Wednesday, October 26, 2016
 

Chair Christian Gregor Dieseldorff, Director Industry Research & Analysis, SEMI
Christian Gregor Dieseldorff

Christian Gregor Dieseldorff
Director Industry Research & Analysis
SEMI

Christian Gregor Dieseldorff

Biografie
CHRISTIAN GREGOR DIESELDORFF Director Industry Research & Analysis Chris has 30 years of industry experience. He earned an engineering degree in chemistry at the University of Applied Science in the German Alps. In 1986, he began as process and development engineer for 1Mb DRAM on 4- and 5-inch wafers at the new pilot line at the Siemens R&D center in Munich, Germany. In 1990 Chris moved to the US as one of the first members of the “Development Alliance Team” at IBM in East Fishkill, New York, at the world’s first 200mm facility. From 1996 to 1999 he held the positions of engineering manager and director of the world’s first 300mm beta line at International Sematech in Austin, Texas. In 1999, he became the quality assurance manager for Memory and Graphics chips for North America at Infineon in San Jose, California. Chris joined Strategic Marketing Associates in California as senior analyst and director of market research in 2001. Since 2007, he conducts worldwide fab database research and forecasts in the Industry Research and Statistics group at SEMI headquarters in San Jose, California.

10:15 Introduction
10:20
200mm Fabs Re-awaken!
  Christian Gregor Dieseldorff, Director Industry Research & Analysis, SEMI
200mm Fabs Re-awaken!
Christian Gregor Dieseldorff

Christian Gregor Dieseldorff
Director Industry Research & Analysis
SEMI

Christian Gregor Dieseldorff

Abstract
Spurred mainly by increasing content in mobile devices but also by IOT, 200mm fabs make a return, signaling a new hope of growth for the industry. 200mm fabs are striking back with new fabs being built and capacities expected at levels seen back in 2006. This presentation gives a glimpse into the past, present and resurgence of 200mm fabs. The data are derived from a soon to be release update of the SEMI Global 200mm Fab report that provides insights to fab activities and capacity trends through 2020 .

Biografie
CHRISTIAN GREGOR DIESELDORFF Director Industry Research & Analysis Chris has 30 years of industry experience. He earned an engineering degree in chemistry at the University of Applied Science in the German Alps. In 1986, he began as process and development engineer for 1Mb DRAM on 4- and 5-inch wafers at the new pilot line at the Siemens R&D center in Munich, Germany. In 1990 Chris moved to the US as one of the first members of the “Development Alliance Team” at IBM in East Fishkill, New York, at the world’s first 200mm facility. From 1996 to 1999 he held the positions of engineering manager and director of the world’s first 300mm beta line at International Sematech in Austin, Texas. In 1999, he became the quality assurance manager for Memory and Graphics chips for North America at Infineon in San Jose, California. Chris joined Strategic Marketing Associates in California as senior analyst and director of industry research in 2001. Since 2007, he conducts worldwide fab database research and forecasts in the Industry Research and Statistics group at SEMI headquarters in San Jose, California.

10:40
Advanced Packaging: Even Moore than you expect!
  Thibault Buisson, Business Unit Manager, Advanced Packaging & Manufacturing, Yole Developpement
Advanced Packaging: Even Moore than you expect!
Thibault Buisson

Thibault Buisson
Business Unit Manager, Advanced Packaging & Manufacturing
Yole Developpement

Thibault Buisson

Abstract
A market and technology briefing on advanced packaging industry to understand related challenges, evolutions, trends, etc. This market briefing will provide market metrics and forecasted trends for Advanced Packaging and evaluate their impact on the supply-chain and technologies. Also, Yole Développement’s Advanced Packaging team will present the findings from its most recent analyses. Afterwards, all attendees are welcome to participate in a Q&As session, during which we’ll compare and contrast different points-of-view and visions. For more information, please contact Camille Veyrier (veyrier@yole.fr).

Biografie
Thibault Buisson is the Business Unit Manager of the Advanced Packaging & Semiconductor Manufacturing activities at Yole Développement, the “More than Moore” market research and strategy consulting company. Thibault graduated from Grenoble Institute of Technology (INP) with a Master’s degree of Research in Micro and Nano electronics and from Polytech Grenoble with an engineering degree in Material Sciences. He then joined NXP Semiconductors as an R&D process engineer in the thermal treatment area to develop CMOS technology devices from the 65 to 45nm nodes. Afterwards, he joined IMEC Leuven and worked for over 5 years as a process integration engineer in the field of 3D technology. He has authored or co-authored fifteen international publications in the semiconductor field and has spoken at several conferences and symposiums, including keynotes, related to Advanced Packaging.

11:00
Semi Market & Materials Trends for the Millenial Era
  Lita Shon-Roy, President / CEO, TECHCET
Semi Market & Materials Trends for the Millenial Era
Lita Shon-Roy

Lita Shon-Roy
President / CEO
TECHCET

Lita Shon-Roy

Abstract
Electronic end use devices and applications drive the consumption of semiconductor devices and the market for process materials. If there is no Killer-app out there, then what is going to drive the semiconductor industry over the next 5-10 years? And what materials will be needed to support those devices? TECHCET will present global and local trends driving the overall semiconductor market and focus-in on those materials that are growing at a higher than average rate, in addition to new materials required to support future devices.

Biografie
Lita Shon-Roy, President/CEO of TECHCET, has worked in the electronics materials industry in business development and technical marketing for more than 30 years. Her work experience spans from business development, marketing and sales of semiconductor devices, equipment and materials, to process development of flat panel displays (TFTs). She has developed new business opportunities for companies such as RASIRC/Matheson Gases and IPEC/Speedfam and helped establish marketing and sales proficiency in companies such as Air Products/Schumacher, Brooktree/Rockwell, and IPEC/Speedfam. Lita facilitated the transition of the Critical Materials Council from SEMATECH to TECHCET’s business in January 2016 and continues to build upon the organization by inviting additional fab members to the CMC. She has authored and co-authored various articles and texts focused on the semiconductor materials markets, industry forecasting, and the world economy and is a recognized expert in electronic materials marketing and business development. Lita holds a Master’s Degree in Electrical Engineering, with a specialty in Solid State Physics from USC and a Bachelor’s Degree in Chemical Engineering from UCSD. She is currently completing her MBA at California State University, Dominguez Hills.

11:20
Thin and Flexible Battery Market Trends
  Christine Ho, CEO, Imprint Energy, Inc.
Thin and Flexible Battery Market Trends
Christine Ho

Christine Ho
CEO
Imprint Energy, Inc.

Christine Ho

Abstract
A review of the technical and commercial challenges facing the thin and flexible battery market, and the new paradigms and products these batteries will enable.

Biografie
Dr. Christine Ho is a co-founder and Chief Executive Officer of Imprint Energy, a UC Berkeley spin-off commercializing a revolutionary printed battery technology of which Dr. Ho is the principal inventor. Imprint Energy, based in Alameda, CA, is developing technology to enable long lasting, low cost, rechargeable batteries composed of earth-abundant materials for today's and tomorrow's electronic devices. Dr. Ho received her Ph.D. in Materials Science and Engineering from UC Berkeley. Imprint Energy's website: www.imprintenergy.com

11:40 End