3 | To top | ||
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3M |
Grommes, Walther
3M Insulative Thermal Bonding Film (ITBF) for Power Module Packaging![]() ![]() Abstract Biography |
Advanced Packaging Conference |
A | To top | ||
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Alemnis AG |
Widmer, Remo
Recent innovations in Scanning electron microscope in situ mechanical testing for semiconductor failure analysis![]() ![]() Abstract Biography |
Innovation Showcase |
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Amkor Technology Europe Portugal (ATEP) |
Silva, José
Amkor Activities in Portugal and Overall Trends in Europe![]() Abstract Biography |
Advanced Packaging Conference |
ASM International |
Givens, Michael
How Did and Will Atomic Scale Processing Change the Logic and Memory IndustriesAbstract Biography |
Materials Innovation | |
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ASML |
Hajiahmadi, Reza
Wafer contamination detection: an unsupervised learning approach![]() ![]() Abstract Biography |
Innovation Showcase |
Atotech |
Schmidt, Ralf
Optimization of the Cu Microstructure to Improve Cu-to-Cu Direct Bonding for 3D IntegrationAbstract Biography |
Advanced Packaging Conference | |
C | To top | ||
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Carl Zeiss Digital Innovation GmbH |
Hörr, Christian
The Pareto Principle in Industry 4.0![]() ![]() Abstract Biography |
Fab Management Forum |
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CITC |
Smits, Edsger
Reliability characterization of silver sintering for die attach applications![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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COHU |
Wagner, Markus
The challenges in testing small and highly integrated devices in a massive parallel test system![]() Abstract Biography |
Advanced Packaging Conference |
E | To top | ||
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Edwards Vacuum |
Serapiglia, Antonio
Improving productivity by using data in the subfab![]() ![]() Abstract Biography |
Fab Management Forum |
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Eindhoven University of Technology |
Fiore, Andrea
Spectral sensing with photonic chips![]() ![]() Abstract Biography |
Integrated Photonics |
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Ericsson Research |
Tillman, Fredrik
Industry talk![]() Abstract Biography |
ITF Beyond 5G |
G | To top | ||
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GlobalFoundries |
Capecchi, Simone
GlobalFoundries 22FDX® Auto grade 1 Chip Package Interaction Reliability Assessment![]() ![]() Abstract Biography |
Advanced Packaging Conference |
H | To top | ||
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Henkel Corporation |
Trichur, Ramachandran
Semiconductor Packaging Materials Enabling Advanced Flip-Chip and Heterogeneous Integration![]() ![]() Abstract Biography |
Advanced Packaging Conference |
Holst Centre / TNO |
Hendriks, Rob
Impulse Printing™: Enabling 3D Printed Interconnects for Volume Production![]() Abstract Biography |
Advanced Packaging Conference | |
I | To top | ||
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Imec |
Peeters, Michael
Opening![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Imec |
Collaert, Nadine
Tech talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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Imec |
De Simone, Danilo
EUV Lithography patterning: status and challenges towards High NA![]() ![]() Abstract Biography |
Materials Innovation |
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INFICON |
Bode, Christopher
Predictive Maintenance Scheduling for Assembly Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Infineon |
Knott, Bernhard
Innovative Sensor Packaging in Europe![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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ISRL |
Zabelinsky, Ilya
Time to Collaborate. SubFAB Research and Development![]() ![]() Abstract Biography |
Innovation Showcase |
L | To top | ||
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LineLab |
Nietner, Larissa
LineLab, an Analytical Tool for Modeling Semiconductor Manufacturing Systems![]() ![]() Abstract Biography |
Fab Management Forum |
M | To top | ||
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MSV Systems & Services Pte Ltd |
Tan, Joe
Keep It Simple & Save (KISS) in Burn-In Operations![]() ![]() Abstract Biography |
Innovation Showcase |
N | To top | ||
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Niching Industrial Corp. |
Dong, Rui-Xuan
Ultra low-temperature silver sintering materials for substrate-based power applications![]() Abstract Biography |
Advanced Packaging Conference |
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Nova Ltd |
Szafranek, Dana
Spectral Interferometry (SI) And Vertical Traveling Scatterometry (VTS) Technology For Advanced Metrology Of Back-End-Of-Line (BEOL) Manufacturing Process Steps![]() ![]() Abstract Biography |
Innovation Showcase |
P | To top | ||
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PhotonDelta |
Penning de Vries, René
Next generation microchips, powered by light![]() ![]() Abstract Biography |
Integrated Photonics |
R | To top | ||
Robert Bosch GmbH |
Beer, Leopold
Semiconductors for Software Defined Vehicles![]() Abstract Biography |
Advanced Packaging Conference | |
S | To top | ||
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Schrödinger |
Elliott, Simon
Current trends in digital chemistry to drive semiconductor innovation![]() ![]() Abstract Biography |
Materials Innovation |
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Scientific Visual S.A. |
Orlov, Ivan
Intelligent wafering: how to widen the bottleneck in semiconductor substrate manufacturing![]() ![]() Abstract Biography |
Innovation Showcase |
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Scintil Photonics |
Langlois, Pascal
Advanced Photonic Integrated Circuits solutions with integrated lasers for ultimate optical connectivity in Datacenters, HPC and 5G![]() ![]() Abstract Biography |
Integrated Photonics |
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SHK Engineering and Consulting GmbH & Co. KG |
Kummer, Sebastian
No fear of high dynamics in Fab core design![]() ![]() Abstract Biography |
Fab Management Forum |
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Silicon Austria Labs GmbH |
Roshanghias, Ali
Ultra-fine pitch Die bonding approaches with Cu interconnects for high-performance 3D IC packages![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Soitec |
Maleville, Christophe
Industry talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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ST Microelectronics |
Theveniau, Raphael
Complete LVS verification methodology and process for complex System-In-Package assemblies![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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SYSTEMA |
Roßbach, Philipp
How to simplify engineers’ life in complex Semiconductor Manufacturing. About democratization of information and its usage in production scheduling and root cause analysis.![]() ![]() Abstract Biography |
Fab Management Forum |
T | To top | ||
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TechInsights Inc. |
Hutcheson, Dan
Market Trends![]() ![]() Abstract Biography |
Fab Management Forum |
Technical University of Applied Sciences Regensburg |
Ramsauer, Ralf
Jailhouse: Mixed Criticality Systems for Semicondutor ManufacturingAbstract Biography |
Fab Management Forum | |
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TERADYNE |
Ducrocq, David
Minimizing Execution Risk in Test Solution Development Projects with a Technical Project Lead![]() ![]() Abstract Biography |
Innovation Showcase |
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Texas Instruments |
Thomas, Vipin Koshy
Machine Learning for Automated Image Classification in Yield Enhancement![]() ![]() Abstract Biography |
Fab Management Forum |
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time:matters GmbH |
Kohnen, Alexander
Panel Discussion – Navigating through global developments affecting the supply chain management![]() ![]() Abstract Biography |
Fab Management Forum |
Trinity College Dublin |
Boland, John
Nanoscale metals are comprised of grain boundaries that are significantly different from those found in bulk materials![]() Abstract Biography |
Materials Innovation | |
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Tyndall National Institute |
Ghosh, Samir
Heterogeneously integrated InP-laser on Silicon Photonics realized by micro-transfer printing![]() ![]() Abstract Biography |
Integrated Photonics |
W | To top | ||
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Wooptix |
Gaudestad, Jan
New Metrology Technique for Measuring Patterned Wafer Geometry on a full 300mm wafer![]() ![]() Abstract Biography |
Innovation Showcase |
X | To top | ||
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X-fab |
U’Ren, Gregory
Industry talk![]() ![]() Abstract Biography |
ITF Beyond 5G |
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X-fab |
Tillner, Rico
How medical devices are changing the customer-foundry relationship![]() ![]() Abstract Biography |
Fab Management Forum |
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X-FAB Group |
Schoder, Henryk
The people challenge: How to overcome the skill shortage in the FAB´s?![]() ![]() Abstract Biography |
Fab Management Forum |