D | To top | ||
![]() |
DISCO Hi-Tec Europe GmbH |
Klug, Gerald
New solutions for plasma dicing, and new solutions for processing of SiC wafers ranging from ingot splitting, grinding, polishing to high speed and chipping free dicing.![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |
E | To top | ||
![]() |
EVG |
Brandl, Elisabeth
High throughput & high yield heterogeneous integration with implemented metrology for collective D2W Bonding![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |
F | To top | ||
![]() |
Fraunhofer ENAS |
Gadhiya, Ghanshyam
Virtual Prototyping for System-in-Package with Heterogeneous Integration - Enabler for faster Time-to-Market![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |
![]() |
Fraunhofer Institut für Zuverlässigkeit und Mikrointegration |
Brockmann, Carsten
Innovative Packaging and Evaluation Approach for an Universal Sensor Platform![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |
I | To top | ||
![]() |
Intel Deutschland GmbH |
De Mesa, Eduardo
Flip-Chip Scale Package(FCCSP) Process Characterization and Reliability of Coreless Thin Package with 7nm TSMC Si![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |
L | To top | ||
![]() |
LPKF Laser & Electronics AG |
Roick, Florian
Active Mold Packaging for novel Antenna-in-Package interconnection and manufacturing![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |
U | To top | ||
![]() |
United Test and Assembly Center Ltd |
Attard, Alastair
Vertical stacking of controller IC on a copper clip attached on MOSFET as a space-saving solution for high current switch e-fuse applications![]() ![]() Abstract Biography |
Advanced Packing Conference (APC) |