A | To top | ||
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AEMtec GmbH |
Negrea, Dan
Packaging in Europe - Micro Balling on Chips with a High Ball-count for Space Applications - an Extension of the Process Capabilities at AEMtec![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Air Liquide |
Misra, Ashutosh
How can a supplier help its customers fight climate change in the semiconductor industry? -The Air Liquide case-![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Amkor Technology, Inc. |
Pancholi, Vineet
Heterogeneous Integration Test Impacts![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Analog Devices |
Olivadoti, Giuseppe
From Sensing to Action![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Applied Materials |
Rosa, Mike
Technology and Equipment Roadmaps Enabling the More-than-Moore Wave![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Applied Materials Europe |
Robson, James
Introduction![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Arbe |
Marenko, Kobi
Next Generation Radar- a Game Changer for Truly Safe and Smart Mobility![]() ![]() Abstract Biography |
SMART Mobility Forum |
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ASE Group |
Chen, William (Bill)
The Growing Momentum of Heterogeneous Integration![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Aspinity |
Doyle, Tom
Analyze-first Architecture for Ultra-low-power Always-on Sensing![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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Asset Pictures |
Blake, Tessa
Overcoming an unconscious bias![]() ![]() Abstract Biography |
Diversity Forum |
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AT&S |
Beica, Rozalia
Heterogeneous Integration - The New Driver of Innovation and Growth![]() ![]() Abstract Biography |
Advanced Packaging Forum |
B | To top | ||
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Beneq |
Rabinzohn, Patrick
Atomic Layer Deposition process and equipment set to transform the More-than Moore era![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Bruno Kessler Foundation (Fondazione Bruno Kessler – FBK) |
Casse, Gianluigi
Technology and Knowledge Open Hub: a Pathway to Future Imaging and MEMS![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
C | To top | ||
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Chipmetrics Oy |
Utriainen, Mikko
Novel Platform to Solve 3D Nanometrology Challenge![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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Cohu, Inc. |
Cockburn, Peter
Session Chair![]() ![]() Abstract Biography |
Advanced Packaging Forum |
D | To top | ||
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Duale Hochschule Baden-Württemberg (State Cooperative University Baden-Württemberg) |
Hopf, Gregor
Drivers of Digitalisation: What is Digitalisation and Why can it Change so much?![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
E | To top | ||
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Edwards |
Collart, Erik
Data Sharing and the Cost of Inaction![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Edwards Ltd |
Pelissier, Christine
Successful Strategies to Attract Young Professionals![]() ![]() Abstract Biography |
Diversity Forum |
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Edwards Vacuum |
Samadi, Hassan
SEMI S30 - Safety Guideline for use of energetic materials in semiconductor R&D and manufacturing processes![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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ENTEGRIS |
AMADE, Antoine
How to Support the Functional Safety Requirements of the Automotive Industry![]() ![]() Abstract Biography |
SMART Mobility Forum |
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ESPAT-Consulting - Steffen Kroehnert |
Kroehnert, Steffen
Conference Chair, Session Chair![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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EV Group |
Dielacher, Bernd
Manufacturing Technologies for Next-Generation Microfluidics![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum SMART MedTech Forum |
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EVG |
Brandl, Elisabeth
High end power device manufacturing – substrate manufacturing and handling at the transition from Si to Compound Semiconductor materials![]() ![]() Abstract Biography |
Advanced Packaging Forum SMART Mobility Forum |
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Exawatt |
Price, Simon
SiC in the Automotive Supply Chain![]() ![]() Abstract Biography |
SMART Mobility Forum |
F | To top | ||
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Festo SE & Co. KG. |
Melzer, Frank
Efficiently managing your resources in production – I4.0 and AI are the keys to success![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Fluxergy |
Tinazli, Ali
How the COVID-19 Exposes the Flaws of Current HealthTesting - Hypermobility & Microfluidics for Health 4.0 Tools for new Medicine![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Fraunhofer EMFT |
Yacoub-George, Erwin
Development of a Foil based Flexible Interposer for Power Conditioning IC in Energy Autarkic Systems![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Fraunhofer EMFT |
Grünerbel, Lorenz
Early Diagnosis and Prevention of Pressure Induced Wounds (Ulcer) at Vulnerable Patients![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Fraunhofer ENAS |
Gadhiya, Ghanshyam
Virtual Prototyping for System-in-Package with Heterogeneous Integration - Enabler for faster Time-to-Market![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Fraunhofer Institut für Zuverlässigkeit und Mikrointegration |
Brockmann, Carsten
Innovative Packaging and Evaluation Approach for an Universal Sensor Platform![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Fraunhofer Institute for Photonic Microsystems (IPMS) |
Kaiser, Bert
All-silicon ultrasonic recognition of the environment![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
G | To top | ||
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GLOBALFOUNDRIES |
Kuechenmeister, Frank
Biography![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Google Corporation |
Dorn, Rüdiger
Smarter tools for smarter fabs - taking automation to the next level![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
H | To top | ||
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Henkel Belgium NV |
de Wit, Ruud
Enabling Assembly and Packaging Material Developments for Next Gen RF Devices, Antennas and Radars![]() ![]() Abstract Biography |
Advanced Packaging Forum |
I | To top | ||
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ICFO – The Institute of Photonic Sciences |
Goossens, Stijn
Enabling a World of Enhanced Vision![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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IMEC |
Miller, Andy
My Bio![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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INFICON |
Behnke, John
Evolution of Smart Manufacturing - Integrated and Collaborative Smart Systems![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Infineon Technologies |
Meyer, Thorsten
Challenges for Heterogeneous Integration in Package – Applications Driving Materials and Processes towards Diversity![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Infineon Technologies |
von Schierstaedt, Philipp
Sensors to Make the World Greener, Easier and Safer![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Infineon Technologies |
Kopetz, Andreas
XENSIV™ PAS CO2 Sensor: New Environmental Sensor Technology: Photoacoustic Spectroscopy (PAS) Miniaturizes CO2 Sensor for High-volume Applications![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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Intel Deutschland GmbH |
De Mesa, Eduardo
Flip-Chip Scale Package(FCCSP) Process Characterization and Reliability of Coreless Thin Package with 7nm TSMC Si![]() ![]() Abstract Biography |
Advanced Packaging Forum |
L | To top | ||
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LPKF Laser & Electronics AG |
Roick, Florian
Active Mold Packaging for Novel Antenna-in-Package Interconnection and Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Forum |
M | To top | ||
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MAX Group |
Meyuhas, Ariel
How Precision Maintenance Enables Agile Fabs![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Medical University Graz |
Pieber, Thomas
Next generation insulin pumps using new technologies![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Middlesex Industries SA |
Horn, George
AMLS Hybrid Implant Technology and Product![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
N | To top | ||
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NXP Semiconductors |
Vos, Sandra
Above and Beyond Methodology: Robustness Validation of Automotive MEMS Sensors![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
O | To top | ||
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OECD |
Schleicher, Andreas
Where is the next generation of technology experts?![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Okmetic |
Haapalinna, Atte
C-SOI® and patterned wafers enabling advanced MEMS and Sensor applications![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
P | To top | ||
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PEER Group |
Suerich, Doug
Cost-effective Automation for Legacy Factories![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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PROPHESEE |
Verre, Luca
Toward Event-Based Vision Wide-scale Adoption![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Pyreos Ltd. |
Phair, John
Miniature Digital IR Detectors Enabling Gas Sensing Everywhere![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
R | To top | ||
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radboudumc |
Huisman, Henkjan
Artificial Intelligence in Healthcare Delivery![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Robert Bosch GmbH |
Frangen, Joachim
Future wafer handling concept powered by permanent magnetic levitation![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Robert Bosch GmbH Stuttgart, Corporate Sector Research & Advance Engineering |
Laermer, Franz
Starting the Continuum: Fast Track to Diagnostics with Semiconductors![]() ![]() Abstract Biography |
SMART MedTech Forum |
S | To top | ||
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SEMI Foundation |
Williams-Vaden, Michelle
Fire-side chat with Sherry Alexander![]() ![]() Abstract Biography |
Diversity Forum |
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Senior Director - Diversity, Inclusion and Talent |
Scott, Alicia
Unconscious Bias – A discussion on how we tackle it in the Tech Space![]() ![]() Abstract Biography |
Diversity Forum |
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Silicon Austria Labs GmbH |
Mohssen, Moridi
Emerging piezo MEMS devices, trends and perspectives![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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SPTS Technologies Ltd |
Jones, Chris
Deposition and Etch Processing of highly-doped AlScN for Piezo-MEMS applications![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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STMicroelectronics |
Hofmeister, Anton
MEMS Actuators at the Core of Emerging Applications![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
T | To top | ||
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Teledyne e2v |
Segovia, Jose
120fps, Ultra High Definition (8K UHD), Low Noise, Global Shutter Sensor for High-end Rigid Endoscopy![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Tokyo Electron Limited |
Shekel, Eyal
From Smart Manufacturing Vision to Innovative Advanced Service Solutions![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Trelleborg Sealing Solutions |
Gulcur, Murat
Correct Material Selection and Life-Time Prediction of Elastomer Parts Using FEA Simulations![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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TriEye |
Livne, Ziv
Short-Wave Infrared Breaking the Status Quo - Identifying Hazards on the Road and Solving the Low Visibility Challenge![]() ![]() Abstract Biography |
SMART Mobility Forum |
U | To top | ||
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United Test and Assembly Center Ltd |
Attard, Alastair
Vertical Stacking of Controller IC on a Copper Clip Attached on MOSFET as a Space-saving Solution for High Current Switch e-fuse Applications![]() ![]() Abstract Biography |
Advanced Packaging Forum |
V | To top | ||
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VisIC Technologies |
Smith, Kurt
Gallium Nitride Technology to Meet Automotive High Reliability Requirements![]() ![]() Abstract Biography |
SMART Mobility Forum |
Y | To top | ||
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Yole Développement |
Cambou, Pierre
Embedded Computing the Next Paradigm Shift for Image Sensors![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Yole Développement |
Clerc, Sebastien
Microfluidics market and technology trends![]() ![]() Abstract Biography |
SMART MedTech Forum |
Z | To top | ||
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ZIAN & Co industrial consulting and recruitment |
Zimmer, Andreas C.
Skills in the Workforce and People in Processes![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |