Thursday, November 15, 2018

Smart Mobility Session

Chair Oliver Pyper, Senior Manager R&D&I Programmes, Infineon Technologies Dresden GmbH & Co. KG
Oliver Pyper

Oliver Pyper
Senior Manager R&D&I Programmes
Infineon Technologies Dresden GmbH & Co. KG

Oliver Pyper

Biography
Dr. Oliver Pyper (m) holds a Diploma in chemistry and a PhD in natural science. After investigating basic principles of electrochemical effects in thin film oxides at the Technical University of Berlin, he joined Infineon Technologies Dresden in 2000. Until 2005 he was responsible for a module of the DRAM-technology and managing several projects for optimising current technologies and fast ramp of new technologies. In 2005 he changed to production, managing several projects to improve the manufacturing landscape. Since 2007 he has taken the responsibility for establishing consortia in R&D&I programmes. Dr. Pyper has been leading several projects on regional, national and european level focusing on More-than-Moore technologies, automation and power semiconductors.

10:00 Opening
  Oliver Pyper, Senior Manager R&D&I Programmes, Infineon Technologies Dresden GmbH & Co. KG
10:05 TBA
  Bram van den Ende, Project Manager, TNO
10:25 TBA
  Martin Donoval, NanoDesign
10:45
A new ADAS Chip Design in 22 nm FDSOI Technology for Automotive Computer Vision Applications
  Jens Benndorf, Managing Director, COO, DreamChip Technologies
A new ADAS Chip Design in 22 nm FDSOI Technology for Automotive Computer Vision Applications
Jens Benndorf

Jens Benndorf
Managing Director, COO
DreamChip Technologies

Jens Benndorf

Abstract
The presentation explores the European collaboration for a System-on-Chip development for Advanced Driver Assistance Systems (ADAS) in a brand new 22nm FDSOI low power technology implementation from Global Foundries. The presentation will elaborate on the history of the project, the partnership of the German consortium, the technology itself as well as on the target System-on-Chip implementation and the different applications within future ADAS devices. According to market analysis’s more than 60% of the cars sold today are equipped with different driver assistance systems and this number will grow over next years further. Because of growing demand, but also because of the very fast growing complexity and performance requirements of such systems cost reduction and power consumption become more and more important. Both requirements are addressed by the new architecture. A special focus will be put on HW/SW codesign trade offs to address flexibility, low power consumption and high performance requirements. The presentation will highlight ADAS applications like 360o top view cameras, Camera based automotive mirror replacement, massive CNN processing and the chip reference board demonstration of the final system.

Biography
Jens Benndorf has a PhD. from Moscow University (1991) where he researched DSP technologies for use in high speed voice band modems. Jens’ passion for DSPs continued within international blue chip companies including Alcatel, BridgeCo, Infineon and Silicon Image. He built and led teams developing products for early DSL and complex imaging applications. In 2010 Jens cofounded DreamChip Technologies GmbH and now leads the company in his role as MD and COO. DreamChip specialise with 80 engineers team in multi processor system on chip designs for automotive camera and imaging applications. The company is based in Hannover and Hamburg, Germany and is a member of the Silicon Saxony network.

11:05
Wafer Foundry Solutions for Smart Mobility Systems
  Alexander Muffler, Business Line Manager Automotive, X-FAB Semiconductor Foundries AG
Wafer Foundry Solutions for Smart Mobility Systems
Alexander Muffler

Alexander Muffler
Business Line Manager Automotive
X-FAB Semiconductor Foundries AG

Alexander Muffler

Abstract
This presentation will show the challenges seen from the viewpoint of a silicon foundry for analog/mixed signal devices developed and manufactured for Smart Mobility Systems. Smart Mobility Solutions require a wide range of semiconductor solutions. In addition to the main processing units and software solutions multiple sensor interfaces and actuator drivers are required in Smart Mobility Systems which are the interface to the analog world. These interface chips need to be designed on robust and highly reliable semiconductor processes. Such devices have to cope with the harsh automotive environments and often have to include high voltage, non-volatile memory (NVM) and extended temperature ranges on one chip. This needs to be considered not only already by the foundry at semiconductor process and NVM IP development stage but also during manufacturing in automotive certified semiconductor factories. To enable IC designers developing such high reliable products specific foundry support with simulation models which behave as close as possible to the real silicon, but also tools for lifetime calculation based on user defined mission profiles are available as well as memories with built-in ECC are just a few examples what the foundry has to offer in addition to a very close collaboration between the foundry and its clients to ensure highest possible quality with zero incidents during lifetime.

Biography
As Business Line Manager Automotive, Alexander Muffler is responsible for the development of product marketing strategies for Automotive semiconductor processes as well as NVM IP for integrated circuit technologies. Prior to joining X-FAB, he worked for Chartered Semiconductor as EDA Manager Europe. Earlier, Alexander worked as an ASIC design engineer at Thesys GmbH. Alexander has more than 25 years of semiconductor technology and design experience. He holds a Master’s degree in Telecommunication Engineering from the University of Applied Science in Konstanz, Germany.

11:25 TBA
  Gerald Dallmann, Microelectronics & Special Analytics Division Manager, SGS
11:45 Closing
  Oliver Pyper, Senior Manager R&D&I Programmes, Infineon Technologies Dresden GmbH & Co. KG