integration and chiplets, are becoming essential. However, they complicate access and introduce new failure modes including verticals. Similar problems arise with modern trends such as the move to backside power delivery or new materials for high power devices.Diamond-based quantum sensing can image currents from multiple layers non-destructively via their magnetic field. The technique is capable of detecting defects in hidden layers and infere three-dimensional current density distributions. In addition, high sensitivity is achieved at DC currents as well as higher frequency bands up to several GHz. In this talk, we will present the capabilities of the innovative technique with examples from multiple industries including advanced packages.

Biography
Dr. Fleming Bruckmaier has seven years of working experience in quantum technologies, including a PhD from the Technical University of Munich. He worked on cutting-edge diamond-based technologies targeted at the semiconductor and bio-tech markets resulting in several publications in prestigious journals such as Science Advances or Nature Communications.Since 2022 he is CTO at the Munich-based quantum sensing company QuantumDiamonds, which develops magnetic field microscopes, used in semiconductor electrical failure analysis.

Kischkat, Jan F
CEO
Quantune Technologies GmbH

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Modern medicine has improved dramatically through a better understanding of what causes a condition or what it is correlated to. However, the healthcare system still follows an episodic (reactive) model, where patients only seek medical advice when there are symptoms, which, for certain medical conditions, has proven critically insufficient. Several biomarkers such as uric acid, free fatty acids, or ketone bodies correlate with and thus indicate aspects of chronic conditions such as the metabolic syndrome, prediabetes, or diabetes. The more biomarkers can be measured and quantified with high accuracy, the easier it becomes to make conclusive decisions on the patient’s status.Quantune Technologies provides an alternative approach for the measurement of biomarkers, using Mid-Infrared (MIR) Spectroscopy (or simply Infrared Spectroscopy, not to be confused with Near-Infrared Spectroscopy), the most powerful laboratory analytics tool, used in biological and chemical labs around the world for decades to analyze, among many other things, the molecular composition of body fluids and tissue. Currently, this kind of technology is stuck to laboratory use only due to its desktop size, the need for a vibration-free environment, cryogenic temperatures, and extensive sample preparation and maintenance. Additionally, the devices are expensive, with a cost of around 100k€. Quantune has developed an MIR spectrometer based on a widely tunable Quantum Cascade Laser and touch-detector based on the photoacoustic effect. It is miniaturized to wearable-level with hyper-scalable production for volume markets. It is also robust and suitable for everyday use. The spectral coverage of the technology of 5–11 μm is ideally suited to detect biomarkers non-invasively and pain-free in the interstitial fluid in the skin.

Biography
Jan studied physics at Humboldt-University Berlin and at the University of Illinois at Urbana-Champaign with a Fulbright scholarship. For his PhD, he worked on novel External-Cavity Quantum Cascade Lasers, before founding Quantune Technologies in 2019. Quantune is transforming infrared spectroscopy by bringing its lab-grade analytical power to new markets and people’s lives. He co-authored 6 patent families and has won several scientific awards, most notably the 2023 Bertold Leibinger Innovationspreis.

Goossens, Stijn
CTO
Qurv

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Computer vision (CV) enables machines and their users to interpret and understand the world around them, making them more intelligent. Current CV systems face limitations under adverse weather or light and struggle to capture more information than a human already sees. Wide-spectrum image sensor technology overcomes these challenges by providing eye-safe active illumination without sunlight interference, offering the ability to penetrate through fog or smoke, and enabling molecular imaging. Quantum dot (QD) based technology is an attractive candidate for high-volume manufacturing of affordable and RoHS-compliant wide-spectrum image sensors. Qurv presents its latest QD-based wide-spectrum image sensor developments, focusing on scalability and computer vision-first use cases.

Biography
Dr. Stijn Goossens is CTO of Qurv and a pioneer in wide-spectrum image sensor technologies based on quantum materials such as colloidal quantum dots. He is inventor of multiple patents in qurv’s portfolio. He obtained his PhD from Delft University of Technology and continued his career as a team lead at the Institute of Photonic Sciences (ICFO). In 2020, he co-founded Qurv as a spin-out of ICFO to develop and commercialize wide-spectrum image sensor technology for high volume computer vision applications.

Vozarova, Maria
Material and 3D Printing Researcher
RHP-Technology GmbH

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E. Neubauer¹, Z.Kovacova¹, Lea Babejova¹, Maria Vozarova¹, Carmen Vladu¹, M.Kitzmantel¹, D.Dewire², J.Vriens²¹RHP-Technology GmbH, A-2444 Seibersdorf²Hi-Rel Alloys – A Qnnect Company, Niagara Falls, ON L2H 0Y5, CanadaLightweight dissipative materials with tailored Coefficient of Thermal Expansion (CTE) is a focal point in materials used in electronic packaging applications. This research aims on materials possessing not only high thermal conductivity, but also allowing to provide significant CTE reduction to conventional Aluminum, Copper and Silver alloys widely employed in electronics. A second material category comprises aluminum alloys reinforced with carbon fibers or with Silicium Carbide (Al-SiC). Especially the fiber reinforced composites allow to tailor the anisotropy of thermal properties. New concepts for the manufacturing have been applied, including methods such as direct hot pressing which allows a precise control of the SiC or Carbon fiber content and facilitates the production of large plates with uniform microstructure up to 400 mm in diameter. This approach allows minimizing energy consumption, while ensuring customizable properties and enhanced thermal and mechanical performance tailored for specific applications. Thermophysical analysis have been carried out showing the positive impact of the inserts on the reduction of the coefficient of thermal expansion as well as the improvement of the thermal diffusivity/conductivity value. Examples of different shapes and heat sink components, which were realized, will be presented.

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Joeres, Stefan
Vice President for Business Development, Semiconductor Strategy and Strategic Projects
Robert Bosch GmbH

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Stefan Joeres has been Vice President for Business Development, Semiconductor Strategy and Strategic Projects of Robert Bosch GmbH since 2014.Born in Mönchengladbach, Germany, on April 15, 1977, he is married and has two children. He studied electrical engineering and information technology at RWTH Aachen (Germany).He Graduated as Dipl.-Ing. And finalized his doctorship in 2008 about system simulation for high-frequency circuits at the RWTH Aachen.

Van Poucke, Bart
VP Market Strategy and Development
Robovision

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In the context of back-end packaging and test lines, the semiconductor industry is witnessing a paradigm shift towards Industry 4.0 principles. This represents a significant opportunity for Integrated Device Manufacturers (IDMs) and Outsourced Assembly and Test (OSAT) entities to enhance throughput, minimise capital expenditures, and gain a firmer grip on cost efficiency.Chiplets and heterogeneous integration solutions are characterised by the use of new materials, more complex process steps, and a high level of customization. This results in a growing defect complexity and the need for very efficient and high performance quality control.Traditional approaches often lead to significant time expenditure on recipe creation, as the number of products, customised processes, process steps, and inspection machines increases. Even the most advanced recipes struggle to classify all defects with great accuracy.In this paper, we chart a path to lights out operation in the era of advanced packaging. We first introduce a new approach using deep learning vision AI for defect inspection and then present a path to large scale operation by means of tangible strategies and solutions for the main operational challenges.The approach can be best described as a “Subject Matter Expert first” workflow providing minimum description and knowledge loss in the creation of vision AI models which helps achieve human-like performance. Combined with a set of easy to use governance flows for label purity, data set purity and model performance monitoring this approach also guarantees optimal model performance at initial model creation and during model operation.Instantiating this approach in a systemic way requires a platform approach governing the full model life cycle management with self-service data consumption for SME’s and data scientists. A single platform, providing flexibility in early process research and stability in High Volume Manufacturing.The approach shows an 48% increase in FTE productivity for critical competences like data scientists, process owners and computer scientists and as such tackles the critical competence challenges of the semiconductor industry. The SME-first approach both creates trust with SME’s to start using vision AI, while it enables them to fully drives model outcomes. Last but not least it offers an agile model development capable of driving continuous model improvements and handling the large product mix in an efficient way.

Biography
Bart Van Poucke is leading the semiconductor market strategy and devlopment at Robovision, a platform provider for developing scalable vision AI solutions to power intelligent machines. He started his semiconductor carreer at imec in Belgium in various roles from research engineer towards business devlopment roles.

Gomez, Jessica
CEO
Rogue Valley Microdevices

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Although the semiconductor industry began manufacturing on 300mm wafers in the early 2000s, benefiting from economies of scale, design standards, and standardized process nodes, the MEMS industry has lagged. In MEMS, it’s still a single product, single process world – making it time-consuming and expensive to bring new devices to market. As the number of 300mm CMOS fabs continue to increase, so does the demand for 300mm-capable MEMS foundries to support critical technology integration, scalability, and efficiency.For the MEMS industry, the adoption of 300mm wafers will signify a substantial leap forward in manufacturing automation and cost-effectiveness, yet it still presents many challenges. MEMS processing frequently utilizes non-CMOS compatible materials for metallization, sensing and actuation, making it nearly impossible to support both CMOS and MEMS manufacturing in the same facility. To be successful on a 300mm platform, MEMS foundries will need to manufacture a high mix of products to ensure their facilities run efficiently and at capacity.This session will explore how Rogue Valley Microdevices – a pureplay, full-service precision MEMS foundry – has reacted to this need for 300mm MEMS with the construction of its second fab, a flexible, 300mm-capable MEMS foundry in Palm Bay, Florida with production set to begin in 2025. Rogue Valley Microdevices expects to address multiple areas of need, including thin film deposition, through-silicon via (TSV), RDL, UBM, wafer level packaging, and is poised to leverage 300mm technology to propel MEMS sensor development to unprecedented heights.Join us as we explore how flexible, 300mm-capable MEMS foundries promise to revolutionize the integration of microsensors into the supply chain, fostering innovation and unlocking new possibilities for transformative products.

Biography
As founder and CEO of Rogue Valley Microdevices, Jessica Gomez has created a world-class precision MEMS foundry in the heart of Southern Oregon, with a second foundry under construction in Palm Bay, Florida. Integral to her role as CEO, Ms. Gomez practices a business philosophy of offering best-in-class process technology and R&D expertise to customers, to help them achieve the highest quality and reliability in their products. Prior to founding Rogue Valley Microdevices in 2003, Ms. Gomez honed her experience in semiconductor processing and production management through positions at Standard Microsystems Corporation, Integrated Micromachines, and Xponent Photonics.Ms. Gomez plays an active leadership role within and beyond the technology industry. She is a board member of the prestigious SEMI Board of Industry Leaders, and she is the first executive selected for Spotlight on SEMI Women, which honors accomplished women in the global microelectronics industry.

Manocha, Ajit
President and CEO
SEMI

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Ajit Manocha is the president and CEO of SEMI. Headquartered in Milpitas, California, SEMI is the global industry association serving the electronics manufacturing and design supply chain. Throughout his career, Manocha has been a champion of industry collaboration as a critical means of advancing technology for societal and economic prosperity.Manocha was formerly CEO at GLOBALFOUNDRIES. Prior to this he held the role of EVP of worldwide operations at Spansion and earlier served as EVP and chief manufacturing officer at Philips/NXP Semiconductors. He began his career at AT&T Bell Laboratories as a research scientist where he was granted more than a dozen patents related to semiconductor manufacturing processes that served as the foundation for modern microelectronics manufacturing. He has served on the boards of SEMI, SIA and GSA.Today, there is a much broader scope for SEMI to help foster collaboration and fuel growth than we could have ever imagined at its inception in 1970. This scope has to be accomplished without compromising the strong foundation of SEMI – the equipment suppliers and materials makers. Manocha feels SEMI must evolve as the industry’s ecosystem rapidly expands to support smarter, connected applications based on artificial intelligence, machine learning and other disruptive technologies.Manocha is active on global advocacy and workforce development issues and has served on the President’s committees for “Advanced Manufacturing Partnerships” and the President’s Council of Advisors on Science & Technology (PCAST).In 2021, VLSIresearch added Manocha to its Semiconductor Industry Hall of Fame for his leadership of SEMI efforts to address geopolitical trade tensions as well as for his initiative in navigating the many challenges of the COVID-19 pandemic impacting SEMI and the microelectronics industry. In 2020, Manocha was inducted into the Silicon Valley Engineering Hall of Fame, and VLSI named him an “All Star of the Semiconductor Industry” for his visionary leadership in 2019 to restructure SEMI to represent the expanded electronics supply chain.

Altimime, Laith
President
SEMI Europe

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Laith Altimime, as President of SEMI Europe, leads SEMI’s activities in Europe and the Middle East and Africa (EMEA). Altimime has P&L responsibility as well as ownership of all Europe region programs and events, including SEMICON Europa. He is responsible for establishing industry standards, advocacy, community development, expositions, and programs. He provides support and services to SEMI members worldwide that have supply chain interests in Europe. He manages and nurtures relationships with SEMI members in the region and globally as well as with local associations and constituents in industry, government, and academia. Altimime has more than 30 years of international experience in the semiconductor industry. Prior to joining SEMI in 2015, He held senior leadership positions at NEC, KLA-Tencor, Infineon, Qimonda and imec. Altimime holds an MSc from Heriot-Watt University, Scotland.

Heurung, Thomas
CEO Siemens Electronic Design Automation GmbH & Technical Director EMEA
Siemens EDA

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Since graduating with a degree in electrical engineering in 1997 from Friedrich-Alexander University in Erlangen, Thomas Heurung has been assisting customers in solving various challenges in industrial applications. His first engagements were with the development of electrical systems for automobiles and airplanes, embedded software for distributed control systems, and eventually moved on to the development of complex electronic systems and components.After transitioning from Synopsys to Mentor Graphics in 2004, which became part of Siemens AG in 2017 and is now known as Siemens Electronic Design Automation, he held various responsibilities such as global business development and establishing and leading technical sales in Europe and India for the Capital and Volcano product lines.Since 2020, he is serving as Technical Director, responsible for the technical sales of semiconductor and electronic systems development tools at Siemens EDA in EMEA.

Germain, Marianne
General Manager BU GaN & CEO
SOITEC Belgium NV

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Dr Marianne Germain received in 1999 her PhD degree in Electrical Engineering from the University of Liege (BE), where she conducted research in close collaboration with RWTH Aachen (D), and as invited post-doc in Purdue University (US) and Würzburg University (D). In 2001, she joined IMEC, where she became in 2004 Program Manager of the “Efficient Power/GaN” program. In May 2010, she co-founded “EpiGaN”, a spin-off located in Hasselt manufacturing GaN epiwafers for electronics applications, where she acted as CEO and member of the Board of Directors. EpiGaN nv was acquired by SOITEC in May 2019, where she is now acting as General Manager of BU GaN and CEO of SOITEC Belgium NV.

Yang, Cheng
Corporate Fellow
STATS ChipPAC

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With ever growing demands of AI and cloud applications, advanced packaging especially 2.5D/3D with chiplet integration, becomes a major technology path to meet the increasing demands of computing power. Power delivery and thermal management are two crucial roadblocks in various scenarios, e.g. when large size xPU power can reach thousand watts, liquid cooling and high efficiency power modules at both board and package level become prerequisites for the system to work properly. Package and silicon power delivery solutions, e.g. silicon capacitors (including DTC, MIM etc.), integrated VR etc. add process complexities and cost but are necessary to make the advanced node IC work properly. Further integration in both board and package level can been foreseen, e.g. 48V package integrated VR to meet future demands. On the other side, the thermal management (basically all power delivered to computing ICs will be dissipated as heat) becomes very challenging, advanced package and system level cooling methods are needed. Thermal interface material is a major concern at many cases where advanced TIM becomes a very hot topics in the industry. Heat induced reliability (silicon, package) is also a critical job for the packaging industry. Key trends observed and a few cases will be discussed.

Biography
Dr. Yang is currently corporate fellow for JCET STATS ChipPAC. He has more than 20 years’experience in electronics system and IC packaging development. At present he is leading corporate technology office at JCET STATS ChipPAC. Before joining JCET, he was at Flex on SiP products and technology development in IoT, automotive, medical, and industrial applications, covering design, manufacturing, and testing areas. He has worked at Intel on memory packaging design and technology development for 13 years. Dr. Yang hold a Ph.D. degree from National University of Singapore, EMBA from Washington University in St. Louis, and Master and Bachelor from Shanghai Jiaotong University.

François, Simoens
CEO
SteerLight

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LiDAR sensors are key for safe mobility and in particular for automated and autonomous robots, machines and vehicles to detect obstacles. However, today’s commercial LiDAR technologies cannot face the issues of a widespread adoption in terms of costs, reliability and form factors. Steerlight, a CEA-Leti spin-off, develops a third generation of LiDARs on-chip combining at chip-scale level FMCW detection scheme and non-mechanical beam steering thanks to Silicon Photonics. FMCW provides instantaneous depth and velocity information while Silicon Photonics allows a system on-chip integration of the optical and electronics functionalities.This miniature and scalable LiDAR enables high reliability, compactness, cost reduction with high resolution/range performance. These features are ‘must have’ for a mass adoption by the growing markets of automotive and robotics. More generally, such new sensor will empower the use of 3D vision for a wide range of applications such as smart cities, services, homes or even consumer electronics.

Biography
Dr François Simoens is the CEO and the co-founder of SteerLight, a deeptech start-up founded in July 2022 with the ambition to provide smarter 3D vision with a new generation of miniaturized FMCW silicon-photonics based LiDAR sensors. He builds this disruptive value proposition on his prior involvement in photonics developments for more than 25 years. He joined CEA-Leti in 2003 to contribute to R&D institutional and industrial project before taking the position of program manager and expert in the imaging sensor field. During the 15 last years, he has been acting as Business Developer for industrial partnerships and Marketing Manager for the strategic imaging domain.

Ferri, Simone
APMS Group Vice-President, MEMS sub-group General Manager
STMicroelectronics

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Sensors are at the core of many of our interactions with the world. They serve as the bridge between the physical and digital realms. From this perspective, there is a strong expectation that sensorization remains human-centric, enhancing our daily lives by contributing to a better lifestyle. Also, there is an increasing urgency to keep up with long-term plans regarding sustainability. The path for a net-zero transition is everyone's responsibility, and embedding sustainability practices in our sensor strategy is essential to our people, our business, and society at large. Our commitment to sustainability is reflected in the way our sensors deliver valuable data efficiently across various industries, including automotive, industrial sectors, infrastructure projects, and consumer electronics, ensuring that our technological footprint is both meaningful and environmentally conscious.

Biography
Simone Ferri is General Manager for STMicroelectronics MEMS sub-group since February 2016.Simone began his career in STMicroelectronics in 1999 as an R&D engineer, before moving on to digital designer for the Audio Division, leading into product management after 5 years. In 2014, Simone was entrusted with ST MEMS consumer sensors then with global MEMS-sensor related Marketing and Application activities across all markets and segments, and, more recently with AMS Group Vice-President and General Manager of the MEMS sub-groupSimone Ferri was born in Milan in 1972 and graduated with a degree in Microelectronics from the Polytechnic of Milan, where he also completed his MBA.

Schmidt, Thomas
Product Manager Bonder
SUSS MicroTec Solutions GmbH

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Integrated high-performance metrology for overlay has become a key requirement for state-of-the-art hybrid bonding applications not only as a potential quality gate for incoming substrates, but in particular to monitor bonding performance in general.Powered by the need of more and more memory and computing capabilities, hybrid bonding is gradually adopted to produce the required chips for HPC application. This advanced packaging technology relies on dielectric fusion bonding of two wafers or dies together at room temperature, electrical interconnection of the Cu pads is formed subsequently at the post-bond anneal in a separate oven. Surface quality, cleanliness and Cu-recess control are key process parameters to ensure high yield and cost-effective integration of this assembly technology. The different bonding strategies, from W2W towards known good dies selected and transferred directly to the target wafer (sequential D2W) or via a temporary substrate (collective D2W) are illustrated in the following figure below.In this article, we want to shift the focus towards the requirements for integrated metrology solutions and discuss the benefits and results obtained by in-line measurement to enable both, high bonding performance and process control.We present the W2W overlay concept based on our dual side pneumatic deflection and bond wave propagation concept. This technology features, together with a 20mK temperature control enables for scaling correction and offer a <50nm post bond accuracy (@3sigma) with a max vector not larger than 80nm. In order to ensure and monitor the bonding performance, a powerful and reliable metrology solution is required. The integration of the ISO3-based SET NEO HB flip-chip bonder into a SUSS production cluster even places additional requirements on the metrology platform for void free sequential D2W placement. Integrated metrology can easily feedback both wafer-to-wafer and die-to-wafer alignment offsets if sufficiently fast and accurate. In case of D2W direct glass carrier pick-up capability allows to handle and realize void free stacking of <50um thin dies assisted by up to 3kgF bond force to mitigate the die-warpage. Furthermore, by combining D2W with W2W bonding, thin dies placed on glass carrier with LR/TBM can be collectively transferred in one single step to the target wafer. Here D2CW overlay error can then be improved by prior overlay mapping and derived global offsets.

Biography
Thomas Schmidt is Product Manager in the Bonder Division of SUSS MicroTec iSolutions GmbH n Sternenfels. After his graduation in Microsystems Technology at the University of applied sciences in Kaiserslautern he has held various positions in MEMS/semiconductor processing and has also lectured on advanced lithography as well as on MEMS and advanced CMOS fabrication.Since December 2017 Thomas Schmidt is a member of the Bonder Division of SUSS MicroTec (product line "Permanent Wafer Bonding“) with a strong focus on automated cluster platforms for MEMS/packaging applications and hybrid bonding for advanced packaging.

Pandey, Amit
PhD Student
Technische Hochschule Ingolstadt

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Due to increasing active safety requirements from tests like NCAP, it is expected that all newly registered vehicles will soon have at least two cameras, with medium to higher-end vehicles having four. With 80 million new vehicles worldwide annually, this creates a high demand for cameras, which, due to volume, has a high potential for cost reductions. Since the most expensive component in a camera is its objective, it raises the question of whether its complexity can be reduced. This work investigates a curved imager to reduce the number of elements in the objective by eliminating the need to form a planar image.The long-term goal is to attach the imager to the last optical surface, either with a recess in the element to attach bond wires or using a Through-Silicon Via approach. This work presents an intermediate step, where a commercially available imager is thinned and bonded into a curved pedestal, detached from the objective as in established camera designs.The design was first evaluated using silicon chips with thicknesses of 30 and 50 µm. BK7 glass was used as the pedestal’s material, into which a 60mm concave radius was ground. Various liquid adhesives were investigated to bond the chip into the curvature. During assembly, the top side of the chip was vacuum sucked onto a convex 60mm radius tool, adhesive was applied, and the chip was pressed into the pedestal's depression. While remaining in place, the adhesive was cured at 150°C for 15 minutes. The assembly process impact was investigated by measuring induced stress via Raman spectroscopy and bonding quality via scanning acoustic microscopy (SAM). SAM investigation showed that the interconnect with the adhesive was inhomogeneous because of non-uniform adhesive dispensing and pressure application. Therefore, the approach was modified by investigating various adhesive volumes and dispensing patterns. After bonding, high compressive stress concentrations were seen at the center of the edges.In the next step, thinned imagers were bonded to pedestals and to PCBs. Electrical connections were realized by 25 µm wire bonds. After the assembly, it was possible to read register values from the imager, but capturing an image was not feasible. The reason for this was hypothesized to be damage to the imager during thinning. The hypothesis was supported by results from accelerated thermal aging, where cracks appeared after 100 cycles. Work is in progress to achieve a fully functional imager.

Biography
Amit Pandey received a B. Tech degree in Mechanical Engineering fromSRM University in India and an M. Eng. degree in Automotive Engineeringfrom University of Applied Sciences in Ingolstadt. He is a researcher atthe Institute of Innovative Mobility affiliated with Technische Hochschulein Ingolstadt, Germany. He is currently a PhD student at the University ofApplied Sciences in Ingolstadt and his current research topics are reliabilty ofoptical sensors in automotive industry and the effect of aging on automotivecamera and its impact on performance on critical tasks such as objectdetection.

Rhoads, Geoff
Chief Technology Officer
Transformative Optics Corporation

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Creating lighting for adequate detection is a primordial problem of imaging. We can trace this struggle to the late 1800s, where solutions began with the flash lamp- an explosive comprised of flash powder and ignition. After 30 years, it was replaced by oxygen and electricity. Harnessing electricity became more efficient, bulbs became reusable, and eventually LED flashes became standard. After over a century of improving lighting, we need a new approach to the problem: how do we maintain image quality regardless of lighting? Hardware solutions have increased Bayer pattern sensors' sensitivity, but maintaining high dynamic range detail in low light remains an issue. The ShadowChrome (SC) ISP is a new approach, built to optimize the performance of every individual sensor. The algorithm exists in two parts. First, we define a standard image set highlighting the nonlinearity of mean pixel values at low SNRs. These are collected and processed with the ShadowChromeProfile (SCP) algorithm, which produces a file (SCProfile) containing information on the noise-floor of the sensor. Second, the SC algorithm leverages SCProfile to intelligently accumulate signal, converging to a lower correlated noise-floor. The result is empirically verified to increase the bit depth of images. SC is suitable for a webservice, on-device processing, or in imaging or video pipelines where raw data is accessible. Visual and performance results, along with partner testimonials show dramatic increase in dynamic range (typically 20dB-30dB), visually sharper details, truer color, and overall reduced noise. With the implementation of ShadowChrome, any camera can continue to produce detailed, high-quality images regardless of lighting- from high dynamic range scenery to nighttime lighting conditions. Beyond our early adopters in live content streaming, we are actively pursuing implementation in CMOS manufacturing, immersive experiences, endoscopic imaging systems, security and more.

Biography
Transformative Optics Corporation (TOC) was founded on the goal of capturing every detail. TOC began with ai-CMOS, a 9-color channel CFA pattern. Sensors with this pattern capture twice as much light, richer feature vectors, and superior color discrimination. ShadowChrome (SC) ISP originated in the development of algorithms supporting ai-CMOS increasing the color channel information. Upon studying SC’s ability to pull detail from dim and low dynamic range imagery, SC was birthed to support standard Bayer pattern sensors. TOC enhances the hardware elements as well, with the Integrated Imaging Modules (IIMs) and Array Cameras. The IIMs are integrated lens and sensor units reducing cost per pixel while increasing image quality. Array Cameras configure solutions of multiple IIMs with specialized data processing algorithms that provide super resolution while maintaining high frames per second. TOC remains focused on advancing these solutions and driving innovation to capture every detail.

Bakal, Avi
CEO & Co-founder
TriEye

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Coming Soon

Biography
Coming Soon

Soukkamaki, Jussi
Lead, Hyperspectral & Imaging Technologies
VTT Technical Research Centre of Finland Ltd

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VTT has created an active hyperspectral imaging concept using spectrally tunable light source based on MEMS Fabry-Perot interferometer and supercontinuum laser. The proposed solution opens new possibilities in close and long range distances enabling detection even in the total darkness. Especially in the industrial lines, this new technology may enable hyperspectral market expansion from niche to machine vision mainstream.

Biography
Jussi Soukkamäki has over 20 years of experience in optoelectronics industry. During the last 12 years he has worked with spectroscopical applications in various positions from R&D to sales and business development in companies like Rikola Ltd, Senop, Timegate Instruments and Spectral Imaging Ltd.(SPECIM). Currently he works as a Lead, hyperspectral and imaging technologies, at VTT.

Damianos, Dimitrios
Project Manager
Yole Group

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The "MEMS & Imaging Young Talent" session is dedicated to showcasing the next generation of innovators in the field of MEMS and imaging sensors. As these technologies continue to revolutionize industries ranging from consumer to automotive, healthcare and elsewhere, nurturing young talent is essential for sustaining innovation and growth.In this session, we will spotlight emerging researchers and engineers who are pushing the boundaries of MEMS and imaging technologies. These young professionals bring fresh perspectives and novel approaches to longstanding challenges, offering new solutions that could shape the future of the industry. Their work spans cutting-edge developments in sensor miniaturization, advanced fabrication techniques, and enhanced imaging capabilities, reflecting the dynamic and interdisciplinary nature of this field.Join this session as it is an opportunity not only to celebrate the achievements of young talent but also to foster connections that will drive future collaborations and innovations.

Biography
Dimitrios Damianos, Ph.D., is a Project Manager in the Consulting Services Division at Yole Group. He manages transverse consulting projects, ensuring their quality and maintaining long term relationships with key accounts. Dimitrios also plays a key role in the expansion of Yole’s market & technical knowledge and supports the development of strategic projects following the company’s leading customers within the semiconductor industry. He holds a BSc in Physics and MSc in Photonics, both from the University of Patras (GR), as well as a PhD. in optics & microelectronics from the University of Grenoble-Alpes (FR).