Tuesday, November 14, 2017
 

Opening Ceremony

08:45
Welcome
  Ajit Manocha, President and CEO, SEMI
Welcome
Ajit Manocha

Ajit Manocha
President and CEO
SEMI

Ajit Manocha

Abstract
Welcome speech

Biografie
Ajit Manocha is the president and CEO of SEMI. Headquartered in Milpitas, California, SEMI is the global industry association serving the electronics manufacturing supply chain. Manocha, an industry leader has over 35 years of global experience in the semiconductor industry. Manocha was formerly CEO at GLOBALFOUNDRIES, during which he also served as vice chairman and chairman of the Semiconductor Industry Association (SIA). Earlier, Manocha served as EVP of worldwide operations at Spansion. Prior to Spansion, Manocha was EVP and chief manufacturing officer at Philips/NXP Semiconductors. He began his career at AT&T Bell Laboratories as a research scientist where he was granted several patents related to microelectronics manufacturing. Today, there is a much broader scope for SEMI to help foster collaboration and fuel growth than we could have ever imagined at SEMI’s inception in 1970. This has to be accomplished without compromising the strong foundation of SEMI comprising of Equipment Suppliers and Materials makers. Given our ecosystem is rapidly expanding due to the massive explosion of applications based on the Internet and mobile devices, biomedical devices, defense, social media, artificial intelligence/machine learning, autonomous vehicles e-commerce, the Internet of Things, etc., Manocha feels it is the right time for us to evolve as the space around us evolves. Additionally, Manocha has served on the President’s committees for “Advanced Manufacturing Partnerships” and the President’s Council of Advisors on Science & Technology (PCAST) during the last 4+ years.

08:50
Empowering Innovation and Shaping the Value Chain at SEMICON Europa
  Laith Altimime, President, SEMI Europe
Empowering Innovation and Shaping the Value Chain at SEMICON Europa
Laith Altimime

Laith Altimime
President
SEMI Europe

Laith Altimime

Abstract
Connect is the theme and vision where SEMI strives to connect the electronics manufacturing supply chain ecosystems and there strategic relevance to our industry at European and global levels. Today we are at the brink of a new wave of innovation, driven by Connected objects and Smart Applications also known as the Internet of Things, This in turn presents many opportunities for closer collaborations at global level, connecting the key players, key Eco systems and building on the strengths of different players in the value chain. Semiconductors are at the heart of the value chain driving innovations enabling key future growth drivers in Mobile, Automotive, Medical, passive and intelligent computing as well as AR and VR. In such applications driven industry Europe’s strengths in innovation, automotive, MEMS, provide the full complementary and strategic solutions fueling our future connected world. Co-located with productronica in Munich for the first time, the global exposition will expand attendee opportunities to exchange ideas and promote technological progress, featuring the most advanced and innovative electronics manufacturing platform in Europe.

Biografie
Laith Altimime joins SEMI as president of SEMI Europe, as of October 1, 2015. Laith Altimime has more than 25 years of international experience in the semiconductor industry. Most recently, he held senior director position in business development at imec. Prior to this, Laith Altimime held leadership positions at Infineon/Altis, Qimonda, KLA-Tencor, Communicant Semiconductor AG, and NEC Semiconductors. Laith Altimime holds an Honors Bachelor’s Degree in Applied Physics and Semiconductors Electronics from Heriot-Watt University in Scotland.

09:00

Keynote

 
Environmental sensing in the IoT – for a better quality of life
  Stefan Finkbeiner, CEO of Bosch Sensortec, Bosch Sensortec GmbH
Environmental sensing in the IoT – for a better quality of life
Stefan Finkbeiner

Stefan Finkbeiner
CEO of Bosch Sensortec
Bosch Sensortec GmbH

Stefan Finkbeiner

Abstract
As the IoT began to emerge, more and more devices have been developed with the purpose of making our lives more comfortable and more exciting – in short: IoT is about improving the quality of life. MEMS sensors are a key technology for the IoT by enabling things to be sensed and connected in all parts of our daily life, such as our homes, vehicles, and cities. A substantial factor that is closely related to the quality of our life are the environmental conditions in our homes and cities. Especially the indoor air quality has a strong impact on our health. In his speech “Environmental sensing in the IoT – for a better quality of life”, Stefan Finkbeiner is going to explore the ways in which environmental sensing can contribute to a better quality of life in the context of the IoT. He will touch upon the challenges of our daily well-being by demonstrating real life examples of how to overcome these risks with the help of MEMS environmental sensing technology.

Biografie
Dr. Stefan Finkbeiner CEO and General Manager of Bosch Sensortec GmbH Stefan Finkbeiner was born in 1966 in Freudenstadt, Germany. He received his Diploma in Physics from the University of Karlsruhe in 1992. He then studied at the Max-Planck-Institute in Stuttgart and received his PhD in Physics from the University of Stuttgart in 1995. Dr. Finkbeiner was appointed as CEO of Bosch Sensortec in 2012, having previously served as General Manager and CEO of Akustica Inc, a Bosch Group company which develops MEMS microphones for consumer electronics applications and is located in Pittsburgh, PA, USA. Dr. Finkbeiner joined Robert Bosch GmbH in 1995 and has been working for more than 20 years in different positions related to the research, development, manufacturing, and marketing of sensors. Senior positions at Bosch have included Director of Marketing for sensors, Director of Corporate Research in microsystems technology, and Vice President of Engineering for sensors. In 2015 Dr. Finkbeiner was recognized with the prestigious lifetime achievement award from MEMS & Sensors Industry Group.

09:30

Keynote

 
Enabling European Innovation to Capture the Opportunity in Automotive Semiconductors
  Maria Marced, President, TSMC Europe BV
Enabling European Innovation to Capture the Opportunity in Automotive Semiconductors
Maria Marced

Maria Marced
President
TSMC Europe BV

Maria Marced

Abstract
The need to drive safer, greener, and smarter is changing the automotive semiconductor industry. The evolution of autonomous driving, being always connected and adopting deep learning capabilities is enabling the vision of self driving cars. Giving Cars the Power to Sense, Think, and Learn . The tighter emission controls to combat global warming is seeing the rapid move to more energy efficient driving solutions. And collaboration of shared mobility with autonomous driving will bring many opportunities for new business models to apply in the smart city . As the world's leading foundry service provider, TSMC continues to innovate with advanced logic and specialty technologies, to provide the most extensive solutions for the automotive world. Through its OIP Ecosystem and manufacturing excellence, TSMC is helping to make driving safer, greener and more connected . Maria Marced will outline the opportunity to enable your innovations for the automotive world.

Biografie
Mrs. Maria Marced is President of TSMC Europe, with responsibility for driving the development, strategy and management of TSMC’s business in Europe, Middle East and Africa. Before joining TSMC, Maria was Senior Vice President of Sales and Marketing at NXP /Philips Semiconductors. Before this Maria was Senior Vice President / General Manager of the Connected Multimedia Solutions Business Unit overseeing Philips' semiconductor solutions for Connected Consumer applications. Previous to Philips, Maria was at Intel where she developed her professional career over 19 years, reaching the top position in the Europe, Middle East and Africa region as Vice President and General Manager. Mrs. Marced holds a PhD in Telecommunications Engineering at Universidad Politecnica de Madrid, Spain.

10:00

Keynote

 
The Smart Things Opportunity, a Smart Materials Answer
  CARLOS MAZURE, EVP & CTO, Soitec
The Smart Things Opportunity, a Smart Materials Answer
CARLOS MAZURE

CARLOS MAZURE
EVP & CTO
Soitec

CARLOS MAZURE

Abstract
Smart wearables, smart homes, smart cars, and so forth constitute the next big microelectronics industry inflexion point. It will enable a large number of applications and products that will, in turn, challenge the existing business models, the Internet infrastructure and the existing IC ecosystem. Smart applications will thrive on the co-optimization of very different technologies to integrate multiple functionalities (sensing, analyzing, computing, communicating) while maximizing performance, optimizing energy efficiency to extend battery life to its limits or adapt to the constrains of energy harvesting and simultaneously improving form factor and reducing cost. Behind this industrial renewal we will find "More than Moore" technologies, clever material processes and engineered substrates. In the RF world, engineered substrates have become the standard for RF front-end module (FEM) devices, which we find in every smart phone. The industrialization of SOI with nm-thin Si and buried oxide (BOX) layers has enabled low-cost, low power ICs. Ultra-thin Si and BOX SOI make possible fully depleted (FD) CMOS technologies with ultra low VDD operation without significant performance loss. Innovative SOI architectures are competitive answers to Si Photonics, automotive SOI, imagers and sensors. Tailored SOI substrates accompany the trend to full mobility. This review will discuss the contributions and benefits of engineered substrates solutions and thin layer transfer technologies, focusing on applications in the smart space.

Biografie
Dr. Carlos Mazure, CTO & EVP, Head of Corporate R&D at Soitec since 2001. Chairman and Executive Director of SOI Industry Consortium since July 2014. IEEE Fellow, 30+ years of experience in Semiconductor Industry. Prior to Soitec, Carlos headed the ferroelectric FeRAM program at Infineon (Munich, Germany), and initiated Infineon/Toshiba FeRAM Alliance. Earlier he worked for IBM/Infineon DRAM Alliance (Fishkill, NY); and before at APRDL, Motorola (Austin, Texas). Carlos holds two doctorates (University Grenoble, France; Technical University Munich, Germany). Authored/co-authored 120+ technical papers, holds 100+ US patents. Member of several international advisory committees and company boards.

10:30

Keynote

 
Mobility of tomorrow: Will all be different, will all be better?
  Frank Rinderknecht, Founder & CEO, Rinspeed
Mobility of tomorrow: Will all be different, will all be better?
Frank Rinderknecht

Frank Rinderknecht
Founder & CEO
Rinspeed

Frank Rinderknecht

Abstract
To be announced

Biografie
Frank M. Rinderknecht (born 1955) is the founder and CEO of Rinspeed Inc. - based in Zumikon/Switzerland - which he has established in 1977 as young student at the ETH (Technical University of Zurich). While the import of sunroofs from the USA was his first business activity, Rinspeed soon became a pioneer and first mover in the then newly created tuning industry. In 1995 Rinspeed started to build proprietary prototypes and concept cars. The invention of the steering wheel with integrated controls for radio or other functions, sustainable powertrains and driver assistance systems are amongst noteworthy milestones in the company’s history. After having sold all tuning activities in 2008 to a German competitor, Frank’s activities are centered today on being a Think Tank of the automotive and other industries and create and promote innovative technologies, materials and mobility means of tomorrow. Privately, Frank is passionate about spending his time on the sea, preferably in the Med.

11:00 End