Monday, October 24, 2016
 

Opening and Outlook

14:00
Welcome
  Laith Altimime, President, SEMI Europe
Welcome
Laith Altimime

Laith Altimime
President
SEMI Europe

Laith Altimime

Abstract
We would like to welcome you to the 20th Fab Management Forum during SEMICON Europa

Biografie
Laith Altimime joins SEMI as president of SEMI Europe, as of October 1, 2015. He has more than 25 years of international experience in the semiconductor industry. Most recently, Laith held a senior director position in business development at imec. Prior to that, he held leadership positions at Infineon/Altis, Qimonda, KLA-Tencor, Communicant Semiconductor AG, and NEC Semiconductors. Laith holds a Honors Bachelor's Degree in Applied Physics and Semiconductors Electronics from Heriot-Watt University in Scotland.

14:10
World Fab Forecast Report
  Christian Gregor Dieseldorff, Director Industry Research & Analysis, SEMI
World Fab Forecast Report
Christian Gregor Dieseldorff

Christian Gregor Dieseldorff
Director Industry Research & Analysis
SEMI

Christian Gregor Dieseldorff

Abstract
Exciting current and new technologies such as 3D, mobile applications, and IoT bring new life to fabs. Based on SEMI’s acclaimed World Fab Forecast report, this presentation gives a glimpse into past, present and future, showing how mergers and acquisitions, developments in China, and economic trends will affect capital expenditure, construction of new fabs, and capacities.

Biografie
CHRISTIAN GREGOR DIESELDORFF Director Industry Research & Analysis Chris has 30 years of industry experience. He earned an engineering degree in chemistry at the University of Applied Science in the German Alps. In 1986, he began as process and development engineer for 1Mb DRAM on 4- and 5-inch wafers at the new pilot line at the Siemens R&D center in Munich, Germany. In 1990 Chris moved to the US as one of the first members of the “Development Alliance Team” at IBM in East Fishkill, New York, at the world’s first 200mm facility. From 1996 to 1999 he held the positions of engineering manager and director of the world’s first 300mm beta line at International Sematech in Austin, Texas. In 1999, he became the quality assurance manager for Memory and Graphics chips for North America at Infineon in San Jose, California. Chris joined Strategic Marketing Associates in California as senior analyst and director of market research in 2001. Since 2007, he conducts worldwide fab database research and forecasts in the Industry Research and Statistics group at SEMI headquarters in San Jose, California.

 

Manufacturing

Chair Joerg Recklies, Senior Director, Infineon Technologies Dresden GmbH
Joerg Recklies

Joerg Recklies
Senior Director
Infineon Technologies Dresden GmbH

Joerg Recklies

Biography
Joerg Recklies has been in the semiconductor industry for 23 years with responsibilities ranging from Chip design to IDM productuin. He is currently in charge of Senior Director of Production at Infineon Technologies. Prior to that, Joerg Recklies held several positions in Automation and Productions at Infineon. These positions contributed to his excellent experience in terms of operation,equipment, processes and automation. Earlier in his carrier at Diehl he has made contributions in digital and analog Chip design. Joerg Recklies holds a graduate engineer for Semiconductor. Highlight during the time with Infineon: - Establish high automation at IFD 1995-1997 as project leader software Integration - Lead world wide cost reduction project within Infineon Frontends Productions from 1999 –2003 - Section Manager Plasma Etch / Wafer Inspection 2003- 2007 - Director Maintenance Engineering and Facility Management 2007 – 2013 - Enable 300 mm Line for Power and qualify the first products 2011-2013 - FAB Manager of 200/300 mm Lines 2014-today

14:30

Keynote

 
Next level of productivity in Europe's semiconductor fabs
  Ondrej Burkacky, Partner, McKinsey & Company
Next level of productivity in Europe's semiconductor fabs
Ondrej Burkacky

Ondrej Burkacky
Partner
McKinsey & Company

Ondrej Burkacky

Abstract
Europe's semiconductor fabs have always been challenged in terms of cost by competition from lower cost locations in terms of wages and energy cost. Several companies have undertaken a large effort to transform its productivity to a higher lever to compensate for these cost disadvantages. Our fab benchmarking, however, indicates that there is still some room for improvement. Complementing the typical lean levers we see the emergence of new approaches like advanced analytics as key enabler for further productivity increase. For Europe to remain competitive as a location for semiconductor fabs, there is need for action for the governments as well. Here a clear commitment and an answer to subsidies received in many other countries is needed. Finally given the expected new demand for IoT driven technologies, we see a clear opportunity for Europe's fabs to immediately leverage the increased productivity to attract additional volume.

Biografie
Ondrej Burkacky is a partner at McKinsey and part of its semiconductor leadership. He supports global clients on issues related to operational improvements and transformations as well as R&D and software-related topics. Since joining McKinsey in 2007, Ondrej has served integrated-device manufacturers (IDMs), foundries, and fabless players. He also serves original-equipment manufacturers (OEMs) in the high-tech and automotive industries.

15:00
Semiconductor Technologies for Smart Mobility
  Rudi Cartuyvels, EVP Smart Electronics & Business Development, IMEC
Semiconductor Technologies for Smart Mobility
Rudi Cartuyvels

Rudi Cartuyvels
EVP Smart Electronics & Business Development
IMEC

Rudi Cartuyvels

Abstract
80% of the key innovations in cars today are enabled by semiconductor technologies. An average car contains about 7000 semiconductor components and that number will strongly increase over the next decade. Intelligent sensing and connectivity technologies are paving the way to change driving a car into a smart mobility experience that will be offered as a service. It will also tremendously increase the average duty cycle of car usage and will put challenges to the reliability requirements for this use case. The connected car will also need to keep pace with the rapid innovations in multimedia technologies and will need earlier access to advanced CMOS nodes, but also to new semiconductor technologies that enable advanced sensing and energy management. This presentation will cover new semiconductor technology developments that will enable smart mobility for the next decade driven by progress in radar, lidar, image sensing technologies, connectivity, power electronics and solid state battery technology.

Biografie
Rudi Cartuyvels Executive Vice President Smart Electronics & Business Development Rudi Cartuyvels leads Imec’s Smart Electronics R&D. He is passionate about delivering industry relevant innovations in electronic micro and nano systems enabling novel applications in the field of IoT, Healthcare and Energy markets. Imec’s Smart Electronics delivers innovative electronic system platforms to imec’s global partner network enabling sensing & wireless connectivity for smart cities & vehicles, wearable electronics for health and lifestyle, microfluidic & electro-optical components for medical diagnostics, thin film electronics for flexible displays & smart tags, photovoltaic energy generation for smart buildings, solid state batteries and GaN-on-Si power electronics. Rudi Cartuyvels holds a Masters degree in Electrical Engineering from the KU Leuven, Belgium. He started his career at IMEC in 1990 on advanced CMOS technologies. He was appointed Director of Interconnect Technologies in 2001 and has held several management roles in semiconductor technology development and smart electronic systems. Since 2016, he is Executive Vice President leading imec’s Smart Electronics R&D and is also heading imec’s Business Development unit.

15:20
Fab Labor Productivity Improvement through a Combined Modeling Approach
  Ariel Meyuhas, COO, The MAX Group
Fab Labor Productivity Improvement through a Combined Modeling Approach
Ariel Meyuhas

Ariel Meyuhas
COO
The MAX Group

Ariel Meyuhas

Abstract
This case study describes a comprehensive approach to Fab staffing modeling which is based on combining two different methods. The first is based on the transaction records (lot track in) from the MES system and It provides a quick evaluation of the impact of staffing levels on the productivity of different areas. The second one uses data collected by following and observing operators on the floor and timing their activities; this evaluation provides more details on how the operators spend their time, and it provides insight on improvement opportunities for direct labor. This dual approach generates both quick guidelines for optimization of staffing levels and long term guidance for improvement plans. This method has been successfully tested in two different fabs and it has generated up to 15% improvement in output per operator.

Biografie
Mr. Meyuhas is a co-founder and COO of the MAX Group, a global consulting firm transforming the semiconductor industry’s operational landscape. The firm provides a unique range of operational solutions that increase factory and supply chain delivery performance – More product out of installed capital, faster cycle times, higher yields and lower cost of operation. With over 20 years of experience in the semiconductor industry, Ariel brings vision, innovation, a very strong relationship portfolio with leading semiconductors companies, and steers for perfect execution at MAX.

15:40 Coffee Break
16:00
Leveraging Technology in Manufacturing Automation of Legacy Fabs
  Eng Keong Ho, Director of Photo & IT, SSMC
Leveraging Technology in Manufacturing Automation of Legacy Fabs
Eng Keong Ho

Eng Keong Ho
Director of Photo & IT
SSMC

Eng Keong Ho

Abstract
Singapore’s Semiconductor Front End Manufacturing started >30 years ago in 1984 with 5-inch progressing towards 6 inch, 8 inch and finally state of the art 12 inch. Although the legacy fabs were expected to phase out gradually, recent technology developments in the “More than Moore” for IoT(Internet of Things) has breathe new life into the 5,6,8 inch factories. Hence, to improve the productivity and cost competitiveness, it is paramount to leverage new automation technologies to improve the manufacturing processes in these fabs. This will help to reduce the gap in manpower requirements required in the legacy fabs against the 12 inch factories. This presentation will share the challenges and how the new technologies can improve factory automation in a cost competitive manner.

Biografie
Mr Ho is the Department Director of Photo Lithography and Information Technology working in SSMC(A joint venture between NXP and TSMC) for more than 15 years. Much of his work focuses on leveraging information technology to drive manufacturing automation to improve Productivity in SSMC. He also represents SSMC in the working committee of robotics automation in SEMICONSG Vision2020. Mr Ho holds a Master of Technology(Knowledge Engineering) from Institute of Systems Science(NUS) and a Honours Degree in Mechanical Engineering from National University of Singapore. He is also a Spring Singapore Business Excellence assessor.

16:20
Online Scheduling applied to 8-inch fabs
  Vincent Gosselin, Director - Optimization Solutions, IBM
Online Scheduling applied to 8-inch fabs
Vincent Gosselin

Vincent Gosselin
Director - Optimization Solutions
IBM

Vincent Gosselin

Abstract
After being the pioneer during the early 2000s in developing Optimization based schedulers to replace Rules-Based Dispatch in South Korea’s memory (12-inch fabs) and TFT fabs, IBM Analytics have tuned the technology to provide even greater benefits in high-mix fabs such as foundries in Taiwan, Singapore and the US. Some of our customers have used our “packaged” software solution FPO (aka FAS: Fab Area Scheduler). Others have opted for our core optimization software to develop their own scheduler themselves adopting concepts similar to FPO’s. More recently, a few 8-inch fabs have implemented successfully FPO for their Photo-litho and Diffusion processes. While we expected a much bigger challenge in terms of the acceptance of technology, we have found that 8-inch fabs have as much to gain as their 12-inch counter parts. A few 8-inch specific requirements had to be modelled/added to the software in particular when certain fabs operate with few operators. Some simplifications have also been warranted in the face of less specific information being provided by 200mm MES or other external IT systems. We will share with the audience these experiences in deploying FPO in 8-inch environments: initial pushbacks, technical and human related challenges, lessons learnt and results/benefits etc.

Biografie
Director Optimization Solutions – IBM Analytics Act as Optimization & Industry Expert involved with large customer accounts. Provides consulting to customers in the field of discrete Manufacturing, logistics & transportation with a strong experience in the domain of Semiconductor/Electronics. He spent 15 years in Asia bringing the benefits of optimization technology to large players. In the early 2000s, his first involvement with Semicon manufacturing was for Samsung with the development of Monthly Production Planning software for the early generation of TFT Plants and later for memory Fabs. Then his main focus was to propose Optimization-based Software to improve the productivity of Lot Dispatching for front-end Fabs. He designed several versions of ever more sophisticated online Schedulers from RTS (Real Time Scheduler for Samsung Memory) to FPO (Fab Power Ops). The software has since replaced RTD in many 300mm fabs for keys sectors such as Photo Litho and Diffusion. More companies have now embrassed this solution: TSMC, UMC, NTC, ST Micro, Global Foundry etc. His current mission is to propagate the benefits of “online Optimization” beyond the world of 300mm plants” in particular with 200mm fabs but also in other industries in areas like disruption management for airlines or railways. Other Positions: Ilog Asia Pacific – Consulting Director In charge of the Consulting activities for ILOG’s regional customers with a strong focus on semicon front-end and back-end players: Scheduling Testing Dpt (Back-end), Production Planning, Supply Chain Planning. HoneyWell Australia - Principal Consultant - Strategic Business Department Management of several optimization projects for the Australian’s Public Transportation Corporation (PTC) which showed an improved utilization of the client's resource and a better integration between the planning department and the control centre. Other Information Author of 12 technical papers on resource optimization in the Manufacturing sectors, Railways and Logistics.

16:40
Remote service with smart glasses
  Benrhard Riester, Engineering Manager, Texas Instruments GmbH
Remote service with smart glasses
Benrhard Riester

Benrhard Riester
Engineering Manager
Texas Instruments GmbH

Benrhard Riester

Abstract
Worldwide collaboration and knowledge transfer is a key differentiator in today’s industry and especially in manufacturing. Collaboration is not something new. We did it already in the past, however with less efficiency. Years ago knowledge transfer was mainly done by telephone or by travelling, which is by the way the most costly way to do it. Video conferencing was used in the 90th . Web based applications like Webex, Skype followed in the next decade with the broadening of the internet. With the high speed internet becoming available in all regions of the world we can now make the next step and make use of recent developments: the smart glasses. Widely known as “Google Glas”. These smart glases are no longer IT gadgets. They can help in our daily business. Easy to use and flexible. In this paper we will show how smart glases can be used for remote maintenance and therefor help to maintain and repair our tools much faster and in a more efficient way.

Biografie
Biography Education: Master in photo-engineering from the University of applied sciences in Cologne 1985 – 1988 Process engineer at Siemens with responsibility for Exposure Equipment Evaluation 1988 – 1996 Process engineer At TI Freising with various responsibilities in the Photo Module 1996 – 1998 WW Deputy Lithography Technology Mgr. in Dallas 1999 – 2002 Module Mgr. Epi/Implant Freising Wafer Fab. 2002 – 2015 Equipment Engineering Mgr. Freising Wafer Fab 2016 – Engineering Mgr. Automation/Cost Freising Wafer Fab

17:00
Smart Defect Density Monitoring solutions in multi-product waferfabs
  Andreas Driesen, Team Leader - Defect Inspection, X-FAB Semiconductor Foundries AG
Smart Defect Density Monitoring solutions in multi-product waferfabs
Andreas Driesen

Andreas Driesen
Team Leader - Defect Inspection
X-FAB Semiconductor Foundries AG

Andreas Driesen

Abstract
Semiconductor manufacturers are constantly confronted by growing customer requirements in terms of product quality, in particular the Defect Density. The focus is mainly on the achievement of "Zero-Defect-Rate". This objective is even more challenging due to the complexity in a multi-product wafer fab and their varied and extensive product mix. The challenges continue to grow through a combination of CMOS and MEMS processes. Ultimately, are our everyday efforts, customer satisfaction, creating a trusting and open customer relationship as important goal. The resulting needs are major challenges for an appropriate Defect Density Monitoring. On the one hand it is necessary to efficiently combine the respective process specifics of both the CMOS production and MEMS production together and on the other hand to meet the challenges of a semiconductor foundry. An equally important aspect is the understandable and comprehensible description of the methods and systems to our discerning customers. “Zero-Defect-Rate" for a semiconductor foundry means a close and strategic cooperation, starting from the direct customer up to the final product. For this is an appropriate solution to the defect density monitoring with the reliable product monitoring throughout the supply chain essentially.

Biografie
Andreas Driesen, born 26.02.1975 in Erfurt, married, one daughter. School in Erfurt, then training at Deutsche Telekom AG, followed by studying electrical engineering in Jena at the University of Applied Science. Since 2007 in the X-FAB Erfurt AG Defect Density Engineering. Since 2015 Team Leader of Defect inspection teams (In -Line Defect Density, automated QA, OQA, packaging / shipment, clean rooms).

17:20 END
 

19:30 Networking Reception
  - only for attendees of the Fab Management Forum -
 
Tuesday, October 25, 2016
Session 2

Facility

Chair Serge Nicoleau, 200mm/300mm Operations Deputy Director, STMicroelectronics
Serge Nicoleau

Serge Nicoleau
200mm/300mm Operations Deputy Director
STMicroelectronics

Serge Nicoleau

Biography
Serge Nicoleau began his career at STMicroelectronics 18 years ago starting in Production management in their 200mm fab at Crolles near Grenoble in 1998. After various positions in Manufacturing and in Process & Equipment Engineering he was assigned to the newly starting 300mm fab “Crolles2 Alliance” with Motorola/Freescale and Philips/NXP Semiconductors in 2004. This role lead to being Device Engineering Director in 2007 before taking the responsibility of the Crolles 200/300mm Engineering Competence Center as Deputy Director of Operations in 2012. This role includes a specific responsibility for the industrial challenges of Automotive and IoT products in technologies ranging from 0.5µm down to 28nm critical dimensions with their multiple variants and options. Serge Nicoleau holds an Engineering Degree of the Ecole Polytechnique (Paris), a Master’s Degree in Theoretical Physics of the Ecole Normale Supérieure (Lyon) and a PhD in Particle Physics.

08:50

Keynote

 
Environmentally Friendly Innovative Etch Solutions
  Ashutosh Misra, CTO Electronics, Air Liquide
Environmentally Friendly Innovative Etch Solutions
Ashutosh Misra

Ashutosh Misra
CTO Electronics
Air Liquide

Ashutosh Misra

Abstract
To be completed

Biografie
As the CTO of Air Liquide Electronics, Ashutosh is responsible for defining the global technical vision and product development strategies of the Electronics Business Line. Prior to his current position, he was the Worldwide Director of ALOHA™ Electronics Performance Materials, where he oversaw Air Liquide’s advanced precursor business that supplies leading edge materials for CVD and ALD processes. From 2001-2008, as Director of Materials Development, Ashutosh lead the accelerated development and screening of advanced precursors and surface preparation products for semiconductor applications. He holds a Ph.D. in Physical Chemistry and was nominated as Air Liquide Group Fellow in 2013.

09:20
Managing Condensable Gases
  Chris O'Rourke, Applications Manager, Edwards
Managing Condensable Gases
Chris O'Rourke

Chris O'Rourke
Applications Manager
Edwards

Chris O'Rourke

Abstract
The range of CVD process precursor materials and associated reaction by-products vulnerable to condensation in dry pump foreline and exhaust systems is expanding. To some extent, the tendency for materials to condense in pipes can be reduced by diluting the exhaust with inert gas, as is done to control flammability. If, however, dilution rates are reduced to lower cost and improve abatement efficiency, an alternative strategy is needed to control condensation of liquids and solids in the process exhaust stream. Clearly, the major perceived risk associated with condensation is blockage of the exhaust pipe and a consequent process interruption caused by excessive dry-pump exhaust pressure or breach of seal integrity due to high pipe internal pressure. However, there are also other serious hazards that may result from condensed materials in exhaust pipes. To counter the condensation threat and improve system safety and productivity, thermal management systems control operating temperatures of forelines and exhaust pipes. Typically, these systems comprise electrical heater mats in close contact with the process pipe wall, enclosed by high-efficiency thermal insulation material. However, these systems are really only fully effective if they are carefully installed on the pipes to avoid cold spots, and their operation controlled in real time to ensure correct pipe operating temperature at all times. Temperature management is critical to prevent condensation of process materials and byproducts in vacuumm pump forlines and exhaust lines. The new thermal management systems address many of the shortcomings of previous generations to reduce equipment downtime and health and safety risks to operating and service personnel. The systems also provide increased functionality with programmable remote controllers that interface readily to fab control software, and better energy efficiency.

Biografie
Chris O'Rourke has worked in the semiconductor industry for over 20 years in various technical service and project management roles. Previously working for Rolls Royce and Wood group in Instrument control, he currently works as Applications Manager for thermal management systems at Edwards Vacuum.

09:40
Smart, Green and Lean Facilities: A competitive advantage
  Edwin Dobson, Senior Director, ESH and Facilities, STMicroelectronics
Smart, Green and Lean Facilities: A competitive advantage
Edwin Dobson

Edwin Dobson
Senior Director, ESH and Facilities
STMicroelectronics

Edwin Dobson

Abstract
In today’s world of rapidly changing technology & product mix juxtaposed upon a complex and demanding legislative framework, it is already a challenge to manage our sites and operations. In addition, customers are also becoming more demanding with higher expectations of the Sustainability performance of the factories used to make their products. Can we, in this context, transform our Facilities from being a “difficulty” into being a competitive advantage? STMicroelectronics with its 6 FrontEnd and 5 BackEnd sites has historically been a leader in driving the Environmental performance of its Facilities. This has been done through a corporate & local approach and through using a metric, the Environmental Footprint, as a driver to allow prioritization between sites both to address the most pertinent projects for continuous Environmental improvement. Locally, our sites work hand in hand with the authorities to optimize performance; one example being our site in Agrate, Italy, who have a complete water management program which focused on local community specific needs; the ST site optimized its water treatment process in order to eliminate the withdrawal from the deep aquifer used by the Agrate citizens as drinkable water, in favor of the more salted and not drinkable shallow aquifer. This win win approach gave the advantage for the Company of not having limitation for the next 15 years on the use of the water and the advantage for the Community of the drinkable sources preservation. More recently, Lean management practices are being deployed throughout our Manufacturing, including in our Facilities. These methodologies change fundamentally the way we work and provide new tools to help us to reduce consumptions, improve the efficiency, safety and motivation of our people and overall give us more effective and sustainable infrastructures. This presentation will include practical examples showing how smart, green and lean facilities are a way to achieve competitive advantage.

Biografie
Edwin started his career in 1984 at Inmos in the UK as a Process Engineer after graduation with an honours degree in Physics from the University of Durham. After the acquisition of Inmos by SGS-Thomson (which later became STMicroelectronics) he moved to France in 1991 to start-up the Lithography section of ST’s first 200mm fab at Crolles. After several Engineering Management positions he was subsequently made responsible for the Facilities & Infrastructure of the Crolles 2 300mm fab built in 2002. Since then he has held management positions at national and international levels in the fields of Facilities and ESH. Currently Edwin has a double responsibility for STMicroelectronics; at Corporation level as Director of Environment, Safety and Health (ESH) and for Front End Manufacturing as Director of Facilities & ESH.

10:00
Reducing Carbon Footprint in a Global Semiconductor Manufacturing Operations
  Joseph O'Sullivan, Manager of Global Energy Conservation Program, Intel Corporation
Reducing Carbon Footprint in a Global Semiconductor Manufacturing Operations
Joseph O'Sullivan

Joseph O'Sullivan
Manager of Global Energy Conservation Program
Intel Corporation

Joseph O'Sullivan

Abstract
With a strong track record of sustainability leadership Intel Corporation continually seeks to increase the handprint of its products while reducing the footprint of its operations. The strategies employed by Intel to reduce its carbon footprint include ..Taking into account the environmental impact when selecting sites, designing buildings, setting performance levels for manufacturing tools, and establishing goals for new production processes ..Continually seeking to reduce the environmental impact of the manufacturing operations by incorporating green design standards into the construction of facilities. ..In the past two decades Intel has reduced its direct emissions by 60% on an absolute basis while expanding its manufacturing capacity. Furthermore Intel has made a commitment to reduce direct emissions by an additional 10% on a per unit basis from 2010 levels. ..Manufacturing semiconductors is an energy intensive process and reducing energy use at manufacturing sites is a key component of Intel’s strategy to reducing its overall carbon footprint. ..Another key component to reducing its carbon footprint is continued support of the alternate energy market. Since 2008 Intel has been the largest voluntary corporate purchaser of green power in the U.S. according to the U.S. EPA. In 2015 as part of the U.S. White House Climate Pledge Intel adopted two new alternate energy goals to reduce our carbon footprint. ..Intel maintains a multi-site, 3rd party verified ISO14001 registration, and ISO 50001 certification (at 4 manufacturing sites). The ISO14001 registration helps Intel to evaluate the effectiveness of its environmental management system while the 50001 ensures that there is a robust energy management system in place. This presentation will outline Intel’s achievements in the areas of LEED certification, energy efficiency, alternate energy and also include an overview on the implementation of ISO 50001.

Biografie
Manager of Intel's Corporate Services Energy Conservation Program. The Energy Conservation Program seeks to design, procure, build, & operate Intel’s operations for optimal energy efficiency. Between 2012 - 2015 Intel has invested more than $120M on resource conservation and efficiency projects to reduce energy usage in its operations and reduce its carbon footprint.

10:20 Coffee Break
Session 3

How do we keep our fab vital?

Chair Thomas Richter, Vice President, Robert Bosch GmbH
Thomas Richter

Thomas Richter
Vice President
Robert Bosch GmbH

Thomas Richter

Biography
Thomas Richter, since July 2015 Vice President of the Wafer Fab 150/200 mm & MEMS at BOSCH Reutlingen, was born 1974 in Chemnitz. Working for SIEMENS, INFINEON, QIMONDA and MELEXIS he now has about 20 years of experience in the semiconductor industry. He holds a Diploma in Micro Technology of the University of Applied Sciences Zwickau (WHZ).

11:00

Keynote

 
Mature Product and End Markets: Strategies to Optimize Fab Operations
  Dan Boyle, AGS NA VP/GM, Applied Materials
Mature Product and End Markets: Strategies to Optimize Fab Operations
Dan Boyle

Dan Boyle
AGS NA VP/GM
Applied Materials

Dan Boyle

Abstract
In today's markets, the industry is seeing continued expansion and wafer fab lifetime extension of the MTM (More than Moore) production sites with the continued growth in Mobility, Automotive, IoT, VR, Al and Robotics. This lifetime extension is driving new requirements in Hardware, Services, Automation, Data Management and Waferfab control requirements as well as industry life time support with aging tools, supply chain and workforce. Dan Boyle will share how Applied Materials continues to invest in technology, skills and services to enable the customer and market requirements and keep our customers operations vital for future business demands.

Biografie
Dan Boyle is the Vice President of Field Services for the Europe and North America Regional Accounts within the Applied Global Services Organization. He has customer account management for service, spares and overall customer factory support with the regional accounts. Since joining Applied Materials in 1998, Mr. Boyle has held various positions in Service Management, Sales Management, Business Operations Support as well as overall Customer Account Support and Management. Prior to Applied Materials, he worked for Texas Instruments as well as TwinStar (TI/Hitachi JV) for fourteen years in various Equipment, Process and Manufacturing wafer fabrication engineering and management roles. Mr. Boyle holds a bachelor degree in Manufacturing from Bradley University and an MBA from the University of Dallas.

11:30
Industry 4.0 and the influence on the work environment
  Martina Holland, EMEA HR Operations Director, Texas Instruments
Industry 4.0 and the influence on the work environment
Martina Holland

Martina Holland
EMEA HR Operations Director
Texas Instruments

Martina Holland

Abstract
Industry 4.0 is not only changing the way production processes are organized but also influences the working environment for employees. The presentation will cover how the 4th industrial revolution affects the different aspects of resource development within the manufacturing sphere. It will discuss the topics of which tools can be effective in the field of recruiting, how employer branding needs to be adapted and how this impacts the work environment for employees.

Biografie
Martina Holland began her career at Texas Instruments in 1997 as a trainee located in Germany. After the trainee program she started in the HR department and since then has held various positions. In 2004 Martina Holland transferred to the US covering various roles within Compensation supporting multiple businesses for 6 years. In March 2010 she returned back to Germany to take the role as the HR Director for EMEA Sales & Applications. In addition to that she took on the leadership of the EMEA Staffing team in January 2014. Since September 2015 she is the HR Director for EMEA HR Operations managing all operational aspects of HR in EMEA for Texas Instruments.

11:50
I4.0 @ Bosch: People as key player
  Jens Knut Fabrowsky, Executive Vice President of Automotive Electronics, Robert Bosch GmbH
I4.0 @ Bosch: People as key player
Jens Knut Fabrowsky

Jens Knut Fabrowsky
Executive Vice President of Automotive Electronics
Robert Bosch GmbH

Jens Knut Fabrowsky

Abstract
I4.0 technology is a sozio-technical system, which has strong interdependencies between people and technology. People not only invent I4.0 technology they use it as well. Their creativity and interventions are important to develop and perform a high standard. That is why one of the 7 important features of I4.0 @ Bosch is “People as key player”. Within the next decade, work in shopfloor will change tremendously and we believe that this change is no destiny but can (and must!) be shaped. In the presentation first examples of this change will be shown together with a description of the main action fields for management and HR.

Biografie
Jens Knut Fabrowsky has been Executive Vice President Automotive Electronics of Robert Bosch GmbH since April 2012. He was born on 13th August 1968 in Esslingen (Germany) and is married. He studied mechanical engineering and industrial engineering at the University of Stuttgart (Germany) and the Technical University of Munich (Germany). Career stages in the Bosch Group: 1999 Director Chassis Systems, Blaichach, Germany - 2000 Technical Plant Manager Gasoline Systems, Rutesheim, Germany - 2004 Plant Manager Gasoline Systems, Eisenach, Germany - 2007 Executive Vice President Manufacturing Starter Motors and Generators Division, Schwieberdingen, Germany - 2012 Executive Vice President Automotive Electronics Division, Reutlingen, Germany

12:10
Developing competitiveness of Manufacturing in Europe
  Erik POITRENAUD, Senior Client Partner, Korn Ferry - Hay Group
Developing competitiveness of Manufacturing in Europe
Erik POITRENAUD

Erik POITRENAUD
Senior Client Partner
Korn Ferry - Hay Group

Erik POITRENAUD

Abstract
Most semiconductors operators have maintained a balance in their production footprint between Western Countries and Asia so far. Confronted to megatrends such as an ageing population in Europe, digitalization and technology convergence, they face the challenge of keeping on developing the competitiveness of their European sites if they are to maintain a significant production capacity in their historic cradle. Helping our clients develop their performance through organizational and human levers is Core to Korn Ferry Hay Group activities. Through our projects and client discussions, we could identify some patterns, philosophies and actions developed in other industries who started facing this kind of issues earlier than semiconductors. Each industry is specific and first critical thing is defining the nature of the problematic. It is different when people account for 10% of production costs vs. 30% or more. Transportation costs are also a factor, such as scarcity of Know-How and expertise in some geographies is. A lot of companies in the automotive, chemical, utilities... industries (amongst other) developed innovative ways to increase competitiveness of their western hemisphere production sites. Relocalization is an emerging reality which roots in a series of factors where productivity is one of the most impactful. With our clients, we have been developing programs such as process redefinition, continuous improvement, performance management, reorganizations, culture change, leadership development... We have also been observing the impact of technical training on new work habits, when it comes to developing usage of digital tools or reducing accidents at work. During the keynote, we will share experiences and develop our point of view that being disruptive not only in technology implementation but also in Organization, Culture and Leadership changes is critical to develop competitiveness.

Biografie
Erik Poitrenaud has been a consultant at Korn Ferry Hay Group for 20 years. He focuses on developing companies' performance by implementing innovative programs in the fields of organization and talent management, mainly at large global players. Before joining Hay Group, he was Product Manager at Sybel, a French software publisher now part of the Sage Group. Mr. Poitrenaud holds a diploma of the Ecole des Hautes Etudes Commerciales du Nord (EDHEC).

12:30 Lunch