Monday, November 12, 2018
 

Networking Reception

19:30 Restaurant LEHEL
  Karl- Scharnagl Ring 6-8, 80538 München

Tuesday, November 13, 2018
Market Presentation

11:00 Welcome
11:05
2016-2019 FABulous Years: The Impact of Korea, China and the Surge in 200mm Demand
  Lara Chamness, Senior Market Analyst Manager, SEMI
2016-2019 FABulous Years: The Impact of Korea, China and the Surge in 200mm Demand
Lara Chamness

Lara Chamness
Senior Market Analyst Manager
SEMI

Lara Chamness

Abstract
Coming off of a record year in 2017, many are optimistic about the outlook for fab investments in 2018 and 2019 as well. If this forecast plays out, it will be the first time since the mid-1990's the industry has had four consecutive years of growth. This presentation will provide an overview of historical fab trends but will focus on the latest data from SEMI's World Fab Forecast highlighting regional trends, fab spending, including equipment, and fab capacity trends in 2018 and 2019. A discussion of 200mm fab trends will also be included.

Biography
Ms. Lara Chamness is a Senior Manager Market Analysis at SEMI® and is responsible for SEMI’s data collection programs for equipment and materials. This includes leading interactions with SEMI’s participating companies, partners and subscribers. Ms. Chamness has 18 years of industry experience and has BA/MS degrees in environmental sciences and a MBA degree from Santa Clara University.

Session 1

Flexibility as Key Element for European Manufactures

11:30
MEMS – One Product one process?
  Udo Gómez, Senior Vice President, Robert Bosch GmbH
MEMS – One Product one process?
Udo Gómez

Udo Gómez
Senior Vice President
Robert Bosch GmbH

Udo Gómez

Abstract
The demand and variety of applications for MEMS sensors has been growing steadily since the first series applications in the automotive sector in the early 1990s. Especially since the rise of fast-moving consumer markets, quick and efficient design has become increasingly important. However, in particular for MEMS, the strong interaction of product design and manufacturing processes is a major challenge. The growing number of applications for sensing of various physical and increasingly chemical parameters, often require specific solutions in MEMS production, chip level packaging and component testing as well. Fast and market-driven product development is only possible through innovative design concepts and the provision of modular process building blocks. A deep understanding of the interrelationships and the development of corresponding simulation tools are further key competencies. As market leader in MEMS sensor business and one of the first MEMS pioneers, BOSCH is continuously pushing forward the development of MEMS technology. The extension of our process platform originally defined for automotive applications to consumer products opens up new possibilities in the realization of complex 3D structures. This enables new product designs that are reflected in high-performance sensors for both automotive and consumer electronics applications. The presentation gives a short overview of the different requirements on MEMS technology compared to standard IC design and manufacturing. It provides insights into the future development in the field of surface micromechanics and highlights challenges and solutions of MEMS technology development and manufacturing as well as design methodology. In addition, we give examples of new design and product concepts and finally question: Does the old MEMS law "one product, one process" continue to apply?

Biography
Dr. Udo-Martin Gómez Senior Vice President Sensor Engineering, Robert Bosch GmbH Dr. Gómez is Senior Vice President of Robert Bosch GmbH. He is heading the Sensor Engineering at Bosch Automotive Electronics (AE/NE-SE) in Reutlingen, Germany, the world’s largest MEMS supplier serving the Automotive, Consumer Electronics and IoT industry. Having completed his doctorate in physics, Dr. Gómez started his career at Robert Bosch GmbH in 1999 at Corporate Sector Research and Advanced Engineering (MEMS technology). Before joining Bosch Automotive Electronics in April 2018, he worked in various management positions at Bosch and also held the position of Chief Expert for MEMS sensor technology. From 2013 to March 2018, he was Chief Technical Officer of Bosch Sensortec GmbH - a fully-owned subsidiary of Robert Bosch GmbH, responsible for research and development of micro-electro-mechanical sensors (MEMS) for consumer electronics, smartphones, security systems, industrial technology and logistics. Since 2014, Dr. Gómez is Deputy Chairman of the Board of VDE/VDI-Society Microelectronics, Microsystems and Precision Engineering (GMM). Since 2015, he is also member of the GSA (Global Semiconductor Alliance) EMEA Leadership Council.

11:55 LUNCH
12:45
The MEMS production challenge: How to manage an increasing MEMS production and complex R&D activities within a combined CMOS-MEMS foundry fab?
  Volker Herbig, VP BU MEMS X-FAB Group, X-FAB MEMS Foundry GmbH
The MEMS production challenge: How to manage an increasing MEMS production and complex R&D activities within a combined CMOS-MEMS foundry fab?
Volker Herbig

Volker Herbig
VP BU MEMS X-FAB Group
X-FAB MEMS Foundry GmbH

Volker Herbig

Abstract
How the CMOS foundry business model runs is well understood: a process technology is developed, a corresponding PDK is created and given to customers, followed by the product development at their side. At this point many customers can be served at the same time. This helps to achieve a high level of fab utilization and to minimize costs and risks. This model does not apply exactly for MEMS – the MEMS business model is different. Process as well as product development are very mostly customer specific and take place simultaneously for different customers within a running foundry production fab environment. On the one hand this is the key to short time to market and to robust production processes as no extra industrialization stage is needed after technology development. On the other hand this is generating various special challenges. This presentation especially talks about those challenges the fab team has to address besides the ongoing CMOS and MEMS production: - tool dedication and tool stability / matching in relation to production and empty costs - advanced metrology concepts including PCM and automatic optical outgoing inspection - process engineering support model in complex and fast running MEMS development projects … and many more. These challenges can be mastered by a deep process understanding and good process integration schemes, both based on intensive collaboration of production and development departments.

Biography
Volker Herbig, VP BU MEMS at X-FAB, oversees all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.

13:10
Next Generation of Powerful Intralogistics Automation for 200MM Semiconductor Fabs
  Heinz Martin Esser, Managing Director, Fabmatics GmbH
Next Generation of Powerful Intralogistics Automation for 200MM Semiconductor Fabs
Heinz Martin Esser

Heinz Martin Esser
Managing Director
Fabmatics GmbH

Heinz Martin Esser

Abstract
Existing 200mm semiconductor fabs can master the challenges of a 24x7 production under highest cost and quality pressure by implementing intralogistics automation solutions. In the previous years many companies operating mature fabs understood that older does not mean obsolete and started or continued their journey towards higher automated production. Fabmatics developed a variety of automation solutions in the fields of material identification and tracking, storage, transport and handling. After the first generation of these automation systems entered the fabs, left the prototype level and have been running in production for a couple of years the customer needs and requirements changed. Focused the first material handling automation solutions on general feasibility the trend now develops towards continuous improvement, stability, performance and cost of ownership, which creates new and different challenges for automation suppliers like Fabmatics. In his presentation Heinz Martin Esser will explain the newest trends of customer requirements for automation of mature fabs and how Fabmatics is tackling these challenges by developing the 2nd generation of intralogistics automation systems, which will gives the customers the opportunity to further stretch the current limits of fab performance.

Biography
Managing Director of Fabmatics GmbH and President of Silicon Saxony e.V. Heinz Martin Esser, born in 1955, completed his studies of supply engineering at the university of applied science in Cologne with diploma in 1981. In 1985 he got an additional university degree in business administration. He gained a wide experience in detailed engineering and project management for large and complex investments for nuclear industry and beverage and food industry. Later he was assigned as branch manager to build production clean rooms and facilities in semiconductor and pharmaceutical industry. In 1999 he was appointed as CEO of Roth & Rau - Ortner GmbH, Dresden (formerly Ortner c.l.s. GmbH). The company provided automated transport, storage and handling systems, RFID components and special products for cleanroom applications as well as complex systems expertise in AHMS installation and qualified services for the international semiconductor industry. Since the merger of Roth & Rau - Ortner GmbH and HAP GmbH Dresden into Fabmatics GmbH in September 2016, Heinz Martin Esser has been managing the company together with Dr. Steffen Pollack. With Fabmatics Heinz Martin Esser is responsible for “Sales & Marketing”, “Customer Service” and “Administration”. Since 2001 Heinz Martin Esser has been a member of the board of directors of the high-tech network Silicon Saxony e.V. In 2009 he was assigned to be the speaker of the board. Since 2008 he has been a member of the European Advisory Board of the worldwide industry association SEMI as well.

Session 2

Attractive through Organizational Innovation – Sharing Best Practices

13:35

Keynote

 
Innovation needs People Power
  Glenn van der Burg, Founder, People Power
Innovation needs People Power
Glenn van der Burg

Glenn van der Burg
Founder
People Power

Glenn van der Burg

Abstract
What can make a real difference between you and your competitor? Cutting edge technology? A strong brand? Cost efficiency? Especially in this era of super fast tech development, the one thing that we need to thrive is People Power. Innovation, creativity, customer intimacy, they all rely on engaged people that cooperate to be better everyday. Probably nothing new, but why is it so hard to create a workplace that is bursting with energy? In this talk, Glenn van der Burg will take you on a trip into the drivers for human behavior. What motivates us to be the best version of ourselves? What's happening to people in meetings? What sparks people's creativity? And what takes away all the energy? With insights from science, examples of innovative organisations and actions to start innovating your workplace tomorrow. And at least one guaranteed laugh!

Biography
As founder of People Power, Glenn van der Burg is striving for people-centric organizations for better performance and happy people. He facilitates groups of leaders and professionals that want to make a leap forward in making their organization people centric. Every monday Glenn hosts his radioprogram "People Power" with experts and best practices in people-centric organizations. And he is the author of two management books. His favourite quote is by prof. Gary Hamel: “You can not build an organization fit for the future if it is not fit for human beings."

14:05
From Lean Manufacturing to Lean everywhere
  Olivier Ardesi, Lean Office Director, ST Microelectronics
From Lean Manufacturing to Lean everywhere
Olivier Ardesi

Olivier Ardesi
Lean Office Director
ST Microelectronics

Olivier Ardesi

Abstract
ST Microelectronics started its Lean journey 10 years ago, in two of its main Front-End fabs. The approach covered the classical Lean tools & methods (that had to be adapted to cope with semiconductor manufacturing specificities) but also the Management system and practices in order to really bring a change in mindset & behaviors and deeper engage all employees. After 3 years,the results on the key industrial indicators were improved but more over the culture of the site had been transformed as recognized by main customers. The approach was thus expanded to all Front-End fabs, then Back-End plants, always taking into account the local context, specificities and culture. The question then arose whether this Lean approach could also be applied and bring similar improvements in non-manufacturing areas such as Technology and Product development, but also Business support functions and Sales ? How to convince organizations whose efficiency is less easily measurable and subject to continuous improvement that there really was an added-value for them to change their way-of-working with Lean ? And finally, how to make Lean a key ingredient of ST culture ? Today, 75% of ST organizations are engaged into Lean initiatives among which Technology R&D, Product development, HR, Purchasing, ICT, Sales & Marketing… In this talk, Olivier Ardesi, in charge of ST Lean office, will show how ST is following a proliferation strategy through experience sharing and a balanced mix of bottom-up and top-down approach to deploy Lean in every domain and make it part of its Leadership culture. What are the actual and foreseen benefits and what are the challenges will be part of the discussion.

Biography
Olivier Ardesi, Lean Office Director of STMicroelectronics, coordinates Lean proliferation all across ST organizations. After 10 years and various manufacturing roles in ST Rousset Front-End fab, he led the first Lean Manufacturing program in ST started in 2008. Three years later, he was in charge of deploying Lean approach among the other ST Front-end fabs. He then started to support Lean initiatives in non-manufacturing organizations, exploring how Lean principles could apply in R&D, Human Ressources, purchasing, etc.. He graduated with an engineering degree from Ecole Centrale Paris and holds an Executive MBA from EM Lyon business school.

Poster Session

What Makes Organizations Innovative and Why Does this Make Manufacturing Attractive?

Chair Manfred Kraxenberger, Vice President, ABB Switzerland
Manfred Kraxenberger

Manfred Kraxenberger
Vice President
ABB Switzerland

Manfred Kraxenberger

Biography
Manfred Kraxenberger is currently factory manager for ABB’s BiMOS wafer fab and assembly line in Lenzburg, Switzerland. Manfred Kraxenberger studied physical engineering and started working as process engineer at Siemens Semiconductor in Munich in 1986. Over the last 30 years, he has held several engineering and management positions in manufacturing as well as R&D at Siemens/Infineon/Qimonda and Globalfoundries. Prior to his current position he was in charge of ABB’s Bipolar factory.

14:30 Introduction
14:35 Smart Vocational Training: Infineon Dresden attracts Generation Z …
  Lutz Lippmann, Infineon
14:40 TBA
  Henryk Schoder, Vice President HR, X-Fab Group
14:45 TBA
  Carsten Deuper, Production Manager, NXP Semiconductors
14:50
Per aspera ad astra - innovation in a mature fab
  Alexander Urban, Unit Manager, Texas Instruments
Per aspera ad astra - innovation in a mature fab
Alexander Urban

Alexander Urban
Unit Manager
Texas Instruments

Alexander Urban

Abstract
It will be shown, that innovation in a mature fab needs a combination of neccessity, good leadership and people with the proper mindset. All items will be discussed in detail with examples.

Biography
Alexander started 1999 as a photo process engineer at Hitachi Semiconductor. He joined Texas Instruments in the same position in the year 2000. In 2009 he took over the position of an engineering section head for photo and yield enhancement. In 2016 Alexander extended his leadership to process engineering, equipment engineering and manufacturing of photo, epi and implant. Alexander holds several patents and is responsible for driving innovation in Texas Instruments Freising fab.

14:55 Digital transformation of semiconductor design to manufacturing processes
  TBA, Dassault Systèmes
15:00
Enabling Productivity, Performance and Organization Efficiency Through Equipment Intelligence™
  Marcello Della Pia, Fab Productivity Director, Lam Research
Enabling Productivity, Performance and Organization Efficiency Through Equipment Intelligence™
Marcello Della Pia

Marcello Della Pia
Fab Productivity Director
Lam Research

Marcello Della Pia

Abstract
Industry 4.0 is the current trend of automation and data exchange in manufacturing technologies. It includes cyber-physical systems, the Internet of things and cloud computing. Industry 4.0 creates what has been called a "smart factory". Which implies computerization and digitalization of all processes. This changes makes manufacturing more attractive enabling a higher level of efficiency allowing more precise and faster decision. The impact is on human resources as well since the job content became more interesting and might require a higher level of qualification in some function. At the same time it might make the production less impacted by turn over. Lam Vision for Equipment Intelligence is to be the Customer Choice For “Smart Tools Of The Future, Lam’s existing capability (sensors, data management & analytics) enables most of the Industry 4.0 potential, enabling process tools to deliver market leading process & productivity with a significant optimization in human resources. Six main components constitute the essence of Lam Research path to enabling smart tools in the semiconductor industry, which have been addressed through: Big data Machine Learning Platform: an Integrated scalable distributed big data and machine learning platform supporting fast algorithm development and customization. Automation: New robotics and platform design to increase productivity and enable lights out operation, including Monitoring & Self-Tuning. Sensors & Process Control: In-Situ & Integrated sensors monitor system and wafer status during process at high sensitivity and data rate providing greater productivity, Improved variability and Expanded process window Virtual Processing: Computational etch and virtual fabrication SW enabling fast learning & process development reducing development cost & time Advanced Productivity Solutions: Ecosystem of software and services built designed to drive improved OEE and Productivity, leveraging data

Biography
Mr. Della Pia is a semiconductor professional with 23 years of experience in high tech industry. He started his career working for Texas Instrument. When Micron Technology acquired the DRAM division of TI, he joined Micron technology. In Year 2000 he moved to China, being among the first to join the foundation of the first cutting-edge IC Foundry in China (SMIC), actively participated to the construction of semiconductor industry in the Mainland. Mr Della Pia advanced to various leadership roles across multiple Fabs and corporate position for SMIC. In 2013 He joined Lam research and currently is working as Director in the Customer Support Business Group of Lam Research, leading a team focus on Productivity Solution for Semiconductor Fabs. Mr. Della Pia is also responsible for Big Data project for Lam Research in the EMEA region. Mr. Della Pia holds a master degree in Chemical Engineering.

15:05 Smart Manufacturing enabled by Silicondash - A Big Data and Machine Learning web-based Application
  TBA, Qualtera
15:10
Predictive/Preventive Maintenance + Fab-Planning 4.0, via Augmented reality solutions
  Tobias Bausch, Director Sales & Marketing, AP&S International GmbH
Predictive/Preventive Maintenance + Fab-Planning 4.0, via Augmented reality solutions
Tobias Bausch

Tobias Bausch
Director Sales & Marketing
AP&S International GmbH

Tobias Bausch

Abstract
Imagine the following situation: You need a new wet process tool and therefore a supplier is visiting you in your fab. But he doesn’t show you some catalogues and presentations, but instead brings you a realistic virtual model of the required wet process application and positions it directly in your production hall. From the very first moment during your first supplier meeting you see how the offered wet process tool fits into your fab and which local adjustments are necessary e.g. additional space creation, adaptation of the exhaust system or others. The result for you is an optimized fab planning before the production start or the tool ordering. This great process is offered to you by the AP&S Augmented reality solution. Through a realistic, detailed visualization integrated into the real environment of your fab, you get an outlook to your future fab view. Further advantage of this AP&S solution is an optimized construction process, as the verification of design plans is possible in a very early project phase and via a virtual design review, the system including all subsystems can be viewed and discussed in a comfortable and easy to understand manner. It happens thanks to various simulation options enabling optimized matching of customer needs and supplier suggestions before and during the developing process. But our Augmented reality solution doesn’t end with the delivery of the ordered tool. It continues in the area of predictive/preventive maintenance and brings you time and cost savings in this field. The benefits of our Augmented reality solution are varied, so come and see how it can improve the performance of your fab. I look forward to meet you at the Fab Management Forum.

Biography
Tobias Bausch has been involved in the semiconductor industry since 2005. In 2007 he joined AP&S International GmbH, an international active provider of wet process solutions. In 2015 he moved to his actual function as Director Sales & Marketing. He holds a Master Degree in Technical Management CCI.

15:15 Poster session & Coffee break
15:55 Voting of best poster with lucky draw
Final Keynote

16:00

Keynote

 
TBA
  TBA, McKinsey
16:30 End