Tuesday, November 13, 2018
Session

Heterogeneous Multifunctionality Integration

11:00 Introduction
  Wilfried Lerch, Corporate Director R&D and Technology, Centrotherm
11:10
Recent Developments in Multifunctional Integration
  Stephan Guttowski, Head of Technology Park »Heterointegration«, Fraunhofer FMD
Recent Developments in Multifunctional Integration
Stephan Guttowski

Stephan Guttowski
Head of Technology Park »Heterointegration«
Fraunhofer FMD

Stephan Guttowski

Abstract
New device technologies and applications with their ever increasing performance and functionality are driving the requirements and innovation for assembly and packaging. The technology boundaries between semiconductor technology, packaging and system design are becoming blurred. As a result chip, package and system designers will have to work closer together than ever before in order to drive the performance for future microelectronic systems. In addition heterogeneous integration will be an integral aspect for all future advanced electronic applications.

Biography
Dr.-Ing. Stephan Guttowski studied electrical engineering at TU Berlin, focusing on measuring and automation technology, and then went on to do a doctorate in electromechanical compatibility. He then did a post-doc at the Massachusetts Institute of Technology (M.I.T.) in Cambridge. After returning to Germany, Guttowski first worked in the electric drive research lab at DaimlerChrysler AG and, in 2001, moved to the Fraunhofer Institute for Reliability and Microintegration IZM. Here, he was initially chairman of the Advanced System Development group before taking over the System Design & Integration department. Since June 2017, Guttowski has been technology park manager in the FMD and, within this role, works towards cross-institute cooperation.

11:30
Versatile Silicon Photonic Platform for Datacom and Computercom Applications
  Bertrand Szelag, Head of silicon photonic lab, CEA-LETI
Versatile Silicon Photonic Platform for Datacom and Computercom Applications
Bertrand Szelag

Bertrand Szelag
Head of silicon photonic lab
CEA-LETI

Bertrand Szelag

Abstract
The explosive growth of information exchange requires scalable, high-yield and cost-effective integration of microsystems. Silicon photonics is becoming a technology of choice for optical communications. Compatibility with cmos manufacturing process is one key of success since it allows taking advantage of the production capacities of foundries; i.e. big volume and low cost manufacturability [1-2]. Integration of high performances devices is the key of success for these platforms. Today, many silicon platforms are available in foundry with similar device offer aiming to address at least 25 Gb/s applications. CEA-Leti has developed such base line silicon photonic technology with demonstrated results for 50 Gb/s data rate. New technological challenges are explored to improve the capacities of this platform by developing new integration schemes such as multilevel silicon, integration of a silicon nitride level on top of the silicon or heterogeneous materials and specific edge coupling processing. We are presenting here results on 3 add-on developed on our silicon photonic platform: • silicon nitride and hybrid silicon nitride on silicon device • Hybrid III-V on silicon laser • 3D packaging

Biography
Dr Bertrand SZELAG received the Master degree in Physics from the University of Lille in 1994 and the PhD degree in Microelectronics from the University of Grenoble in 1999. He has been a visiting researcher in Tohoku University in 1997 working in the field of sub-100nm CMOS transistor properties. In 1999 he joint STMicroelectronics in Crolles, France to work on BiCMOS platfrom development for Analog/RF applications. Since 2013, he has been with the LETI, MINATEC Institute, Grenoble, France as a Project Manager and senior process integration researcher in the field of silicon photonic devices. His current research activities included high speed silicon modulator, germanium photodetectors and hybrid III-V laser integration in silicon. He is the author or co-author of more than 50 papers in scientific journals and international conference proceedings in the field of CMOS, Bipolar and DMOS transistors and silicon photonic devices.

11:50 Towards Smart Integrated Photonic Building Blocks
  Meint Smit, Professor, TU Eindhoven
12:10 TBA
  Adrian Ionescu, Full Professor, EPFL
12:30
Challenges of mounting magnetic materials in electronics
  Jens Müller, Coordinator Innovation Projects, XENON Automatisierungstechnik GmbH
Challenges of mounting magnetic materials in electronics
Jens Müller

Jens Müller
Coordinator Innovation Projects
XENON Automatisierungstechnik GmbH

Jens Müller

Abstract
Automotive electronics will show an annual 2-digit growth until 2025. One driver of this development is the increasing number of sensors and actuators in vehicles. This is not only due to additional functions of driver assistance systems, but also due to the demand for lower-emission and more efficient drive systems. New sensor functionalities also require new or diversified sensor designs with partly new components and materials. Here, magnetic materials also play an important role. The results are heterogeneous systems, which require new manufacturing technologies. The classic back-end sensor packaging is facing new challenges. The processing of magnetic materials creates several problems. These are among other things the clean feeding of magnets and a damage-free handling. Adhesive technologies must be adapted to different materials, including a desired short curing time. Despite the processing of roughly tolerated magnetic materials, a high accuracy in the placement must be achieved. Furthermore, the automation concept should enable a high production rate with short cycle times and continuous data tracking during the packaging process. XENON has many years of experience in the development of product-specific equipment, especially for sensor and actuator mass production. In the context of an EU-funded project "IoSense", preliminary studies were carried out for special technologies to produce magnetic sensors, how process safety can be realized together with high quality requirements. Some results will be presented.

Biography
Dr.rer.nat. Jens Müller Studied Physics (including doctorate on CIGS thin film solar cells) in Germany and worked thereafter as postdoc in the field of X-Ray diffraction at NIST, Boulder USA. Work in the industrial sector included semiconductor reliability and reliability of thin film solar cells. Actual position at XENON Automatisierungstechnik GmbH includes work as project coordinator for the funding acquisition and supervision of R&D projects.

12:50 Closing Remarks & End