Lepelletier, Guillaume
Increasing Fab Productivity through Variability reduction![]() Abstract CV of presenting author |
Fab productivity (TechARENA) | |
3 | To top | |
3D-Micromac AG |
Zuehlke, Hans-Ulrich
TLS-Dicing - Enabling technology for separation of SiC wafers![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC)
Exhibitor Presentations: Packaging (TechARENA) |
3D PLUS |
Noiray , Jerome
Application of WDoDTM technology for the manufacturing of SiPs in the medical domain and in the defense and industrial domain![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
A | To top | |
A.M. Fitzgerald & Associates, LLC |
Fitzgerald, Alissa
Letting Process Drive Design: The RocketMEMS#CHR:trade# Model![]() Abstract CV of presenting author |
International MEMS Industry Forum |
ABB Semiconductors |
Kraxenberger, Manfred
![]() Biography |
18th Fab Managers Forum |
adixen Vacuum Products |
Davenet, Magali
AMC contamination management strategy for 450mm![]() Abstract CV of presenting author |
450mm |
Advantest Europe GmbH |
Ainslie, Stuart
Advantest F7000 leading e-beam lithography tool![]() Abstract CV of presenting author |
Lithography: What lithography options for tomorrow? (TechARENA) |
AIRBUS |
Pons, Philippe
Advanced components packaging in Avionics, challenges and perspectives![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
AIS Automation Dresden GmbH |
Schulze, Mirko
Automation challenges for secondary equipment![]() Abstract CV of presenting author |
Secondary Equipment (TechARENA) |
AIS Automation Dresden GmbH |
Kinauer, Jochen
Innovative Semiconductor Solutions supplied out of Silicon Saxony![]() Abstract CV of presenting author |
450mm |
Aixtron Ltd |
Jouvray, Alex
Scaling up Chemical Vapour Deposition Graphene to 300 mm Si substrates![]() Abstract CV of presenting author |
2D (TechARENA) |
Aldebaran Robotics |
Gelin, Rodolphe
Imaging for companion humanoid robots![]() Abstract CV of presenting author |
Imaging Conference |
Amkor |
Clark, David
![]() Biography |
Advanced Packaging Conference (APC) |
Analitycal Pixels Technology |
Colinet, Eric
MEMS as gas detectors and their use in gas chromatography![]() Abstract CV of presenting author |
International MEMS Industry Forum |
ANSYS |
Toublanc, Jerome
Optimize Power Consumption and Delivery from RTL to GDS![]() Abstract CV of presenting author |
Low Power Conference |
Applied Materials |
Stolley, Tobias
Roll-to-Roll Plasma Enhanced Chemical Vapor Deposition for Next Generation Thin Film Electronic Device & Ultra High Barrier Applications![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Arizona State University |
Raupp, Gregory
HIgh Performance Flexible Electronics on Plastic for Display, Imaging and Sensing Technologies![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Arkema |
Domingues Dos Santos, Fabrice
Fluorinated Electroactive Polymers for Printed Electronic![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Arkema |
Cayrefourcq, Ian
DSA materials status for HVM![]() Abstract CV of presenting author |
Lithography: What lithography options for tomorrow? (TechARENA) |
ARM |
Hartley, Tim
The Benefits of GPU Compute on ARM Mali GPUs![]() Abstract CV of presenting author |
Imaging Conference |
ASE |
Yannou, Jean-Marc
Semiconductor packaging and test trends: a supply chain challenge'![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC)
16th European Manufacturing Test Conference (EMTC) |
Asia Optical Ether |
Lusinchi, Jean Pierre
Evolution of Design and Manufacturing of optical modules for mobile phone.![]() Abstract CV of presenting author |
Imaging Conference |
ASM Europe BV |
Herbschleb, Cornelis
The dawn of 450mm production: Batch and single wafer equipment and process exploration![]() Abstract CV of presenting author |
450mm |
ATREG. Inc. |
Silver, Barnett
Shared Manufacturing Model - An Alternative Approach for Semiconductor Companies![]() Abstract CV of presenting author |
International MEMS Industry Forum |
Audi |
Hellenthal, Berthold
Driving solutions - intelligent sensor systems![]() Abstract CV of presenting author |
Imaging Conference |
AWAIBA CMOS IMAGE SENSORS |
Waeny, Martin
Miniaturization trends in medical imaging enabled by full wafer level integration if micro camera modules![]() Abstract CV of presenting author |
Imaging Conference |
B | To top | |
Beneq |
Shuo Li, Shuo
Excellent Moisture Barrier by Plasma Enhanced Atomic Layer Deposition Aluminum Oxide for plastic electronics applications![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Bosch Connected Devices and Solutions GmbH |
Mueller, Thorsten
Smart connected sensor devices for the Internet of Things and Services![]() Abstract CV of presenting author |
18th Fab Managers Forum |
Bosch Sensortec |
Forget, Jeanne
The Future of MEMS Sensors in Our Connected World![]() Abstract CV of presenting author |
International MEMS Industry Forum |
Bosch Sensortec GmbH |
Lammel, Gerhard
![]() Biography |
International MEMS Industry Forum |
C | To top | |
Cadence Design Systems Inc |
Binning, Marcus
Using Configurable Processor Technology to achieve power efficient architectures![]() Abstract CV of presenting author |
Low Power Conference |
Caeleste |
Dupont, Benoit
Custom image sensors for high performance application![]() Abstract CV of presenting author |
Imaging Conference |
Cambridge University |
Rider, Chris
Innovating in Plastic Electronics within a manufacturing model![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
CATRENE |
Rousset, Denis
450mm specifications will boost the 300mm yield in wafer manufacturing![]() Abstract CV of presenting author |
450mm |
CEA-Leti |
Clermidy, Fabien
Low-power multiprocessing: from embedded to servers multi-core![]() Abstract CV of presenting author |
Low Power Conference |
CEA-Leti |
Louis, Didier
![]() Biography |
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
CEA-Leti |
Tedesco, Serge
![]() Biography |
Lithography: What lithography options for tomorrow? (TechARENA) |
CEA-Leti |
Lattard, Ludovic
Mask Less Lithography for Volume Manufacturing![]() Abstract CV of presenting author |
Lithography: What lithography options for tomorrow? (TechARENA) |
CEA-Leti |
Gouze, Eric
Microsensor for Health applications![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
Cea-Liten |
Gwoziecki, Romain
![]() Biography |
Plastic Electronics - PE2014 |
CEA / Leti /optics and photonics Division |
Mourey, Bruno
![]() Biography |
Imaging Conference |
CEA LETI MINATEC |
Frey, Laurent
Spectral filtering on CMOS Image Sensors with metal dielectric multilayers![]() Abstract CV of presenting author |
Imaging Conference |
CEA, LETI, MINATEC Campus |
Toffoli, Alain
![]() Biography |
16th European Manufacturing Test Conference (EMTC) |
CEA LITEN |
Bouthinon, Benjamin
Coupled organic photodetector onto a plastic organic thin-film transistor backplane.![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
CEA tech |
Serbutoviez, Christophe
From LAB to FAB, review of printing technologies for organic electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
CEA/LETI |
Aubert, Jean-Jacques
GaN on silicon: A way to low cost power devices![]() Abstract CV of presenting author |
Power Electronics Conference |
CEA/LETI/Minatec |
Fenouillet-Bearnger, Claire
Technological challenges and applications of 3D sequential integration![]() Abstract CV of presenting author |
3D integration (TechARENA) |
CMOSIS nv |
Meynants, Guy
High Performance Global Shutter Image Sensors - Design and Applications![]() Abstract CV of presenting author |
Imaging Conference |
CNSE |
Liehr, Michael
Scaling Options in Relation to 450mm![]() Abstract CV of presenting author |
450mm |
Colibrys SA |
Rudolf, Felix
High Performance Low Volume MEMS for Aerospace Defense, Industrial and Energy Applications![]() Abstract CV of presenting author |
International MEMS Industry Forum |
Compugraphics International ltd |
McCallion, Michael
The Experts Behind the Mask![]() Abstract CV of presenting author |
Exhibitor Presentations: MEMS (TechARENA) |
Continental |
Fritzsche, Harald
![]() Biography |
Advanced Packaging Conference (APC) |
Continental Automotive GmbH |
Feuerstein, Robert
Advanced Packages in Automotive Electronics - the necessary, beloved and hated Components![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Corial SAS |
Parrens, Pierre
Advances in plasma etch & deposition solutions for R&D and production![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
Corning Incorporated |
Enicks, Darwin
Thin Flexible Glass as an Enabling Material for Conformable, Flexible and Highly Integrated Electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Coventor |
Welham, Chris
Coventor Software Platform: Speed, Accuracy & Automation in MEMS Development![]() Abstract CV of presenting author |
Exhibitor Presentations: MEMS (TechARENA) |
CSEM S.A. |
Schaffer, Bernhard
High speed line and area image sensor for industrial and medical applications![]() Abstract CV of presenting author |
Imaging Conference |
CyberOptics Corporation |
Jackson, Allyn
Increasing Efficiency and Effectiveness of Processes in Lithography Related to Airborne Particle Measurement![]() Abstract CV of presenting author |
Lithography: What lithography options for tomorrow? (TechARENA) |
D | To top | |
D-SIMLAB Technologies GmbH |
Lendermann, Peter
Operations decision - support for productivity enhancement in a mature Fabs![]() Abstract CV of presenting author |
18th Fab Managers Forum |
Dainippon Screen Deutschland GmbH |
Goeke, Mark
Wafer Thinning Using a Versatile, State-of-the-Art Single Wafer Processor![]() Abstract CV of presenting author |
Exhibitor Presentations: MEMS (TechARENA) |
Dartmouth |
Fossum, Eric R.
CMOS Image Sensors: Now and Future![]() Abstract CV of presenting author |
Imaging Conference |
DAS Environmental Expert GmbH |
Cavaillier, Juliette
Reduced Utilities Consumption for Single Wafer Clean by using Point-of-Use Scrubber![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
Debiotech SA |
Piveteau, Laurent-Dominique
What MEMS can bring to medical devices : selected examples![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
DECISION |
Coulon, Olivier
World Electronic Industries : 2012 - 2017![]() Abstract CV of presenting author |
Market Briefing (TechARENA) |
Department of Bioengineering and Robotics,Tohoku University |
Tanaka, Shuji
Tiny Tactile Sensor on Bus Network![]() Abstract CV of presenting author |
International MEMS Industry Forum |
DISCO HI-TEC EUROPE GmbH |
Klug, Gerald
Solutions for thinning, dicing and packaging of power devices made of Si, Sapphire, SiC and GaN![]() Abstract CV of presenting author |
Exhibitor Presentations: Packaging (TechARENA) |
Docea Power |
Blanc, Lionel
Explore, track and validate power and thermal targets from architecture specifications to validation![]() Abstract CV of presenting author |
Low Power Conference |
DuPont Teijin Films UK Ltd |
Rollins, Keith
The development of a manufacturing infrastructure for flexible and printed electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
E | To top | |
ECPE European Center for Power Electronics e.V. |
Harder, Thomas
Power Electronics Research in the European ECPE Network - from Power Devices to Systems![]() Abstract CV of presenting author |
Power Electronics Conference |
Edwards |
Cottle, Steve
450mm - it's more than abatement, it's the solution.![]() Abstract CV of presenting author |
Fab productivity (TechARENA)
450mm |
enablingMNT Netherlands |
van Heeren, Henne
Standards and design rules for microfluidic device manufacturing![]() Abstract CV of presenting author |
International MEMS Industry Forum |
Entegris GmbH |
Lundgren, Jorgen
Next Generation Contactless Shipping Solution for bumped wafers / glass substrates at 80um -1100um thickness![]() Abstract CV of presenting author |
450mm
3D integration (TechARENA) |
EPFL |
Kis, Andras
Single-Layer MoS2 - 2D Devices, Circuits and Heterostructures![]() Abstract CV of presenting author |
2D (TechARENA) |
EpiGaN nv |
Germain, Marianne
GaN-on-Si for power electronics: large diameter epiwafers![]() Abstract CV of presenting author |
Power Electronics Conference |
Ericsson |
Di Muro, Rodolfo
Business Growth with Energy Efficient Networks![]() Abstract CV of presenting author |
Low Power Conference |
European Commission |
van Puymbroeck, Willy
Power electronics key for European industry![]() Abstract CV of presenting author |
450mm
Power Electronics Conference |
European Commission |
Reynaert, Philippe
A European Horizon on Organic and Large Area Electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
European Space Agency |
Meynart, Roland
Imaging Devices in Space![]() Abstract CV of presenting author |
Imaging Conference |
EV Group |
Pabo, Eric
Temporary Wafer Bonding for Novel MEMS Manufacturing Processes and Products![]() Abstract CV of presenting author |
International MEMS Industry Forum |
EV Group E Thallner GmbH |
Wimplinger, Markus
Nanoimprint status for HVM![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA)
Lithography: What lithography options for tomorrow? (TechARENA) |
EV Group (EVG) |
Matthias, Thorsten
Hybrid wafer bonding for 3D IC![]() Abstract CV of presenting author |
3D integration (TechARENA) |
F | To top | |
Fab Owners Association |
Guttadauro, LT
Change, Challenge and the Enduring Success of Cooperation![]() Abstract CV of presenting author |
Secondary Equipment (TechARENA) |
Facilities 450mm Consortium (F450C) |
Maynes, Adrian
Sustainability challenges in the 450mm technology node![]() Abstract CV of presenting author |
450mm |
Fairchild |
Akram, Salman
Progress in Low and Medium Voltage Power Semiconductor Devices.![]() Abstract CV of presenting author |
Power Electronics Conference |
Fairchild Semiconductor |
Neyer, Thomas
![]() Biography |
Power Electronics Conference |
Fairchild Semiconductor |
Hong, Steven
Smart Power Module and the Future![]() Abstract CV of presenting author |
Power Electronics Conference |
Fingerprint Cards AB |
Johannesson, Jan
Capacitive Fingerprint sensors capturing the mass market![]() Abstract CV of presenting author |
International MEMS Industry Forum |
FlexTech Alliance |
Ciesinski, Michael
![]() Biography |
Plastic Electronics - PE2014 |
Fondazione Bruno Kessler |
Piemonte, Claudio
Development of Silicon Photomultipliers at FBK for nuclear medicine applications.![]() Abstract CV of presenting author |
Imaging Conference |
Fraunhofer-Institute for Electronic Nano Systems ENAS |
Vogel, Martina
![]() Biography |
International MEMS Industry Forum |
Fraunhofer ENAS |
Vogel, Dietmar
Advanced Stress Analysis on TSV Structures![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Fraunhofer FEP |
Hild, Olaf R.
Organic Electronics and Organic Photodiodes![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
Fraunhofer IISB |
Pfitzner, Lothar
![]() Biography |
450mm |
Fraunhofer IISB |
Pfeffer, Markus
Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)![]() Abstract CV of presenting author |
450mm |
Fraunhofer IISB |
Oechsner, Richard
Energy Efficiency in Semiconductor Manufacturing - Tool and Fab Aspects![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
Fraunhofer IOF |
Brückner, Andreas
Multi aperture camera module with 720p-resolution using microoptics![]() Abstract CV of presenting author |
Imaging Conference |
Fraunhofer IPA |
Meßmer, Felix
Mobile robots in industrial service robotic applications![]() Abstract CV of presenting author |
18th Fab Managers Forum |
Fraunhofer IZM |
Tekin, Tolga
Hetero Silicon Photonics: Components, systems, packaging and beyond![]() Abstract CV of presenting author |
Silicon Photonics (TechARENA) |
Fraunhofer IZM |
Lang, Klaus-Dieter
Technologies and applications for thin flexible and stretchable electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Freescale |
Osajda, Marc
Sensor for Internet of Things: challenge and opportunity![]() Abstract CV of presenting author |
International MEMS Industry Forum |
FRT GmbH |
Marheineke, Bastian
Multi Sensor Metrology for Control of MEMS Production![]() Abstract CV of presenting author |
Exhibitor Presentations: MEMS (TechARENA) |
Fujifilm Electronic Materials N.V. |
Vanclooster, Stefan
Novel low temperature cure polyimide materials for enhanced package reliability in advanced packages like fan-in & fan-out CSP and 3D/IC TSV packages.![]() Abstract CV of presenting author |
3D integration (TechARENA) |
G | To top | |
G450C |
Robertson, Frank
Continued Progress on 450mm Development![]() Abstract CV of presenting author |
450mm |
Galaxy Semiconductor |
Leblond, Nicolas
Multi-Variate Part-Average-Testing Analysis to Improve Outlier Identification![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Georg Fischer Piping Systems |
Mueller, Hanspeter
Upsizing Wafer Fab UPW Needs to 450mm Demands![]() Abstract CV of presenting author |
450mm |
GLOBALFOUNDRIES |
Horstmann, Manfred
From 32/28nm partial depleted volume production to energy efficient fully depleted solutions in 28nm and beyond![]() Abstract CV of presenting author |
Low Power Conference |
GlobalSensing Technologies |
Brousse, Olivier
Artificial Neuro-Inspired Embedded Vision![]() Abstract CV of presenting author |
Imaging Conference |
H | To top | |
Hamamatsu Photonics France |
Roux, Jean
Xray & high energy imaging : applied technologies oriented perspective![]() Abstract CV of presenting author |
Imaging Conference |
HAP GmbH Dresden |
Stegemann, Burkhard
Real HEROs: Latest developments for Automated Carrier Handling![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
Heliatek GmbH |
Le Seguillon, Thibaud
![]() Biography |
Plastic Electronics - PE2014 |
Henkel Electronic Materials |
Josso, Stieven
Silver Sintering![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Heptagon Advanced MicroOptics |
Rossi, Markus
Wafer-level technologies for imaging and sensing applications in mobile devices![]() Abstract CV of presenting author |
Imaging Conference |
Hewlett Packard |
Barbarin, Rémi
Data Centers![]() Abstract CV of presenting author |
Low Power Conference |
Hillcrest Labs |
Lucien, Chad
Sensor Hubs: Enabling The Next Generation of High-Performance, Low-Power Mobile and Wearable Devices![]() Abstract CV of presenting author |
International MEMS Industry Forum |
HP |
Renaud, Gallig
Using SoCs to build datacenter servers![]() Abstract CV of presenting author |
Low Power Conference |
I | To top | |
IBS, Inc. |
Jones, Handel
FD SOI and Internet of Things![]() Abstract CV of presenting author |
Low Power Conference |
IHS |
Bouchaud, Jérémie
Sensors for the Internet of Things: how big is the opportunity![]() Abstract CV of presenting author |
International MEMS Industry Forum |
Imagination Technologies |
Hasan, Munir
MIPS: Multi-Threaded RISC Architecture to Enable Higher Performance in Low Power Applications![]() Abstract CV of presenting author |
Low Power Conference |
IMEC |
Willems, Maarten
CMOS-based innovations for specialty imaging industries to consumer applications![]() Abstract CV of presenting author |
18th Fab Managers Forum
Imaging Conference |
IMEC |
Dekoster, Johan
![]() Biography |
2D (TechARENA) |
IMEC |
Lauwers, Lode
Eco system requirements to enable further system scaling and semiconductor manufacturing effectiveness![]() Abstract CV of presenting author |
450mm |
IMEC |
Van Hoof, Chris
Generic Silicon Technologies for Individualized Medicine![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
IMEC |
Hendrickx, Eric
EUV lithography: On the move from pre-production to production![]() Abstract CV of presenting author |
Lithography: What lithography options for tomorrow? (TechARENA) |
IMEC |
Barla, Kathy
FinFeT: challenges and opportunities![]() Abstract CV of presenting author |
Low Power Conference |
IMEC |
Heremans, Paul
Thin-film transistors on plastic: manufacturability and applications![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
IMEC |
Huyghebaert, Cedric
2D materials : From Advanced CMOS to Beyond CMOS devices![]() Abstract CV of presenting author |
2D (TechARENA) |
IMEC |
La Manna, Antonio
3D System Integration - Technology choices and challenges![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC)
3D integration (TechARENA) |
IMEC & Ghent University |
Vanfleteren, Jan
The use of elastic and thermoplastic polymer carriers for the fabrication of randomly shaped electronic circuits![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Imina Technologies SA |
Dagon, Benoît
Probe smaller, probe smarter, or how micro-robots can help shorten the development cycle of your products![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Infineon |
Irsigler, Peter
Power Semiconductors on 300mm Wafers![]() Abstract CV of presenting author |
Power Electronics Conference |
Infineon AG |
Labs, Lutz
Increasing the Automation Level in running Fabs![]() Abstract CV of presenting author |
18th Fab Managers Forum |
Infineon Technologies AG |
Sturm, Johannes
Automation as Key Enabler for Productivity Increase![]() Abstract CV of presenting author |
18th Fab Managers Forum
Fab productivity (TechARENA) |
Infineon Technologies AG |
Vock, Stefan
![]() Biography |
16th European Manufacturing Test Conference (EMTC) |
Infineon Technologies AG |
Janker, Achim
Secondary Equipment and 300 mm - Opportunities & Challenges![]() Abstract CV of presenting author |
Secondary Equipment (TechARENA) |
Infineon Technologies AG |
Wille, Catharina
One Material - Two Worlds: Sintering Die Attach on DCB and Leadframe![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Infineon Technologies AG |
Miller, Gerhard
Power Electronics - the ultimate path to CO2 reduction![]() Abstract CV of presenting author |
Power Electronics Conference |
Infineon Technology AG |
Roemer, Bernd
![]() Biography |
Advanced Packaging Conference (APC) |
Institut de la vision |
Picaud, Serge
Imaging in ophthalmology: From eye astronomy to artificial retina for visual restoration in blind patients![]() Abstract CV of presenting author |
Imaging Conference |
Intel Ireland Ltd |
Capraro, Bernie
![]() Biography |
450mm |
Interposers GmbH |
Kaiser, Thomas
3D-printed Interposer as an intermediate layer for the 3D integration of micro electronic components![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
IOF |
Bräuer, Andreas
![]() Biography |
Imaging Conference |
ISORG |
Jamet, Laurent
Image sensors in organic and plastic electronics for Industry 4.0 and Internet-Of-Things![]() Abstract CV of presenting author |
Plastic Electronics - PE2014
Imaging Conference |
J | To top | |
JEM Europe |
Mai, Joe
Trends in Wafer Probing: Challenges and Solutions![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Joanneum Research Forschungsgesellschaft mbH |
Stadlober, Barbara
High performance organic electronics fabricated by self-aligned lithography on large scale![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
K | To top | |
Kaleido Technology ApS |
Holme, Christian
All-glass wafer-level lens manufacturing technology for industrial imaging applications![]() Abstract CV of presenting author |
Imaging Conference |
L | To top | |
Logitech ltd |
Forsyth, Kirstin
Akribis-Air: A new innovation in wafer processing![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
Low-Power Electronics Association & Project (LEAP), Renesas Electronics Corporation |
Kamohara, Shiro
Ultralow-Voltage Design and Technology of Silicon-on-Thin-Buried-Oxide (SOTB) CMOS for Highly Energy Efficient Electronics in IoT Era![]() Abstract CV of presenting author |
Low Power Conference |
M | To top | |
MCRT GmbH |
Dobler, Maximilian
Minienvironments: flexible solutions![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
memsstar Limited |
Connock, Peter
![]() Biography |
Secondary Equipment (TechARENA) |
Microelectronic Packaging Dresden GmbH |
Steinhof, Falk
Packaging of integrated optical sensor systems![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
MultiXDetection |
Radisson, Patrick
MultiX - multi energy spectrometric X-ray detectors for various applications![]() Abstract CV of presenting author |
Imaging Conference |
N | To top | |
NANIUM, S.A. |
Tavares, Armando
![]() Biography |
Advanced Packaging Conference (APC) |
NANIUM S.A. - Niederlassung Dresden |
Kroehnert, Steffen
New WLP-Technology-Fusion Concept Offers Significant Advantages![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC)
Exhibitor Presentations: Packaging (TechARENA) |
Nasiri Ventures |
Nasiri, Steve
Building Successful MEMS Company: From Start to IPO![]() Abstract CV of presenting author |
International MEMS Industry Forum |
National Center for Scientific Research DEMOKRITOS |
Dimoulas, Athanasios
Epitaxial MoSe2 semiconductor heterostructures on AlN/Si(111) substrates![]() Abstract CV of presenting author |
2D (TechARENA) |
New Imaging Technologies |
Potet, Pierre
New Developments on CMOS Logarithmic Image Sensor![]() Abstract CV of presenting author |
Imaging Conference |
Nikkoia |
Jutant, Alain
Imaging applications based on organic materials![]() Abstract CV of presenting author |
Imaging Conference |
Nokia |
Ryhänen, Tapani
Graphene in Flexible Electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
NovaCentrix |
Rawson, Ian
Commercialization Case Study: Implementation of Copper Oxide Conductive Ink with Photonic Curing for Production RFID in Integrated High-Volume Production![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
NUS |
Alioto, Massimo
Enabling the IoT through ultra-low voltage operation: down to the threshold and below![]() Abstract CV of presenting author |
Low Power Conference |
O | To top | |
Oclaro Technology Ltd. |
Wale, Michael
Low-Cost Access to Advanced Photonic Foundry Processes in InP![]() Abstract CV of presenting author |
Silicon Photonics (TechARENA) |
Oxford Instruments |
Bourke , Michelle
Leading Techniques for the Nano-scale Etching and Deep Etching of Silicon![]() Abstract CV of presenting author |
Exhibitor Presentations: MEMS (TechARENA) |
Oxford Instruments |
Cooke, Mike
Early production testing of 450mm process modules![]() Abstract CV of presenting author |
450mm |
P | To top | |
PandA Europe |
Longford, Andy
![]() Biography |
Advanced Packaging Conference (APC) |
Parrot |
Dorval, David
ASIC and SYSTEM tests partitioning for consumer and automotive infotainment markets![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Parrot |
Levy, Yannick
Power Dissipation in the Design of Consumer Products and Drones![]() Abstract CV of presenting author |
Low Power Conference |
Particle Measuring Systems |
Rodier, Dan
Recent Advances and Challenges in Nanoparticle Monitoring for the Semiconductor Industry![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
PEER Group |
Schmalz, William
An Agile Approach to Automation Software for Tool Control![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
PEER Group GmbH |
Arnold, Michael
![]() Biography |
Fab productivity (TechARENA) |
Philips Research |
Cennini, Giovanni
What to plasticize and what not (yet) to plasticize? A general lighting application perspective![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Pixalys |
Rommeveaux, Philippe
Specialized Design House for High Performances CMOS Image Sensors![]() Abstract CV of presenting author |
Imaging Conference |
Plasma-Therm LLC |
Lazerand, Thierry
Plasma dicing, A new technology to improve the overall device manufacturing ecosystem![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Plastic Logic |
Banach, Mike
Flexible AMOLED display driven by organic TFTs on a plastic![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Presto Engineering |
de Ledinghen, Edouard
Cost-effective RF MEMS wafer test solution![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Presto Engineering |
Mayor, Cedric
![]() Biography |
16th European Manufacturing Test Conference (EMTC) |
Prismark Partners |
Swiggett, Brian
A Rapidly Changing Test Landscape![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Q | To top | |
Qualcomm Technologies |
Badaroglu, Mustafa
System Integration: More Moore![]() Abstract CV of presenting author |
Low Power Conference
ITRS: Trends in Enabling Technologies (TechARENA) |
R | To top | |
RECIF Technologies |
Delpu, Guilhem
450mm progress - toward cross collaboration & cross utilization![]() Abstract CV of presenting author |
450mm |
Red Belt SA |
Jaffard, Jean-Luc
![]() Biography |
Imaging Conference |
Renault |
Cregut, Samuel
Technical and economical challenges and stakes of the charge of electric vehicles![]() Abstract CV of presenting author |
Power Electronics Conference |
ReSeCo |
Segers, Rene
![]() Biography |
16th European Manufacturing Test Conference (EMTC) |
Robert Bosch GmbH |
Widmer, Thorsten
Secondary equipment- a strategic approach in a 200mm semiconductor and MEMS Fab![]() Abstract CV of presenting author |
18th Fab Managers Forum
Secondary Equipment (TechARENA) |
Robert Bosch GmbH |
Fischer, Andreas
![]() Biography |
Advanced Packaging Conference (APC) |
Robert Bosch GmbH |
Gross, David
Ultrasonic Heavy Copper Wire Bonding on Silicon Dies with Electroplated Copper Bond Pads![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Robert Bosch GmbH |
Koyuncu, Metin
![]() Biography |
Plastic Electronics - PE2014 |
Rockwood Wafer Reclaim |
PEYRE, Georges
European bespoke wafer processing & development solutions for : Grinding, CMP, Edge Treatment, Wafer Bonding, Dicing and Cleaning![]() Abstract CV of presenting author |
3D integration (TechARENA) |
Roos Instruments |
Roos, Marc
Finding meaning in semiconductor manufacturing data using Rich Interactive Test Data Base (RITdb)![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Roth & Rau - Ortner GmbH |
Spannring, Ulrich
Higher Yield with Nitrogen: The retrofitable FOUP Purge System for Existing Storage Bins![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
Roth und Rau B.V. |
Lichtenberg, Claus K.
Printed Electronics: Hybrids![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Rudolph Technologies |
Kaoui, Mounir
Increasing fab productivity in mask shops![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
Rudolph Technologies |
Cochet, Philippe
Advanced Packaging related lithography challenges![]() Abstract CV of presenting author |
Exhibitor Presentations: Packaging (TechARENA) |
S | To top | |
Salland Engineering |
Martignoni, Stefano
![]() Biography |
16th European Manufacturing Test Conference (EMTC) |
Schneider Electric |
Dorn, David
Multisensor Camera Architectures for Security and Operational Applications![]() Abstract CV of presenting author |
Imaging Conference |
Schneider Electric |
Wang, Miao-Xin
Power electronics in industrial applications: key innovations, impacts and perspectives![]() Abstract CV of presenting author |
Power Electronics Conference |
Schneider Electric |
Venet, Cécile
Challenges & Opportunities for Printed Electronic and 3D-MID within Schneider Electric![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Schneider Electric |
Chabanis, Gilles
Ultra Low Power wireless sensors in Buildings![]() Abstract CV of presenting author |
Low Power Conference |
Schneider Electric Industries |
Brosset, Pascal
From pervasive sensing to operational efficiency a path towards internet of everything![]() Abstract CV of presenting author |
Imaging Conference |
Schweizer Electronic AG |
Gottwald, Thomas
Printed Circuit Board (PCB)-based IC Embedding and Package Technology![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
SEMI |
van den Kieboom, Ed
![]() Biography |
Plastic Electronics - PE2014 |
SEMI |
Tracy, Daniel
SEMI Market Outlook- Fab Investments and Equipment Spending Forecast![]() Abstract CV of presenting author |
Market Briefing (TechARENA) |
Semi Consulting |
van Nooten, Bas
![]() Biography |
450mm |
SEMI Europe |
Raithel, Stephan
![]() Biography |
Exhibitor Presentations: MEMS (TechARENA) |
SEMI Europe |
Kundert, Heinz
![]() Biography |
International MEMS Industry Forum
18th Fab Managers Forum |
SEMI Europe |
Georgoutsakou, Ourania
![]() Biography |
Exhibitor Presentations: Packaging (TechARENA) |
Sencio |
van Dommelen, Ignas
![]() Biography |
International MEMS Industry Forum |
SiCrystal AG |
Stockmeier, Matthias
Status of silicon carbide substrate production by physical vapor transport method![]() Abstract CV of presenting author |
Power Electronics Conference |
Siliconware Precision Industries Co., Ltd.(SPIL) |
Lan, Albert
Challenges of Flip Chip Packaging with Embedded Fine Line and Coreless Substrate![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
Siltronic AG |
Muemmler, Frank
Advanced Silicon Substrates for Power Technologies![]() Abstract CV of presenting author |
Power Electronics Conference |
Soda Ltd |
Warman, Fiddian
How can design thinking type approaches be effective in facilitating innovative technological development and open up new markets and opportunities?![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Sofradir |
Billon-Lanfrey, David
French infrared technologies offering competitive edges to imaging sensors business![]() Abstract CV of presenting author |
Imaging Conference |
SOITEC |
Auberton-Herve, André-Jacques
Agile manufacturing in an innovative and competitive European semiconductor ecosystem![]() Abstract CV of presenting author |
18th Fab Managers Forum |
SOITEC |
Mazure, Carlos
Material Solutions to address the Wireless Low Power Demands![]() Abstract CV of presenting author |
Low Power Conference |
SOITEC |
Radu, Ionut
![]() Biography |
3D integration (TechARENA) |
SOITEC |
Rigny, Arnaud
Smart power technology needs smart substrate![]() Abstract CV of presenting author |
Power Electronics Conference |
Soligie, Inc. |
Heitzinger, John
Advances in Additive Manufacturing of Electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
SORIN CRM |
Dal Molin, Renzo
Active implantable medical devices requirements for Nanoelectronics![]() Abstract CV of presenting author |
Low Power Conference
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
ST Microelectronics |
Rabouin, Jean Pierre
Lean : the ST Manufacturing strategy for Efficiency![]() Abstract CV of presenting author |
18th Fab Managers Forum |
STMicroelectronics |
Portelli-Hale, Chris
![]() Biography |
16th European Manufacturing Test Conference (EMTC) |
STMicroelectronics |
Le Pailleur, Laurent
![]() Biography |
Low Power Conference |
STMicroelectronics |
Zuffada, Maurizio
![]() Biography |
Silicon Photonics (TechARENA) |
STMicroelectronics |
Vasseur, Marc
![]() Biography |
Imaging Conference |
STMicroelectronics |
Finck, François
Improving manufacturing efficiency thanks to collaborative European projects![]() Abstract CV of presenting author |
Fab productivity (TechARENA) |
STMicroelectronics |
Cathelin, Andreia
Fully integrated CMOS THz Imaging Solutions![]() Abstract CV of presenting author |
Imaging Conference |
STMicroelectronics |
Cogez, Patrick
Outside system connectivity![]() Abstract CV of presenting author |
ITRS: Trends in Enabling Technologies (TechARENA) |
STMicroelectronics |
Jacquet, David
Architectures for Energy Efficiency and power management![]() Abstract CV of presenting author |
Low Power Conference |
STMicroelectronics |
Ferrera, Marco
Manufacturing challenges of MEMS for wearable electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
STMicroelectronics |
Pagani, Alberto
3D IC Test through Power-Line Methodology![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
STMicroelectronics |
Boeuf, Frederic
Recent Progress in 300mm Si-Photonics R&D and Manufacturing![]() Abstract CV of presenting author |
Silicon Photonics (TechARENA) |
STMicroelectronics |
Clerc, Christian
Secondary equipment opportunities, risks and advantages![]() Abstract CV of presenting author |
Secondary Equipment (TechARENA) |
STMicroelectronics |
Chery, Jean-Marc
Highly Energy Efficient Nanotechnologies and Applications![]() Abstract CV of presenting author |
Low Power Conference |
STMicroelectronics |
Imbs, Yvon
From Design To Packaging: Necessity & Limitation Of Verification & Simulation Tools![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
STMicroelectronics |
Skotnicki, Thomas
Ultimate scaling of CMOS technologies![]() Abstract CV of presenting author |
Low Power Conference |
STMicroelectronics |
Perriaud, Eric
ST Low cost wire bonding solution : Copper Cu, CuPd and Silver alloy results and startegy down to Ultra Fine Pitch 45 µm BPP (30µm Ball diameter process)![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |
STMicroelectronics |
Rochereau, Krysten
What's aside of Megapixel race: Imager & Photonics Process Development for Mass Production![]() Abstract CV of presenting author |
Imaging Conference |
STMicroelectronics |
Lule, Tarek
Automotive Camera Systems - Photons to Ethernet![]() Abstract CV of presenting author |
Imaging Conference |
STMicroelectronics |
Saggio, Mario
SiC and GaN power devices: technologies and products![]() Abstract CV of presenting author |
Power Electronics Conference |
STMicroelectronics Srl |
Contiero, Claudio
Challenges on BCD Technology Evolution![]() Abstract CV of presenting author |
Power Electronics Conference |
Sunchon National University |
Cho, Gyoujin
Fundamentals to Start Fully R2R Gravure Printed Flexible Logic Circuits and TFT Backplane Arrays![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Supergrid Institute |
Mermet-Guyennet, Michel
Silicon Carbide devices for high voltage / high current applications![]() Abstract CV of presenting author |
Power Electronics Conference |
System Plus Consulting |
Fraux, Romain
Technological and cost evolution of consumer inertial combo sensors![]() Abstract CV of presenting author |
International MEMS Industry Forum |
SYSTEMA GmbH |
Luhn, Gerhard
Manufacturing Intelligence and BIG DATA in Real-Time![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
T | To top | |
Techcet Group, a Techcet CA LLC Company |
Shon-Roy, Lita
The Impact on Process Materials Requirements for 3D Transistors and Vertical NAND![]() Abstract CV of presenting author |
Market Briefing (TechARENA) |
Telekom Innovation Laboratories |
Swaminathan, Rahul
Imaging and Telcommunications![]() Abstract CV of presenting author |
Imaging Conference |
TestCIM Consulting |
Hartman, Don
Outlier technologies ... how to select the right method![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Thin Film Electronics AB |
Eriksson, Torbjörn
Printed Electronics: Status, outlook and manufacturing challenges![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
TNO |
Kievit, Olaf
450mm synergies for smaller wafer diameters: contamination control![]() Abstract CV of presenting author |
450mm |
TRONICS |
Renard, Stephane
Submicron Technologies for MEMS at Tronics : evolution or revolution ? A new industrial generic technology platform for Integrated MultiDOF Sensor![]() Abstract CV of presenting author |
International MEMS Industry Forum |
TRUMPF Hüttinger & SPM |
Andreea Vasiliu, Tobias Keller,
State of the art RF generators - cost-efficient adaptation to your systems![]() Abstract CV of presenting author |
Secondary Equipment (TechARENA) |
TSMC |
Yu, Douglas
Wafer-Level-System-Integration (WLSI) Technologies For 2D and 3D System-in-Packaging![]() Abstract CV of presenting author |
3D integration (TechARENA) |
TU Delft |
Graef, Mart
ITRS 2.0![]() Abstract CV of presenting author |
ITRS: Trends in Enabling Technologies (TechARENA) |
U | To top | |
UJF / CNRS / CHU Grenoble |
Cinquin, Philippe
From Computer Assisted Medical Interventions to micro-nano implanted medical robots![]() Abstract CV of presenting author |
Application driven technology: Nanoelectronic for Healthcare (TechARENA)
Imaging Conference |
Univ. of Cambridge / EPSRC Centre for Innovative Manufacturing in Large-Area Electronics |
Occhipinti, Luigi G.
![]() Biography |
Plastic Electronics - PE2014 |
Univ. Paris Sud |
Marris-Morini, Delphine
Silicon photonics on 300mm platform![]() Abstract CV of presenting author |
Silicon Photonics (TechARENA) |
Universal laser Systems |
Hillman, Joseph
Application of Multiple Wavelength Laser Processing to the Fabrication of Flexible Electronic Circuits![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
University of Applied Sciences Wiener Neustadt |
Nemecek, Alexander
System-On Chip Gas Sensor with TSV-contacts in 0.35µm CMOS technology![]() Abstract CV of presenting author |
International MEMS Industry Forum |
University of Pisa |
Fiori, Gianluca
What can we expect from two-dimensional materials for electronic applications? A simulation study![]() Abstract CV of presenting author |
2D (TechARENA) |
V | To top | |
VALEO |
Vanhelle, Stephane
Flexible electronics in Intuitive Driving![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
VTT technical research centre of Finland |
Kaisto, Ilkka
PrintoCent towards industrialization of Printed Intelligence![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
W | To top | |
Wavelens |
Pouydebasque, Arnaud
Wavelens - Shaped for Sharpness![]() Abstract CV of presenting author |
Imaging Conference |
X | To top | |
X-Celeprint Limited |
Bower, Christopher
Micro-Transfer-Printing: Assembly of Microscale Components Using Elastomer Stamps![]() Abstract CV of presenting author |
International MEMS Industry Forum |
Xcerra |
Cockburn, Peter
Using a Test-Cell-Solution Approach to Achieve Device Quality and Production-Efficiency Goals for 77GHz Automotive Radar ICs![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Xfab Mixed Signal Foundry |
Richter, Steffen
Optimizing Automatic Parametric Test (APT) in Mixed Signal / MEMS foundry![]() Abstract CV of presenting author |
16th European Manufacturing Test Conference (EMTC) |
Y | To top | |
Ynvisible |
Henriques, Ines
Printoo - a new prototyping platform for printed electronics![]() Abstract CV of presenting author |
Plastic Electronics - PE2014 |
Yole |
Mounier, Eric
Future of MEMS: Market and technologies perspective![]() Abstract CV of presenting author |
Imaging Conference
Plastic Electronics - PE2014 International MEMS Industry Forum |
Yole Développement |
Breussin, Frédéric
Medical & healthcare: What are the opportunities for MEMS and sensors?![]() Abstract CV of presenting author |
International MEMS Industry Forum
Application driven technology: Nanoelectronic for Healthcare (TechARENA) |
Yole Développement |
Gueguen, Pierric
Market & technology overview of power electronics industry and impact of WBG devices![]() Abstract CV of presenting author |
Power Electronics Conference |
Yole Développement |
Cambou, Pierre
2013 - 2018 Markets & Applications for CMOS Image Sensors![]() Abstract CV of presenting author |
Imaging Conference |
YOLE DÉVELOPPEMENT |
Eloy, Jean-Christophe
Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics:![]() Abstract CV of presenting author |
Advanced Packaging Conference (APC) |