A | To top | ||
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ABB Semiconductors |
Kraxenberger, Manfred
![]() ![]() Biography |
Fab Management Forum |
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Alertgy |
Hubert, John
Non-Invasive Continuous Glucose Monitor (NICGM) for Diabetics![]() ![]() Abstract Biography |
SMART MedTech |
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Amazon Web Services |
Pellerin, David
Cloud-Accelerated Innovation for Semiconductor Design and Verification![]() ![]() Abstract Biography |
SMART Design |
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Amkor Technology, Inc. |
John, Gerard
Don't Let Your ADAS Chips Crash! Test Them!![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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ams |
Frederix, Filip
Sensors to Enable Consumer Health Applications![]() ![]() Abstract Biography |
SMART MedTech |
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Ap-s |
Kluge, Christoph
Use of AI based predictive maintenance solutions to predict failures and tovisualize the required preventive maintenance operations within a shopfloor todetermine the optimal maintenance schedule for a production process chain![]() ![]() Abstract Biography |
Fab Management Forum |
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Applied Materials GmbH |
Clark, Emily
![]() ![]() Biography |
SMART Workforce |
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ASM Pacific Technology |
Boulanger, Richard
Innovative Panel Plating for finer line spacing and better uniformity to allow semiconductor or embedded die assembly for Heterogeneous Integration![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Atotech Deutschland GmbH |
Knaup, Jan M.
Influence of Chemical Copper Surface Treatments on the Mechanical Reliability and Failure Modes in Heterogeneous Integration Packages![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Atotech Deutschland GmbH |
Hörburger, Markus
Holistic Approach to Improve the Reliability of Advanced Heterogeneous Packaging by Chemistry![]() ![]() Abstract Biography |
Advanced Packaging Conference |
B | To top | ||
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Bart's Heart Centre |
Mathur, Anthony
The Clinician’s Point of View![]() ![]() Abstract Biography |
SMART MedTech |
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Beratergruppe Neuwaldegg GmbH |
Ried, Christian
Self-organization, hype or hope? How to leverage the potential benefits of speeding up in a VUCA world![]() ![]() Abstract Biography |
Fab Management Forum |
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BESI Austria GmbH |
Abdilla, Jonathan
Packaging of a MOEMS LIDAR sub assembly for distance metering on a 3D housing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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BMW Group |
Schambeck, Simon
Effect of harsh temperature ramp rates on solder joints of Wafer-Level CSPs in board level reliability tests.![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Breker Verification Systems |
Hamid, Adnan
![]() ![]() Biography |
SMART Design |
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Brewer Science, Inc |
Guerrero, Alice
Temporary Bonding Materials: The Future Beyond Temporary Thin Wafer Handling![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Brewer Science, Inc. |
Guerrero, Douglas
![]() ![]() Biography |
Strategic Materials Conference |
C | To top | ||
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C.Uyemura & Co.,Ltd. |
Sakuma, Yuichi
Low Phosphorus Content Of Electroless-Ni for Power Device![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Cadence Design Systems, Inc. |
Cunningham, Paul
![]() ![]() Biography |
SMART Design |
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CEA |
Vinet, Maud
Silicon for large scale quantum computing![]() ![]() Abstract Biography |
Disruptive Computing |
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CEA-Leti |
Feuillet, Guy
Nanopatterning for Reduced Template Hetero-Epitaxy of Low Defect Density Semiconductors![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Chronolife |
Vandebrouck, Laurent
![]() ![]() Biography |
SMART MedTech |
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CNRS-Grenoble INP |
Balestra, Francis
Challenges for the end of Moore Law![]() ![]() Abstract Biography |
Challenges of Moores Law |
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Cobham Advanced Electronics Solutions |
Sayer, Christian
Addressing the "New-Space" Paradigm Shift in Development and Production of High Reliability, Space Grade Semiconductor Components![]() ![]() Abstract Biography |
SMART Design |
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Cohu, Inc. |
Cockburn, Peter
![]() ![]() Biography |
Advanced Packaging Conference |
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Convanit GmbH&Co.KG |
Thurner, Ines
A Roadmap for the future inline control and yield management in MEMS production![]() ![]() Abstract Biography |
MEMS along the Value Chain |
D | To top | ||
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DAS Environmental Experts |
Raithel, Stephan
![]() ![]() Biography |
3D Printing |
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Digital Mindset GmbH |
Bredlow, Christian
From now on everybody is #Agile, or what?![]() ![]() Abstract Biography |
Fab Management Forum |
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DOW Silicones Belgium |
Seldrum, Thomas
Ultra-Low Stress Silicone Die-Attach Film For Stress Sensitive, SiP and Stacked Dies Assembly![]() ![]() Abstract Biography |
Strategic Materials Conference |
E | To top | ||
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Edwards |
Czerniak, Mike
The UN IPCC GHG Guidelines (2019) and the Impact on the Semiconductor Industry;What are the Changes & Implications?![]() ![]() Abstract Biography |
SMART Workforce |
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Edwards |
Lievens, Tom
![]() ![]() Biography |
SMART Workforce |
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Edwards Vacuum |
Walsh, Niall
More than Moore - Edwards EUVL HVM Availability Programme![]() ![]() Abstract Biography |
Fab Management Forum |
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Eindhoven University of Technology |
Heemstra de Groot, Sonia
Wireless research beyond 5G![]() ![]() Abstract Biography |
Technology for Communication |
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Electronic System Design (ESD) Alliance a SEMI Strategic Association Partner |
Smith, Bob
Welcome![]() ![]() Abstract Biography |
SMART Design |
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Entegris SAS |
Amade, Antoine
A new collaborative approach to defectivity challenges in the automotive industry![]() ![]() Abstract Biography |
SMART Transportation Forum |
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EPFL |
Ionescu, Adrian
Advances in Energy Efficient Neuromorphic Computing: Ready for Artificial Intelligence at the Edge?![]() ![]() Abstract Biography |
Disruptive Computing |
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Ericsson AB |
Tillman, Fredrik
5G radios – commercial challenges and opportunities![]() ![]() Abstract Biography |
Technology for Communication |
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Eriksholm Research Center |
Hermann, Uwe Andreas
Disruptions Ahead – Hearings Instruments as Multi-Sensor Platforms![]() ![]() Abstract Biography |
Disruptive Computing |
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European Commission |
Lymberis, Andreas
![]() ![]() Biography |
SMART MedTech |
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EVG |
Brandl, Elisabeth
Mechanical Debonding for ultrathin chiplet manufacturing![]() ![]() Abstract Biography |
Advanced Packaging Conference |
F | To top | ||
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Fraunhofer EMFT |
Leistner, Henry
![]() ![]() Biography |
SMART MedTech |
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Fraunhofer Institute |
Quay, Rüdiger
Diamond for Quantum Computing![]() ![]() Abstract Biography |
Disruptive Computing |
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Fraunhofer IZM |
Schischke, Karsten
A Circular Economy for Smartphones![]() ![]() Abstract Biography |
Building a Circular Economy in the Electronics Manufacturing Industry |
G | To top | ||
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GE Research |
Potyrailo, Radislav
Bridging the Gap from Semiconductors to Medical Technologies: GE Research Advances in Multiparameter Gas, Physiological, and Biological Sensing![]() ![]() Abstract Biography |
SMART MedTech |
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GE Research |
Cho, Sanghee
![]() ![]() Biography |
SMART MedTech |
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Globalfoundries |
Capecchi, Simone
Chip Package Interaction Test structure design to address challenges from products with RF specific back end of line metallization options on Flip Chip ETS substrate![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Globalfoundries |
Madani, Ramin
Digital Twin / Ion Source Prediction![]() ![]() Abstract Biography |
Fab Management Forum |
H | To top | ||
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Harbor Electronics |
Bleakley, Tom
Stretching the Performance Envelope of ATE PCBs![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Henkel Corporation |
Trichur, Ramachandran
Advanced Assembly Materials for Enabling Heterogeneous Integration and System-in-Package (SiP) Applications![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Henkel Electronic Materials |
de Wit, Ruud
Innovative Interconnect and Encapsulation Developments for Wafer Level Packaging![]() ![]() Abstract Biography |
Strategic Materials Conference |
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HQ-Dielectrics GmbH |
Niess, Juergen
Thermal Treatments in MEMS Fabrication:Challenges and Benefits of Rapid Thermal Processing (RTP)![]() ![]() Abstract Biography |
MEMS along the Value Chain |
I | To top | ||
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Ibm Services |
Kobusch, Ingo
Democratizing AI to accelerate the journey towards smart manufacturing![]() ![]() Abstract Biography |
Smart Manufacturing I (software-centric) |
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IC'Alps |
Girin, Remy
Enabling Smart MD with Custom Integrated Circuit (ASIC)![]() ![]() Abstract Biography |
SMART MedTech |
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IHP |
Mai, Andreas
High performance photonic technologies for communication and sensing applications![]() ![]() Abstract Biography |
Smart Photonics |
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IHS Markit |
Akhtar, Noman
Factors Affecting the Market Landscape for Sensors![]() ![]() Abstract Biography |
MEMS along the Value Chain |
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IMAPS Germany |
Mueller, Jens
![]() ![]() Biography |
Advanced Packaging Conference |
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imec |
Van den Bosch, Anne
![]() ![]() Biography |
SMART MedTech |
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imec |
Shahriari, Navid
Connected Health for a Bright Future![]() ![]() Abstract Biography |
SMART MedTech |
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imec |
Boullart, Werner
EU consortia joining forces to tackle challenges of advanced technology nodes![]() ![]() Abstract Biography |
Challenges of Moores Law |
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imec |
Pauwelyn, Thomas
Microfluidic, CMOS Microelectrode Array-based Organ-on-chip System: a Platform for Personalized Medicine![]() ![]() Abstract Biography |
SMART MedTech |
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imec |
Mallik, Arindam
Enablement of Energy-efficient Machine Learning hardware through System-Technology Co-optimization![]() ![]() Abstract Biography |
Disruptive Computing |
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imec |
Peeters, Michael
From 4G to 6G: do the networks of the future care about the technologies of the past?![]() ![]() Abstract Biography |
Technology for Communication |
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imec |
Stassen, Andim
CMOS Compatible SiN Photonics Platform for Life Science Applications![]() ![]() Abstract Biography |
SMART MedTech |
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imec.xpand |
Vanhoutte, Tom
Smart Investments in Health![]() ![]() Abstract Biography |
SMART MedTech |
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Inficon |
Behnke, John R
Why is everyone talking about scheduling their fabs?![]() ![]() Abstract Biography |
SMART Transportation Forum Smart Manufacturing I (software-centric) |
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Infineon |
Pressel, Klaus
![]() ![]() Biography |
Advanced Packaging Conference |
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Infineon Technologies AG |
Robl, Werner
Challenges for Cu-Metallization in More than Moore Applications![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Intel Deutschland GmbH |
Seidemann, Georg
Product on Board Test Method for Advanced Reliability Performance of a Large 0.3 mm Pitch Wafer Level Chip Scale Package![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Intel Research and Development Ireland Ltd |
Capraro, Bernie
Semiconductor Manufacturing – Enabling the Data Revolution![]() ![]() Abstract Biography |
SMART Workforce |
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Irish Manufacturing Research |
McConnell, Sean
The implementation of Additive Manufacturing![]() ![]() Abstract Biography |
3D Printing |
J | To top | ||
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Johnson & Johnson |
Wiegand, Benjamin
From Disease Care to Health Care![]() ![]() Abstract Biography |
SMART MedTech |
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JSRmicro N.V. |
Jakus, Catherine
The use of chemicals in the Semi conductor industry and the regulatory requirements or concerns![]() ![]() Abstract Biography |
Strategic Materials Conference |
K | To top | ||
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KLA Corporation |
Donzella, Oreste
Trends in Automotive: Fab Inspection and Metrology Changing Role in “Zero Defect”![]() ![]() Abstract Biography |
SMART Transportation Forum |
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KU Leuven |
Van der Perre, Liesbet
IoT with a Soft Touch: Connecting for a Sustainable Future![]() ![]() Abstract Biography |
SMART Workforce |
L | To top | ||
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Lam Research Corporation |
Della Pia, Marcello
Innovations to Enable Industry 4.0 for Semiconductor Process Tools![]() ![]() Abstract Biography |
Fab Management Forum |
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Leibniz-Institute for Crystal Growth (IKZ) |
Sumathi, R. Radhakrishnan
Germanium as an emerging strategic material for next-generation devices and applications![]() ![]() Abstract Biography |
Strategic Materials Conference |
M | To top | ||
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Materials Center Leoben Forschung GmbH |
Defregger, Stefan
Temperature-dependent thermal properties of nm-thin Nb2O5 using a novel thermal impedance approach![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Maxim Integrated |
Mulpuru, Sudhir
Can Wearables Help Prevent the Silent Killer, Blood Pressure?![]() ![]() Abstract Biography |
SMART MedTech |
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Medspray BV |
Nijdam, Wietze
New technology for inhalers and sprays for a healthier world![]() ![]() Abstract Biography |
MEMS along the Value Chain |
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MedTech Europe |
Boisseau, Patrick
![]() ![]() Biography |
SMART MedTech |
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MedTech Europe |
Strübin, Michael
Perspectives on Healthcare, the Medtech Industry, and Digital![]() ![]() Abstract Biography |
SMART MedTech |
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Mentor Graphics |
Pulini, Gabriele
![]() ![]() Biography |
SMART Design |
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Micron Technology Inc. |
Tiziani, Federico
Overview of the Automotive market and future challenges from memory perspectives![]() ![]() Abstract Biography |
SMART Transportation Forum |
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Micronit |
van’t Oever, Ronny
Personalised Health Management Enabled by Nanotechnology and Laboratory on a “Chip” Products![]() ![]() Abstract Biography |
SMART MedTech |
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Minima Processor |
Koskinen, Lauri
Near-Threshold Logic Benefits the Full Application Stack![]() ![]() Abstract Biography |
SMART Design |
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MRL Consulting Group |
Stone, David
![]() ![]() Biography |
SMART Workforce |
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MRL Consulting Group |
Rudnick, Enrico
How to Approach the Semiconductors Skills Shortage![]() ![]() Abstract Biography |
SMART Workforce |
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Mycronic AB |
Cabello, Javier
Deep Learning for Electronics Manufacturing![]() ![]() Abstract Biography |
SMART Design |
N | To top | ||
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NXP |
Kamphuis, Tonny
Board Level Reliability results for a two side molded WLCSP![]() ![]() Abstract Biography |
Advanced Packaging Conference |
O | To top | ||
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Okmetic Oy |
Sievilä, Päivi
Recent advancements in tailor-made silicon substrate manufacturing![]() ![]() Abstract Biography |
Strategic Materials Conference |
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OnePlanet | Connected Health Solutions |
Rios Velazquez, Emmanuel
Digital Health: Tracking Mental Stress and Mood Using Wearable Data and Machine Learning![]() ![]() Abstract Biography |
SMART MedTech |
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Onera |
Adnane, Soukaina
Introducing the Next Generation of Sleep Diagnostics![]() ![]() Abstract Biography |
SMART MedTech |
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OnScale |
Campbell, Ian
Cloud Engineering Simulation: A Game Changer for Engineers![]() ![]() Abstract Biography |
SMART Design |
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Optimal Plus |
Schuldenfrei, Michael
Semiconductors in a world where safety rules supreme![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Orbotech Ltd. a KLA company |
Maayan, Lior
![]() ![]() Biography |
SMART Workforce |
P | To top | ||
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PacTech - Packaging Technologies GmbH |
Oppert, Thomas
![]() ![]() Biography |
Advanced Packaging Conference |
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Panasonic Industry Europe GmbH |
Weber, James
Cutting-edge Plasma Dicing for wafer singulation applied to MEMS devices![]() ![]() Abstract Biography |
MEMS along the Value Chain |
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Panasonic Smart Factory Solutions |
Okita, Shogo
Suitable Total Process Integration of Plasma Dicing for Each Device Category![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Pfeiffer Vacuum SAS |
Didierjean, Manuel
Real time compounds monitoring in clean room environment![]() ![]() Abstract Biography |
Fab Management Forum |
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Philips |
Janssen, Ger
The Digital Patient: Will We One Day Have our Own Health Avatar?![]() ![]() Abstract Biography |
SMART MedTech |
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PKvitality |
Pierart, Luc
K'Watch, World First Painless Continuous Glucose Monitoring Smartwatch![]() ![]() Abstract Biography |
SMART MedTech |
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PMT Corporation |
Miyake, Kenji
Half-inch FOWLP Process Line utilizing Minimal FAB![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Polytec GmbH |
Heilig, Markus
Pushing the Limits: Recent Advancements in the Optical Characterization of MEMS Devices![]() ![]() Abstract Biography |
MEMS along the Value Chain |
R | To top | ||
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Recif Technologies |
Brillouet, Thomas
Wafer-Level Package handling and inspection/metrology platforms![]() ![]() Abstract Biography |
Smart Manufacturing II (hardware-centric) |
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Robert Bosch GmbH |
Gromala, Przemyslaw
Reliability Requirements of Advanced Packaging in the Era of Electrified, Automated and Connected Driving![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Robert Bosch GmbH |
Richter, Thomas
![]() ![]() Biography |
Fab Management Forum |
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Robert Bosch GmbH |
Kohn, Robert
Full Factory Scheduling![]() ![]() Abstract Biography |
Fab Management Forum |
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Robert Bosch GmbH |
Winkler, Jonathan
New Prospects for Temperature and Current Sensing for Wide Bandgap Semiconductors![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Robert Bosch GmbH Stuttgart, Corporate Sector Research & Advance Engineering |
Laermer, Franz
The Future of Personalized Treatment![]() ![]() Abstract Biography |
SMART MedTech |
S | To top | ||
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Schrödinger Inc |
Elliott, Simon
More novelty and less risk with materials modelling for the semiconductor roadmap![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Scientific Visual |
Orlov, Ivan
Quality control in sapphire production: From automated defect detection to big data approach.![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Scintil Photonics SAS |
Langlois, Pascal
COMMUNICATE, SENSE WITH LIGHTGenerating, Modulating, Routing, Filtering, and Detecting Light on Siliconwith Mass Manufacturable Semiconductor Integrated Circuit![]() ![]() Abstract Biography |
Smart Photonics |
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SEMI |
Demircan, Emir
SEMI Advocacy Program Helps Members Grow | An Overview of Policies Affecting the Semiconductor Manufacturing Industry![]() ![]() Abstract Biography |
Global Trade Disputes: a zero-sum game for all ― is there a way out? Building a Circular Economy in the Electronics Manufacturing Industry SMART Workforce Member session: SEMI: Delivering Member Value |
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SEMI |
Kysela, Marek
![]() ![]() Biography |
MADEin4 Session |
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SEMI |
Chamness, Lara
2019 Semiconductor Fab, Equipment and Materials Market: Have we reached the bottom of this cycle?![]() ![]() Abstract Biography |
Member session: SEMI: Delivering Member Value Fab Management Forum Market Briefing |
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SEMI |
Dossi, Roberto
Strategic Engagement through SEMI Technology Communities![]() ![]() Abstract Biography |
Member session: SEMI: Delivering Member Value |
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SEMI Europe |
Melvin, Cassandra
![]() ![]() Biography |
SMART MedTech SMART Workforce |
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SEMI Europe |
Demircan, Emir
METIS: MicroElectronics Training, Industry and Skills: Europe’s Newest and Largest Electronics Education Initiative![]() ![]() Abstract Biography |
SMART Workforce |
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Sensome |
Bozsak, Franz
Sensome: Medical Devices Enhanced by Microelectronics to Revolutionize the Treatment of Stroke![]() ![]() Abstract Biography |
SMART MedTech |
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Siconnex |
Woerndl, Fabio
Fab cost saving programs with Siconnex Batchspray® Technology![]() ![]() Abstract Biography |
Fab Management Forum |
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Siemens Healthineers |
Heidenreich, Georg
![]() ![]() Biography |
SMART MedTech |
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Silvaco Inc |
Taheri, Babak
Next Generation SoC Design: From Atoms to Systems![]() ![]() Abstract Biography |
SMART Design |
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SMART Photonics |
Augustin, Luc
Foundry model for low-cost versatile photonic integrated circuits![]() ![]() Abstract Biography |
Smart Photonics |
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Soitec |
Radu, Ionut
![]() ![]() Biography |
Technology for Communication |
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Soitec |
Brunier, Francois
Building European ecosystem on SOI to answer Societal challenges of Smart Mobility and Communication![]() ![]() Abstract Biography |
Technology for Communication |
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Spectricity |
Smets, Carl
How Hyperspectral Sensing Technologies can Help Enabling Wearables for Health Diagnostics![]() ![]() Abstract Biography |
SMART MedTech |
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SPTS Technologies Ltd, A KLA Company |
Harrington, Claire
![]() ![]() Biography |
SMART Workforce |
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STMicroelectronics |
Bidault, Laurent
Automatic Defect Classification of images of defect or Wafermap using Deep Learning![]() ![]() Abstract Biography |
Fab Management Forum |
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SUSS MicroTec |
Schmidt, Thomas
Advanced Plasma Surface Activation for Hybrid Fusion Bonding![]() ![]() Abstract Biography |
Advanced Packaging Conference |
T | To top | ||
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Technische Universität Dresden |
Meier, Karsten
Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Technological University Dublin |
Walsh, John
From Products to Prostates: Experiments in 3D Printing Design and Creative Arts![]() ![]() Abstract Biography |
3D Printing |
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TechSearch International, Inc. |
Vardaman, Jan
Packaging Trends for AI![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Texas Instruments |
Enzelberger-Heim, Michael
Automated Hardware Diagnosis and Qualification![]() ![]() Abstract Biography |
Fab Management Forum |
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TowerJazz |
Hirsch, Yoav
Industry 4.0 Digitization of Manufacturing for Enhanced Productivity![]() ![]() Abstract Biography |
MADEin4 Session |
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TU Dresden IAVT |
Tiedje, Tobias
3D electronic packaging for IoT devices – from prototype to series production![]() ![]() Abstract Biography |
3D Printing |
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Tyndall National Institute |
Gunning, Fatima
Coherent photonic transmitters: what, how and when?![]() ![]() Abstract Biography |
Smart Photonics |
U | To top | ||
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Umicore |
Steegen, An
![]() ![]() Biography |
SMART Workforce |
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Univ. grenoble Alpes, CNRS, LTM |
Pargon, Erwine
Si and SiN High-Q microresonators for quantum and nonlinear optics applications![]() ![]() Abstract Biography |
Smart Photonics |
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University College Dublin |
Russo, Giovanni
Cyber-Physical Human-in-the-Loop Systems for manufacturing: exploring the border between learning and control![]() ![]() Abstract Biography |
Smart Manufacturing I (software-centric) |
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University of Bristol |
Michalopoulou, Eleni
![]() ![]() Biography |
SMART Workforce |
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University of Stuttgart, Institute of Semiconductor Engineering (IHT) |
Schulze, Jörg
SiGeSn – A new (old) building block for nano- and optoelectronic devices![]() ![]() Abstract Biography |
Strategic Materials Conference |
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University of Twente |
Zwanenburg, Floris
Ambipolar quantum dots in planar silicon![]() ![]() Abstract Biography |
Disruptive Computing |
V | To top | ||
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Veeco |
Vijayendran, Anil
Addressing Impact of Shrinking Line/Space Dimensions on PR Strip, UBM/RDL Etch and Wafer Thinning Processes![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Vista Ventures, LLC |
Hogan, Jim
![]() ![]() Biography |
SMART Design |
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VTT |
Aalto, Timo
Micron-scale low-loss silicon photonics for communication and sensing![]() ![]() Abstract Biography |
Smart Photonics |
X | To top | ||
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X-FAB MEMS Foundry |
Ernst, Stefan
Medical is the next Automotive – the Advance of Silicon-based Microfluidics Technologies and Applications![]() ![]() Abstract Biography |
SMART MedTech |
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X-FAB MEMS Foundry GmbH |
Leopold, Steffen
Clash of Generations? – Changing Motivations, Requirements and Communication Styles as Seen by Young Professionals![]() ![]() Abstract Biography |
Fab Management Forum |
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X-FAB Semiconductor Foundries GmbH |
Liebau, Matthias
Development of an Efficient Software-Backup-Management-System for Semiconductor Equipment Controllers![]() ![]() Abstract Biography |
Fab Management Forum |
Y | To top | ||
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Yole Développement |
Jolivet, Emilie
5G enabler : Advanced Packaging![]() ![]() Abstract Biography |
Advanced Packaging Conference |
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Yole Développement |
Boulay, Pierrick
How next generation cars will impact the automotive industry?![]() ![]() Abstract Biography |
SMART Transportation Forum |
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Yole Développement |
Pizzagalli, Amandine
Polymeric materials for Advanced packaging![]() ![]() Abstract Biography |
Strategic Materials Conference |
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Yole Développement |
Mouly, Jerome
Personalized Medicine: Toward Innovative Solutions to Meet Healthcare Challenges![]() ![]() Abstract Biography |
SMART MedTech |
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Yole Développement |
Troadec, Claire
5G's impact on RF Front-End: from Telecom Infrastructure to Hand sets![]() ![]() Abstract Biography |
Technology for Communication |
Z | To top | ||
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Zollner Elektronik AG |
Hoffmann, Markus M.
Smart Manufacturing setups to achieve an AI based Digital Transmission within the EMS-industry![]() ![]() Abstract Biography |
Smart Manufacturing II (hardware-centric) |