Monday, October 24, 2016
 

Opening and Outlook

14:00
Welcome
  Laith Altimime, President, SEMI Europe
Welcome
Laith Altimime

Laith Altimime
President
SEMI Europe

Abstract
We would like to welcome you to the 20th Fab Management Forum during SEMICON Europa

Biografie
Laith Altimime joins SEMI as president of SEMI Europe, as of October 1, 2015. He has more than 25 years of international experience in the semiconductor industry. Most recently, Laith held a senior director position in business development at imec. Prior to that, he held leadership positions at Infineon/Altis, Qimonda, KLA-Tencor, Communicant Semiconductor AG, and NEC Semiconductors. Laith holds a Honors Bachelor's Degree in Applied Physics and Semiconductors Electronics from Heriot-Watt University in Scotland.

14:10 Market Outlook
  Christian Dieseldorff, Director Semiconductor Industry Analysis & Statistics, SEMI
 

Session 1: Manufacturing

14:30

Keynote

 
Next level of productivity in Europe's semiconductor fabs
  Ondrej Burkacky, Partner, McKinsey & Company
Next level of productivity in Europe's semiconductor fabs
Ondrej Burkacky

Ondrej Burkacky
Partner
McKinsey & Company

Abstract
Europe's semiconductor fabs have always been challenged in terms of cost by competition from lower cost locations in terms of wages and energy cost. Several companies have undertaken a large effort to transform its productivity to a higher lever to compensate for these cost disadvantages. Our fab benchmarking, however, indicates that there is still some room for improvement. Complementing the typical lean levers we see the emergence of new approaches like advanced analytics as key enabler for further productivity increase. For Europe to remain competitive as a location for semiconductor fabs, there is need for action for the governments as well. Here a clear commitment and an answer to subsidies received in many other countries is needed. Finally given the expected new demand for IoT driven technologies, we see a clear opportunity for Europe's fabs to immediately leverage the increased productivity to attract additional volume.

Biografie
Ondrej Burkacky is a partner at McKinsey and part of its semiconductor leadership. He supports global clients on issues related to operational improvements and transformations as well as R&D and software-related topics. Since joining McKinsey in 2007, Ondrej has served integrated-device manufacturers (IDMs), foundries, and fabless players. He also serves original-equipment manufacturers (OEMs) in the high-tech and automotive industries.

15:00 Automotive
  TBC
15:20
Fab Labor Productivity Improvement through a Combined Modeling Approach
  Ariel Meyuhas, COO, The MAX Group
Fab Labor Productivity Improvement through a Combined Modeling Approach
Ariel Meyuhas

Ariel Meyuhas
COO
The MAX Group

Abstract
This case study describes a comprehensive approach to Fab staffing modeling which is based on combining two different methods. The first is based on the transaction records (lot track in) from the MES system and It provides a quick evaluation of the impact of staffing levels on the productivity of different areas. The second one uses data collected by following and observing operators on the floor and timing their activities; this evaluation provides more details on how the operators spend their time, and it provides insight on improvement opportunities for direct labor. This dual approach generates both quick guidelines for optimization of staffing levels and long term guidance for improvement plans. This method has been successfully tested in two different fabs and it has generated up to 15% improvement in output per operator.

Biografie
Mr. Meyuhas is a co-founder and COO of the MAX Group, a global consulting firm transforming the semiconductor industry’s operational landscape. The firm provides a unique range of operational solutions that increase factory and supply chain delivery performance – More product out of installed capital, faster cycle times, higher yields and lower cost of operation. With over 20 years of experience in the semiconductor industry, Ariel brings vision, innovation, a very strong relationship portfolio with leading semiconductors companies, and steers for perfect execution at MAX.

15:40 Coffee Break
16:00
Leveraging Technology in Manufacturing Automation of Legacy Fabs
  Eng Keong Ho, Director of Photo & IT, SSMC
Leveraging Technology in Manufacturing Automation of Legacy Fabs
Eng Keong Ho

Eng Keong Ho
Director of Photo & IT
SSMC

Abstract
Singapore’s Semiconductor Front End Manufacturing started >30 years ago in 1984 with 5-inch progressing towards 6 inch, 8 inch and finally state of the art 12 inch. Although the legacy fabs were expected to phase out gradually, recent technology developments in the “More than Moore” for IoT(Internet of Things) has breathe new life into the 5,6,8 inch factories. Hence, to improve the productivity and cost competitiveness, it is paramount to leverage new automation technologies to improve the manufacturing processes in these fabs. This will help to reduce the gap in manpower requirements required in the legacy fabs against the 12 inch factories. This presentation will share the challenges and how the new technologies can improve factory automation in a cost competitive manner.

Biografie
Mr Ho is the Department Director of Photo Lithography and Information Technology working in SSMC(A joint venture between NXP and TSMC) for more than 15 years. Much of his work focuses on leveraging information technology to drive manufacturing automation to improve Productivity in SSMC. He also represents SSMC in the working committee of robotics automation in SEMICONSG Vision2020. Mr Ho holds a Master of Technology(Knowledge Engineering) from Institute of Systems Science(NUS) and a Honours Degree in Mechanical Engineering from National University of Singapore. He is also a Spring Singapore Business Excellence assessor.

16:20 Automation 8inc fab
  TBC
16:40
Remote service with smart glasses
  Benrhard Riester, Engineering Manager, Texas Instruments GmbH
Remote service with smart glasses
Benrhard Riester

Benrhard Riester
Engineering Manager
Texas Instruments GmbH

Abstract
Worldwide collaboration and knowledge transfer is a key differentiator in today’s industry and especially in manufacturing. Collaboration is not something new. We did it already in the past, however with less efficiency. Years ago knowledge transfer was mainly done by telephone or by travelling, which is by the way the most costly way to do it. Video conferencing was used in the 90th . Web based applications like Webex, Skype followed in the next decade with the broadening of the internet. With the high speed internet becoming available in all regions of the world we can now make the next step and make use of recent developments: the smart glasses. Widely known as “Google Glas”. These smart glases are no longer IT gadgets. They can help in our daily business. Easy to use and flexible. In this paper we will show how smart glases can be used for remote maintenance and therefor help to maintain and repair our tools much faster and in a more efficient way.

Biografie
Biography Education: Master in photo-engineering from the University of applied sciences in Cologne 1985 – 1988 Process engineer at Siemens with responsibility for Exposure Equipment Evaluation 1988 – 1996 Process engineer At TI Freising with various responsibilities in the Photo Module 1996 – 1998 WW Deputy Lithography Technology Mgr. in Dallas 1999 – 2002 Module Mgr. Epi/Implant Freising Wafer Fab. 2002 – 2015 Equipment Engineering Mgr. Freising Wafer Fab 2016 – Engineering Mgr. Automation/Cost Freising Wafer Fab

17:00
Smart Defect Density Monitoring solutions in multi-product waferfabs
  Andreas Driesen, Team Leader - Defect Inspection, X-FAB Semiconductor Foundries AG
Smart Defect Density Monitoring solutions in multi-product waferfabs
Andreas Driesen

Andreas Driesen
Team Leader - Defect Inspection
X-FAB Semiconductor Foundries AG

Abstract
Semiconductor manufacturers are constantly confronted by growing customer requirements in terms of product quality, in particular the Defect Density. The focus is mainly on the achievement of "Zero-Defect-Rate". This objective is even more challenging due to the complexity in a multi-product wafer fab and their varied and extensive product mix. The challenges continue to grow through a combination of CMOS and MEMS processes. Ultimately, are our everyday efforts, customer satisfaction, creating a trusting and open customer relationship as important goal. The resulting needs are major challenges for an appropriate Defect Density Monitoring. On the one hand it is necessary to efficiently combine the respective process specifics of both the CMOS production and MEMS production together and on the other hand to meet the challenges of a semiconductor foundry. An equally important aspect is the understandable and comprehensible description of the methods and systems to our discerning customers. “Zero-Defect-Rate" for a semiconductor foundry means a close and strategic cooperation, starting from the direct customer up to the final product. For this is an appropriate solution to the defect density monitoring with the reliable product monitoring throughout the supply chain essentially.

Biografie
Andreas Driesen, born 26.02.1975 in Erfurt, married, one daughter. School in Erfurt, then training at Deutsche Telekom AG, followed by studying electrical engineering in Jena at the University of Applied Science. Since 2007 in the X-FAB Erfurt AG Defect Density Engineering. Since 2015 Team Leader of Defect inspection teams (In -Line Defect Density, automated QA, OQA, packaging / shipment, clean rooms).

17:20 END
 

Tuesday, October 25, 2016
 

Session 2: Facility

08:30

Keynote

 
Air Liquide (TBC)
09:00 TBA
  Joerg Peter Weher, GLOBALFOUNDRIES
09:20 TBA
09:40
Smart, Green and Lean Facilities: A competitive advantage
  Edwin Dobson, Senior Director, ESH and Facilities, STMicroelectronics
Smart, Green and Lean Facilities: A competitive advantage
Edwin Dobson

Edwin Dobson
Senior Director, ESH and Facilities
STMicroelectronics

Abstract
In today’s world of rapidly changing technology & product mix juxtaposed upon a complex and demanding legislative framework, it is already a challenge to manage our sites and operations. In addition, customers are also becoming more demanding with higher expectations of the Sustainability performance of the factories used to make their products. Can we, in this context, transform our Facilities from being a “difficulty” into being a competitive advantage? STMicroelectronics with its 6 FrontEnd and 5 BackEnd sites has historically been a leader in driving the Environmental performance of its Facilities. This has been done through a corporate & local approach and through using a metric, the Environmental Footprint, as a driver to allow prioritization between sites both to address the most pertinent projects for continuous Environmental improvement. Locally, our sites work hand in hand with the authorities to optimize performance; one example being our site in Agrate, Italy, who have a complete water management program which focused on local community specific needs; the ST site optimized its water treatment process in order to eliminate the withdrawal from the deep aquifer used by the Agrate citizens as drinkable water, in favor of the more salted and not drinkable shallow aquifer. This win win approach gave the advantage for the Company of not having limitation for the next 15 years on the use of the water and the advantage for the Community of the drinkable sources preservation. More recently, Lean management practices are being deployed throughout our Manufacturing, including in our Facilities. These methodologies change fundamentally the way we work and provide new tools to help us to reduce consumptions, improve the efficiency, safety and motivation of our people and overall give us more effective and sustainable infrastructures. This presentation will include practical examples showing how smart, green and lean facilities are a way to achieve competitive advantage.

Biografie
Edwin started his career in 1984 at Inmos in the UK as a Process Engineer after graduation with an honours degree in Physics from the University of Durham. After the acquisition of Inmos by SGS-Thomson (which later became STMicroelectronics) he moved to France in 1991 to start-up the Lithography section of ST’s first 200mm fab at Crolles. After several Engineering Management positions he was subsequently made responsible for the Facilities & Infrastructure of the Crolles 2 300mm fab built in 2002. Since then he has held management positions at national and international levels in the fields of Facilities and ESH. Currently Edwin has a double responsibility for STMicroelectronics; at Corporation level as Director of Environment, Safety and Health (ESH) and for Front End Manufacturing as Director of Facilities & ESH.

10:00 TBA
  TBA, Intel
10:20 Coffee Break
 

Sesion 3: How do we keep our fab vital?

11:00

Keynote

 
Werner Finsterbusch, Applied Materials
11:30 Recource development
  Matina Holland, Texas Instruments
11:50 TBD
12:10 Trends for society challenges vs. manufacturing
  Korn Ferry (TBC)
12:30 Lunch