3 | To top | ||
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3M |
Grommes, Walther
3M Insulative Thermal Bonding Film (ITBF) for Power Module Packaging![]() ![]() Abstract Biography |
Advanced Packaging Conference |
A | To top | ||
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Airbus |
Ombach, Grzegorz
The Future of Aviation![]() Abstract Biography |
Executive Forum |
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Alemnis AG |
Widmer, Remo
Recent innovations in Scanning electron microscope in situ mechanical testing for semiconductor failure analysis![]() ![]() Abstract Biography |
Innovation Showcase |
Alphawave IP |
Chan Carusone, Tony
Feeding AI’s Demand for DataAbstract Biography |
Thursday Innovation Showcase | |
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Amkor Technology Europe Portugal (ATEP) |
Silva, José
Amkor Activities in Portugal and Overall Trends in Europe![]() Abstract Biography |
Advanced Packaging Conference |
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ams OSRAM |
Milnikel, Jens
Opening Keynote![]() ![]() Abstract Biography |
Smart MedTech |
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Applied Materials |
Neuber, Andreas
Sustainability Improvements in Semiconductor Manufacturing Using Smart Manufacturing Technologies![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
ASM International |
Givens, Michael
How Did and Will Atomic Scale Processing Change the Logic and Memory IndustriesAbstract Biography |
Materials Innovation | |
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ASML |
Hajiahmadi, Reza
Wafer contamination detection: an unsupervised learning approach![]() ![]() Abstract Biography |
Innovation Showcase |
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Atotech |
Schmidt, Ralf
Optimization of the Cu Microstructure to Improve Cu-to-Cu Direct Bonding for 3D Integration![]() Abstract Biography |
Advanced Packaging Conference |
C | To top | ||
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Carl Zeiss Digital Innovation GmbH |
Hörr, Christian
The Pareto Principle in Industry 4.0![]() ![]() Abstract Biography |
Fab Management Forum |
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CEA-Leti |
Joly, Sylvie
Will More-than-Moore technologies with 3D integration meet the challenges of edge AI devices ?![]() ![]() Abstract Biography |
Future of Computing |
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CEA, Leti MINATEC |
Sousa, Veronique
Overview of the normally-OFF GaN-on-Si MOSc HEMT transistor in the fully recessed gate architecture![]() ![]() Abstract Biography |
Electrification & Power Semiconductors |
Cimetrix Incorporated |
Weber, Alan
The Role of Streaming Data in Smart Manufacturing: Methods, Applications, and Benefits![]() Abstract Biography |
Thursday Innovation Showcase | |
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CITC |
Smits, Edsger
Reliability characterization of silver sintering for die attach applications![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Cohu |
Wagner, Markus
The challenges in testing small and highly integrated devices in a massive parallel test system![]() Abstract Biography |
Advanced Packaging Conference |
D | To top | ||
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DAS Environmental Expert GmbH |
Davies, Guy
The Road To A Zero-Emission Subfab![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
E | To top | ||
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Edwards Vacuum |
Serapiglia, Antonio
Improving productivity by using data in the subfab![]() ![]() Abstract Biography |
Fab Management Forum |
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Edwards Vacuum |
Jones, Chris
Collaboration - The challenge to reduce emissions during a period of growth![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Edwards Vacuum |
Wilson, Kate
Sustainability of the Semiconductor Industry![]() ![]() Abstract Biography |
Executive Forum |
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Edwards Vacuum |
Lievens, Tom
Coming Soon![]() ![]() Abstract Biography |
The Future of Work |
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Eindhoven University of Technology |
Fiore, Andrea
Spectral sensing with photonic chips![]() ![]() Abstract Biography |
Integrated Photonics |
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Elisa IndustrIQ |
Ylä-Jarkko, Kalle
Machine Learning Solving the Puzzle in Wafer Anomaly Detection![]() ![]() Abstract Biography |
Thursday Innovation Showcase |
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Entegris |
Amade, Antoine
Automotive Reliability – Contamination Management and Maturity of the Ecosystems![]() ![]() Abstract Biography |
Smart Mobility |
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Ericsson Research |
Tillman, Fredrik
Industry Talk: THz Frequencies and Mobile Networks – a good blend?![]() Abstract Biography |
ITF Beyond 5G |
F | To top | ||
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Fraunhofer-Gesellschaft |
Schulze, Jörg
(Ultra-)Wide Bandgap Semiconductors for Sensor and Power Electronic Applications![]() ![]() Abstract Biography |
Electrification & Power Semiconductors |
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Fraunhofer Institute for Reliability and Microintegration IZM |
Nissen, Nils
Green ICT![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Fraunhofer Research Institution for Modular Solid State Technologies EMFT |
Wieland, Robert
Green ICT![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
G | To top | ||
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Galaxy Semiconductor |
Smith, Wes
An Omnivariate Test Data Approach to Reliability Improvement for Aerospace and Automotive Applications![]() ![]() Abstract Biography |
Thursday Innovation Showcase |
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GLOBALFOUNDRIES |
Capecchi, Simone
GlobalFoundries 22FDX® Auto grade 1 Chip Package Interaction Reliability Assessment![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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GLOBALFOUNDRIES |
Yan, Ran
MicroLED Advance Bonding Method to enable AR Metaverse![]() ![]() Abstract Biography |
Future of Computing |
H | To top | ||
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Henkel Corporation |
Trichur, Ramachandran
Semiconductor Packaging Materials Enabling Advanced Flip-Chip and Heterogeneous Integration![]() ![]() Abstract Biography |
Advanced Packaging Conference |
Holst Centre / TNO |
Hendriks, Rob
Impulse Printing™: Enabling 3D Printed Interconnects for Volume Production![]() Abstract Biography |
Advanced Packaging Conference | |
I | To top | ||
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IBM Zurich |
Curioni, Alessandro
Keynote Opening![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Imec |
Peeters, Michael
Opening![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Imec |
Collaert, Nadine
Tech talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Imec |
De Simone, Danilo
EUV Lithography patterning: status and challenges towards High NA![]() ![]() Abstract Biography |
Materials Innovation |
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Imec |
Rolin, Cedric
The environmental footprint of Si chip manufacturing![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Imec |
Van den hove, Luc
Deep tech: the lodestar to meet the challenges of the 21st century.![]() ![]() Abstract Biography |
Executive Forum |
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INFICON |
Bode, Christopher
Predictive Maintenance Scheduling for Assembly Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Infineon |
Knott, Bernhard
Innovative Sensor Packaging in Europe![]() ![]() Abstract Biography |
Advanced Packaging Conference |
Infineon Technologies AG |
Friedrichs, Peter
SiC Power Technologies and business – empower a greener futureAbstract Biography |
Electrification & Power Semiconductors | |
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Intel Corporation |
Scheper, Frans
Building Europe’s Digital Future - A Pan European Investment![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Intel Corporation |
Brady, Todd
Intel RISE2030 and 2040 carbon neutral goals![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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ISRL |
Zabelinsky, Ilya
Time to Collaborate. SubFAB Research and Development![]() ![]() Abstract Biography |
Innovation Showcase |
K | To top | ||
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Kontron-AIS GmbH |
Mueller, Bert
Sensor Integration Framework with Interface A![]() ![]() Abstract Biography |
Thursday Innovation Showcase |
L | To top | ||
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LineLab |
Nietner, Larissa
LineLab, an Analytical Tool for Modeling Semiconductor Manufacturing Systems![]() ![]() Abstract Biography |
Fab Management Forum |
M | To top | ||
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McLaren Applied |
Lambert, Stephen
High Performance 800V Silicon Carbide Inverters for Automotive Applications: The Next Step in Electrification?![]() ![]() Abstract Biography |
Smart Mobility |
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Melexis |
Chombar, Francoise
Accelerating Gender Balance in the Semiconductor Talent Pool![]() Abstract Biography |
The Future of Work |
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Merck KGaA |
Matz, Laura
Keynote Presentation![]() ![]() Abstract Biography |
Executive Forum |
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MSV Systems & Services Pte Ltd |
Tan, Joe
Keep It Simple & Save (KISS) in Burn-In Operations![]() ![]() Abstract Biography |
Innovation Showcase |
N | To top | ||
Newcastle University |
O'Neill, Anthony
Improving 4H-SiC MOSFETs by Gate Engineering![]() Abstract Biography |
Electrification & Power Semiconductors | |
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Niching Industrial Corp. |
Dong, Rui-Xuan
Ultra low-temperature silver sintering materials for substrate-based power applications![]() Abstract Biography |
Advanced Packaging Conference |
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Nokia |
Ziegler, Volker
Panelist![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Nova Ltd |
Szafranek, Dana
Spectral Interferometry (SI) And Vertical Traveling Scatterometry (VTS) Technology For Advanced Metrology Of Back-End-Of-Line (BEOL) Manufacturing Process Steps![]() ![]() Abstract Biography |
Innovation Showcase |
O | To top | ||
Oxford Instruments Plasma Technology |
O'Mahony, Aileen
A reliable manufacturing solution to enable normally-off recessed gate GaN MISHEMT by atomic layer etch and in-situ etch depth monitoring![]() Abstract Biography |
Thursday Innovation Showcase | |
P | To top | ||
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PEER Group |
Suerich, Doug
Treading lightly: How a pandemic pivot to remote integrations helped reduce our carbon footprint![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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PhotonDelta |
Penning de Vries, René
Next generation microchips, powered by light![]() ![]() Abstract Biography |
Integrated Photonics |
R | To top | ||
Robert Bosch GmbH |
Beer, Leopold
Semiconductors for Software Defined Vehicles![]() Abstract Biography |
Advanced Packaging Conference | |
Robert Bosch GmbH |
Kokkinos, Christina
Silicon carbide boosting the path to e-mobility in various applications![]() Abstract Biography |
Electrification & Power Semiconductors | |
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Robert Bosch GmbH |
Laermer, Franz
Medtech-Innovation through the Fusion of Microelectronics with Sensors![]() ![]() Abstract Biography |
Smart MedTech |
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Robert Bosch GmbH |
Bornefeld, Ralf
Electrification for EVs![]() ![]() Abstract Biography |
Fab Management Forum |
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Roland Berger |
Alexander, Michael
Next Generation Manufacturing![]() ![]() Abstract Biography |
Fab Management Forum |
S | To top | ||
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Schrödinger |
Elliott, Simon
Current trends in digital chemistry to drive semiconductor innovation![]() ![]() Abstract Biography |
Materials Innovation |
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Scientific Visual S.A. |
Orlov, Ivan
Intelligent wafering: how to widen the bottleneck in semiconductor substrate manufacturing![]() ![]() Abstract Biography |
Innovation Showcase |
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Scintil Photonics |
Langlois, Pascal
Advanced Photonic Integrated Circuits solutions with integrated lasers for ultimate optical connectivity in Datacenters, HPC and 5G![]() ![]() Abstract Biography |
Integrated Photonics |
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SEMI |
Manocha, Ajit
Welcome Note![]() ![]() Abstract Biography |
Executive Forum |
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SEMI |
Weiss, Bettina
Global Updates![]() ![]() Abstract Biography |
Smart Mobility Fab Management Forum |
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SEMI Europe |
Melvin, Cassandra
Opening Remarks![]() ![]() Abstract Biography |
The Future of Work |
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SEMI Europe |
Altimime, Laith
Welcome Note![]() ![]() Abstract Biography |
Executive Forum Fab Management Forum Smart MedTech |
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SEMI Europe |
Frieling, Christopher
Welcome Remarks![]() ![]() Abstract Biography |
The Future of Work |
SEMI Foundation |
Liss, Shari
The Work Force Supply-Chain Crunch and Need for a Diverse and Innovative Workforce Development.Abstract Biography |
The Future of Work | |
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SHK Engineering and Consulting GmbH & Co. KG |
Kummer, Sebastian
No fear of high dynamics in Fab core design![]() ![]() Abstract Biography |
Fab Management Forum |
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Silicon Austria Labs GmbH |
Roshanghias, Ali
Ultra-fine pitch Die bonding approaches with Cu interconnects for high-performance 3D IC packages![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Soitec |
Maleville, Christophe
Industry talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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ST Microelectronics |
Theveniau, Raphael
Complete LVS verification methodology and process for complex System-In-Package assemblies![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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STMicroelectronics |
Champseix, Jean-Louis
Wellbeing and D&I![]() ![]() Abstract Biography |
Fab Management Forum |
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SYSTEMA |
Roßbach, Philipp
How to simplify engineers’ life in complex Semiconductor Manufacturing. About democratization of information and its usage in production scheduling and root cause analysis.![]() ![]() Abstract Biography |
Fab Management Forum |
T | To top | ||
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TechInsights Inc. |
Hutcheson, Dan
Frontier of Challenge and Opportunity: Semiconductor Shortages, Geopolitics, & Outlooks![]() ![]() Abstract Biography |
Fab Management Forum |
Technical University of Applied Sciences Regensburg |
Ramsauer, Ralf
Jailhouse: Mixed Criticality Systems for Semicondutor ManufacturingAbstract Biography |
Fab Management Forum | |
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TERADYNE |
Ducrocq, David
Minimizing Execution Risk in Test Solution Development Projects with a Technical Project Lead![]() ![]() Abstract Biography |
Innovation Showcase |
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Texas Instruments |
Thomas, Vipin Koshy
Machine Learning for Automated Image Classification in Yield Enhancement![]() ![]() Abstract Biography |
Fab Management Forum |
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time:matters GmbH |
Kohnen, Alexander
Panel Discussion – Navigating through global developments affecting the supply chain management![]() ![]() Abstract Biography |
Fab Management Forum |
Trinity College Dublin |
Boland, John
Nanoscale metals are comprised of grain boundaries that are significantly different from those found in bulk materials![]() Abstract Biography |
Materials Innovation | |
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TU Dublin |
Kelleher, John
Green AI![]() ![]() Abstract Biography |
Smart and Green Manufacturing Summit |
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Tyndall National Institute |
Ghosh, Samir
Heterogeneously integrated InP-laser on Silicon Photonics realized by micro-transfer printing![]() ![]() Abstract Biography |
Integrated Photonics |
W | To top | ||
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Wooptix |
Gaudestad, Jan
New Metrology Technique for Measuring Patterned Wafer Geometry on a full 300mm wafer![]() ![]() Abstract Biography |
Innovation Showcase |
X | To top | ||
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X-FAB |
Tillner, Rico
How medical devices are changing the customer-foundry relationship![]() ![]() Abstract Biography |
Fab Management Forum |
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X-FAB Group |
U’Ren, Gregory
Industry talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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X-FAB Group |
Schoder, Henryk
The people challenge: How to overcome the skill shortage in the FAB´s?![]() ![]() Abstract Biography |
Fab Management Forum |