Monday, November 13, 2017
 

19:30 Networking Reception
  Participants Only
 
Tuesday, November 14, 2017
Session 1

New quality methods - key drivers for operational excellence

Chair Thomas Richter, Vice President, Robert Bosch GmbH
Thomas Richter

Thomas Richter
Vice President
Robert Bosch GmbH

Thomas Richter

Biography
Thomas Richter, since July 2015 Vice President of the Wafer Fab 150 / 200mm & MEMS at BOSCH Reutlingen, was born 1974 in Chemnitz. Working for SIEMENS, INFINEON, QIMONDA and MELEXIS he now has about 20 years of experience in the semiconductor industry. He holds a Diploma in Micro Technology of the University of Applied Sciences Zwickau (WHZ).

12:00 Welcome
12:05
Industry Outlook and Forecast for Fab spending and Capacity
  Christian Gregor Dieseldorff, Director Industry Research & Analysis, SEMI
Industry Outlook and Forecast for Fab spending and Capacity
Christian Gregor Dieseldorff

Christian Gregor Dieseldorff
Director Industry Research & Analysis
SEMI

Christian Gregor Dieseldorff

Abstract
These are exciting times! Great sales outlook and historic highs in fab spending for equipment and construction of new fabs in 2017 and 2018. These unprecedented high numbers are not only driven by a handful of well-known, established companies, but also by several new Chinese companies entering the scene. While Korea and China are leading regions, Europe makes a big leap.

Biografie
Chris has over 30 years of industry experience. For 15 years he was engaged in various engineering and management position in R&D and pilot lines at Siemens (Munich), IBM (New York), I300I & International Sematech (Austin, Texas), and Infineon in San Jose, California. Since 2002 he worked as senior industry analyst and director of market research first for Strategic Marketing Associates and since 2007 for SEMI.

12:25
Digital Vehicle - requirements for quality and availability of semiconductors
  Frank Zerrweck, Director Instrumentation & Components, Daimler AG
Digital Vehicle - requirements for quality and availability of semiconductors
Frank Zerrweck

Frank Zerrweck
Director Instrumentation & Components
Daimler AG

Frank Zerrweck

Abstract
Connectivity, autonomous driving, sharing and electrical drive are key trends in the automotive industry. These trends as well as most innovations in automotive require a lot of computing power, which leads to an increasing amount of semiconductors in the car. Customer’s expectation especially in the infotainment domain is of course to see the same performance as known from consumer electronics. However, semiconductors in a car have to follow special requirements in terms of reliability and life-time in order to ensure comfort and safety. Since semiconductors from consumer devices hardly can be used, most of the semiconductors in a car are special automotive grade, the availability of which has to be ensured over many years - not only the vehicle cycle but also for spare parts.

Biografie
Frank Zerrweck works as director Instrumentation & Components at the RD-Department of Mercedes Benz. Currently he is responsible for the development of infotainment components and architecture as well as for the advance development of the next infotainment generation. After studying electrical engineering at Munich University he joined the Daimler AG in 1993. He has extensive experience in research and development, supplier management, quality and purchasing.

12:50
From PPM to PPB – how device manufacturers meet increasing challenges in automotive quality and reliability
  Dirk Drescher, General Manager, XFAB
From PPM to PPB – how device manufacturers meet increasing challenges in automotive quality and reliability
Dirk Drescher

Dirk Drescher
General Manager
XFAB

Dirk Drescher

Abstract
Electronics applications in automotive have been increasing for years. With the shift towards autonomous driving expected within the next decade the number of electronic devices residing in a vehicle will grow at an even faster rate. Thus, current defect levels around 1 ppm are not sufficient anymore to meet future requirements in device reliability and robustness. Safety specifications for autonomous driving vehicles will further raise the pressure and push reliability standards down to ppb levels. Semiconductor device manufacturers are required to implement improved and new methodologies to meet these requirements. This talk aims to discuss opportunities, tools and methods in semiconductor design, development, manufacturing and test that help pushing defectivity levels from ppm to ppb.

Biografie
Dirk Drescher is Chief Executive Officer and Site Manager of X-FAB Dresden since August 2016. He started his career in semiconductors in 1995 as process engineer for Siemens Microelectronics Center Dresden and served in different managerial functions until 1999. In 2000 he joined Infineon’s Semiconductor 300 organization as Engineering Manager to help starting up the worlds first 300mm Semiconductor Manufacturing Line. In 2008 he joined Calyxo GmbH managing a thin film Solar Panel manufacturing line. 2010 Mr. Drescher joined Globalfoundries to help starting up its green field/ leading edge 300mm Manufacturing Site, Fab8, Malta, NY, USA. In 2013 he took over a managerial position at Globalfoundries Fab1, Dresden, Germany. Mr. Drescher holds a diploma in Physics from Dresden Technical University and a PhD in Experimental Physics from the Technical University Chemnitz.

13:15 Lunch
14:40
How to manage Semiconductor R&D Dilemma: More and more Stringent Quality requirements versus fastest possible Product Access to the Right Differentiated Technology?
  CYRIL COLIN-MADAN, Technology & Design Platform Deputy, ST Microelectronics
How to manage Semiconductor R&D Dilemma: More and more Stringent Quality requirements versus fastest possible Product Access to the Right Differentiated Technology?
CYRIL COLIN-MADAN

CYRIL COLIN-MADAN
Technology & Design Platform Deputy
ST Microelectronics

CYRIL COLIN-MADAN

Abstract
Technology R&D, Product R&D and Product manufacturing are more and more done in concurrent mode to guaranty fastest product access to the right differentiated technology. On the other hand, Quality is becoming more and more stringent with reduced level of defects, excursions required by most of product market segments. This is making Semiconductor R&D much more challenging and re-inforce the needs of deploying complete different methods, way of thinking & doing Quality in a Semiconductor R&D environment. We will explain how this can be done leveraging on Design, Process, Product, Manufacturing Technical strengths within ST Microelectronics coupled with new way of doing / thinking coming from LEAN R&D practices.

Biografie
Cyril Colin-Madan has been Technology & Design Platforms Deputy Director in ST Microelectronics Crolles France since February 2017. He started his career in semiconductors as a SRAM engineer in ST Microelectronics Agrate Italy in 1994. He joined ST Microelectronics Crolles France R&D and Manufacturing Center in 1996 as a Library project leader then as group leader. Starting 2000, he became Technology Platforms Manager in charge of Design & Process R&D programs. From 2006 to 2014, he held various management positions covering PDK, Design Platform, Design flows and Design Programs. Between 2015 and 2017, he became the Design Platform Director in charge of all Design Platforms internally developed within ST. Mr. Colin-Madan is graduated from French engineering school SUPELEC with a specialization in semiconductors.

15:05
Meeting the increased Demand for 200mm Capacity by Enhancing Capital Efficiency and Fab Productivity for IoT Applications
  DAVID HAYNES, Sr. Director CSBG Strategic Marketing, CSBG MARKETING, Lam Research
Meeting the increased Demand for 200mm Capacity by Enhancing Capital Efficiency and Fab Productivity for IoT Applications
DAVID HAYNES

DAVID HAYNES
Sr. Director CSBG Strategic Marketing, CSBG MARKETING
Lam Research

DAVID HAYNES

Abstract
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Biografie
David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications. In his professional career, David has accrued more than 20 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors with STS, SPTS and Oxford Instruments. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies. Building on this technical knowledge, David has a proven track record in developing strategic business partnerships; specialising in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide. David Joined Lam Research in June 2016 and is currently Senior Director of Strategic Marketing in the CSBG Business Unit.

15:30
Human failure & mindset change
  Jan Hagen, Associate Professor, ESMT Berlin
Human failure & mindset change
Jan Hagen

Jan Hagen
Associate Professor
ESMT Berlin

Jan Hagen

Abstract
Dealing with errors – your own and those of others – is a challenge although we all make mistakes. As leaders we may recognize this and expect our staff to alert us on our own errors. However in practice this rarely happens. A view on airline flight decks shows us that pilots follow a concept that provides valuable lessons for managers. We will explore the concept of dealing with errors in the aviation industry and discuss the applicability of this error management concept in other organizations.

Biografie
Jan Hagen is an associate professor at ESMT European School of Management and Technology in Berlin. Jan’s research and teaching focus is on leadership. He is particularly interested to understand how teams and organizations deal with errors. Apart from articles in academic journals he published the book Confronting Mistakes – Lessons from the Aviation Inustry when Dealing with Error (Palgrave Macmillan) in 2013. His research received media coverage in international outlets like the BBC, Financial Times, The Economist, The Guardian, Forbes, Harvard Business Manager, Irish Times, and Sunday Times. Jan directs the ESMT open enrollment program Leadership under Pressure and is the host of the ESMT Error Management Conference. He teaches in executive education programs and human factors training of the German Federal Armed Forces. In addition to his academic work, he has more than 15 years of experience in management and consulting.

15:55 Coffee Break
Session 2

Tool Vitality for highest quality: Controlling / Sustainability

Chair Manfred Kraxenberger, Vice President, ABB Semiconductors
Manfred Kraxenberger

Manfred Kraxenberger
Vice President
ABB Semiconductors

Manfred Kraxenberger

Biography
Manfred Kraxenberger is currently factory manager for ABB’s BiMOS wafer fab and assembly line in Lenzburg, Switzerland. He studied physical engineering and started working as process engineer at Siemens Semiconductor in Munich in 1986. Over the last 30 years, he has held several engineering and management positions in manufacturing as well as R&D at Siemens/Infineon/Qimonda and Globalfoundries. Prior to his current position he was in charge of ABB’s Bipolar factory.

16:30
Providing Key Process Enabling Vacuum Capability Through Integrated Sub-Fab Data Management
  Erik Collart, Global Product Manager EdCentra, Edwards
Providing Key Process Enabling Vacuum Capability Through Integrated Sub-Fab Data Management
Erik Collart

Erik Collart
Global Product Manager EdCentra
Edwards

Erik Collart

Abstract
The sub-fab, with its vacuum, abatement and ancillary systems has evolved dramatically over the years. In many ways it has become as sophisticated as the fab itself, and now provides key enabling process technology. There is also a growing recognition among semiconductor manufacturers that sub-fab information can no longer be dismissed when it comes to fab process and yield optimization. Available sub-fab data sources such as equipment parameters, process data and equipment failure analyses will be discussed, as well as how these may be integrated to provide overall sub fab health monitoring and deliver vacuum conditions required by today’s leading edge technology nodes.

Biografie
Erik Collart joined Edwards in July 2015 as Global Product Manager for Edwards’ vacuum and abatement equipment monitoring, data acquisition and integrated data management platforms. He has over 30 years of experience in the semiconductor industry. Prior to joining Edwards he he held a number of different positions in semiconductor R&D and process development (Philips Research, Applied Materials), semiconductor equipment development (Applied Materials), and Product Management and Marketing ( Axcelis Technologies, AIBT). He has authored and co-authored over 80 publications in peer-reviewed scientific and industry journals and proceedings and holds several patents. He graduated with a Master Degree in Physics from Katholieke Universiteit Leuven (KUL) in Leuven, Belgium, in 1986.

16:55
Predictive Intelligence - Project examples for Self-learning Artificial Intelligence in Production
  Britta Hilt, Managing Director, IS Predict GmbH
Predictive Intelligence - Project examples for Self-learning Artificial Intelligence in Production
Britta Hilt

Britta Hilt
Managing Director
IS Predict GmbH

Britta Hilt

Abstract
Having data – that is not the key to happiness. But getting insight out of this data causes value add. To do so, you need to look into the future: Predictive analytics and, thus, predictive-optimized processes. In complex processes this is not easy because high dynamic causes continuous changes. However, even toughest “process nuts”can be cracked thanks to innovative Artificial Intelligence which realizes reliable predictions. Due to self-learning algorithms, analytics adapts itself automatically for individual instances which leads to scalable and highly reliable solutions for predictive control. In this presentation, the focus are project examples, i.e. predictive maintenance, predictive quality control, logistics optimization, energy efficiency, …

Biografie
Since 2011: Co-Founder & Managing Director, Marketing & Sales at IS Predict GmbH 16 years at IDS Scheer / Software AG in international consulting and product management, last responsibility: Director Product Management & Solution Marketing

17:20
Proactive scrap risk reduction in a grown high complexity 200mm Wafer Fab
  Arthur Pelzmann, Project Mgr, Texas Instruments Deutschland GmbH
Proactive scrap risk reduction in a grown high complexity 200mm Wafer Fab
Arthur Pelzmann

Arthur Pelzmann
Project Mgr
Texas Instruments Deutschland GmbH

Arthur Pelzmann

Abstract
One common challenge for Analog Wafer Fabs is the large variety of technologies, products and process steps. Due to the usually long lifetime of analog products the product-mix and therefore the complexity of manufacturing processes increase over the years. The high complexity leads to a high risk of misprocessing due to overlooked or weak equipment and process controls. In most cases this especially affects newer products in the Fab portfolio. Traditional FMEA is aimed to cover all possible failure modes and provide corrective actions to lower the risk. In the case of risk reduction solely focused on process and equipment controls an easier method is desired. For this reasons we at Texas Instruments Deutschland developed the EPCA process (Equipment and Process Control Assessment). EPCA approach is dedicated to prevent quality issues caused exclusively by insufficient equipment- and process-parameter controls. Especially in ramp phases of new fab products the method can be beneficial if equipment-and process requirements have changed. EPCA is among other methods one of our elements for pro-active risk reduction and finally completes existing FMEA. In the presentation the workflow, the fab wide implementation of the method, key learnings and examples will be discussed.

Biografie
Dr.-Ing. Arthur Pelzmann Born:1967 Education: Physics Diplom, University of Ulm, PhD in EE (Optoelectronics, GaN LEDs) University of Ulm 1998 – 2000 Process Engineer at STEAG RTP Systems GmbH, Dornstadt 2000 – 2002 Project Manger, Product Manager at GFD Gesellschaft fuer Diamantprodukte mbH, Ulm (Startup, MEMS, medical) 2002 – 2016 Process Engineering Section Manager Diffusion/Surface Preparation TI Freising Wafer Fab 2016 – Mgr. Process Yield/SFC/Tool-Stability Projects TI Freising Wafer Fab

17:45
Precise localization, motion sensing and add-on data communication: How innovative sensor & analytics solutions enable new applications in the fab of tomorrow.
  Oliver Trinchera, CEO, KINEXON GmbH
Precise localization, motion sensing and add-on data communication: How innovative sensor & analytics solutions enable new applications in the fab of tomorrow.
Oliver Trinchera

Oliver Trinchera
CEO
KINEXON GmbH

Oliver Trinchera

Abstract
The industrial Internet of Things is on the rise, leading to a significant digital transformation of production & logistics processes. Thinking about the semiconductor factory of the future, we assume that all objects such as parts, tools and products will interact fully with each other – as if they were steered by an invisible hand. However, to make this vision come true we need to know two essential pieces of information: 1. Where are the objects exactly located? 2. What is the status of the objects? The following contribution deals with a cutting-edge real-time location solution (RTLS) that provides an answer to the two previous questions and that enables manufacturers to bring the automation and efficiency of their production facilities to the next level. At the core oft he solution is a small sensor that captures the 3D-position of various objects such as wafer boats or autonomous ground vehicles with an accuracy of a few centimeters. In addition to that, the sensor captures motion information such as acceleration, rotation and orientation. Moreover, a bi-directional communication path and standardized interfaces allow to transmit process relevant add-on information that is related to the objects, such as temperature and humidity. All information is processed in real-time and made available on a powerful analytics platform. The platform offers a variety of features to describe and monitor production processes and, finally, to improve them in terms of quality, costs and time.

Biografie
Dr. Oliver Trinchera is Founder & Managing Director of KINEXON. KINEXON develops precision tracking solutions for centimeter accurate 3D localization of people and objects in indoor and outdoor environments. A smart analytics platform analyzes the data and provides users with new and valuable insights on various devices such as notebook, smartphone or tablet PC. The KINEXON sensors and applications are used by renowned customers in various industries such as manufacturing, logistics, healthcare, sports & media. The full asset visibility and analytics by KINEXON enable customers to map their processes and optimize them in terms of quality, costs, and time. The company received a number of prestigious awards, including the Smart Digital Award as most innovative Bavarian start-up and the Galileo Master Award of the European Satellite Navigation Competition (promoted by European Commission and ESA, for example). Oliver studied Business Administration in combination with Electrical Engineering at Technische Universität München. Additionally, he studied Technology Management at the Center for Digital Technology and Management (CDTM). Moreover, he holds a PhD from Technische Universität München.

18:10 End