A | To top | ||
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Air Liquide |
Meneses, David
How can a supplier help its customers fight climate change in the semiconductor industry? -The Air Liquide case-![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Airy3D |
Gallagher, Paul
A Simple and Versatile Single Camera Near-Depth Solution![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Amkor Technology, Inc. |
John, Gerard
Test Methods for System-in-Package and Challenges to Testing Heterogeneously Integrated Systems![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Analog Devices |
Olivadoti, Giuseppe
From Sensing to Action![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Applied Materials |
Rosa, Mike
Technology and Equipment Roadmaps Enabling the More-than-Moore Wave![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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Arbe |
Marenko, Kobi
Next Generation Radar- a Game Changer for Truly Safe and Smart Mobility![]() ![]() Abstract Biography |
SMART Mobility Forum |
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ASE Group |
Chen, William (Bill)
The Growing Momentum of Heterogeneous Integration![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Aspinity |
Doyle, Tom
Analyze-first Architecture for Ultra-low-power Always-on Sensing![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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AT&S |
Beica, Rozalia
Heterogeneous Integration - The New Driver of Innovation and Growth![]() ![]() Abstract Biography |
Advanced Packaging Forum |
C | To top | ||
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Chipmetrics Oy |
Utriainen, Mikko
Novel Platform to Solve 3D Nanometry Challenge![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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Cohu, Inc. |
Cockburn, Peter
Session Chair![]() ![]() Abstract Biography |
Advanced Packaging Forum |
D | To top | ||
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Duale Hochschule Baden-Württemberg (State Cooperative University Baden-Württemberg) |
Hopf, Gregor
Drivers of Digitalisation: What is Digitalisation and Why can it Change so much?![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
E | To top | ||
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Edwards Ltd |
Pelissier, Christine
Successful Strategies to Attract Young Professionals![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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ENTEGRIS |
AMADE, Antoine
How to Support the Functional Safety Requirements of the Automotive Industry![]() ![]() Abstract Biography |
SMART Mobility Forum |
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ESPAT-Consulting - Steffen Kroehnert |
Kroehnert, Steffen
Conference Chair, Session Chair![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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EV Group |
Dielacher, Bernd
Novel Bonding Technologies for Photonic and MEMS Sensor Integration![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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EVG |
Brandl, Elisabeth
High Throughput & High Yield Heterogeneous Integration with Implemented Metrology for Collective D2W Bonding![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Exawatt |
Price, Simon
SiC in the Automotive Supply Chain![]() ![]() Abstract Biography |
SMART Mobility Forum |
F | To top | ||
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Fraunhofer EMFT |
Yacoub-George, Erwin
Development of a Foil based Flexible Interposer for Power Conditioning IC in Energy Autarkic Systems![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Fraunhofer EMFT |
Grünerbel, Lorenz
Early Diagnosis and Prevention of Pressure Induced Wounds (Ulcer) at Vulnerable Patients![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Fraunhofer ENAS |
Gadhiya, Ghanshyam
Virtual Prototyping for System-in-Package with Heterogeneous Integration - Enabler for faster Time-to-Market![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Fraunhofer Institut für Zuverlässigkeit und Mikrointegration |
Brockmann, Carsten
Innovative Packaging and Evaluation Approach for an Universal Sensor Platform![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Fraunhofer Institute for Photonic Microsystems (IPMS) |
Kaiser, Bert
All-Silicon Ultrasonic Gesture Recognition![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
G | To top | ||
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GLOBALFOUNDRIES |
Kuechenmeister, Frank
Biography![]() ![]() Abstract Biography |
Advanced Packaging Forum |
H | To top | ||
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Henkel Belgium NV |
de Wit, Ruud
Enabling Assembly and Packaging Material Developments for Next Gen RF Devices, Antennas and Radars![]() ![]() Abstract Biography |
Advanced Packaging Forum |
I | To top | ||
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ICFO – The Institute of Photonic Sciences |
Goossens, Stijn
Enabling a World of Enhanced Vision![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
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IMEC |
Miller, Andy
My Bio![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Infineon Technologies |
Meyer, Thorsten
Challenges for Heterogeneous Integration in Package – Applications Driving Materials and Processes towards Diversity![]() ![]() Abstract Biography |
Advanced Packaging Forum |
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Infineon Technologies |
von Schierstaedt, Philipp
Sensors to Make the World Greener, Easier and Safer![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Intel Deutschland GmbH |
De Mesa, Eduardo
Flip-Chip Scale Package(FCCSP) Process Characterization and Reliability of Coreless Thin Package with 7nm TSMC Si![]() ![]() Abstract Biography |
Advanced Packaging Forum |
L | To top | ||
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LPKF Laser & Electronics AG |
Roick, Florian
Active Mold Packaging for Novel Antenna-in-Package Interconnection and Manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Forum |
M | To top | ||
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Middlesex Industries SA |
Horn, George
AMLS Hybrid Implant Technology and Product![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
N | To top | ||
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National Research Council (CNR) |
Profumo, Francesco
Technology and Knowledge Open Hub: a Pathway to Future Imaging and MEMS![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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NXP Semiconductors |
Vos, Sandra
Above and Beyond Methodology: Robustness Validation of Automotive MEMS Sensors![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
P | To top | ||
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PEER Group |
Suerich, Doug
Cost-effective Automation for Legacy Factories![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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PROPHESEE |
Verre, Luca
Toward Event-Based Vision Wide-scale Adoption![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Pyreos Ltd. |
Phair, John
Miniature Digital IR Detectors Enabling Gas Sensing Everywhere![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Technology Showcase |
R | To top | ||
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radboudumc |
Huisman, Henkjan
Artificial Intelligence in Healthcare Delivery![]() ![]() Abstract Biography |
SMART MedTech Forum |
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Robert Bosch GmbH Stuttgart, Corporate Sector Research & Advance Engineering |
Laermer, Franz
Starting the Continuum: Fast Track to Diagnostics with Semiconductors![]() ![]() Abstract Biography |
SMART MedTech Forum |
S | To top | ||
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STMicroelectronics |
Hofmeister, Anton
MEMS Actuators at the Core of Emerging Applications![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
T | To top | ||
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Teledyne e2v |
Segovia, Jose
120fps, Ultra High Definition (8K UHD), Low Noise, Global Shutter Sensor for High-end Rigid Endoscopy![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
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Trelleborg Sealing Solutions |
Gulcur, Murat
Correct Material Selection and Life-Time Prediction of Elastomer Parts Using FEA Simulations![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |
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TriEye |
Livne, Ziv
Short-Wave Infrared Breaking the Status Quo - Identifying Hazards on the Road and Solving the Low Visibility Challenge![]() ![]() Abstract Biography |
SMART Mobility Forum |
U | To top | ||
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United Test and Assembly Center Ltd |
Attard, Alastair
Vertical Stacking of Controller IC on a Copper Clip Attached on MOSFET as a Space-saving Solution for High Current Switch e-fuse Applications![]() ![]() Abstract Biography |
Advanced Packaging Forum |
Y | To top | ||
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Yole Développement |
Cambou, Pierre
Embedded Computing the Next Paradigm Shift for Image Sensors![]() ![]() Abstract Biography |
MEMS & Imaging Sensors Forum |
Z | To top | ||
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ZIAN & Co industrial consulting and recruitment |
Zimmer, Andreas C.
Skills in the Workforce and People in Processes![]() ![]() Abstract Biography |
Fab Management Forum (FMF) |