A | To top | ||
Applied Materials GmbhH |
Neuber, Andreas
Continuous Sustainability Improvements in Subfab Operation Using Advanced Communication Capabilities as a Cooperative Effort of Multiple StakeholdersAbstract Biography |
Fab Management Forum | |
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ASM |
Khazaka, Rami
Epitaxial Growth of SiGe/Si Multi-Layers for Advanced Logic Devices![]() ![]() Abstract Biography |
Materials Innovations |
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ATREG, Inc. |
Rothrock, Stephen
Topic Coming Soon![]() Abstract Biography |
ATREG |
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AT&S Austria Technologie & Systemtechnik Aktiengesellschaft |
Voraberger, Hannes
Latest Solutions in the Energy Efficiency of Electronic Systems![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Automotive |
Lobo, Ashley
An Overview of Silicon Carbide Packaging for Power Electronics![]() ![]() Abstract Biography |
Advanced Packaging Conference |
B | To top | ||
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Bluefors |
Gunnarsson, David
Future Computation Technology from Cryogenics Point of View![]() ![]() Abstract Biography |
Future of Computing |
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Boston Consulting Group |
Mohr, Jan-Hinnerk
Moderator![]() ![]() Abstract Biography |
imec ITF |
C | To top | ||
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Cadence |
Dobson, Rebecca
Topic Coming Soon![]() ![]() Abstract Biography |
Opening Ceremony |
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Cadence |
Nisewaner, Karna
Topic Coming Soon![]() ![]() Abstract Biography |
imec ITF |
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Canatu |
Salmi, Emma
Carbon Nanotube Membranes for EUV Photolithography– a Versatile Material Platform![]() Abstract Biography |
Materials Innovations |
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CEA-Leti |
Dauvé, Sébastien
Boosting Technological Innovation and its Impact on Society – the Vital Role of RTOs![]() ![]() Abstract Biography |
Opening Ceremony |
Cohu, Inc. |
Cockburn, Peter
Opening RemarksAbstract Biography |
Advanced Packaging Conference | |
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Comet Group |
Haferl, Stephan
Curiosity & Collaboration: Innovating Together for the Sustainable Progress of the Semiconductor Industry![]() ![]() Abstract Biography |
Opening Ceremony |
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Comet Yxlon |
van de Ven, Dionys
The Future of Advanced Packaging Inspection is X-Ray![]() ![]() Abstract Biography |
Fab Management Forum Global GAAC Summit |
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Comet Yxlon GmbH |
Drolz, Isabella
The Future of Advanced Packaging Inspection is X-Ray!![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Comet Yxlon International GmbH |
Driller, Christian
Zero defects matter | The Power of Xray in Advanced Packaging![]() ![]() Abstract Biography |
Future Disruptions |
D | To top | ||
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D-SIMLAB Technologies |
Lendermann, Peter
Squeezing More Wafers out of a Fab: Can this be Done without Driving Cycle Times Through the Roof?![]() ![]() Abstract Biography |
Fab Management Forum |
E | To top | ||
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Edwards |
Jones, Chris
Topic Coming Soon![]() ![]() Abstract Biography |
imec ITF |
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Edwards |
Lauwers, Koen
Topic Coming Soon![]() ![]() Abstract Biography |
Opening Ceremony |
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Edwards |
Pelissier, Christine
Topic Coming Soon![]() ![]() Abstract Biography |
Future of Work |
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Elmos Semiconductor AG |
Montino, Ralf
It is all about Cost of Test? New Duties for Packaging and Test![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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EV Group |
Varga, Ksenija
Optimization of Advanced Packaging Process: Concept of Maskless Dual–Layer Lithographic Patterning![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Evatec |
Rettenmeier, Roland
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
F | To top | ||
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Fraunhofer EMFT |
Kutter, Christoph
Topic Coming Soon![]() ![]() Abstract Biography |
Future of Computing |
Fraunhofer FMD |
Töpper, Michael
A European 3D Heterogeneous Integration Pilot Line – a Leap ahead to Achieve Technology LeadershipAbstract Biography |
Advanced Packaging Conference | |
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Fraunhofer Institute for Applied and Integrated Security AISEC |
Hiller, Matthias
Challenges and Technologies towards Secure Embedded Systems and Trusted Electronics![]() ![]() Abstract Biography |
Future of Computing |
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Fraunhofer IZM |
Braun, Tanja
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
G | To top | ||
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GLOBALFOUNDRIES |
Yan, Ruby
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
GLOBALFOUNDRIES |
Heller, Thomas
Data Driven Optimization in Semiconductor Fabrication: How Business Efficiency Helps Environment as WellAbstract Biography |
SMART Manufacturing | |
H | To top | ||
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Henkel Ltd |
Winster, Tony
Bare Copper Lead Frame Compatible Die Attach Developments for Automotive Applications![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Heraeus Electronics |
Jörger, Michael
Topic Coming Soon![]() ![]() Abstract Biography |
Materials Innovations |
I | To top | ||
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imec |
Marent, Katrien
Topic Coming Soon![]() ![]() Abstract Biography |
imec ITF |
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imec |
Rolin, Cedric
Environmental Footprint Chip Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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imec |
Ragnarsson, Lars-Ake
Topic Coming Soon![]() ![]() Abstract Biography |
imec ITF |
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imec |
Gallagher, Emily
Topic Coming Soon - joint presentation with ASML![]() ![]() Abstract Biography |
imec ITF |
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imec |
Van den hove, Luc
A World Under Pressure Needs Skyrocketing Collaboration![]() ![]() Abstract Biography |
Opening Ceremony |
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INFICON |
Behnke, John
Topic Coming Soon![]() ![]() Abstract Biography |
Fab Management Forum |
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Infineon Technologies AG |
Recklies, Joerg
Opening Remarks![]() ![]() Abstract Biography |
Fab Management Forum |
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Infineon Technologies AG |
Grassmann, Andreas
New Approaches to Achieve Superior Reliability in Power Electronic Packaging![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Infineon Technologies Dresden GmbH |
Hasse, Holger
Building the new Smart Power Fab in Dresden: A Strong Signal for the Future![]() ![]() Abstract Biography |
Fab Management Forum |
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Intel |
Schell, Christoph
Topic Coming Soon![]() ![]() Abstract Biography |
Opening Ceremony |
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Intel Foundry Services |
De Ambroggi, Luca
Chiplets - Accelerating System Innovation in the Era Heterogeneous Integration![]() ![]() Abstract Biography |
Future Disruptions |
J | To top | ||
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JCET Group - STATS ChipPAC |
Antonicelli, Roberto
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
K | To top | ||
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KLA |
Donzella, Oreste
Bridging Front End, Packaging and Substrates to Advance the Semiconductor Roadmap![]() Abstract Biography |
Advanced Packaging Conference |
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Koh Young Europe GmbH |
Lindloff, Axel
High-speed Die, Component 3D Reconstruction Solution by Multimodal Phase Shift Optics Approach![]() ![]() Abstract Biography |
Advanced Packaging Conference |
L | To top | ||
Luceda Photonics |
Dumon, Pieter
Photonic IC Design: Innovation and ScalabilityAbstract Biography |
Integrated Photonics | |
M | To top | ||
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Merck Electronics KGaA |
vom Stein, Thorsten
Digitalization of Chemical Process Design for Semiconductor Materials Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Merck KGaA |
Siragusa, Nina
Intersecting Paths: Uniting Moore's Law and Biology Through Bioconvergence![]() ![]() Abstract Biography |
SMART Medtech |
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MKS/Atotech |
Pieper, Stefan
How to Achieve Upcoming Bump Requirements by Optimized ECD Plating Processes![]() Abstract Biography |
Advanced Packaging Conference |
O | To top | ||
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Otto-von-Guericke-Universität Magdeburg |
Rolf, Benjamin
AI Engineering (B. Sc.) - Rethinking Applied AI Education![]() ![]() Abstract Biography |
SMART Manufacturing |
P | To top | ||
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ProSys, Inc. |
Dussault, Donald
High Efficiency Cleaning for Permanent Bonding-Based 3D Applications![]() ![]() Abstract Biography |
Advanced Packaging Conference |
Q | To top | ||
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Qualcomm Korea |
Kim, Leo
The Advanced APC Application to Enable the Geometric Scaling by DTCO in sub-5nm SoC Manufacturing![]() ![]() Abstract Biography |
Fab Management Forum |
R | To top | ||
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Research Fab Microelectronics Germany (FMD) / Forschungsfabrik Mikroelektronik Deutschland (FMD) |
Rom, Tim
A Research Fab to Enable and Scale Quantum Computing![]() ![]() Abstract Biography |
Future of Computing |
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Robert Bosch GmbH |
Buseck, Peter
Topic Coming Soon![]() ![]() Abstract Biography |
Fab Management Forum |
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Robert Bosch GmbH |
Schwaiger, Stephan
Radiation Hardness of SiC TrenchMOS Devices for Automotive Applications![]() ![]() Abstract Biography |
Electrification & Power Semiconductors |
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RWTH Aachen University |
Lemme, Max C.
Neuromorphic Computing for Autonomous AI Systems – the NeuroSys Cluster4Excllence in the Aachen Region![]() ![]() Abstract Biography |
Future of Computing |
S | To top | ||
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Schneider Electric |
Colombo, Paolo
Is Digitalization Really Worth it? The Latest Approaches for Fab Efficiency and Resilience![]() Abstract Biography |
imec ITF |
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Schneider Electric |
Hua, Sharon
Why Digital Solutions are the Key to a Sustainable Fab Transformation![]() ![]() Abstract Biography |
Fab Management Forum |
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SEMI |
Manocha, Ajit
Opening Remarks![]() ![]() Abstract Biography |
Opening Ceremony |
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SEMI |
Weiss, Bettina
Welcome Remarks![]() ![]() Abstract Biography |
Global GAAC Summit |
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SEMI |
Bhat, Mousumi
Topic Coming Soon![]() ![]() Abstract Biography |
imec ITF |
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SEMI Europe |
Melvin, Cassandra
Opening Remarks![]() ![]() Abstract Biography |
Future of Work Fab Management Forum Chip in SEMI Doc Premiere |
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SEMI Europe |
Altimime, Laith
Welcome Remarks![]() ![]() Abstract Biography |
Fab Management Forum SMART Medtech Opening Ceremony Advanced Packaging Conference |
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Soitec |
Barnabé, Pierre
Topic Coming Soon![]() ![]() Abstract Biography |
imec ITF |
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Soitec |
Schwartzmann, Jerome
Topic Coming Soon![]() Abstract Biography |
SMART Manufacturing |
STmicroelectronics |
Alba, Simone
Key Takeaways by Session Chair![]() Abstract Biography |
Fab Management Forum | |
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STmicroelectronics |
Gärtner, Manuel
The SiC Power Revolution is Ready for High-Volume Car Manufacturing![]() ![]() Abstract Biography |
Electrification & Power Semiconductors |
STmicroelectronics |
Tumminia, Alessandro
Pushing the Limits of SiC Technology: Advanced Packaging Solutions and System Integration![]() Abstract Biography |
Advanced Packaging Conference | |
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SUSS MicroTec SE |
Lutter, Stefan
Disruptive and Sustainable Bonding Technology Covering Various Material Combinations for Emerging Applications![]() ![]() Abstract Biography |
Future Disruptions |
T | To top | ||
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Texas Instruments |
Schimpf, Klaus
Opening Remarks![]() ![]() Abstract Biography |
Fab Management Forum |
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Texas Instruments |
Stur, Alexander
TI’s Path to Net Zero Activities![]() ![]() Abstract Biography |
Fab Management Forum |
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Tokyo Electron Europe Limited |
Franchi, Marco
Topic Coming Soon![]() Abstract Biography |
Fab Management Forum |
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TSMC |
Yu, Douglas
Lights Outside Tunnel![]() ![]() Abstract Biography |
Advanced Packaging Conference |
Tyndall National Institute |
Nolan, Michael
Designing Atomic Level Process Chemistries. The Role of Atomistic Simulation in Developing Sustainable Deposition and Etch Processes.![]() Abstract Biography |
Materials Innovations | |
U | To top | ||
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Umicore |
Zyulkov, Ivan
Germanium Substrates for Photonics: GaAs Replacement Advantages and New Production Possibilities through CMOS Integration![]() ![]() Abstract Biography |
Integrated Photonics |
V | To top | ||
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Volkswagen AG |
Aal, Andreas
Opening Remarks![]() ![]() Abstract Biography |
Global GAAC Summit |
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Volkswagen AG |
Schmid, Michael
Semiconductor Management from an OEM Perspective![]() ![]() Abstract Biography |
Global GAAC Summit |
W | To top | ||
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Watlow Electric Manufacturing Company |
Parkinson, Blake
Watlow’s Approach Towards Energy Efficiency and Achieving Net-Zero![]() ![]() Abstract Biography |
Fab Management Forum |
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Wolfspeed |
Stigall, Missy
The Great Wolfspeed Takeover![]() ![]() Abstract Biography |
Fab Management Forum Global GAAC Summit |
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Wolfspeed, Inc. |
Reynolds, Neill
Conversation with![]() ![]() Abstract Biography |
ATREG |
X | To top | ||
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X-FAB Dresden GmbH & Co. KG |
Woittennek, Michael
Challenges of Capacity Doubling Under Brownfield and Full Load Conditions![]() ![]() Abstract Biography |
Fab Management Forum |
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X-FAB Semiconductor Foundries GmbH |
von Podewils, Mario
Opening Remarks![]() ![]() Abstract Biography |
Fab Management Forum |
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XFAB AG |
Mellin, Joni
PhotonixFAB – The EU-funded Pilot Line to Empower Photonics Innovations![]() ![]() Abstract Biography |
Integrated Photonics |
Z | To top | ||
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ZEISS Digital Innovation |
Wagner, Frank
Easy Integration of Machine Interface![]() ![]() Abstract Biography |
SMART Manufacturing |