3 | To top | ||
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3M |
Grommes, Walther
3M Insulative Thermal Bonding Film (ITBF) for Power Module Packaging![]() ![]() Abstract Biography |
Advanced Packaging Conference |
A | To top | ||
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Airbus |
Ombach, Grzegorz
The Future of Air Travel will be Carbon Neutral and More Autonomous![]() ![]() Abstract Biography |
Executive Forum |
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Alemnis AG |
Widmer, Remo
Recent innovations in Scanning electron microscope in situ mechanical testing for semiconductor failure analysis![]() ![]() Abstract Biography |
Innovation Showcase |
Alphawave IP |
Chan Carusone, Tony
Feeding AI’s Demand for DataAbstract Biography |
Thursday Innovation Showcase | |
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Amkor Technology Europe Portugal (ATEP) |
Silva, José
Amkor Activities in Portugal and Overall Trends in Europe![]() Abstract Biography |
Advanced Packaging Conference |
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ams OSRAM |
Milnikel, Jens
Opening Keynote![]() ![]() Abstract Biography |
Smart MedTech |
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Applied Materials |
Neuber, Andreas
Sustainability Improvements in Semiconductor Manufacturing Using Smart Manufacturing Technologies![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
|
Applied Materials |
Chudzi, Michael
A Materials to Systems Understanding of a BEOL Embedded Analog NVM Memory Technology for Edge Compute Applications![]() Abstract Biography |
Future of Computing |
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ASE Europe |
Factor, Bradford
Packaging for Integrated Photonics![]() ![]() Abstract Biography |
Integrated Photonics |
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ASE, Inc. |
Chang, Yin
Advanced Packaging: Enabling a New Generation of Silicon Systems![]() ![]() Abstract Biography |
Advanced Packaging Conference |
ASM International |
Givens, Michael
How Did and Will Atomic Scale Processing Change the Logic and Memory IndustriesAbstract Biography |
Materials Innovation | |
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ASML |
Hajiahmadi, Reza
Wafer contamination detection: an unsupervised learning approach![]() ![]() Abstract Biography |
Innovation Showcase |
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Athinia |
Matz, Laura
How the Semiconductor Industry can leverage Data Expertise from Healthcare![]() ![]() Abstract Biography |
Executive Forum |
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Atotech |
Schmidt, Ralf
Optimization of the Cu Microstructure to Improve Cu-to-Cu Direct Bonding for 3D Integration![]() Abstract Biography |
Advanced Packaging Conference |
C | To top | ||
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Carl Zeiss Digital Innovation GmbH |
Hörr, Christian
The Pareto Principle in Industry 4.0![]() ![]() Abstract Biography |
Fab Management Forum |
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CEA-Leti |
Joly, Sylvie
Will More-than-Moore Technologies with 3D Integration meet the Challenges of Edge AI Devices ?![]() ![]() Abstract Biography |
Future of Computing |
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CEA-Leti |
Signamarcheix, Thomas
Opening Remarks by Session Chair![]() ![]() Abstract Biography |
Future of Computing |
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CEA, Leti MINATEC |
Sousa, Veronique
Overview of the normally-OFF GaN-on-Si MOSc HEMT transistor in the fully recessed gate architecture![]() ![]() Abstract Biography |
Electrification & Power Semiconductors |
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centrotherm Clean Solutions |
Stover, Adam
Effect of Gas Abatement Selection and Destruction Efficiency on Carbon Neutrality Goals![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
Cimetrix Incorporated |
Weber, Alan
The Role of Streaming Data in Smart Manufacturing: Methods, Applications, and Benefits![]() Abstract Biography |
Thursday Innovation Showcase | |
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CITC |
Smits, Edsger
Reliability Characterization of Silver Sintering for Die Attach Applications![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Cohu |
Wagner, Markus
The Challenges in Testing Small and Highly Integrated Devices in a Massive Parallel Test System![]() Abstract Biography |
Advanced Packaging Conference |
D | To top | ||
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DAS Environmental Expert GmbH |
Davies, Guy
The Road To A Zero-Emission Subfab![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Dr. Ing. h.c. F. Porsche AG |
Frenkel, Barbara
Enabling collaboration in the Automotive value chain: Faster, more Transparent and Secure![]() ![]() Abstract Biography |
Executive Forum |
E | To top | ||
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Edwards Vacuum |
Serapiglia, Antonio
Improving Productivity by Using Data in the Subfab![]() ![]() Abstract Biography |
Fab Management Forum |
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Edwards Vacuum |
Jones, Chris
Collaboration - The challenge to reduce emissions during a period of growth![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Edwards Vacuum |
Wilson, Kate
Sustainability of the Semiconductor Industry![]() ![]() Abstract Biography |
Executive Forum |
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Edwards Vacuum |
Clarke, Jill
Coming Soon![]() ![]() Abstract Biography |
The Future of Work |
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Edwards Vacuum |
Agujar, Mark
Panelist![]() ![]() Abstract Biography |
The Future of Work |
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Eindhoven University of Technology |
Fiore, Andrea
Spectral sensing with photonic chips![]() ![]() Abstract Biography |
Integrated Photonics |
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Elisa IndustrIQ |
Ylä-Jarkko, Kalle
Machine Learning Solving the Puzzle in Wafer Anomaly Detection![]() ![]() Abstract Biography |
Thursday Innovation Showcase |
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Entegris |
Amade, Antoine
Automotive Reliability – Contamination Management and Maturity of the Ecosystems![]() ![]() Abstract Biography |
Smart Mobility |
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Ericsson Research |
Tillman, Fredrik
Industry Talk: THz Frequencies and Mobile Networks – a good blend?![]() Abstract Biography |
ITF Beyond 5G |
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ESPAT-Consulting |
Kröhnert, Steffen
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Evatec AG |
Rettenmeier, Roland
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
F | To top | ||
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Flexciton Ltd |
Potter, Jamie
Step Into the Future: Unparalleled Efficiency Gains with the Next-Generation Optimization-Based Platform (Real Use Cases).![]() ![]() Abstract Biography |
Fab Management Forum |
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Fraunhofer-Gesellschaft |
Schulze, Jörg
(Ultra-)Wide Bandgap Semiconductors for Sensor and Power Electronic Applications![]() ![]() Abstract Biography |
Electrification & Power Semiconductors |
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Fraunhofer Institute for Reliability and Microintegration IZM |
Nissen, Nils
Green ICT![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Fraunhofer Research Institution for Modular Solid State Technologies EMFT |
Wieland, Robert
Green ICT![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
G | To top | ||
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Galaxy Semiconductor |
Smith, Wes
An Omnivariate Test Data Approach to Reliability Improvement for Aerospace and Automotive Applications![]() ![]() Abstract Biography |
Thursday Innovation Showcase |
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GLOBALFOUNDRIES |
Capecchi, Simone
GlobalFoundries 22FDX® Auto grade 1 Chip Package Interaction Reliability Assessment![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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GLOBALFOUNDRIES |
Yan, Ran
MicroLED Advance Bonding Method to enable AR Metaverse![]() ![]() Abstract Biography |
Future of Computing |
H | To top | ||
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Henkel Corporation |
Trichur, Ramachandran
Semiconductor Packaging Materials Enabling Advanced Flip-Chip and Heterogeneous Integration![]() ![]() Abstract Biography |
Advanced Packaging Conference |
Holst Centre / TNO |
Hendriks, Rob
Impulse Printing™: Enabling 3D Printed Interconnects for Volume Production![]() Abstract Biography |
Advanced Packaging Conference | |
I | To top | ||
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IBM Zurich |
Curioni, Alessandro
Keynote Opening![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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imec |
Peeters, Michael
Opening![]() ![]() Abstract Biography |
Future of Computing ITF Beyond 5G |
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imec |
Collaert, Nadine
Tech talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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imec |
De Simone, Danilo
EUV Lithography Patterning: Status and Challenges Towards High NA![]() ![]() Abstract Biography |
Materials Innovation |
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imec |
Rolin, Cedric
The environmental footprint of Si chip manufacturing![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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imec |
Van den hove, Luc
Deep tech: the lodestar to meet the challenges of the 21st century.![]() ![]() Abstract Biography |
Executive Forum |
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imec |
Marent, Katrien
Welcome![]() ![]() Abstract Biography |
ITF Beyond 5G |
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imec the Netherlands |
Zevenbergen, Marcel
Panelist![]() ![]() Abstract Biography |
Smart MedTech |
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INFICON |
Bode, Christopher
Predictive Maintenance Scheduling for Assembly Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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INFICON |
Behnke, John
The Digital Transformation of Semiconductor Manufacturing![]() ![]() Abstract Biography |
Fab Management Forum |
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Infineon |
Knott, Bernhard
Innovative Sensor Packaging in Europe![]() ![]() Abstract Biography |
Advanced Packaging Conference |
|
Infineon |
Stöckl, Martin
What skills and talents do we need for the future of work in Europe![]() Abstract Biography |
The Future of Work |
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Infineon Technologies AG |
Recklies, Joerg
Opening Remarks by Session Chair![]() ![]() Abstract Biography |
Fab Management Forum |
Infineon Technologies AG |
Friedrichs, Peter
SiC Power Technologies and business – empower a greener futureAbstract Biography |
Electrification & Power Semiconductors | |
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Intel Corporation |
Scheper, Frans
Building Europe’s Digital Future - A Pan European Investment![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Intel Germany GmbH & Co. KG |
Mohr, Anneclaire
Net-Zero: A Call to Action for the Semiconductor Industry![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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IQE |
Pelzel, Rodney
How Advanced Epitaxy is Critical to making the Semiconductors for Next-Gen Mobile Connectivity![]() Abstract Biography |
ITF Beyond 5G |
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ISRL |
Zabelinsky, Ilya
Time to Collaborate. SubFAB Research and Development![]() ![]() Abstract Biography |
Innovation Showcase |
J | To top | ||
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JCET |
Antonicelli, Roberto
New trends in mobility and automotive semiconductor industry. A supply-chain perspective![]() ![]() Abstract Biography |
Advanced Packaging Conference Smart Mobility |
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JCET |
Azzopardi, Mark
HFBP as a New and Better Approach to DFN![]() ![]() Abstract Biography |
Advanced Packaging Conference |
K | To top | ||
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Kontron-AIS GmbH |
Mueller, Bert
Sensor Integration Framework with Interface A![]() ![]() Abstract Biography |
Thursday Innovation Showcase |
L | To top | ||
Ligentec SA |
Hessler, Thomas
Silicon Nitride based low loss Photonics Integrated CircuitsAbstract Biography |
Integrated Photonics | |
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LineLab |
Nietner, Larissa
LineLab, an Analytical Tool for Modeling Semiconductor Manufacturing Systems![]() ![]() Abstract Biography |
Fab Management Forum |
M | To top | ||
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McLaren Applied |
Lambert, Stephen
High Performance 800V Silicon Carbide Inverters for Automotive Applications: The Next Step in Electrification?![]() ![]() Abstract Biography |
Smart Mobility |
|
Melexis |
Chombar, Francoise
Accelerating Gender Balance in the Semiconductor Talent Pool![]() Abstract Biography |
The Future of Work |
Merck Healthcare KGaA |
Weitzel, Uwe
Panelist![]() Abstract Biography |
Smart MedTech | |
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Merck KGaA |
Matthes, Philip
Panelist![]() ![]() Abstract Biography |
The Future of Work |
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MSV Systems & Services Pte Ltd |
Tan, Joe
Keep It Simple & Save (KISS) in Burn-In Operations![]() ![]() Abstract Biography |
Innovation Showcase |
N | To top | ||
Newcastle University |
O'Neill, Anthony
Improving 4H-SiC MOSFETs by Gate Engineering![]() Abstract Biography |
Electrification & Power Semiconductors | |
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Niching Industrial Corp. |
Dong, Rui-Xuan
Ultra low-temperature silver sintering materials for substrate-based power applications![]() Abstract Biography |
Advanced Packaging Conference |
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Nokia |
Ziegler, Volker
Panelist![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Nova Ltd |
Szafranek, Dana
Spectral Interferometry (SI) And Vertical Traveling Scatterometry (VTS) Technology For Advanced Metrology Of Back-End-Of-Line (BEOL) Manufacturing Process Steps![]() ![]() Abstract Biography |
Innovation Showcase |
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NXP |
Oberndorff, Pascal
Opening Remarks![]() ![]() Abstract Biography |
Advanced Packaging Conference |
O | To top | ||
Oxford Instruments Plasma Technology |
O'Mahony, Aileen
A reliable manufacturing solution to enable normally-off recessed gate GaN MISHEMT by atomic layer etch and in-situ etch depth monitoring![]() Abstract Biography |
Thursday Innovation Showcase | |
P | To top | ||
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PEER Group |
Suerich, Doug
Treading lightly: How a pandemic pivot to remote integrations helped reduce our carbon footprint![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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PhotonDelta |
Penning de Vries, René
Next Generation Microchips, Powered by Light![]() ![]() Abstract Biography |
Integrated Photonics |
R | To top | ||
Robert Bosch GmbH |
Beer, Leopold
Semiconductors for Software Defined Vehicles![]() Abstract Biography |
Advanced Packaging Conference | |
Robert Bosch GmbH |
Araujo, Samuel
Silicon carbide boosting the path to e-mobility in various applications![]() Abstract Biography |
Electrification & Power Semiconductors | |
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Robert Bosch GmbH |
Laermer, Franz
Medtech-Innovation through the Fusion of Microelectronics with Sensors![]() ![]() Abstract Biography |
Smart MedTech |
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Robert Bosch GmbH |
Bornefeld, Ralf
Electrification for EVs![]() ![]() Abstract Biography |
Fab Management Forum |
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Rohde & Schwarz |
Stuhlfauth, Reiner
Panelist![]() Abstract Biography |
ITF Beyond 5G |
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Roland Berger |
Alexander, Michael
Panelist![]() ![]() Abstract Biography |
Fab Management Forum ITF Beyond 5G |
S | To top | ||
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Samsung Semiconductor Europe |
Fischer, Axel
Keynote Presentation![]() ![]() Abstract Biography |
Executive Forum |
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Schrödinger |
Elliott, Simon
Current Trends in Digital Chemistry to Drive Semiconductor Innovation![]() ![]() Abstract Biography |
Materials Innovation |
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Scientific Visual S.A. |
Orlov, Ivan
Intelligent wafering: how to widen the bottleneck in semiconductor substrate manufacturing![]() ![]() Abstract Biography |
Innovation Showcase |
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Scintil Photonics |
Langlois, Pascal
Advanced Photonic Integrated Circuits solutions with integrated lasers for ultimate optical connectivity in Datacenters, HPC and 5G![]() ![]() Abstract Biography |
Integrated Photonics |
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SEMI |
Manocha, Ajit
Welcome Note![]() ![]() Abstract Biography |
Executive Forum |
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SEMI |
Weiss, Bettina
Global Updates![]() ![]() Abstract Biography |
Smart Mobility Fab Management Forum |
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SEMI Europe |
Melvin, Cassandra
Opening Remarks![]() ![]() Abstract Biography |
The Future of Work |
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SEMI Europe |
Frieling, Christopher
Welcome Remarks![]() ![]() Abstract Biography |
The Future of Work |
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SEMI Europe |
Altimime, Laith
Welcome Note![]() ![]() Abstract Biography |
Executive Forum Fab Management Forum Smart MedTech Smart and Green Manufacturing Summit |
SEMI Foundation |
Liss, Shari
The Work Force Supply-Chain Crunch and Need for a Diverse and Innovative Workforce Development.Abstract Biography |
The Future of Work | |
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SHK Engineering and Consulting GmbH & Co. KG |
Kummer, Sebastian
No Fear of High Dynamics in Fab Core Design![]() ![]() Abstract Biography |
Fab Management Forum |
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Silicon Austria Labs GmbH |
Roshanghias, Ali
Ultra-fine pitch Die bonding approaches with Cu interconnects for high-performance 3D IC packages![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Soitec |
Maleville, Christophe
Industry talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Spiden AG |
Grünstein, Leo
A New Era of Label-Free Biomarker Sensing Leveraging Photonic Integration![]() ![]() Abstract Biography |
Integrated Photonics |
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ST Microelectronics |
Theveniau, Raphael
Complete LVS verification methodology and process for complex System-In-Package assemblies![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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STMicroelectronics |
Champseix, Jean-Louis
Wellbeing and Diversity and Inclusion![]() ![]() Abstract Biography |
Fab Management Forum |
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STMicroelectronics |
Alba, Simone
Opening Remarks![]() ![]() Abstract Biography |
Fab Management Forum |
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SYSTEMA |
Roßbach, Philipp
How to Simplify Engineers’ life in Complex Semiconductor Manufacturing - About Democratization of Information and its Usage in Production Scheduling and Root Cause Analysis![]() ![]() Abstract Biography |
Fab Management Forum |
T | To top | ||
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TechInsights Inc. |
Hutcheson, Dan
Frontier of Challenge and Opportunity: Semiconductor Shortages, Geopolitics, & Outlooks![]() ![]() Abstract Biography |
Fab Management Forum |
Technical University of Applied Sciences Regensburg |
Ramsauer, Ralf
Jailhouse: Mixed Criticality Systems for Semicondutor ManufacturingAbstract Biography |
Fab Management Forum | |
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TERADYNE |
Ducrocq, David
Minimizing Execution Risk in Test Solution Development Projects with a Technical Project Lead![]() ![]() Abstract Biography |
Innovation Showcase |
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Texas Instruments |
Thomas, Vipin Koshy
Machine Learning for Automated Image Classification in Yield Enhancement![]() ![]() Abstract Biography |
Fab Management Forum |
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time:matters GmbH |
Kohnen, Alexander
Panel Discussion – Navigating through global developments affecting the supply chain management![]() ![]() Abstract Biography |
Fab Management Forum |
Trinity College Dublin |
Boland, John
Nanoscale Metals are Comprised of Grain Boundaries that are Significantly Different from those found in Bulk Materials![]() Abstract Biography |
Materials Innovation | |
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TU Dublin |
Kelleher, John
Green AI![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Tyndall National Institute |
Ghosh, Samir
Heterogeneously integrated InP-laser on Silicon Photonics realized by micro-transfer printing![]() ![]() Abstract Biography |
Integrated Photonics |
W | To top | ||
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Wooptix |
Gaudestad, Jan
New Metrology Technique for Measuring Patterned Wafer Geometry on a full 300mm wafer![]() ![]() Abstract Biography |
Innovation Showcase |
X | To top | ||
|
X-fab |
Bretthauer, Ulrich
Re-organization of the Medtech and Impact of the Pandemic - Reorganization of Supply Chain![]() Abstract Biography |
Smart MedTech |
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X-FAB Dresden |
Tillner, Rico
How medical devices are changing the customer-foundry relationship![]() ![]() Abstract Biography |
Fab Management Forum |
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X-FAB Group |
U’Ren, Gregory
Industry talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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X-FAB Group |
Schoder, Henryk
The People Challenge: How to Overcome the Skill Shortage in the FAB´s?![]() ![]() Abstract Biography |
Fab Management Forum |