A To top
Advantest Europe GmbH Advantest Europe GmbH Dirscherl, Toni
Addressing challenges testing complex power analog semiconductors
Dirscherl, Toni

Dirscherl, Toni
Product Manager Power and Analog
Advantest Europe GmbH

Dirscherl, Toni

Abstract
Innovation and permanent cost reduction measures are driving steady rising semiconductor content. At the same time the pin count stays almost constant and therefore drives the need for complex device I/O structures. Various test requirements from analog/power to digital are observed behind such pins which drive the demand for a flexible ATE resource. High power devices require a careful thermal management to achieve a high measurement stability. An exact defined and repeatable energy delivery of the ATE High Power VI Sources to the DUT is essential. In addition, the power IC market presumes a significant higher mix of devices compared to prevailing digital centric segments. To test such a diversity of products a universal test system architecture is of benefit. A major contributor for saving test cost is to increase the number of test sites. As a consequence, there is a need for additional load board circuitry. Moreover, complex power multiplexing schemes are getting introduced due to resource sharing. With rising site counts a high multisite efficiency (MSE) becomes a key element for throughput optimization. A method to increase ATE efficiency is the parallel execution of test sequences on the ATE hardware, rather than constant interaction between the instrumentation and a workstation CPU. The solution for above challenges is addressed by a universal ATE pin architecture with synchronized pattern based execution for maximum throughput and repeatable setups and measurements. Powerful software tooling supports the capability of complex routing and multiplexing schemes which are seamless integrated into the main test flow.

Biografie
Toni Dirscherl holds a degree as Electronic Engineer from the University of Applied Science in Munich, Germany and joined SZ Testsysteme as Development Engineer for Analog DSP frontends in 1997. After serving 3 years as Senior Application Engineer for SZ Inc and Credence in San Jose/California from 2001 to 2003, Toni Dirscherl took over the position as Product Marketing Engineer for Credence-SZ GmbH. Since the acquisition of Credence-SZ by Advantest Europe in 2008, Toni Dirscherl acts as the Product Manager for Advantest’s Analog and Power Solutions. He has published numerous articles.

Power Electronics Conference
Afore Afore Kuukkala, Ari
Probers with Physical Stimulus – introduction to technology and benefits on WLP MEMS sensor final test.
Kuukkala, Ari

Kuukkala, Ari
Sales Director
Afore

Kuukkala, Ari

Abstract
Two wafer probers with physical stimulus are presented. The other one is for environmental sensor having stimuli for pressure, temperature, humidity or other gases. Another is meant for final testing of motion sensors: accelerometers, gyroscopes and magnetometers. The handling of miniature size, light weighted, sensors is getting more complicated. Many of the P&P systems are limited to package size of 2x2 mm. New wafer level packaging technologies enable much smaller form factors, sensors smaller than 1x1 mm. Using probers, DUTs are well organized on adhesive tape and the handling is smooth during the whole process. The presentation shows how the Cost of Test can be brought down by using probers with physical stimulus in MEMS final testing. The sensors can be fed directly from wafer dicing to the prober. The wafer ring with adhesive tape works as a carrier through the whole process. By this new handling method it is possible to shorten tremendously the manufacturing process and decrease the investment costs. The other benefit of a prober with physical stimulus is much higher capacity compared to traditional test systems, such as Pick & Place based test systems. Thousands of sensors can be fed simultaneously to the prober and the time is mainly used for testing, not for loading and unloading like with P&P systems. Due to constant MEMS sensor price dilution the industry is facing a huge cost pressure. In addition, there is a high demand for smaller, miniature size, sensors. New wafer level packaging technologies are responding to both of these challenges. However, the package type itself doesn’t reduce the cost of test (COT), which is one of the biggest manufacturing costs of MEMS sensors. A real case calculation concerning testing of 3-axis accelerometer shows how the final testing with a prober with physical stimulus leads to lowest cost in the market.

Biografie
Mr. Kuukkala has degree in Mechanical Engineering and is working on degree in Electrical Engineering. In addition he has studies in economics. He has worked for Afore over 10 years in different positions; as a mechanical designer, service engineer and R&D manager. Currently he is working in business development and sales still being highly involved to new product development.

Advanced Packaging Conference
Airbus Airbus Friedberger, Alois
Flexible sensor systems for real time monitoring of aircraft structure fabrication
Friedberger, Alois

Friedberger, Alois
Head of Sensor Integration
Airbus

Friedberger, Alois

Abstract
Over the last years, more and more metallic structures in airplanes have been replaced by lightweight composite materials, especially CFRP (carbon fiber reinforced plastics). This leads to weight reduction and hence reduced fuel consumption. Increased aircraft production rates require mature fabrication processes and adequate quality control. Therefore, real-time monitoring of CFRP processes is needed. We will briefly describe the major fabrication methods for composite based aeronautic structures such as liquid resin injection and autoclave curing. A major and critical step is resin curing which takes place e.g. at 180°C for several hours. The most important parameters during curing are temperature distribution, degree of curing and pressure distribution. The respective requirements will be presented. Several parameters need to be monitored at many positions. A single laminate layer is approx. 125 µm thick requiring very thin sensors. During curing, forces are acting which requires sufficient mechanical robustness or flexibility of the sensor. For all these reasons, an approach based on a large-area flexible PCB has been chosen. However, the sensors are not all based on printed electronics technologies. Instead, hybrid integration of standard silicon pressure sensors and SOI-based pressure sensors has been used to obtain high precision and for the sake of rapid prototyping. The results of extensive testing from room temperature up to 180°C and from 1 to 6 bar absolute pressure will be presented. In addition, the sensors have been embedded in a real structure and its fabrication has been monitored in real-time. We will show details of this flexible sensor system operating in the harsh environment.

Biografie
Alois Friedberger gained his PhD in physics on his work about porous silicon and its application to MEMS (Micro Electro-Mechanical Systems). At Siemens, he worked in the field of microelectronics (CMOS) and surface-micromachining. He worked in the area of micro technologies, microsystems and surface micromachining for 1 ½ years at the Berkeley Sensor & Actuator Center (BSAC) at the University of California at Berkeley. After returning to Germany, Alois was doing research on thermal microsensors at the Daimler Research & Technology Center in Munich. He is currently research team leader at Airbus Group Innovations. A major activity is in the development of detection systems and integration of micro technologies, especially sensor integration in composite materials. Alois has approx. 55 journal and conference contributions and approx. 60 patents and filed patents.

2017FLEX Europe
AMKOR TECHNOLOGY EUROSERVICES AMKOR TECHNOLOGY EUROSERVICES Clark, David
Silicon Wafer Integrated Fan-out Technology (SWIFT®)
Clark, David

Clark, David
Sr Director marketing, business development
AMKOR TECHNOLOGY EUROSERVICES

Clark, David

Abstract
This paper reviews Silicon Wafer Integrated Fan-out Technology (SWIFT®) packaging methodology and its performance in a typical mobile application. In addition, the advantages of a SWIFT® design are reviewed in comparison to a conventional competing 3D packaging technology. Package information, electrical simulation, and reliability test data will be presented to show how SWIFT® technology is poised to provide robust, reliable, and low-cost 3D packaging solutions for advanced mobile products.

Biografie
David Clark currently holds position of Senior Director - Advanced Products Business Unit at Amkor Technology Europe. In this role, David is responsible for strategic business development and marketing of advanced package and test technology for Amkor. Prior to that he has held various roles in sales and business development at FlipChip International, research posts at University of Cambridge, application, product development and process engineering at Vistec Lithography and Agilent Technologies. David has an Honors Degree from University of Glasgow in Electronic, Electrical and Optoelectronic Engineering.

Advanced Packaging Conference
Anxin Capital Anxin Capital Zhou, Alan Zhen
Investing to Boost Power Electronics From Materials to Systems - Opportunities and Challenges
Zhou, Alan Zhen

Zhou, Alan Zhen
Managing Partner
Anxin Capital

Zhou, Alan Zhen

Abstract
Over the last 30 years, the semiconductor industry has been driven by rapid growing in demand for CPUs and Memories by personal computers and communications products at a speed and cost predicted by the Moore's law. As Moore’s law approaching its limit, more attention and resources are devoted in developing new devices and new materials including compound semiconductors such as GaN and SiC. These third generation WBG semiconductor materials are ideal for power electronics. As the world’s first Billion dollar fund dedicated to invest in compound semiconductors and build-up the eco-system globally. We have explored investment opportunities and challenges in many companies from start-ups to conglomerates around the world. These companies are developing new power semiconductor materials and devices, advanced power switching techniques, power control and monitoring technologies, power conversion&storage innovations, and adaptive power optimization algorithms, variable motor drives, green technologies for power generation, conversion and distribution, new internet and “sharing economy” business model in power, smart connected grid,etc. Of course, solution size, efficiency, and cost are well-established metrics for power technology advances and trends for these metrics are discussed. In summary, this talk examines the state of compound semiconductor power technology from an investor perspectives, including materials, devices, and systems; and share our vision for how the world of power electronics may evolve over the coming years and where we are investing to build up and accelerate the adoption and mass manufacturing of new materials, devices, and technologies in power electronics for applications in consumer electronics and mobile devices today as well as Electric Vehicles in the near future.

Biografie
Alan Zhen Zhou is the Managing Partner at An Xin Capital focusing on compound semiconductor ecosystem investments from material, equipment, process, device, to systems. Dr.Zhou has over twenty years of semiconductor experiences where he held both technical and management executive positions at IBM, AT&T, Lucent, Agere Systems and Qualcomm. He also founded and co-founded several companies, including CSMC (IPO in Hongkong), MEMSIC (IPO in NASDAQ), Top Global (acquired), Belleds and Bellnet Technologies. As vice president at Qualcomm, Alan was responsible for all Qualcomm chipset business and design wins in China where he managed Sales, Operations, Customer Services and Field Applications Engineering functions. His team delivered >$3B revenue and >150M units of smart phone chipsets per year to over 50 major OEMs. While working for Lucent and AT&T, he established the first communications IC design center and launched the first GSM handset reference design to a dozen leading communications and consumer electronics companies in China. He also built the first submicron IC foundry in China (now China Resources) with technologies transferred from AT&T Bell Labs. Dr.Zhou received both of his MS and Ph.D. degrees in Electrical Engineering and Computer Science from MIT with his BS degree in EE from NYU-Poly.

Power Electronics Conference
Applied Materials Applied Materials Rosa, Mike
The Challenge and Opportunity of 200mm/300mm More-Than-Moore (MTM) Technology Transitions
Rosa, Mike

Rosa, Mike
Head of Marketing, 200mm EPG
Applied Materials

Rosa, Mike

Abstract
In recent years, the 200mm wafer fab equipment market has enjoyed somewhat of a renaissance. With the meteoric rise of emerging technologies or the so called More-than-Moore (MTM) class of device technologies, the 200mm and below wafer fabs are seeing increased wafer volume demand and tool utilization rates that are driving the demand for both capacity add and new technology tools alike. While this has proven to be a boon in many respects for equipment OEMs, there are new and existing challenges to be overcome in supporting a growing 200mm market and with that, the increased potential for transition of MTM technologies to 300mm. From technology segment trends, to supply chain inventory, impact of new vs. used on price and delivery times, device technology transitions, to presenting the value of wafer size migration. This presentation outlines and discusses some of the challenges faced by Applied Materials’ 200mm EPG as it navigates the pitfalls and opportunities in rapidly changing legacy semiconductor equipment market place.

Biografie
Mike is currently Head of Marketing for the Equipment Product Group (EPG) within the Applied Global Services division of Applied Materials, Inc., The EPG is composed of New and Refurbished 200mm Semiconductor Equipment, Mask Technology Equipment, and Fab and Environment Solutions (FES) groups. Mike’s team within EPG is responsible for identifying key device level technology inflections and translating those into roadmap requirements for the continued development of equipment and processes in support of More-than-Moore (MTM) device technologies, all market sizing and forecasting activities, and finally marketing and communications for the overall group. Mike brings over 20 years of technology focused product and business development experience in emerging technology segments. Prior to joining Applied Materials Mike held various contributor level and senior leadership positions within the United States and Australia, working for technology focused companies that include Xerox Corp., PARC Inc., Australian Microelectronics Centre (AMC) and National ICT Australia (NICTA). His technical qualifications include B.Eng (Hons) and Ph.D. degrees in Microelectronics Engineering and MEMS Design / Fabrication, respectively. In addition to his technical qualifications, Mike has an MBA with dual majors in Marketing / Business Strategy and a minor in Entrepreneurship. He has authored over 40 journal and conference publications and holds over 25 U.S. patents.

TechARENA: MEMS
Applied Materials Applied Materials Britz, David Alexander
Wide Bandgap Power Electronics: What Will it Take for Large Scale Adoption?
Britz, David Alexander

Britz, David Alexander
Business Development Manager
Applied Materials

Britz, David Alexander

Abstract
New materials frequently face "the chicken or the egg" problem. Until there is sufficient scale of a material's usage, there is little incentive for supply chain manufacturers to invest in unique process tools. Applied Materials will review our perspectives on barriers to adoption of wide bandgap materials for power electronics and what would be required for large scale adoption of these materials.

Biografie
David Britz is a Business Development Manager at Applied Materials in the Office of the CTO. He has held various roles in the optics, and optoelectronics industry. David received an MBA from MIT Sloan and a D.Phil. in Materials from the University of Oxford.

Power Electronics Conference
ASM Pacific Technology ASM Pacific Technology Boulanger, Richard
How to dice Molded WLCSP's ?
Boulanger, Richard

Boulanger, Richard
Managing Director
ASM Pacific Technology

Boulanger, Richard

Abstract
HOW TO DICE WAFER LEVEL CHIP-SCALE PACKAGES THAT HAVE BEEN MOLDED TO INCREASE RELIABILITY ? Richard Boulanger, Jeroen van Borkulo, Eric M.M. Tan. ASMPT Laser Separation International B.V. Beuningen, The Netherlands RBoulanger@alsi.asmpt.com ISSUE The introduction of Wafer Level Chip Scale Package (WLCSP) has become one of the key packaging solutions in the semiconductor industry. One of the key innovative package solutions is the Molded Wafer Level CSP (m WLCSP) due to the robust 5 side or 6 side protection of the devices with epoxy mold compound (EMC) This application enhances reliability of the package by reducing chipping and handling damage and improving board level reliability. This paper will address the challenges of dicing m WLCSP’s while ensuring the dies are individually encapsulated to prevent delamination. SOLUTION The demand for molded wafer level chip scale package (m WLCSP) has experienced a significant growth due to the large demand in the mobile phones , wearable technology and automotive markets. The challenging demands of m WLCSP technology require more dies per wafer. As a result, street lane design has to be narrower and allow a sufficient amount of mold compound to remain on the sidewall of the devices. Blade dicing is the Process of Reference for WLCSP but the demands for a more narrow dicing kerf in m WLCSP are too challenging so Laser Dicing is now being explored Multibeam laser dicing will allow the distribution of the laser power into uniform low spot energy to create more narrow dicing kerfs and higher speeds. There are many new challenges such as the coating adhesion, filler size and the wafer alignment. The epoxy material has very unique adhesion properties and coating , materials needed to be optimized The typical coating material had to be modified to improve the adhesion to the Mold Compound and coverage around the Solder Bumps. The filler size needs to be carefully chosen as it affects both kerf width and speed. The filler material is made of fused silica which is evaporated during laser processing and the holes left behind can cause “mouse bites ”on the top and bottom kerf as well as leave a sidewall with multiple craters. Since the wafer is covered with Epoxy, the alignment becomes more challenging. The typical process would remove the outer mold material to expose the wafer and the half cuts done by the Blade Dicing. The machine alignment would then move around the edge to first recognize the crossings and then correct for alignment and then verify before starting dicing Another method being considered is Illumination through the backside of the wafer that needs to transmit through the dicing chuck , the Silicon Wafer and the Mold Compound to a specially equipped camera to capture the information. There are technical challenges to design an optical path that can share an alignment camera and a laser to allow live kerf check. CONCLUSION The m WLCSP package is increasing in popularity due to the demands of increased reliability for the automotive and mobile markets. Several companies are working to develop a mature process which should happen in 2017. This process will include laser dicing instead of blade dicing and has to overcome several challenges that are addressed in this presentation.

Biografie
Richard Boulanger, Managing Director and Vice-President, ASM Pacific Technology, Netherlands rboulanger@alsi.asmpt.com Biography: Richard Boulanger graduated from Ecole Polytechnique at the University of Montreal in Industrial Engineering. He worked at IBM in Bromont, Canada at their Semiconductor Assembly and Test Facility. Over the course of 18 years, he worked in several functions such as Site Quality manager, Memory Business Unit, Sales Director and Strategy Director as well as some assignments in Corporate Headquarters in the USA. He moved to Binghamton, NY as Vice President of a newly formed Business Unit to design, build and sell Flip Chip machines based on a proprietary Linear Motor technology to achieve world class accuracy. He was also responsible for the SMT Process labs in China and the USA. He then went to Switzerland to become the Die Bonder Vice President of Kulicke and Soffa and Managing Director of the newly acquired company Alphasem. Following a short stint as Chief Operating Officer for Synova he became CEO of ALSI in the Netherlands which was then sold to ASM Pacific Technology where he is now the Managing Director of ALSI B.V.

Advanced Packaging Conference
ASML ASML List, Frans
Progression of Moore’s law
List, Frans

List, Frans
Senior Project Manager Strategic Technology Program
ASML

List, Frans

Abstract
In this session the cooperation between industry, SME’s, research institutes and academia in development of next generation semiconductor technologies will be covered. It provides an overview of the results and challenges in enabling 10nm, 7nm and 5nm technology nodes and thereby continuing Moore’s law. Technology areas addressed are Lithography, Metrology, Processing and Mask Infrastructure. The work is supported under the ECSEL Joint Undertaking, projects; E450LMDAP, SeNaTe, TAKE5 and TAKEMI5.

Biografie
Frans List works currently for ASML as Seniors Project Manager Strategic Technology Program. He received his Master degree in Electronic Engineering from the University of Twente, the Netherlands in 1984. Ever since he has been involved in semiconductor product development in roles varying from Integrated Circuit Design, Project-, Program- and R&D management with professional engagements in the Netherlands, England, Italy and Taiwan, leading product development projects, teams and development departments in Philips Research, STMicroelectronics and NXP. In the past he setup and coordinated industrial consortia collaborating on Non-Volatile Memory technology development in European context as part of Medea and Medea+ programs.

TechARENA: Semiconductor Nano-electronics - The Power of Collaboration
Atotech Deutschland GmbH Atotech Deutschland GmbH Walter, Andreas
Direct electroless under bump metallization (UBM) for wire bonding and soldering on next generation power semiconductor materials
Walter, Andreas

Walter, Andreas
Team Manager Electroless Processes
Atotech Deutschland GmbH

Walter, Andreas

Abstract
Direct electroless under bump metallization (UBM) for wire bonding and soldering on next generation power semiconductor materials The presentation will show benefits and feasibility results for electroless plating direct on GaAs, GaN, SiC for next generation packaging in growing power electronics industry. Compared to Si and Ge, these wide band gap materials allow the design of smaller and faster power components with higher reliability and more efficiency. Furthermore, they enable operations at higher temperature, voltage and frequencies, which is necessary for many power applications. Although these materials already gaining more acceptance for new markets, they face some challenges, such as new packaging and design technologies, to become more cost efficient. One solution is to reduce packaging process steps by direct UBM on semiconductor material prior to soldering and wire bonding, which makes sputtering of Al and Cu pads obsolete. Further advantages are 1) higher throughput due to batch and double side processing, 2) self-aligned deposition without patterning and 3) reduced power losses due to low voltage ohmic metal-semiconductor contact after annealing. We will present our proven results that it is possible to deposit electroless Ni on GaAs or Si with different types and levels of dopings. In addition, we will show the feasibility of direct electroless plating on next generation power semiconductor materials, such as SiC, Ge and GaN.

Biografie
Andreas Walter has more than 18 years’ experience in semiconductor industry and is currently working as head of application for electroless plating processes for Semiconductor Advanced Packaging at Atotech. Before he joined Atotech in 2009 he worked 3 years as an Senior Engineer at Qimonda for process integration for new memory systems and 7 years as a Development Engineer at Infineon, where he was responsible for material development and process integration in 300 and 200mm fab for D-RAM and resistive memories. Andreas received his Diploma and PhD in chemistry at the Martin Luther University in Halle, where he started as a scientist for synthesis of OLED dyes and organic semiconductors

Power Electronics Conference
AT&S AT&S Stahr, Hannes
Embedding for Power Application and Fan-out Packaging at Panel Level
Stahr, Hannes

Stahr, Hannes
Groupmanager Technology
AT&S

Stahr, Hannes

Abstract
Embedding is without any doubt the key driver for advanced packaging. This has been shown over the last years. Miniaturization is the general unbroken trend in electronics and it looks for a big variety of technical solutions coming from the different main streams of packaging. A new hype was pushed up when TSMC showed their new fan out package solution for the A10 processor in Apple’s iPhone 7. The whole supply chain has reacted by developing materials, equipment and methodologies to support fan-out packaging to catch a piece of this attractive cake. In this field of expectation Fraunhofer IZM has built a consortium for panel level packaging with a focus on panel level molding. This consortium in the meantime has 16 members which are material suppliers, process and machine suppliers, PCB and substrate makers and a big silicon house. In this presentation the latest developments of this consortium and further interesting project results from IZM will be reported. Power application is another field for embedding technologies starting with DC-DC low power converters years ago in AT&S. New concepts with low thermal resistance and low inductance are developed and the industrialization was started. These concepts have been developed in the frame of the Catrene project EmPower which ended this year. The performance of these concepts and power applications will be shown in this presentation furthermore there is a view on the market potential for embedded power application. Authors : Andreas Ostmann , IZM Hannes Stahr , AT&S

Biografie
Hannes Stahr • He studied electronics and telecommunication engineering at the University in Graz and received his diploma in 1988 • He works as a group manager technology in the R&D of AT&S and was deeply involved in the most recent developments for HDI PCB • Since 1997 his focus area is component embedding in PCB staring with printed passive components • In 2008 he guided the FP7 project Hermes to success which resulted in the industrialization of the chip embedding technology und later to the foundation of the business unit Advanced Packaging in AT&S • The Catrene project EmPower was started in 2013 focusing on the development of embedded power modules and power packages using new embedding and power module concepts. He is the consortium leader of EmPower and will report in his speech about the progress. • He is author and co-author in 21 filed patent families for PCB and advanced packaging

Power Electronics Conference
Attolight AG Attolight AG Sonderegger, Samuel
GaN High Electron Mobility Transistor (HEMT) defect inspection by high resolution quantitative cathodoluminescence
Sonderegger, Samuel

Sonderegger, Samuel
CEO
Attolight AG

Sonderegger, Samuel

Abstract
Gallium nitride based high-electron mobility transistors (HEMTs) face an increasing demand for various applications such as cellular base stations, Lidar, wireless charging and the power supply segment. Gallium nitride has a number of advantages over Silicon such as a wide direct bandgap of 3.49eV, a break down field ten times larger than that of Silicon and a good electron mobility in bulk and heterostructures. These attributes make GaN and related alloys a compelling material for HEMTs. Nevertheless, integrating GaN based semiconductors on a silicon platform remains challenging due to a large lattice mismatch between GaN and Silicon. This mismatch yields to a high density of defects propagating through numerous layers of the device. These defects need to be analysed and understood during the research and development phase and need to be monitored and controlled during ramp up and production. We use quantitative cathodoluminescence to analyse a cross-section of a GaN-based HEMT. High spatial resolution spectroscopic information might be acquired by exploiting cathodoluminescence combined SEM. CL provides information about the electronic bandgap, variation of local concentrations of elements, strain and defect states in semiconductor heterostructures and insulators at the nanometer scale. We gain a direct insight into the presence of defects within the insulating C-doped GaN layer, and the homogeneity of thin AlGaN layers of varying Al content, emitting CL signal in the deep UV range. CL imaging clearly highlights the presence of defects across the insulating C-GaN, as well as highly localized CL emission from AlGaN layers. Further spectral processing allows characterization of local strain between layers with varied Al stoichiometry, determination of bandgap evolution, as well as characterization of Al content in each layer within 1% precision.

Biografie
Samuel studied at EPFL (Swiss Federal Institute of Technology, Lausanne) and Ecole Normale Supérieure de Lyon (France) and obtained a MS of Physics from EPFL. His master thesis on the optical properties of semiconductors was conducted at the Ioffe Physico-Technical Institute (Russia). During his PhD at EPFL, he further developed Attolight's ultrafast cathodoluminescence technology and used this technique to advance the understanding of optical properties of nitride based semiconductors. Samuel decided to jump into the entrepreneurial world after his PhD thesis and co-founded Attolight with Jean Berney. Since then he has headed the business development of the company with a strong focus on developing industrial applications of cathodoluminescence.

Power Electronics Conference
C To top
Cambridge University Cambridge University Udrea, Florin
Silicon and Wide bandgap devices in power electronics
Udrea, Florin

Udrea, Florin
Professor
Cambridge University

Udrea, Florin

Abstract
The view that Silicon will be replaced by wide bandgap materials such as Silicon Carbide and Gallium Nitride is gradually giving way to the idea that Wide bandgap materials will in fact coexist with silicon to address a growing market in power electronics with increasingly more demanding requirements. Silicon will remain the main material in power electronics for a long time to come. Its strength is not in performance, but in reliability, diversity, cost and smartness. The high end and specific niche markets will however embrace GaN and SiC. GaN is likely to create a larger impact in the lower power range with voltages up to 1.2 kV, while SiC will address the higher voltages (above 1.2 kV) and higher power levels. On paper Diamond is better than any other materials for power electronics and will have its chance in the future provided that there is enough investment from public funds. Its struggle now is to deal with the cost, wafer availability and availability and the lack of shallow dopants. This presentation will address the strengths and weaknesses of the different materials and technologies and present a view of how this material will play in the power device field in the future

Biografie
Florin Udrea is a professor in semiconductor engineering and head of the High Voltage Microelectronics and Sensors Laboratory at University of Cambridge. He received his PhD degree in power devices from the University of Cambridge, Cambridge, UK, in 1995. Prof. Udrea has published over 450 papers in journals and international conferences. He is the inventor of over 100 patents and co-funded 5 companies, three in power devices and two in sensors. Two have been among the most successful trade exists as Cambridge University spin-offs. For his ‘outstanding personal contribution to British Engineering’ he has been awarded the Silver Medal from the Royal Academy of Engineering. In 2015 Prof. Florin Udrea was elected a Fellow of Royal Academy of Engineering

Power Electronics Conference
Carleton University Carleton University Barry, Sean
Ligands as Surfactants in CVD and ALD: Making and Modifying Metal Surfaces
Barry, Sean

Barry, Sean
Professor
Carleton University

Barry, Sean

Abstract
Controlled deposition of metal films is important for many interesting applications, including microelectronics, as well as substrates for graphene fabrication, SERS and photochemistry. Deposition from the vapour phase offers superior control over purity and size of deposited metal structures, including films. However, shape control from the vapour phase remains a challenge. Precursor compounds for chemical vapour deposition (CVD) and atomic layer deposition (ALD) can influence the shape of deposited metal structures and surfaces: computational studies show that a coordinative ligand can dissociate from the precursor and act as a surfactant, controlling saturation of the surface and nucleation of metal-bearing moieties. When applied in practice, a deposited metal surface can be controlled by judicious choice of surfactant: saturated N-heterocyclic carbenes are superior to phosphine when applied to a gold surface as surfactants, and produce smoother and more well-controlled crystalline surfaces. This concept can be extended to using free bases in the gas phase to limit surface growth and nucleation. Indeed, tetrahydrothiophene was used recently to form monolithic, single gold features with up to 20 square micron (111) plateaus. The design and choice of coordination ligands in metal-containing precursor compounds will be discussed, with emphasis on their role as a surface-controlling surfactant. Examples of CVD and ALD deposited films will be given, and computational modeling of surface chemistry will be presented.

Biografie
Seán Barry is a Full Professor at Carleton University, Ottawa, Canada), where he works on precursor compounds for atomic layer deposition (ALD). Seán was trained in inorganic synthetic chemistry by Darrin Richeson (PhD, University of Ottawa, 1996), and spent three years working on chemical vapour deposition (CVD) and ALD precursors in the group of Roy Gordon (PDF, Harvard University, 1998 – 2000, 2002 -2003). He was instrumental in the design and synthesis of the well-known copper amidinate dimers that are presently used for copper CVD/ALD. He started in Carleton University in 2003 working on guanidinates of the group 13 metals (Al, Ga, In), and has recently studied guanidinates, iminopyrrolidinates and carbenes of the coinage metals (Cu, Ag, Au) for depositing thin films of these metals. His group works mainly on the mechanisms of thermal decomposition and thin film deposition, and have invented several novel characterization methods to better understand mechanism. He was previously the founder and Senior Scientific Advisor for Precision Molecular Design, a start-up company with GreenCentre Canada to commercialize precursors for atomic layer deposition. Seán is also the director of the Facility for Nanoscience, Surfaces, and Sensor Interfaces (FANSSI), which was commissioned in 2015 by a $1.9M Canadian infrastructure grant to study surface chemistry and ALD. He is recognized as a world expert in metal ALD and precursor design. He has long-standing and extensive industrial collaborations in ALD, including Applied Materials, Air Liquide, the Royal Canadian Mint, and BASF, to name a few. He has over 50 papers and 6 patents and patent applications in ALD precursor and process design:4 of the patents were established while an independent researcher at Carleton. In 2012, he was awarded a Marie Curie Fellowship as part of the EU-funded European Research Training Network ENHANCE to undertake metal ALD at the University of Helsinki, and in 2015 he was awarded a $295k Vinnova VINNMER Mobility grant to undertake CVD/ALD research in Sweden.

TechARENA: Advanced Materials Session2
CEA CEA GAVILLET, Jérôme
SmartEEs, a “Sustainable Marketplace for the Adoption, Ramp-up and Transfer of Emerging Electronics Solutions”
GAVILLET, Jérôme

GAVILLET, Jérôme
EU programs Manager
CEA

GAVILLET, Jérôme

Abstract
The market for organic & printed electronic products is growing at a high level (BUS$ 23-24 in 2014) with predicted annual growth rates of 20 % in all fields. Although the use of OLAE in products is still limited and only have been commercialized by large corporates, the number and type of products has grown significantly. These emerging markets are a huge opportunity for the EU industry. But EU small & mid-size companies have had only a limited access to technologies and often lack the capabilities needed to benefit from OLAE. These include the ability to fully understand the technological implications and the related business implications. They need support in the translation of the OLAE technologies into innovative products, assessing potential markets, finding investors, developing new business models and creating the right partnerships to optimally benefit from OLAE opportunities. SMARTEES will be the Digital Innovation Hub dedicated to OLAE, an organized European innovation network that provides both access to competencies and business support for innovation adoption. SMARTEES will help the European industry to create a competitive advantage within the global economy by providing access to disruptive OLAE technologies and innovation support in a pragmatic, operative and efficient pan-European manner. A 1-Stop-Shop will be set to establish a collaborative environment and to provide wider access to the technology at the same time as coordinating the bespoke services and efficiently and effectively linking them together. 20 Application Experiments will be conducted to explore the technology transfer into business, organization of cooperation, access to finance, services to be provided and act as showcases to raise awareness and activate potential users. The established eco-system will be harnessed by the consortium to propel the continuity of the initiative beyond SMARTEES. This will include the formulation of a comprehensive business plan as a strategic outcome.

Biografie
Dr. Jérôme GAVILLET received his PhD on material physics & surface processing from l’Ecole des Mines de Nancy (F) in 1996. As a researcher, he worked on hydrogen embrittlement of stainless steels for the petrol industry at the Federal University of Rio de Janeiro (B), on zircaloy alloy coatings for the French nuclear industry and on copper interconnects for the semiconductor industry at the University of York (UK). He spent 7 years in microelectronics working as a process engineer for equipment suppliers in Cardiff (UK), Sunnyvale (US) and Grenoble (F). He joined CEA-Liten in 2005 as a project manager in the field of Renewable Energies and Nanomaterials, working on surface energy and thermal management topics. Since 2012, he works as an European program manager, contributing to the management of CEA-Liten’s EU projects portfolio and setting up new business opportunities in the fields of materials, renewable energies, energy efficiency and information & communication technologies. He has authored 10 patents and over 40 publications.

2017FLEX Europe
CEA CEA Berson, Solenn
Perovskite-based Solar Cells Towards Large & Flexible devices
Berson, Solenn

Berson, Solenn
Head of laboratory of organic photovoltaic modules
CEA

Berson, Solenn

Abstract
Perovskite Solar Cells (PSCs) have recently emerged as one of today's most promising upcoming photovoltaic technology. Thanks to a unique combination of attractive features (high efficiency, low-cost, tunable bandgap, etc.) and their potential ease of processing, PSCs have drawn a tremendous research interest over the last few years. Record efficiency has then been quickly increasing and performances over 22% are now achieved. Yet, a number of challenges are still to be met to ensure a bright industrial future for PSCs. While few groups have been able to demonstrate large scale PSCs most of the worldwide current research is indeed focusing on small area lab-scale devices (ca 10 mm² or below). These latter are to a very large extent built on glass using spin-coating as the main fabrication method. No matter how promising their efficiency is, these devices are of course very far from any practical application. We here present the current developments of glass and foiled-based perovskite devices with respective power conversion efficiency of up to 18% on glass and 9% on PET foils. The effect of materials’ nature and processing is first investigated and related to devices’ characteristics. Special emphasis is put on planar low temperature processes (below 150°C) that allow for processing on virtually any kind of substrate especially plastic ones. Some of the issues that have to be overcome when increasing device active area and moving from single cells to serially connected modules are then discussed. Efficiency trend from 13 mm² up to more than 10 cm² is finally presented.

Biografie
Dr Solenn Berson (F) graduated from CPE Lyon, France (Lyon school of Chemistry, Physics and Electronics) with a master degree in Polymer Materials and Composites in 2004. She got her PhD degree in organic photovoltaic field at the Laboratory of Molecular, Organic and Hybrid Electronics, CEA Grenoble, France. After an industrial postdoctoral fellowship at the LIPHT in Strasbourg, she joined the Organic Photovoltaic group, CEA, INES, Le Bourget du Lac, France in 2008 as a postdoctoral researcher and since 2010 as a project manager for architectures and processes of organic/hybrid photovoltaic devices. Since 2013 she is managing the OPV group and since 2014, she is the Head of the Organic Photovoltaic Modules Laboratory.

2017FLEX Europe
CEA-LETI-Minatec Campus, Univ Grenoble Alpes CEA-LETI-Minatec Campus, Univ Grenoble Alpes Martin, François
New materials for More Moore and More than Moore
Martin, François

Martin, François
Senior Scientist
CEA-LETI-Minatec Campus, Univ Grenoble Alpes

Martin, François

Abstract
New processes and materials are emerging to provide possible solutions at the crossroad of MOS scaling and diversification of devices for More than Moore and IOT, including sensors, memories, power devices, RF and optoelectronic devices… New materials like 2D dichalcogenides could provide solutions but promises can become reality if manageable processes can be implemented on large substrates. This talk will discuss our motivation to investigate “green” processes avoiding toxic or corrosive precursors and the solutions brought by organometallic chemistries to promote new ALD or MLD deposition processes. Results on Molecular Doping for semiconductor surface doping and MoS2 (WS2) synthesis by Molecular Layer Deposition will be presented and discussed in a more general frame, aiming to promote manageable solutions for smart materials and interfaces tuning towards sustainable and low cost IOT devices.

Biografie
François Martin, 59 years old, is senior scientist in the Thin Film Deposition team in LETI. He was involved in the past decades on Material research and Developments for Advanced CMOS and memories, including HighK/Metal gate stacks for advanced CMOS. He brought his contribution to the introduction of Atomic Layer Deposition for HighK deposition in LETI and participated to European projects on advanced FEOL developments. His field of interest for several years is the research in emerging materials and processes like Molecular Layer Doping and 2D Dichalcogenide deposition in relationship with academic skills dealing with organometallic chemistry, aiming for sustainable processes and materials availability in future nanoelectronic devices. He was also member of the Emerging Material Section of the ITRS (2006-2014).

TechARENA: Advanced Materials Session2
CEA LETI CEA LETI Bouchet, Thierry
GaN for a new compact power converter generation
Bouchet, Thierry

Bouchet, Thierry
Power Electronic Marketing Strategic Manager
CEA LETI

Bouchet, Thierry

Abstract
Main goal for the next generation of Power converter is miniaturization in order to improve system efficiency at lower cost. Increasing reliability, operation safety and high working temperature (> 300°C) is also expected by end-users. To reach this target, we need to increase the power converter frequency that lead to a reduction of passive devices and contribute to the power converter miniaturization. For low power and medium power applications, GaN/Si technology is the best candidate if we think it at system level. In fact GaN devices allow high frequency capability (>MHz), high current density (at least 10 time higher than silicon) and new integrated functionality (lateral device) at lower cost as technology is CMOS compatible (8 inches GaN epitaxy on a silicon substrate). Power electronics is a key strategic activity of CEA Tech (French CEA institute). CEA TECH value proposition is a complete chain from design to system integration and optimization of Power converter. Our 5 years Power GaN Road map driven by the frequency increase focus on 6 main technological axes: epitaxy, GaN/Si active devices ,HF passive devices, 3D co-integration, GAN IC and new system topologies. 3 main Milestones related to main technology shift are presented to reach in 5 years the System on Chip approach (SOC).

Biografie
Thierry Bouchet earned his PhD in Electrical Engineering in 2001 and went to work for IBS (Ion Beam Services) and then for Atmel, two semiconductor companies. In 2011, Thierry created a fabless start-up (ADIS) in the area of power electronics. Thierry joined Leti end of 2014 and worked on developing of GaN components before becoming Strategic Marketing manager for energy and power electronics.

Power Electronics Conference
Chalmers University of Technology Chalmers University of Technology Kinaret, Jari
Graphene Flagship
Kinaret, Jari

Kinaret, Jari
Professor
Chalmers University of Technology

Kinaret, Jari

Abstract
In this presentation I will describe the Graphene Flagship (www.graphene-flagship.eu), which is a large scale, ten year research initiative funded by the European Commission together with the EU member states and associated countries. The flagship brings together a very large research consortium of academic and industrial partners from over 20 countries, who work together to take graphene and related materials from academic laboratories to society as new products and employment opportunities. I will briefly describe the project, its goals, evolution and results, with a focus on the electronics domain.

Biografie
Jari Kinaret received his M.Sc. degrees in Theoretical Physics and Electrical Engineering at the University of Oulu, Finland, in 1986 and 1987, respectively, and in 1992 he graduated with Ph.D. in Physics from the Massachusetts Institute of Technology. After a brief stay in Copenhagen, he moved to Sweden in 1995 where he works as a Professor of Physics at the Chalmers University of Technology. His research is theoretical condensed matter physics, and his main interests in the last years have been nanoelectromechanical systems as well as optical properties of graphene. He has been the driving force behind the research initiative Graphene Flagship since 2010, and is the Director of this one billion euro endeavor since the project start in 2013.

TechARENA: Semiconductor Nano-electronics - The Power of Collaboration
D To top
Daimler AG Daimler AG Zerrweck, Frank
Digital Vehicle - requirements for quality and availability of semiconductors
Zerrweck, Frank

Zerrweck, Frank
Director Instrumentation & Components
Daimler AG

Zerrweck, Frank

Abstract
Connectivity, autonomous driving, sharing and electrical drive are key trends in the automotive industry. These trends as well as most innovations in automotive require a lot of computing power, which leads to an increasing amount of semiconductors in the car. Customer’s expectation especially in the infotainment domain is of course to see the same performance as known from consumer electronics. However, semiconductors in a car have to follow special requirements in terms of reliability and life-time in order to ensure comfort and safety. Since semiconductors from consumer devices hardly can be used, most of the semiconductors in a car are special automotive grade, the availability of which has to be ensured over many years - not only the vehicle cycle but also for spare parts.

Biografie
Frank Zerrweck works as director Instrumentation & Components at the RD-Department of Mercedes Benz. Currently he is responsible for the development of infotainment components and architecture as well as for the advance development of the next infotainment generation. After studying electrical engineering at Munich University he joined the Daimler AG in 1993. He has extensive experience in research and development, supplier management, quality and purchasing.

Fab Management Forum
DISCO HI-TEC Europe GmbH DISCO HI-TEC Europe GmbH Klug, Gerald
Solutions for thin and tiny dies with high die strength and for thinning WLCSP and eWLB wafers
Klug, Gerald

Klug, Gerald
General Sales Manager
DISCO HI-TEC Europe GmbH

Klug, Gerald

Abstract
DISCO Corporation is a leading manufacturer for equipment and tools for wafer thinning and dicing. “Bringing science to comfortable living by Kiru (Dicing), Kezuru (Grinding) and Migaku (Polishing)” is DISCO’s mission. This way DISCO provides total solutions to meet the more and more demanding requirements of the Semiconductor industry in terms of manufacturing thin dies with high die-strength and several new approaches for advanced packaging. Discrete devices and RFID dies, universally used in smartphones and mobile devices, tend to have narrow street widths (cut margins), partially covered with low-k and ultra low-k layers, in order to maximize the number of dies formed on the wafer. Furthermore, mobile and IoT consumer products incorporate an ever-increasing number of such circuit components. With low-k and ultra low-k layers on top singulation processes become very challenging. In addition a part of these applications require the use of DAF-layers on the backside of the dies. In order to fulfil all these requirements, DISCO proposes several solutions, also focusing on avoidance of side wall cracks and interfacial layer damages, such as Dicing before grinding, Stealth dicing, Reverse Dicing before grinding and Plasma dicing, combined with Ablation laser grooving by ns- or ps-laser technology. WLCSP and eWLB applications face big issues in wafer thinning, because the wafers, due to consisting of resin mold and Silicon dies and having high bumps on the front side, tend to easily break when thickness becomes lower than the bump height. Nevertheless such low thickness is required due to increasing bump thickness. DISCO offers a unique technology to grind wafers with 200 µm high bumps down to 50 µm wafer thickness. DISCO Hi-Tec Europe GmbH, having its facilities close to Munich airport, offers certified Dicing and Grinding Production Services, so that customers can utilize most of afore mentioned Disco technologies in production, even without investing into DISCO equipment.

Biografie
Gerald Klug studied business engineering at the University of Siegen and graduated in 1998 as Dipl.-Wirt.-Ing., completing his thesis at BMW in Munich. He started his career as a designer of coil processing lines for nearly 3 years at a German machine manufacturing company, Heinrich Georg GmbH. At the end of 2000, he joined DISCO as a Sales Engineer for the area of Scandinavia. Meanwhile he has been almost 17 years at DISCO, nowadays operating as General Sales Manager for all Europe.

2017FLEX Europe
Dublin City University Dublin City University Porter, Adam
A Wearable Platform for Harvesting and Analysing Electrolyte Content in Sweat
Porter, Adam

Porter, Adam
Postdoctoral Researcher
Dublin City University

Porter, Adam

Abstract
The biomedical diagnostics industry is currently evolving from large expensive lab based devices to small portable systems allowing personal sensing and point of care analysis. A key example of this is the integration of miniaturised chemical sensing with wearable technology, which is currently one of the fastest growing sectors in the world 1. One of the main advantages of wearable chemical sensing is the ability to incorporate non-invasive sensing which uses readily available fluids such as sweat to test for a target analyte instead of traditional methods 2. Here we present a fully integrated wearable platform for the detection of sodium and potassium in sweat. The platform accesses sweat emerging through the skin during exercise, which is drawn across the sensors by capillary action to a highly adsorbent material reservoir. The sweat electrolyte composition is monitored via an integrated solid-state ion-selective electrode that tracks concentration in real time. The sensor data is digitised, stored locally, and subsequently transmitted via Bluetooth to a mobile phone or laptop. The platform design has been optimised through several iterations and use of rapid prototyping technologies such as 3D printing. Results obtained during on body trials over a period of controlled exercise are consistent with previously published data3 on the use of wearable sensors for the real-time monitoring of electrolytes levels in sweat. 1. Seshadri, D. R., Drummond, C., Craker, J., Rowbottom, J. R. & Voos, J. E. Wearable Devices for Sports: New Integrated Technologies Allow Coaches, Physicians, and Trainers to Better Understand the Physical Demands of Athletes in Real time. IEEE Pulse 8, 38–43 (2017). 2. Glennon, T. et al. ‘SWEATCH’: A Wearable Platform for Harvesting and Analysing Sweat Sodium Content. Electroanalysis 28, 1283–1289 (2016). 3. Gao, W. et al. Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis. Nature 529, 509–514 (2016).

Biografie
Adam Porter is a member of the Adaptive Sensors Group at the Insight Centre for Data Analytics, Dublin City University. He received his PhD (2015) from Dublin City University and his main research interests include the development of novel electrochemical sensors and biosensors, with particular emphasis on their incorporation into practical technologies.

2017FLEX Europe
DuPont Teijin Films DuPont Teijin Films MacDonald, Bill
Polyester Films for the Next Generation of Flexible Electronics
MacDonald, Bill

MacDonald, Bill
Business Research Associate
DuPont Teijin Films

MacDonald, Bill

Abstract
DuPont Teijin Films (DTF) is recognised as the technology leader in flexible substrates for flexible electronics and PV and DTF continues to work with the community to tailor films to meet cost and performance targets. Substrates are unfortunately often taken for granted by the community, yet considerable time and effort can be lost if the wrong substrate is worked on. It is essential to choose the appropriate and most cost effective substrate for a given application. This becomes even more important as this industry moves from demonstrators to commercialisation. It is clear from the feedback we receive when DTF presents that this message is not always understood, especially as new companies emerge onto the scene. The message needs to be continually repeated. This presentation will update the audience with the latest polyester film developments for flexible electronics, including: (i) Themoformable films for in mould electronics offering deep draw coupled with the inherent PET durability properties and the ability to cure conductive inks at higher temperatures (ii) Clear flame retardant films with UL94 VTM0 performance (iii) Ultra clean, cost effective substrates for barrier films; (iv) A new generation of heat stabilised UV stabilised films for frontsheets for flexible PV (v) Super clear, low haze, low iridescence films for Touch Sensors;

Biografie
Bill MacDonald graduated B.Sc and Ph.D in chemistry from the University of St Andrew. He is a Business Research Associate in DuPont Teijin Films (DTF), a 50:50 joint venture between DuPont and Teijin. He is currently actively involved in developing substrates for flexible electronic and PV applications and in understanding the material requirements required for these emerging industries. He has coauthored over 40 papers, several book chapters and regularly presents on the flexible electronic and PV conference “circuit”. He is a Visiting Professor in the Department of Pure and Applied Chemistry, University of Strathclyde.

2017FLEX Europe
Dyconex AG Dyconex AG Bihler, Eckardt
Near hermetic embedding of active components in thin flexible LCP substrates
Bihler, Eckardt

Bihler, Eckardt
Business Development Manager
Dyconex AG

Bihler, Eckardt

Abstract
A near hermetic packing technology of active components in a substrate based on liquid crystal polymers (LCP) technology is demonstrated and reliability measurements based on soak testing are presented. Liquid crystal polymers are chemically inert polymers with very low water and oxygen diffusion levels. The thermoplastic properties of these polymers allow the direct bonding of several thin, flexible polymer layers without the use of adhesives. Substrates, based on this material are very homogeneous and have proven stability in salt water immersion for extended periods (12+ months @ 77°C). The high heat resistance of the material set (MOT up to 180°C) suggests a possible use in high temperature applications. When exposed to even higher temperatures (>200°C) the material set can be thermoformed into a 3D structure. The flexibility of the material in an optimized 3D shape allows their use in stretching conditions. To further increase the functionalization of these substrates, active components have been embedded during the manufacturing process. The LCP substrate acts both to encapsulate and as a wiring interconnect which can be used in harsh environments. Resistance measurements of comb structures on a silicon die, encapsulated and interconnected in a LCP substrate and immersed in a salt water solution show very little resistance changes over time.

Biografie
[1] J. Jeung, et al., “A novel multilayered planar coil based on biocompatible liquid crystal polymer for chronic pain implantation,” Sensors and Actuators A: Physical, Volume 197, 1 August 2013, pp. 38-46. [2] S.W. Lee, et al., “Development of Microelectrode Arrays for Artificial Retinal Implants Using Liquid Crystal Polymers,” IOVS, December 2009, Vol. 50, No. 12, pp. 5859-5866.

2017FLEX Europe
E To top
Eindhoven University of Technology Eindhoven University of Technology Mackus, Adrie
Area-selective atomic layer deposition for self-aligned fabrication
Mackus, Adrie

Mackus, Adrie
Assistant professor
Eindhoven University of Technology

Mackus, Adrie

Abstract
Because nanomanufacturing using conventional top-down processing based on photolithography and etching is becoming extremely challenging at sub-10 nm dimensions, there is currently a strong desire in the semiconductor industry to move towards self-aligned and bottom-up fabrication schemes. Area-selective atomic layer deposition (ALD) aims at the deposition of material only on specific surfaces, and therefore has the potential to eliminate alignment issues, while reducing the number of required lithography steps. In this presentation, several approaches for achieving area-selective ALD will be presented and discussed. Special attention will be given to a recently developed method based on using inhibitor molecules in ABC-type ALD cycles. In this method, an inhibitor molecule is chosen that selectively adsorbs on specific materials, and subsequently blocks the precursor adsorption, resulting in area-selective deposition on those materials on which the inhibitor does not adsorb. It will be shown that an ALD process consisting of acetylacetone inhibitor, bis(diethylamino)silane precursor, and O2 plasma pulses, enables area-selective ALD of SiO2 on for example GeO2, SiNx, or WOx, without coating Al2O3, HfO2, or TiO2. The opportunities for using such an area-selective ALD process in self-aligned fabrication schemes will be discussed.

Biografie
Adrie Mackus (1985) is an assistant professor in Applied Physics at Eindhoven University of Technology, TU/e. He earned his M.Sc. and Ph.D. degrees (both cum laude) in Applied Physics from TU/e in 2009 and 2013, respectively. Adrie worked as a postdoc at the department of Chemical Engineering at Stanford University in 2014-2015, after which he returned to TU/e in 2016. His research covers the field of thin film deposition by atomic layer deposition (ALD) for applications in nanoelectronics, with the focus on area-selective deposition and on the study of the underlying reaction mechanisms.

TechARENA: Advanced Materials Session1
EPCOS OHG - A TDK Group Company EPCOS OHG - A TDK Group Company Kügerl, Georg
Trends in Passives for Power Electronics
Kügerl, Georg

Kügerl, Georg
Executive Vice President and CTO
EPCOS OHG - A TDK Group Company

Kügerl, Georg

Abstract
The capability of a power electronic system is strongly influenced by its passive components. In this regard, the passives should offer a maximum level of operating temperature, switching frequency, electrical field and current, and robustness. This calls for new materials and technologies, innovative product designs, and an increased level of component integration. Passive components that fulfill these requirements enable new possibilities for power electronic systems and are therefore called ‘More-than-Moore Passives’. In this presentation we review the specific requirements on passive components used for power electronics. We outline some of the current physical and practical limitations of passives, and present some examples how these constraints can be overcome. Emphasis is placed on new materials for improving the high temperature and high frequency characteristics of capacitors and inductors. Also some examples of system integration of passives are given.

Biografie
Dr. Georg Kuegerl earned his PhD in Physics at the Graz University of Technology (TU Graz) in Graz, Austria. In 1992 he joined Siemens Components, which in the meantime is a part of TDK Corporation. He is now the Chief Technology Officer of TDK's Piezo and Protection Devices Business Group, and is also Head of the TDK European R&D Center.

Power Electronics Conference
ESMT Berlin ESMT Berlin Hagen, Jan
Human failure & mindset change
Hagen, Jan

Hagen, Jan
Associate Professor
ESMT Berlin

Hagen, Jan

Abstract
Dealing with errors – your own and those of others – is a challenge although we all make mistakes. As leaders we may recognize this and expect our staff to alert us on our own errors. However in practice this rarely happens. A view on airline flight decks shows us that pilots follow a concept that provides valuable lessons for managers. We will explore the concept of dealing with errors in the aviation industry and discuss the applicability of this error management concept in other organizations.

Biografie
Jan Hagen is an associate professor at ESMT European School of Management and Technology in Berlin. Jan’s research and teaching focus is on leadership. He is particularly interested to understand how teams and organizations deal with errors. Apart from articles in academic journals he published the book Confronting Mistakes – Lessons from the Aviation Inustry when Dealing with Error (Palgrave Macmillan) in 2013. His research received media coverage in international outlets like the BBC, Financial Times, The Economist, The Guardian, Forbes, Harvard Business Manager, Irish Times, and Sunday Times. Jan directs the ESMT open enrollment program Leadership under Pressure and is the host of the ESMT Error Management Conference. He teaches in executive education programs and human factors training of the German Federal Armed Forces. In addition to his academic work, he has more than 15 years of experience in management and consulting.

Fab Management Forum
EV Group EV Group Eibelhuber, Martin
Advanced Mask Aligner Lithography for MEMS and Advanced Packaging
Eibelhuber, Martin

Eibelhuber, Martin
Deputy Head of Business Developmnet
EV Group

Eibelhuber, Martin

Abstract
Mask alignment systems are an essential part of the manufacturing lines for MEMS, LEDs and advanced packaging. In particular MEMS devices gain cost and technology advantages which are given by highest throughput, large depth of focus and insensitivity to bowed and warped wafers. In particular the large depth of focus enables the pattering of high topographies like within a deep etched cavity or over tilted side walls. Additionally this can be also used to efficiently and precisely pattern thick resists up to the range of 100µm. Recent improvements on the mask aligner equipment provide these and more advantages but with significantly improved throughput of 165 wph, most precise alignment down to 250nm and increased exposure intensity up to 120mW/cm².

Biografie
Martin Eibelhuber is deputy head of business development at EV Group for bonding, lithography and nanofabrication technologies and particularly focusing on compound semiconductors, nanotechnology and engineered substrates. He holds a PhD (Dr. techn.) in technical physics from the Johannes Kepler University Linz specialized on nanoscience and semiconductor physics. As a university staff member he gained professional experience in photonics, nanofabrication and material characterization.

TechARENA: MEMS
EV Group (EVG) EV Group (EVG) Uhrmann, Thomas
DPSS Laser Debonding for Thin Wafer Handling
Uhrmann, Thomas

Uhrmann, Thomas
Business Development Director
EV Group (EVG)

Uhrmann, Thomas

Abstract
Thin and flexible wafers are often a challenge to process on standard semiconductor equipment; therefore temporary bonding for mechanical support is used and already well established for various applications. Especially UV laser debonding offers process characteristics like high throughput and debonding at room temperature, combined with the availability of high temperature stable materials. Solid state lasers provide several advantages in regards of maintenance and consumables costs and are therefore a reasonable choice for laser debonding. In this paper we will identify and examine critical process parameters for successful laser debonding with a solid state laser with a beam shaping optics for good process control. A successful debond is characterized by delamination between carrier wafer and device wafer with lack of carbonization, therefore the degree of carbonization is evaluated in dependence of the specific process parameters like radiant exposure and beam overlap. Different material systems from different suppliers are evaluated as the value of the parameters vary depending on the used system. The impact of each parameter is analysed during this study.

Biografie
Dr. Thomas Uhrmann is director of business development at EV Group (EVG) where he is responsible for overseeing all aspects of EVG’s worldwide business development. Specifically, he is focused on 3D integration, MEMS, LEDs and a number of emerging markets. Prior to this role, Uhrmann was business development manager for 3D and Advanced Packaging as well as Compound Semiconductors and Si-based Power Devices at EV Group. He holds an engineering degree in mechatronics from the University of Applied Sciences in Regensburg and a PhD in semiconductor physics from Vienna University of Technology.

2017FLEX Europe
F To top
First Sensor AG First Sensor AG Peschke, Matthias
Pressure Sensors: Challenges in Design and Production
Peschke, Matthias

Peschke, Matthias
Vice President Production
First Sensor AG

Peschke, Matthias

Abstract
Pressure sensor manufacturers cover a broad range of processes and technologies to produce high-performance sensors and sensor systems for pressure ranges between 0.01 and 2,000 bar. Trends such as the on-going miniaturization in sensor technology, higher demands on reliability and long-term stability or growing intelligence lead to challenges within the value chain of sensor production. Manufacturers have to develop innovative solutions for growing market demands. In addition, they have to consider investments, flexibility, quality, and cost influence in production. In Front End production, high investments in “standard” semiconductor processes and special MEMS processes are combined with essential effects on sensor quality. Innovative packaging solutions can significantly influence the robustness of sensors. A rising influence on costs during the manufacturing process can be noted for calibration which is driven by intelligence and functionality requirements. Moreover, the demand for new and competitive technologies for high pressure ranges is growing. The lecture focuses on pressure sensor manufacturing steps and works out challenges as well as upcoming trends in sensor technology. Examples for corresponding solutions developed by First Sensor will be introduced, e.g. the use of thicker backplates during packaging processes to ensure mechanical decoupling. Further topics are First Sensor’s STARe technology for higher long-term stability and T-Bridge as a flexible technology for high pressure measurement. Furthermore, the advantages of COB and TSV micro soldering technologies will be discussed.

Biografie
Dr. Matthias Peschke completed his degree in Physics at TU Darmstadt and wrote his doctorate on the topic of “The effect and technology of gas-sensitive field-effect transistors.” He is a recognized expert for, e.g. the qualification of a variety of technologies, the development and implementation of series production processes, and transnational technology transfers and synchronizations. Dr. Matthias Peschke is Vice President Production and has been part of the management team of First Sensor AG since 2015.

TechARENA: Sensors for IoT
First Sensor Packaging GmbH First Sensor Packaging GmbH Mattheier, Lutz
Packaging of Image Sensors and Devices
Mattheier, Lutz

Mattheier, Lutz
Manager Assembly Technology Development
First Sensor Packaging GmbH

Mattheier, Lutz

Abstract
In the past Imaging Sensors and Devices have been mostly assembled in ceramic single packages or ceramic substrates. So mainly the requirements for cleanliness and temperature management could be fulfilled by the single devices. Meanwhile Imaging Sensors and Devices are more and more seen as part of a whole Printed Circuit Boards (PCB) Assembly and will be implemented as part of an active circuitry on a PCB. The packaging process flow has to be designed in a way to guaranty electrical function and module reliability. First Sensor AG will support their customer base on this difficult way. Mobility and information Technology mainly drive the market into higher reliability requirements, smaller packaging and lower cost. But Chip-Size-Packages and Wafer-Level-Packaging stand for high amount of devices to cover high equipment, setup and tooling costs. First Sensor Packaging GmbH Dresden did search for partners and new technologies to make such solutions available for Prototyping and affordable for small customers and their small demand of devices. Here we talk about combination of classic Chip On Board (COB) Technology with new methods: - Assembly of large Imager-Die’s (up to 200mm by 150mm) - Assembly of Matrix Devices (e.g. 4 x 4 die matrix, 32mm by 32mm) - Assembly of Die’s developed in Through Silicon Via (TSV) Technology - Customized design and molding Outlook: - Special and new methods of PCB creation (2.5D Technology) - Modified materials and methods to create glass cover for optical Sensors and Devices

Biografie
Lutz Mattheier, Manager Assembly Technology Development, First Sensor Microelectronic Packaging GmbH Lutz Mattheier begann im Juli 2007 als Manager Process Technology bei der Microelectronic Packaging Dresden GmbH und ist seit 2017 für die Technologie- und AVT-Prozessentwicklung verantwortlich. Seit 1994 arbeitete er 3 Jahre für Siemens Regensburg in der Die und Wire Bonding Entwicklung, 3 Jahre als Assembly Engineering Manager bei White Oak Semiconductor in Richmond Virginia, 2 Jahre für ESEC Schweiz als Director Process Technology Wire Bonding, 1 Jahr für Kulicke&Soffa Deutschland als Manager Center of Excellence und 4 Jahre als Head Process Technology bei der Swissbit Germany AG Berlin. Zuvor arbeitete er für 8 Jahre im Zentrum Mikroelektronik Dresden in der Entwicklung der Thermosonic und Ultrasonic Drahtbondtechnologie. Lutz Mattheier erhielt sein Diplom der Elektronik Technologie 1986 an der Technischen Universität Dresden.

Advanced Packaging Conference
FlexEnable FlexEnable Banach, Mike
Conformable organic LCDs on plastic enabled by high-performance OTFT technology
Banach, Mike

Banach, Mike
Technical Director
FlexEnable

Banach, Mike

Abstract
Today there is an increased demand for flexible and curved displays for various applications (e.g. automotive, digital signage and consumer electronics) that will offer more design freedom, while enabling new use cases and improving user experience. Although display technology has come a long way in a short time, there is still a major challenge to be solved – the majority of displays today are glass-based which leads to form-factor constraints. Organic electronics will play a pivotal role in enabling flexible displays that break form factor constraints of glass and unlock new product applications and use cases. In particular, organic LCD (OLCD) technology opens a new avenue for LCD – it enables glass-free, conformable, high performance displays, combined with a low manufacturing cost that is driven directly by the uniquely low temperature process (sub 100ᵒC) afforded by OTFT. This low cost process has been demonstrated on commodity plastics which have been integrated into highly functional plastic LCD modules. The process has been designed so it can be easily transferred into existing display factories providing a quick route to high production capacity and yields. The organic transistors used are capable of driving full colour displays and operating at video rate. Performance is critical for the success of any display technology. A series of technological advances have led to TFT performance that is superior to amorphous silicon. For example, in terms of mobility, manufacturable OTFTs are now at least three times better than amorphous silicon, whilst having leakage currents nearly 1000X lower – both of which bring direct performance benefits to the display electro-optical performance alongside the benefits of flexibility. The presentation will describe the attributes of OTFT-based LCD technology, its readiness and scalability for mass-production and the value it brings to specific applications and markets.

Biografie
Mike Banach is the Technical Director at FlexEnable. He started his career as a researcher in flexible electronics at the Air Force Research Laboratories at Wright Patterson Air Force Base in USA. He initially joined Plastic Logic in 2003 and played an instrumental role in developing and industrialising its proprietary flexible electronic technology. At FlexEnable Mike and his team have delivered breakthrough technology developments with organic transistors including flexible displays (OLED and OLCD) and sensor arrays. He holds a doctorate degree from the University of Cambridge and a BA from the University of Cincinnati.

2017FLEX Europe
Fraunhofer EMFT Fraunhofer EMFT Bose, Indranil Ronnie
Flexible ultra thin silicon foil packages.
Bose, Indranil Ronnie

Bose, Indranil Ronnie
Group Manager
Fraunhofer EMFT

Bose, Indranil Ronnie

Abstract
We report on a chip foil package technology for thin silicon ICs, wherein the bare silicon ICs are thinned down in the range 12-40 µm and are then packaged face-up in a polymer foil package. These packages are flexible yet offer superior reliability and stability for the fragile bare chips. This entire process is roll to roll process compatible and offers a economically viable solution due to the large scaleup possibility. The packages are subjected to bending and mechanical tests and the results thereof are shown in the paper. (A detailed abstract will follow in the next 2 weeks.)

Biografie
Universität der Bundeswehr München, Germany (University of the German Armed Forces, Neubiberg - Munich, Germany) Pursuing Habilitation and Teaching Assistant at the Institute of Physics Technische Universität Dresden, Germany Dr.-Ing. (summa cum laude), Electronics Packaging Laboratory (IAVT) from the Faculty of Electrical and Computer Engineering Georgia Institute of Technology, Atlanta, USA Visiting Researcher at the Georgia Tech Research Network Operations Center (GT-RNOC) Ludwig-Maximilians-Universität München und Technische Universität München - CDTM Elitestudiengang Technology Management - Elitenetzwerk Bayern, Germany Honours Degree in Technology Management Technische Universität München TUM, Germany Master of Science M.Sc. West Bengal University of Technology, India Bachelor of Technology in Electronics and Communications Engineering

2017FLEX Europe
Fraunhofer Institute for Integrated Systems and Device Technology IISB Fraunhofer Institute for Integrated Systems and Device Technology IISB Hilpert, Florian
Power Electronics of highest power density for Automotive Applications
Hilpert, Florian

Hilpert, Florian
Groupleader Aviation Power Electronics
Fraunhofer Institute for Integrated Systems and Device Technology IISB

Hilpert, Florian

Abstract
Over the last decade new Technologies in power electronics like WBG Devices enabled the development of systems with highest power densities. As volumetric designspace is crucial in the design of Automotive Systems, this opened up a broad field of Automotive Applications especially in power regions above 100kW. Today there is a wide and growing field in Power Electronics for Automotive Applications, ranging from HV DCDC converters and drive inverters for electric vehicles to intelligent power distribution in the LV board grid for fault tolerant E/E architectures in automated driving vehicles. The presentation will focus on latest research prototype systems developed mainly for Automotive Applications to illustrate the advantages of new WBG technologies together with advanced system design like low inductive module packaging. The development of systems with highest volumetric power densities also constantly reduced the weight of the power electronics, enabling the development of lightweight Systems with high gravimetric power densities. An Outlook in possible future Power Electronic Applications for the More and All Electric Aircraft will be given.

Biografie
2006-2011 University of Erlangen-Nuremberg, studies of Mechatronic with focus on Power electronics and Electric Drivetrains 2012-06/2017 Scientific Engineer at Fraunhofer Institute for Integrated Systems and Device Technology IISB, Group Drives and Mechatronics, Responsible for System Design of Automotive Power Electronic Systems with focus on System-Integration and SiC Drive Inverters 07/2017-now Groupleader of the Workgroup Aviation Electronics Focus is to transfer Technologies from Automotive Applications to provide Power Electronic Systems of highest Power Densities for future Aviation Applications like More and All Electric Aircrafts

Power Electronics Conference
Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP Mogck, Stefan
Ultra-thin glass as a substrate and encapsulant for bendable OLED devices fabricated in Roll-to-Roll
Mogck, Stefan

Mogck, Stefan
Head of department Roll2Roll Organik-Technologie
Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP

Mogck, Stefan

Abstract
Different kind of flexible substrates are suitable for roll-to-roll OLED fabrication: plastic barrier film, metal foil or ultra-thin glass foil. Each type of substrate has their potential and challenges of roll-to-roll compatibility, reproducibility and application target. In particular, bendable OLED devices purely embedded in ultra-thin glass have a great potential of high quality and pin hole free large area OLED lighting. Furthermore, flexible glass is suitable for sputtering highly conductive and transparent ITO layers by applying a temperature above 200°C in order to reach a sheet resistance in the area of 10 -15 Ohm, in contrast to sheet resistance of > 30 Ohm on polymer based barrier films. This increases the attractiveness to integrate transparent and homogenous large area OLED devices on ultra-thin glass. However, the biggest challenge is now to develop laser cutting technologies for the OLED device separation with sufficient edge stabilities > 500 MPa. Otherwise the OLED panels will not meet the mechanical stability required for end-users. The present paper will discuss the roll-to-roll fabrication steps and possible application targets for transparent OLED devices on ultra-thin glass fabricated in roll-to-roll.

Biografie
Dr. Stefan Mogck, studied physics at the University of Tübingen, Germany in 2000. In 2004 he received his PhD in mathematics and science at the Institute of Applied Physics (Materials science and engineering) of the University of Groningen (The Netherlands). Afterwards, he joined to Advanced Micro Devices in Dresden as a defect engineer in the CMOS mass-production fab. In 2007 he was engaged at MicroEmissive Displays (MED) a start-up company for OLED micro display manufacturing as process engineer for the sputtering and the PLED spin coat process. Since 2008 he moved to Fraunhofer Institute for Photonic Microsystems. He is now leading the department “Roll-to-Roll Organic Technology” and he is deputy director of the devision Flexible Organic Electronic (FOE).

2017FLEX Europe
Fraunhofer IZM Fraunhofer IZM Middendorf, Andreas
Sensors and electronics for electric vehicles: recent trends and upcoming developments
Middendorf, Andreas

Middendorf, Andreas
scientist business development
Fraunhofer IZM

Middendorf, Andreas

Abstract
Achievements in technology of sensors and electronics are the main drivers for the amazing innovations in the automobile industry in the past two decades. Safety, efficiency and comfort attributes are today realized in almost all vehicle classes. The ongoing miniaturization and integration processes enable the scale effects and cost reduction potentials. Electric vehicles and the therefore needed infrastructure demand further efforts, especially if transportation systems are combined with the smart energy grid or autonomous driving performance is realized. For this scenarios further, sometimes new electronics, sensors and actuators have to be integrated in the vehicle and one challenge is the safeguard of reliability with simulation, qualification and test. Reasons are totally different use cases and mission profiles and the need to bring the latest technology to the market. The presentation outline mainly the hardware aspects like packaging or sensor fusion.

Biografie
Andreas Middendorf Dr.-Ing. Electrical Engineering Andreas Middendorf works in the Business Development Team of the Fraunhofer Institute for Reliability and Microintegration (IZM). He was working as a scientist in the department Environmental and Reliability Engineering of the Fraunhofer Institute for Reliability and Microintegration (IZM) and of the Technical University Berlin since May 1995. He was responsible for the development and implementation of methods and demonstrators for the estimation of lifetime for electronic appliances. Further on he is investigating technological aspects which combine the electronics design with environmental engineering techniques. This includes environmental assessments through LCA and through other methods, especially for Eco-Design, the evaluation of recycling attributes, the development of databases and software as well as environmental oriented product evaluation. He carried out courses on EcoDesign for electronic companies, holds four patents and has coordinated several cooperative research projects in Germany and Europe. Since 2010 until 2015 he was senior manager for the application field automotive and transportation systems and in charge for the System Reliability and Measurement Group at IZM. He studied electrical engineering at the Technical Universities of Aachen and Wuppertal where he specialized on information and communication technologies.

Advanced Packaging Conference
frec|n|sys SAS frec|n|sys SAS Ballandras, Sylvain
Passive wireless SAW sensors using advanced piezoelectric material and structures
Ballandras, Sylvain

Ballandras, Sylvain
CEO
frec|n|sys SAS

Ballandras, Sylvain

Abstract
Passive acousto-electric devices are extensively used for now quite a long term for various radio-frequency applications. Among all of these, the possibility to develop sensors and associated systems using surface acoustic wave (SAW) or bulk acoustic wave (BAW) devices has been widely investigated and has yielded numerous academic as well as industrial developments. Particularly, the capability of these devices to be remotely controlled without on-board power supply has received a growing interest during the passed 15 years. Different strategies can be implemented for probing these sensors, based on time-domain analysis or using spectrum techniques depending on the sensor nature. Whatever the considered approach is, an effort must be paid to adapt the device architecture to a reliable translation of the perturbing effect. The accuracy of the system is therefore controlled by the stability of the measurement approach. According to targeted resolution/accuracy, these sensors can be used for monitoring temperature, pressure, stress or any combination of these parameters in industrial or day-life process. These devices have made an extensive use of standard single-crystal substrates such as quartz, lithium tantalate and niobate. However, new challenges have pushed the development of alternative crystals (Langasite and related materials, GaPO4, BST, etc.) particularly suited to high temperature applications and also composite wafers based on piezoelectric films on Silicon Sapphire and other non piezoelectric substrates. In this presentation, we introduce basic principles of radio-frequency acoustic devices and the various structures usually implemented for sensors. Several examples allows for illustrating the implementation of these devices and a focus is then proposed on material development for wireless SAW/BAW sensors. We provide an outlook of state-of-the-art wireless applications, with a discussion on further developments of such devices and their relation with IoT.

Biografie
Sylvain Ballandras was born in Strasbourg in 1965. He joined the CNRS in 1991, after his PhD in Engineering Sciences from the Université de Franche-Comté. He joined Thomson Microsonics in 1997 for a one year industrial training project. From 1999 to 2005, he was responsible of the Acoustics & Microsonics research group at CNRS/LPMO. He also created at that time a consulting office to answer other demands from industry. In October 2003, he was promoted Research Director at CNRS, in the newly created FEMTO-ST Institute in Besançon. From 2005 to 2008, he was co-director of the joined laboratory between TEMEX company and FEMTO-ST devoted to SAW filters and sensors. In 2008, Sylvain Ballandras group joined the Time-Frequency Department of FEMTO, creating the CoSyMA research platform for industry/academic partnership in acoustics. He has been involved in the creation of SENSeOR, a company dedicated to wireless SAW sensors as CSO (part time) of the company from the end of 2008 till beginning of 2012. In March 2013, he left the CNRS to create his own company, frec|n|sys, devoted to the design, fabrication and marketing of SAW resonators and filters, acoustic-based RF-MEMS devices and SAW sensors for harsh environment applications. He was laureate of the French Research Ministry contest for innovative company creation in 2013. frec|n|sys has received several honorary recognitions to encourage its growth from 2013 till today. Sylvain Ballandras is a member of the IEEE UFFC Society.

TechARENA: Sensors for IoT
G To top
GLOBALFOUNDRIES Inc. GLOBALFOUNDRIES Inc. Kuechenmeister, Frank
Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Automotive Application
Kuechenmeister, Frank

Kuechenmeister, Frank
Principal Member Technical Staff
GLOBALFOUNDRIES Inc.

Kuechenmeister, Frank

Abstract
Automotive is the fastest growing segment in the Foundry business and a major driver for innovation in electronics. The development in the automotive industry is increasing tremendously the complexity and variety of the electronics in modern cars. And these requirements for substantial computing power resulting in the need of advanced silicon solutions. Package-induced failures in the Back End of Line (BEoL) metallization layers in advanced silicon technology nodes have drawn attention in the industry resulting in significant research and development activities. The concern is caused by the selection of the set of materials in BEoL, the transition from SnAg bumps to Cu Pillars, the transition from Au to Cu wire bond and the use of cost improved package solutions. A systematic approach is needed to understand CPI related risk factors especially in conjunction with the application in the automobile industry. The understanding of the different failure modes and their influencing factors is essential to reach highest level of reliability. One approach is the establishment of methods which can give quantitative data beyond the standard reliability stress tests. The paper will reveal a general strategy to assess these risks starting from data generated on wafer level (blanket film and integrated BEoL stack) to an early risk assessment on package level. The understanding of the different failure modes for automotive application and their influencing factors is essential to reach highest level of reliability. The approach is the establishment of methods which can give quantitative data beyond the standard reliability stress tests for consumer application. The paper will discuss the design and functionality of CPI test structures incorporated on the test vehicles. The paper will reveal data for the qualification envelope for different interconnect technologies including wire bond and wafer level packaging fan-out with focus on 22FDX® technology.

Biografie
Dr. Frank Kuechenmeister received a Diploma in Polymer Chemistry and a doctorate in Chemistry from the University of Technology in Dresden, Germany. He held post-doctoral appointments at the Departments of Polymer Science at the ETH Zuerich, Switzerland, the University of Massachusetts in Amherst, USA and the Department of Electrical Engineering and Micro Systems at the University of Technology in Dresden, Germany. He joined AMD in 1999, which converted to become GLOBALFOUNDRIES in 2008 as process engineer working the area of C4 bumping. He was promoted to principal member of technical staff in 2016. He currently leads the chip-packaging interaction team and coordinates all related efforts throughout all technology nodes at GLOBAL-FOUNDRIES. Dr. Kuechenmeister holds more than 30 C4 bump and packaging-related patents and trade secrets.

Advanced Packaging Conference
H To top
Hahn-Schickard Hahn-Schickard Zimmermann, Andre
Zimmermann, Andre

Zimmermann, Andre
Executive Board Member
Hahn-Schickard

Zimmermann, Andre

Biography
André Zimmermann was born in Schweinfurt, Germany, in 1971. He studied chemistry and crystallography at Julius-Maximilians-Universität Würzburg as well as materials science with specialization in mechanical engineering at Technische Universität Darmstadt. After several stays in the USA at NIST and University of Washington he received his PhD in 1999 at Technische Universität Darmstadt. He held positions as group manager at the Max-Planck-Institute for Metals Research, Stuttgart, and as senior manager for electronic packaging within the corporate research and development of Robert Bosch GmbH in Waiblingen. Since January 2015, he is professor for micro technology at the Institute for Micro Integration (IFM) of the University of Stuttgart. Simultaneously, he is the head of the Institute for Micro Assembly Technology at Hahn-Schickard in Stuttgart.

2017FLEX Europe
Hahn-Schickard Hahn-Schickard Meissner, Thomas
A novel process chain for the embedding and interconnection of ultra-thin chips in flexible substrates
Meissner, Thomas

Meissner, Thomas
Head of Micro Assembly
Hahn-Schickard

Meissner, Thomas

Abstract
In order to truly make thin flexible systems smart the integration of ultra-thin Si-based chips is essential. This however requires the development of novel process chains for the reliable embedding and interconnection of the delicate chips. Here we present a novel, mask-less process chain based on conformal coating, laser direct imaging and inkjet printing of interconnections. As a completely digital process chain, this is particularly interesting for smaller batch sizes.

Biografie
- studies of physics at University of Leipzig - PhD in solid state physics - since 2013 at Hahn-Schickard - currently Head of Microassembly - focus on development of novel packaging technologies

2017FLEX Europe
Helmholtz-Zentrum Dresden-Rossendorf e.V. Helmholtz-Zentrum Dresden-Rossendorf e.V. Makarov, Denys
Magnetic functionalities for flexible interactive electronics
Makarov, Denys

Makarov, Denys
Head of research group
Helmholtz-Zentrum Dresden-Rossendorf e.V.

Makarov, Denys

Abstract
The flourishing and eagerness of portable consumer electronics necessitates functional elements to be lightweight, flexible, and even wearable. Next generation flexible appliances aim to become fully autonomous and will require ultra-thin and flexible navigation modules, body tracking and relative position monitoring systems. Such devices fulfill the needs of soft robotics, functional medical implants as well as on-skin electronics. Key building blocks of navigation and position tracking devices are the magnetic field sensors. We developed the technology platform allowing us to fabricate high-performance shapeable, namely, flexible, printable, stretchable and even imperceptible magnetic sensorics [1]. The technology relies on smart combination of thin inorganic functional elements prepared directly on flexible or elastomeric supports. The unique mechanical properties open up new application potentials for smart skins and wearables, allowing to equip the recipient with a “sixth sense” providing new experiences in sensing and manipulating the objects of the surrounding us physical as well as digital world. Combining large-area printable and flexible electronics paves the way towards commercializing the active intelligent packaging, post cards, books or promotional materials that communicate with the environment and provide the respond to the customer. For this concept, we fabricated high performance magnetic field sensors relying on the giant magnetoresistive (GMR) effect, which are printed at pre-defined locations on flexible circuitry and remain fully operational over a temperature range from -10°C up to +95°C, well beyond the requirements for consumer electronics. Our work potentially enables commercial use of high performance magneto-sensitive elements in conventional printable electronic industry, which, although highly demanded, had not yet been possible. [1] D. Makarov et al., Shapeable magnetoelectronics, Appl. Phys. Rev. (Focused Review) 3, 011101 (2016).

Biografie
Denys Makarov is head of the research group “Intelligent materials and devices” at the Helmholtz-Zentrum Dresden-Rossendorf (HZDR), Germany. His work is influential for the topic of magnetism in curved geometries and opened up new research field of spintronics on flexible, bendable and stretchable surfaces enabling the magnetic field sensorics to be reshaped on demand after its fabrication. These so-called shapeable (flexible, printable and stretchable) magnetoelectronics have great potential for eMobility applications and in medicine. These activities are supported by major projects, such as ERC, ERC Proof of Concept and EU FP7-ICT FET Young Explorers Grants. Denys is a Senior Member of the IEEE.

2017FLEX Europe
Henkel Electronic Materials LLC Henkel Electronic Materials LLC Chao, Jay
Ultra-Low Warpage Liquid Compression Molding (LCM) Development for Advanced Wafer Level Packaging
Chao, Jay

Chao, Jay
Sr. Scientist
Henkel Electronic Materials LLC

Chao, Jay

Abstract
As the size of electronic devices is getting thinner and smaller, the requirements for semiconductor and automotive packaging materials become more and more challenging. Especially in Wafer Level Packaging (WLP), there’s a strong need for advanced liquid compression molding (LCM) materials with improved warpage control and finer filler in order to meet the more sensitive process requirements. Regardless the package design variation, Fan-Out or Fan-In type, the warpage issue is driven by the reduced (thinner) package dimensions and the nature of CTE mismatch between thermoset encapsulant and silicon wafer. On top of this, tighter environmental requirements driven by REACH are asking for replacement of anhydride based resins being commonly used in LCM materials today. Recently, Henkel developed a new type of anhydride free LCM material with lower cure shrinkage and finer filler that demonstrates much improved (ultra-low) warpage control after molding of Fan-Out type of wafer level packages. Furthermore, the low warpage level is maintained after several process steps and thermal aging. The low warpage and less cure shrinkage allows polymer molecules to have less stress during reliability tests. Compared to traditional anhydride-based LCM, our reliability data (after 500 cycles of uHAST & AATC) already demonstrates advantage of no filler-fall-off, no delamination, better chemical resistance, etc. For workability, the new system has improved work-life, fast-cure at 110-130 Celsius, good gap filling, etc. Taking advantage of the proprietary resin and formulation design, Henkel’s new LCM materials are currently widely evaluated with positive results in new FO-WLP designs and WLCSP applications asking for 5-side or 6-side protection.

Biografie
Jay Chao, earned Ph. D in Materials Chemistry at the University of Michigan. He started as project supervisor in 2003 with National Starch (later, part of Henkel Electronics, based at Bridgewater, New Jersey, USA). He then became scientist and senior scientist with the company, having in-depth experience in many electronic adhesive areas, such as electronic die-attach, barrier and sintering materials, advanced packaging materials. He is currently product development senior scientist at Henkel Electronics, Irvine, CA.

Advanced Packaging Conference
Henkel Ltd Henkel Ltd Winster, Tony
Conductive Die Attach Adhesives – Effect of Aging at 200C and correlation with Chemical Base
Winster, Tony

Winster, Tony
Technical Advisor
Henkel Ltd

Winster, Tony

Abstract
The choice of die attach adhesive used within a molded package can have an effect on the package reliability and lifetime. Latest generation automotive electronic components tend to have higher power dissipation than previously, and also are frequently located in harsher environments, leading to significantly increased operating temperatures – in some cases up to 200C. Therefore the selection of all materials becomes more critical. This work reports the results from an on-going study of a range of electrically conductive die attach materials, based on different chemistries (Epoxy, BMI, Polyimide and Silicone) applied in paste and film formats. Chips with bare silicon and silver metaillised backsides are included in the evaluation, as are leadframes with bare Cu, silver plating and PPF plating. The aim is to allow selection of the most appropriate chemistry for existing applications, and to guide product development for future requirements.

Biografie
Tony Winster is an Application Engineer supporting Henkels Semiconductor packaging products in Europe. He studied Metallurgy & Materials Science, before working on materials & packaging methods for high reliability circuits. He joined Ablestik in 1989, and has continued his technical support role with Henkel since 2008.

Advanced Packaging Conference
Holst Centre/imec Holst Centre/imec Zevenbergen, Marcel
Air and water quality monitoring with low cost sensor networks
Zevenbergen, Marcel

Zevenbergen, Marcel
Sr. researcher
Holst Centre/imec

Zevenbergen, Marcel

Abstract
Both air and water quality has a strong influence on human health and wellbeing. Monitoring the air/water quality and making the data available to end-users is the first step towards awareness for a healthier society and environment. To achieve this goal, measuring sufficient spatial and temporal data is critical and hence dense sensor networks are needed, both indoor and outdoor. The sensors in these networks need to be relatively low cost, preferable small and low power. The talk will outline the state of the art in gas and water sensors for air/water quality monitoring networks and considers emerging and potential future developments. Outdoor gas sensor network will mainly monitor pollution and measure pollutants including nitrogen monoxide (NO), nitrogen dioxide (NO2), sulphur dioxide (SO2), carbon monoxide (CO), ozone (O3) and volatile organic compounds (VOCs). In case of indoor applications, air quality is more related to comfort (temperature, humidity, carbon dioxide (CO2)) or to safety (VOC’s, CO). Holst Centre/imec the Netherlands is developing wireless sensors nodes that are able to quantify multiple parameters (both with of-the-shelf and in-house developed sensors) validated in real life applications. For water quality monitoring, I will introduce a single-chip electrochemical sensor for simultaneous detection of multiple ions in fluids. The first generation is able to quantify pH and conductivity, two crucial parameters for water quality assessment. This sensor solution is a generic platform that can be extended to other ions tailored towards specific applications beyond water quality, such as monitoring of nutrient concentrations for agricultural applications and disposable point-of-care solutions for bodily fluids. Next to sensor technology, also smarter network design, smarter data use and new tools will be shown. The need for good calibration and reference measurements, to ensure good data quality from these sensor networks, will be discussed.

Biografie
Dr. Ir. Marcel Zevenbergen received his PhD in physics at Delft University of Technology in 2009. During his PhD, he developed an electrochemical sensor capable of detecting single molecules in solution. In 2010, he joined Holst Centre/imec the Netherlands where he develops novel electrochemical sensors for water quality, nutrient monitoring and healthcare.

TechARENA: Sensors for IoT
I To top
Identiv GmbH Identiv GmbH Germann, Thomas
NFC and printed electronics – a perfect match for flexible NFC sensor tags
Germann, Thomas

Germann, Thomas
R&D Project Engineer
Identiv GmbH

Germann, Thomas

Abstract
Recently, more and more NFC tag chips have become available that exhibit functionality beyond pure identification or delivery of NDEF Messages (= NFC Data Exchange Format): Some with integrated sensors, GPIOs or I2C Master capabilities, up to full-blown microcontrollers. Since roll-to-roll NFC tag assembly machines rely on as little components as possible being placed onto flexible substrates, printed electronics is a perfect match in order to enable mass-production of novel NFC sensor tags: Each upwinding and unwinding process bears the risk of disconnecting a rigid discrete component from the flexible substrate, or even of breaking the chip. Therefore it is desirable to have as little machine passes in the assembly machine as possible, which are required for each component – preferably only one, but two at maximum. Especially printed resistors, sensors, batteries and indicator elements help Identiv build solutions based on next generation NFC tags for the logistics, industrial, pharmaceutical and medical area. Identiv has recently built and released the first fully flexible NFC sticker that carries an NFC ASIC chip with an integrated temperature sensor and a datalogging state machine that are connected to a printed battery. Together with an NFC enabled smartphone and a companion app, cold-chain monitoring can effectively be performed without the need to deploy expensive reader-infrastructure in a large scale. An updated version based on an NFC-enabled ARM Cortex M0+ has been launched this year. Another example is a passive sensor tag that communicates by means of an NFC-chip with I2C-Master capability with any kind of I2C-enabled sensor, whereas the pull-up resistors are printed to reduce discrete component count and enable mass production Identiv is taking a leading role in integrating printed electronics into their products, especially concerning upgrading Identiv’s production equipment for manufacturing and at testing every single produced unit.

Biografie
Thomas Germann joined Identiv in 2013 as Development Engineer in the R&D department of Identiv’s RFID transponder & reader business unit. He is mainly responsible for development of novel UHF & HF RFID tags, as well as NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development from his previous work, which enable the product & process development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).

2017FLEX Europe
IHP IHP Wenger, Christian
Towards Graphene-based heterojunction devices for microelectronic applications
Wenger, Christian

Wenger, Christian
Team leader
IHP

Wenger, Christian

Abstract
The integration of dielectrics or semiconductors on Graphene is of critical importance for the development of a new generation of Graphene-based hetero-junction devices. The deposition of a high-k dielectric, like Al2O3 or HfO2 or of Silicon on top of Graphene is still challenging due to Graphene's lack of dangling bonds. In this paper, two strategies for the dielectric-Graphene and Silicon-Graphene integration will be presented. Atomic Layer Deposition (ALD) or Atomic Vapour Deposition (AVD) processes have been explored to deposit high-κ dielectrics on Graphene with negligible damage of the Graphene layer. However, the nucleation of the dielectric film is hindered by the chemical inertness of the Graphene surface. Therefore, the initial ALD or AVD growth on Graphene requires a functionalization of the pristine Graphene surface with reactive groups. Plasma enhanced CVD (PECVD) is of interest for applications requiring low thermal budgets such as the back end of line (BEOL). However, high energy ion bombardment related to plasma exposure readily correlates with worsening of material properties. We demonstrate, that by the use of PECVD at a very high frequency of 140 MHz, thin a-Si:H layers can be grown softly without changing the properties of the underlying Graphene significantly. The herein presented deposition strategies for dielectrics and semiconductors on Graphene surfaces demonstrate a significant progress towards a complete fabrication scheme of Graphene-based heterojunction devices in microelectronic technologies.

Biografie
Christian Wenger received the Diploma in physics from the University of Konstanz, in 1995 and the Ph.D. degree from the Technical University of Dresden, in 2000. Since 2002, he has been with the Innovations for High Performance Microelectronics (IHP), where he works in the field of functional devices for medical and space applications. In 2009, he received the post-doctoral degree at TU Dresden. He has authored and co-authored more than 150 papers and holds 6 patents.

TechARENA: Advanced Materials Session2
IHP IHP Mai, Andreas
SiGe BiCMOS and Photonic technologies for high frequency and communication applications
Mai, Andreas

Mai, Andreas
Department Head
IHP

Mai, Andreas

Abstract
In last decades the continuously improvement of SiGe-BiCMOS technologies fulfilled the increasing demand for novel high speed mm-wave applications as optical networks, automotive radar or imaging and sensing systems. Moreover photonic-electronic co-integration and scalability of certain photonic solutions moved into the focus of technology developments worldwide. In this talk we will present recent progress in device developments of SiGe heterojunction bipolar transistors and related BiCMOS technologies exceeding the 0.5 THz regime as well as monolithic integrated silicon photonic components in a SiGe BiCMOS environment for electronic-photonic-circuit technologies. Based on these technologies circuit developments for broadband optical communication, high frequency circuits for wireless communication up to 240 GHz as well as transceiver circuits and photonic-electronic ASICs will be presented.

Biografie
Dr. rer. nat. Andreas Mai received his diploma degree in physics from the Technical University of Brandenburg in 2006 and his PhD in 2010. He joined the “Process Integration” group of the IHP Technology department and his main research was focused on the development of a 130nm SiGe-BiCMOS technology for mm-wave applications and the integration of RF-LDMOS transistors. He leaded the “Process Integration” group with the responsibility for service and certain research activities as well as technology developments at IHP and became the acting department head of the “Technology-Department” in IHP in 2015. He is an IEEE member, Chair of the ECS-SiGe processing symposia and head of the Joint-Lab between University of Applied Sciences Wildau and IHP.

TechARENA: Photonics
IHS Markit IHS Markit Dixon, Richard
New impulses for sensing in automotive: automated driving and electrification in the new infrastructure
Dixon, Richard

Dixon, Richard
Principal Analyst Sensors
IHS Markit

Dixon, Richard

Abstract
The automotive industry has never been in such a state of flux. Electrification of the engine and automation of the driver function, not to mention connectivity to the world at large, are three of the main factors sculpting the automotive landscape in the next 20 years. Vehicle architectures, systems and components will all be radically affected as a result, and new opportunities will certain result. In this presentation IHS Markit will address the technology for some interesting new applications for sensors, including - In cabin driver monitoring for L3 applications using TOF sensing - Technology for LIDAR-based distance sensing applications - High quality audio experiences using MEMS microphones - Precision navigation in support of automated driving using MEMS inertial sensors - Current sensors for electric cars IHS will also discuss the ramifications for existing sensing applications, some of which will disappear.

Biografie
Richard Dixon, PhD Principal Analyst, Automotive Sensors Richard Dixon is Principal Analyst for Automotive Sensors at IHS Markit and author of more than 30 automotive-related consulting and market research studies. He is a world-renowned expert on all aspects of passenger car sensors used in safety, powertrain, infotainment and body applications. His responsibilities comprise the development of databases that forecast market demand for more than 20 types of sensors (MEMS, magnetic, inductive, ceramic...) deployed in more than 100 automotive applications. His most recent research includes mapping the entire sensor requirement by engine and exhaust system at car model level and sensors for future automated driving. As part of his duties he has supported organizations with custom studies, e.g. future scenarios for car sensors or analyzing the automotive supply chain. Prior to IHS Markit, Richard was a senior analyst at iSuppli with responsibility for MEMS and sensors in automotive and industrial sectors. Prior to his work as an analyst, Richard Dixon worked as a journalist in the semiconductor industry, and also has five years of experience as a commercialization professional providing support for early stage NASA technologies. Richard graduated from North Kent University with a degree in materials science and earned a doctorate from Surrey University.

TechARENA: MEMS
III-V LAB III-V LAB PIOTROWICZ, Stephane
ECSEL OSIRIS Project : Development of a European isotopic SiC supply chain
PIOTROWICZ, Stephane

PIOTROWICZ, Stephane
Research Engineer
III-V LAB

PIOTROWICZ, Stephane

Abstract
OSIRIS project, a Research and Innovation Action (RIA), started on May 1st 2015. It aims at improving substantially the cost effectiveness and performance of gallium nitride (GaN) based millimetre wave devices. It proposes to elaborate innovative SiC materials using isotopic sources in order to offer thermal conductivity improvement of 30% which is important for SiC power electronics and microwave devices using GaN high electron mobility transistors (HEMT) grown on SiC semi-insulating substrates. The improved thermal SiC properties will be obtained by using single isotopic atoms for silicon and carbon, namely 28Si and 12C. The SiC wafer size will be targeted to 100mm (4-inches) which is today widely used in industry. For microwave GaN/SiC HEMT, this isotopic approach should create a complete shift in the currently used SiC substrate/GaN epi-wafer technology by growing the high thermal conductivity (+30%) semi-insulating SiC on top of lower cost semiconducting SiC substrates. The project is also evaluating HEMT microwave power performance improvement at 30GHz thanks to better thermal environment. For power electronics, this innovation will be essentially focused on thermal improvement not on price fall, i.e. better electron mobility at a given power dissipation as mobility and drift mobility decrease with temperature and also better carrier transport thanks to lower scattering rates. Schottky and p-i-n diodes will be tested using this material. This project involves partners from France, Norway, Slovakia, and Sweden. This Consortium is very complementary and this work could not be realised without this collaborative work at European scale as no country would have on its own the different expertises required. The presentation will give an overview of the project outcomes including isotopic material, GaN epitaxy, processing, physical simulation, thermal assessment and device performances.

Biografie
Stéphane PIOTROWICZ received the PhD. Degree in Electronics from the University of Lille in 1999 at Institute for Electronics Microelectronics and Nanotechnology (IEMN). In 2000, he joined the Thales Research Center and worked on the design of hybrid and MMIC power amplifiers on InGaP/GaAs HBT technology for Radar and Space Applications. He is currently in charge of the GaN HEMT for RF applications program at III-V Lab (a joint lab of Nokia Bell Labs France, Thales Research and Technology & CEA Leti). His background concerns design, modeling and RF characterization at transistor and circuit level as power switches, power amplifiers and low noise amplifiers for T/R modules.

TechARENA: Semiconductor Nano-electronics - The Power of Collaboration
imec imec Mertens, Hans
Gate-All-Around MOSFETs based on Vertically Stacked Horizontal Nanowires
Mertens, Hans

Mertens, Hans
Principal member of technical staff
Imec

Mertens, Hans

Abstract
Gate-all-around (GAA) transistors based on vertically stacked horizontal nanowires are promising candidates to replace FinFETs in future CMOS technology nodes. First of all, GAA devices provide optimal electrostatic control over semiconducting nanowire channels, which enables downscaling of the gate length to below the FinFET limit, while maintaining low off-state leakage [1]. Besides, horizontally oriented nanowires are an evolutionary extension of FinFETs, as opposed to vertical nanowires which require more disruptive technology and design changes [2]. Finally, stacking of nanowires is relevant for enhancing the drive current per footprint. Based on these considerations, GAA transistors made of vertically stacked horizontal nanowires have been included in the ITRS roadmap to reduce the contacted gate pitch, which is a key figure of merit for CMOS device density, to below ~40 nm in 2019-2021 [3]. In the context of the industrial relevance described above, we present the fabrication of Si GAA devices on bulk Si substrates. Multiple processing aspects that are relevant for bulk CMOS technology definition are addressed, including stacking of 8-nm-diameter Si wires at 45-nm lateral pitch and 20-nm vertical pitch [4], and nanowire-compatible replacement metal gate processing in combination with threshold voltage tuning by dual work function metal integration [5]. Temperature restrictions for the formation of shallow trench isolation, and the interaction between N- and P-type junction formation on one hand and nanowire release processes on the other hand are discussed as well. [1] K. J. Kuhn, IEEE Trans. Electron Devices, vol. 59 (7), p.1813, (2012). [2] L. Liebmann et al., VLSI Tech. Dig., p.112 (2016). [3] The International Roadmap for Semiconductors (ITRS) 2.0, http://www.itrs2.net/ (2015). [4] H. Mertens et al., VLSI Tech. Dig., p.158 (2016). [5] H. Mertens et al., IEDM Tech. Dig., p.524 (2016).

Biografie
Hans Mertens is a principal member of technical staff at the international nanoelectronics research center Imec, based in Leuven Belgium. His main research interest is gate-all-around process integration based on group-IV semiconductors. Prior to joining Imec in 2012, he was a senior scientist at NXP Semiconductors, working on SiGe BiCMOS technologies for RF small-signal applications. Hans Mertens holds a M.Sc. degree in Applied Physics from Eindhoven University of Technology, and a Ph.D. degree in Physics from Utrecht University, both in The Netherlands.

TechARENA: Advanced Materials Session2
imec imec Efrain, Altamirano-Sanchez
END-OF-CMOS AND BEYOND CMOS, APPLICATIONS FOR ALE
Efrain, Altamirano-Sanchez

Efrain, Altamirano-Sanchez
PMTS
imec

Efrain, Altamirano-Sanchez

Abstract
The continuous increment of pattern density with the aim of following Moore’s law has brought many challenges to the integration processes involved in the manufacturing of integrated circuits (IC). Specifically, sub-N7 technologies require self-aligned processes to overcome lithography overlay (OVL) limitations. Atomic layer etch (ALE) or quasi-ALE approaches provide the means to develop high selective and self-aligned etch processes. For example, the patterning of contact to active in a N7 technology faced tight OVL requirements and tough litho-etch bias restrictions. These issues were solved thanks to a quasi-ALE process. In semiconductor technology roadmap, the usage of 2D (MX2) materials is foreseen as an alternative to Si, Ge, SiGe and III-V channels. The integration of 2D materials in a hetero-structure such as required by a tunneling field effect transistor (TFET) will bring etch challenges; for example: a) selective etch of Silicon and dielectrics to MX2. b) layer-by-layer etch of MX2 (MX2 thinning). In a first part, this presentation will cover some patterning approaches where quasi-ALE was successfully used. In a second part, the emphasis will be put on the etch challenges driven by the integration of 2D materials for future technology nodes, and how ALE can enable it.

Biografie
Efraín Altamirano-Sánchez is a Chemical Engineer and holds a PhD from the Metropolitan University of Mexico (UAM). He has more than 15 years of experience in nanotechnology R&D in Europe. He joined imec in 2006, where he holds a Principal position (PMTS). He is a specialist on Front-End-of-Line (FEOL) and Middle-of-Line (MOL) patterning. His current interest is focused on multiple patterning using either 193i or EUV lithography, selective deposition and Atomic-Layer-Etch.

TechARENA: Advanced Materials Session1
imec imec Absil, Philippe
Imec's silicon photonics platform enabling 100Gb/s OOK optical links.
Absil, Philippe

Absil, Philippe
Director
imec

Absil, Philippe

Abstract
With the emergence of the Internet of Things there will be an unprecedented growth in data center infrastructure needs requiring deployment of novel technologies with improved performance at lower power consumption and lower cost. Addressing these requirements, optical solutions are replacing copper cables for the intra-data center interconnects with increased lines data rates. In this presentation we will present the latest performance updates of imec silicon photonics platform demonstrating 100Gb/s OOK optical links enabling the next generation of optical transceivers.

Biografie
Philippe Absil, Ph.D. is the director of the 3D and optical I/O technologies department at imec since 2013 and has been responsible for the silicon photonics technology platform development since 2010. Before that he spent seven years managing the advanced CMOS scaling program at imec. In the early 2000’s he developed the passive photonics platform technology for Little Optics Inc., Maryland, USA. He earned his Ph.D. degree in 2000 from the department of electrical engineering of the University of Maryland at College Park, USA. His doctoral work contributed to the early demonstrations of semiconductor micro-ring resonators.

TechARENA: Photonics
Infineon Technologies Infineon Technologies Meyer, Thorsten
Packaging for Automotive – Challenges and Solutions
Meyer, Thorsten

Meyer, Thorsten
Principal Engineer
Infineon Technologies

Meyer, Thorsten

Abstract
First modern electronics entered automotive vehicles in the 1950’s and 1960’s with the introduction of semiconductor transistors in car radios and power diodes in alternators. Since then electronics have spread into all relevant areas of the automobile. They are supporting applications in the area of motor and chassis functions, comfort and security and safety, about 80% of all innovations are created by electronics already today. Autonomous driving, electro mobility, connectivity and energy efficiency will give another boost to electronics in the automobile industry. The mayor elements will be “intelligent” sensors, powerful electronic control units and “mechatronic” actuators. Those automotive electronics require highly integrated solutions with technology and packaging features from consumer electronics, but designed and qualified for harsh conditions of automotive industry. We will introduce to packaging technologies for integrated systems, sensors and MEMS with focus on chip package interaction. The mm-wave radar devices application, sensors including MEMS devices and different kinds of power devices like drivers for LEDs will be discussed from package point of view. Embedded Die technology, also an important future packaging technology for the support of system integration, will be discussed. We will show that there is a strong importance of Co-Design for package integration. For the ever increasing reliability requirements the selection of the right packaging materials and processes is crucial and will be discussed. Finally an advanced package integration concept has to also fulfill the thermal and performance requirements as well as to meet cost targets. This plurality of requirements to electronics in automotive shows, that there will be no single package solution fulfilling all needs. In this presentation we will introduce into the manifold of package solutions.

Biografie
Thorsten is Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package Platforms and New Package Definition. Until March 2015 he was leading the Package Technology and Innovation department at Intel Mobile Communications (IMC) in Regensburg. Prior joining IMC, he was overall project leader for the development of Wafer Level Packaging Technologies at Infineon in Regensburg. Thorsten is author of multiple publications and holds more than 140 patents and patent applications in the area of advanced packaging.

Advanced Packaging Conference
Infineon Technologies AG Infineon Technologies AG Barbon, Francesco
Contact resistance in pulse conditions
Barbon, Francesco

Barbon, Francesco
Development Engineer
Infineon Technologies AG

Barbon, Francesco

Abstract
The contact resistance tool (CRes) is a laboratory instrument internally developed used for the measurement of the contact resistance which occurs between the probe contact needle, and the contact surface of the device under test. This parameter is very important and has a big impact on semiconductor test yield, because it influences the signal integrity. The instrument received a hardware upgraded, with a new generator which delivers controlled higher current impulses. The evaluation of the contact resistance with high current impulses will enable to evaluate the current carrying capability (CCC) on various combination of needles vs pads material, under real-life needle operative conditions. The new tool and some initial results will be presented.

Biografie
Francesco Barbon in 2011 obtained his Master of Science in Telecommunications at the Department for Electronics and Informatics of the "Università degli Studi di Padova". In 2014, he terminates his contact as Researcher at the Institute for Electronics Engineering of the University Erlangen-Nuremberg, developing new power detector concept for Six-Port interferometers. At present, he is working at Infineon AG as Development Engineer in the field Test, Technology, and Innovation. His focus is description, verification, and qualification of Probecards used in production for mixed, and analog signals in microwave region.

Power Electronics Conference
Institut für Mikroelektronik Stuttgart (IMS CHIPS) Institut für Mikroelektronik Stuttgart (IMS CHIPS) Harendt, Christine
Chip-Film Patch for Hybrid Systems in Foil – Technology and Applications
Harendt, Christine

Harendt, Christine
Head of Semiconductor Integration Business Unit
Institut für Mikroelektronik Stuttgart (IMS CHIPS)

Harendt, Christine

Abstract
Flexible, thin and bendable electronics have the potential to enable many applications by integrating digital and non-digital functionalities on flexible substrates. The desired system performance often requires the integration of different components such as thin and flexible silicon ICs, sensors and thin-film large-area components. Adequate integration technologies for chip embedding and interconnect are a key issue for these Hybrid Systems in Foil (HySiF). Chip-Film Patch (CFP) is an embedding technology for chip thicknesses ranging from a few microns up to 50 µm using wafer based processes. Fine pitch interconnects and multichip patches are feasible by semiconductor processing technologies and adaptive layout techniques. Due to the material properties of the polymers (polyimide and benzocyclobutene) the technology can be optimized for additional large area processes (printed sensors, organic transistors) and is suitable for medical devices or HF applications. CFP technology is used for single devices such as smart sensor patches or as an interposer for multichip modules in a large area foil systems. Applications ranging from embedded multichip modules for industry 4.0 solutions to bendable sensor foils for robotic gripper fingers are presented.

Biografie
Christine Harendt received her Ph.D. in Physical Chemistry from Freie Universität Berlin in 1987. The following year she joined the Institut für Mikroelektronik Stuttgart in Germany (IMS CHIPS) where she heads the Semiconductor Integration business unit. She is involved in the development and application of new technologies in combination with CMOS processes. She has participated in several national and international research programmes and coordinated a European Research Project focussing on the development of miniaturised video endoscopes. Within the cluster MicroTEC Südwest she was involved in the development of the platform PRONTO, a joint initiative of industrial-oriented R&D institutes in Baden-Württemberg for development and fabrication of microsystems. Recently she coordinated a research project developing flexible foil systems for applications in robotics and safety in industrial automation (KoSiF). Her current research interests are fabrication, packaging and characterisation of ultra-thin silicon chips and Hybrid Systems in Foil.

2017FLEX Europe
J To top
JEM Europe JEM Europe Mai, Joe
Wafer probing challenges and solutions
Mai, Joe

Mai, Joe
Managing Director
JEM Europe

Mai, Joe

Abstract
Semiconductor packaging has always been inherently linked to wafer probing. On the one hand, package features influence, or even define, pad and bump features (sizes, locations, dimensions, and materials). On the other hand, wafer probing methods and probe card limitations (probe geometries, pitch, etc.) also constrain package development. In addition, the contact between probes and pads/bumps inevitably damages the latter, which can affect bond reliabilty and require complex and costly reliabilty studies. This presentation will first describe some of the links between packaging and wafer probing, and the related challenges, including those of testing at high/low temperatures and at high/low power. Then, we will present the latest probe card technologies and probing methods to address these challenges.

Biografie
Joe Mai is managing director of JEM Europe (located in France), a subsidiary of Japan Electronic Materials, which is a top-4 probe-card supplier. He has been with JEM for over 20 years, playing both technical and business-development roles in the US, Europe and Asia. Throughout his career, he has enjoyed working closely with customers to improve their test capabilities. So please feel free to approach him to discuss any problems or challenges you might have - or if you want to play basketball. :)

Advanced Packaging Conference
K To top
KINEXON GmbH KINEXON GmbH Trinchera, Oliver
Precise localization, motion sensing and add-on data communication: How innovative sensor & analytics solutions enable new applications in the fab of tomorrow.
Trinchera, Oliver

Trinchera, Oliver
CEO
KINEXON GmbH

Trinchera, Oliver

Abstract
The industrial Internet of Things is on the rise, leading to a significant digital transformation of production & logistics processes. Thinking about the semiconductor factory of the future, we assume that all objects such as parts, tools and products will interact fully with each other – as if they were steered by an invisible hand. However, to make this vision come true we need to know two essential pieces of information: 1. Where are the objects exactly located? 2. What is the status of the objects? The following contribution deals with a cutting-edge real-time location solution (RTLS) that provides an answer to the two previous questions and that enables manufacturers to bring the automation and efficiency of their production facilities to the next level. At the core oft he solution is a small sensor that captures the 3D-position of various objects such as wafer boats or autonomous ground vehicles with an accuracy of a few centimeters. In addition to that, the sensor captures motion information such as acceleration, rotation and orientation. Moreover, a bi-directional communication path and standardized interfaces allow to transmit process relevant add-on information that is related to the objects, such as temperature and humidity. All information is processed in real-time and made available on a powerful analytics platform. The platform offers a variety of features to describe and monitor production processes and, finally, to improve them in terms of quality, costs and time.

Biografie
Dr. Oliver Trinchera is Founder & Managing Director of KINEXON. KINEXON develops precision tracking solutions for centimeter accurate 3D localization of people and objects in indoor and outdoor environments. A smart analytics platform analyzes the data and provides users with new and valuable insights on various devices such as notebook, smartphone or tablet PC. The KINEXON sensors and applications are used by renowned customers in various industries such as manufacturing, logistics, healthcare, sports & media. The full asset visibility and analytics by KINEXON enable customers to map their processes and optimize them in terms of quality, costs, and time. The company received a number of prestigious awards, including the Smart Digital Award as most innovative Bavarian start-up and the Galileo Master Award of the European Satellite Navigation Competition (promoted by European Commission and ESA, for example). Oliver studied Business Administration in combination with Electrical Engineering at Technische Universität München. Additionally, he studied Technology Management at the Center for Digital Technology and Management (CDTM). Moreover, he holds a PhD from Technische Universität München.

Fab Management Forum
M To top
Masdar Institute of Science and Technology Masdar Institute of Science and Technology Rizk, Ayman
Optimization of Al-doped ZnO films for flexible TFTs and piezoelectric sensors
Rizk, Ayman

Rizk, Ayman
Research Engineer
Masdar Institute of Science and Technology

Rizk, Ayman

Abstract
In this work, we use of a single material Al doped ZnO system for thin film device and sensor application using its electrical and piezoelectric properties to get the desired functionality of multi-purpose. Including the creation of a DOE to show how Al doped ZnO films conductive and piezoelectric properties can be finely tuned by adjustment of the Al doping levels and growth conditions such as films deposition temperatures, purging cycles, deposition (TMA/DEZ) /purging cycles and even thickness. This us allow for instance to minimize the piezoelectric effect in the flexible TFT channel while maintaining good conductivity or for the sensor where maximizing the effect is required. Fabrication of both test structures to measure and optimize these parameters along with the TFT and the sensor on flexible substrates using common deposition methods with low temperature steps to investigate their mechanical and electrical properties. Development of Al doped ZnO thin films for designing high quality flexible TFTs and piezoelectric sensors. ZnO (especially with Al doping) has a moderately high (very high for a semiconductor) electromechanical coupling coefficients which allowed it to be successfully used in thin film piezoelectric devices an TFT. The ability to make Al doped ZnO versatile for various applications. Especially with the rising interest in the Internet of Things (IOT) applications where flexible TFTs and sensor are now an important area of research.

Biografie
Rizk’s research involves new technologies in memories and sensors which will bring the low-power virtues of Internet of Things (IOT) applications.

2017FLEX Europe
Meyer Burger (Netherlands) B.V. Meyer Burger (Netherlands) B.V. Gautero, Luca
Transparent and flexible moisture barriers as application driven manufacturing approaches
Gautero, Luca

Gautero, Luca
Senior Process Engineer
Meyer Burger (Netherlands) B.V.

Gautero, Luca

Abstract
Marketability of wearable displays benefits from high throughput manufacturing of thin film moisture barriers. These are stacks of PECVD or spatial-ALD inorganics, and jettable or dispensable organics. Transparent and flexible barriers with low WVTR are manufactured strictly below 80ºC. we present production on R2R and S2S throughput above several square meter/hour. Handheld and wearable devices, developed in the last years have lowered the bar of accessibility to information and communication technology in many countries. Improvements of their functionality can therefore increase the wellbeing of a growing, connected, social network. These devices can benefit from lightweight and power-wise OLED displays and thin film batteries. These technologies are enabled by thin film barriers, also known as thin film encapsulation (TFE). Following its mission and technological competence, Meyer Burger B.V. has developed both sheet to sheet (S2S) and roll to roll (R2R) clusters for the fabrication of TFE as stacks of inorganic and organic layers. The individual equipment tool have a well installed base within institutes and industry (ie photovoltaic, display, plastic electronics and PCB applications). Inorganic thin film deposition and organic layer coating are therefore combined into single, fully automated, cluster tools with industrial manufacturing capabilities. Inorganic and organic layers, produced by our equipment have been studied to report the most salient properties for TFE applications. The overall TFE, created by stacking these inorganic layers will benefit from a moisture penetration lag time given by the tortuous path. During sampling activities, the results above have been confirmed by successful TFE applied to OLED displays and thin film batteries.

Biografie
Dr. L. Gautero has experience in thin film encapsulation technology as an innovation maker. This resulted in several publications and conference presentations. His academic path features a PhD degree in energy-related discipline obtained from EPFL, a leading education institution, in 2010 and a more recent graduation from the Executive Master in Energy Management at ESCP in 2015.

2017FLEX Europe
mi2-factory GmbH mi2-factory GmbH Rüb, Michael
Energy Filter for Ion Implantation - A Novel Production Technique for SiC-Power Device Technologies
Rüb, Michael

Rüb, Michael
Head of Strategy and R&D
mi2-factory GmbH

Rüb, Michael

Abstract
mi2-factory GmbH is a high-tech start-up company from Jena (Germany) which develops, distributes and applies a so-called “Energy Filter for Ion Implantation” (EFII). This innovative tool can be beneficially used for the doping of any semiconductor material. Customers use this novel technology as a process step in the production of Silicon Carbide (SiC) power devices. EFII is a major leverage to improve the cost performance of these devices. In today´s chip production the advantages of SiC cannot be fully exploited due to the large doping inhomogeneity (at least +/-20%) [1] of the epitaxially grown drift zone, which is the core element of any vertical SiC power device such as SiC Diodes or MOSFETs. A solution to this problem is found in EFII [1]. This technology is based on ion implantation in combination with a thin, micro-patterned Si membrane which gets inserted into the ion beam. The membrane serves as a filter that enables a highly precise depth-distribution of doping atoms with a very high homogeneity (+/-1%) over the wafer surface. Furthermore, EFII can be combined with masking which allows for trench-like doping structures in SiC and may enable a real SiC-superjunction transistor. It is the only evident technology which is scalable to production volume for precise and flexible adjustment of the patterned or blanket drift-layer doping of SiC power devices. mi2-factory demonstrated the huge potential of this novel technology in a cooperation with an industrial partner in 2015 [2,3] and is now seeking to establish EFII in SiC power device production. [1] Csato et al.: Energy filter for tailoring depth profiles in semiconductor doping application, Nucl. Instr. Meth. B (2015), Volume 365, Part A, 15 December 2015, Pages 182–186 [2] Rupp et al.: Alternative highly homogeneous drift layer doping for 650V SiC devices, ICSCRM 2015 [3] Rupp et al.: How to further improve the market penetration of SiC power devices?, ECSCRM 2016

Biografie
since 2016 Co-founder of mi2-factory GmbH, Jena Head of Strategy and R&D since 2008 Professor for Microtechnology at University of Applied Sciences Jena 1997-2008 Infineon Technologies Austria AG Power Device Technology Development 1997 PhD. from Friedrich-Schiller University, Jena 1993 Physics Diploma degree from Friedrich-Alexander-University Erlangen- Nuremberg

Power Electronics Conference
Molex Deutschland GmbH Molex Deutschland GmbH Punt, Wladimir
Latest advancements in flexible printed hybrid electronics
Punt, Wladimir

Punt, Wladimir
Business Development Manager
Molex Deutschland GmbH

Punt, Wladimir

Abstract
Flexible electronics have been in market for many years by etched copper circuitry, using polyimide substrates (“copper flex”). Qualified hybrid printed electronics alternatives are already available and offer a new platform for flexible electronic products and sensor systems, based on a polyester substrate, printing of conductive signal traces and the assembly of electronic components; either sheet- or roll-based production. This talk will cover the introduction of the hybrid printed electronics silver flex technology and look forward to other electronic functions and features that can be supported and combined with the silver flex platform, for example: - Very fine line silver printing - Translucent capacitive sensing - Printing NFC features - Printed batteries - Bio- markers and electrodes

Biografie
Wladimir Punt, Business Development Manager With over 20 years’ experience in technical marketing and business development activities for semiconductors, embedded- and sensor systems, Wladimir joined Molex in 2016 as BDM for Printed Circuit Solutions. With an electronics background, he has been involved in multimedia platforms and sensor solutions at multinationals like Philips Semiconductors and Micronas. Wladimir was also active at several start-up companies, concerning reception of digital broadcast signals and energy harvesting solutions for the “internet of things” (IoT). Wladimir is located in Germany and supports the Molex Printed Electronics products.

2017FLEX Europe
Momentive Performance Materials GmbH Momentive Performance Materials GmbH Wilken, Karen
Conformal/ Selective Coating Materials for enhanced performance in Automotive Electronics Applications
Wilken, Karen

Wilken, Karen
Application Development Engineer – Electronics
Momentive Performance Materials GmbH

Wilken, Karen

Abstract
Recent trends in the electronics industry, call for higher functionality, miniaturization. and improved reliability performance of printed circuit boards. Conformal coating materials are already widely used in such applications. Compared to organic polymers, silicone conformal coating materials have insulation, heat resistance, & cold temperature resistance advantages, & due to their softer properties, excel in their ability to absorb stress.Performance requirements for conformal coatings include: 1.Durability: The ability to provide long-term dielectric stability under high temp & high humidity 2.Adhesion: Good adhesion to PCB & component surfaces 3.Corrosion Prevention: Protection against corrosion 4.Flexibility: Elasticity of the coating layer to absorb stress 5.Chemical Resistance: Resistance to solvents & oil 6.Fast Cure: Fast cure @ low temp 7.Processability: Ease of application 8.Toxicity: Minimize harmful effects on operators and the environment. 9.Optical Clarity: Transparency or translucence Organic conformal coating materials such as acrylics, polyurethane and epoxy are known to have inherent disadvantages associated with temperature resistance, cure shrinkage and toxicity.Silicone conformal coating materials consist of silicone resin that typically is solvent borne, or silicone rubber that is formulated without solvents and cures by either heat (addition) cure or room temperature (moisture) cure. Based on the performance requirements of conformal coating materials, as long as cure time can be shortened, room temperature cure silicone rubber materials are considered good candidates due to their ease of use and ability to eliminate curing equipment from manufacturing processes. Our latest materials with enhanced reliability performance are highlighted below:Momentive’s ECC3011 and ECC3051S silicone conformal coating materials employ a unique formulation that can help prevent the occurrence of corrosion on vital PCB components and surfaces.

Biografie
05/2017- present: Application Development Engineer - Electronics @ Momentive Performance Materials GmbH 06/2016–12/2016 Research Associate at Forschungszentrum Jülich GmbH, Institute of Energy and Climate Research 5–Photovoltaics 06/2013–05/2016 Ph.D. Student at Forschungszentrum Jülich GmbH, Institute of Energy and Climate Research 5–Photovoltaics: “Low Temperature Thin-Film Silicon Solar Cells on Flexible Plastic Substrates” (submitted: 11th October 2016) 06/2013–12/2016 HITEC Graduate School for Energy and Climate 10/2007–05/2013 Darmstadt University of Technology Field of study: Material Science Grade: Very Good 11/2012–05/2013 Diploma Thesis at Forschungszentrum Jülich GmbH, Institute of Energy and Climate Research 5–Photovoltaics: “Tandem Cells providing high Open Circuit Voltages for photoelectrochemical Water Splitting” 08/2011–10/2011 Internship at BASF SE in Ludwigshafen: “Simulation and Degradation of Organic Light Emitting Diodes (OLED)” 01/2011–02/2011 Practical Specialisation in the Department of Electronic Materials: “Investigation of Trap States in Organic Semiconductors”

Advanced Packaging Conference
O To top
ON-Semiconductors ON-Semiconductors Wu, XiaoMin
1000 V/80 W auxiliary power supply as a demonstration vehicle for Wide Bandgap power electronics system design
Wu, XiaoMin

Wu, XiaoMin
Sr Application Engineer
ON-Semiconductors

Wu, XiaoMin

Abstract
With the emergence of Wide Bandgap (WBG) semiconductors, power electronics are experiencing a renaissance. Many design limitations, such as switching frequency, thermal ruggedness and voltage capability of silicon based power devices are being pushed to new limits with Silicon Carbide (SiC) and Gallium Nitride (GaN) based electronics. In order to truly make use of this extended operation range, traditional topologies have to be re-imagined. To switch at higher frequencies, for example, new passives are required; using the extended thermal operation point needs a redesign of the cooling and layout of the PCB, this could lead to extensive saving of material costs. The improved switching efficiency, and reduced die footprint, despite blocking voltage capabilities beyond 1200 V, in combination with ultra-low inductive PCB design can greatly improve switching losses. This paper presents the approach and design considerations needed to turn traditional topologies, such as a quasi-resonant flyback, into WBG optimized systems which can make use of the various added benefits provided by current prototype of ON Semiconductors SiC power MOSFET. The investigations start with a comparison of SiC based power transistors to best in class available 1700 V Silicon MOSFETs, within a non WBG optimized system. Applying a new generation of ON Semiconductor gate drivers, in combination with partnered passives developers we demonstrate how switching frequencies beyond 300 kHz are realizable in high power applications, when using a WBG optimized design and SiC power MOSFETs. To finish the work a functioning demonstrator for a variable range quasi-resonant flyback based on 1700 V SiC MOSFETs is shown and characterized.

Biografie
Bachelor degree of Electrical Engineering and Automation, study in Harbin Institute of Technology university (CN) 2001 – 2005; PSU hardware designer in AcBel Polytech, Hangzhou 2005–2009; PSU hardware designer in Efore (CN & Sweden), 2009- 2011; Senior Simulation Engineer in Grundfos(CN)2011- 2014; Application Engineer in Fairchild &ON Semi(DE)2015-present

Power Electronics Conference
otego GmbH otego GmbH Lessmann, Frederick
Roll-to-roll printed thermal Energy Harvester: A autonomous energy source for IoT
Lessmann, Frederick

Lessmann, Frederick
CEO
otego GmbH

Lessmann, Frederick

Abstract
Heat is everywhere – in many cases more than actually needed. otego develops innovative thermoelectric generators (TEG) that convert heat directly into electric power as soon as there is a condition of differences in temperature. As an independent energy supply for the Internet of Things otego’s TEGs work completely maintenance-free and can use even small differences in temperature. otego managed to bring together low-cost materials and industrial production methods for the first time. The cost advantage will enable otego to be the first manufacturer to produce TEGs suitable for broad mass applications. It is otego’s goal that future wireless sensors and IoT-devices such as smart home heating valves are operating energy self-sufficient. In many connected devices inconvenient battery changes will be a thing of the past. outstanding properties Conventional TEG are very expensive and therefore uncompetitive due to rare as well as toxic materials and complex production processes. The otego-technology makes use of inexpensive printable semiconductors (e.g. electrically conductive polymers) and processes them in large scale industrial production machines (roll-to-roll printing machines). This combination leads to a competitive price of TEGs for the first time. Variable There have never been as flexible and as all-round TEGs then otego’s. They can even be mounted on round surfaces like pipes! This is a handy feature since pipes are often an ideal heatsource. Non-toxic otego is convinced that heavy metals like lead and tellurium have no place in consumer or professional electronics. Therefore otego-TEGs are only made of nontoxic materials, that allow for an eco-friendly disposal. Flexible Vibration and shocks are unable to harm otego-TEGs. The TEGs are made of elastic materials and therefore meet the requirements for rough industrial environments.

Biografie
Frederick Lessmann is Co-Founder and CEO of otego. He and his team is pushing the boundaries of printed electronics and developed a completely new approach to make thermoelectric energy harvesting competitive. Prior to founding otego, Frederick was management consultant at a spin-off firm from AT Kearney and he held positions at Siemens and Fraunhofer. He holds an academic degree in industrial engineering and management from Karlsruhe Institute of Technology (Germany) and McGill University (Canada).

2017FLEX Europe
Oxford Instruments Oxford Instruments Sundaram, Ravi
2D materials and heterostructures: Fabrication Technology and processes
Sundaram, Ravi

Sundaram, Ravi
Market Manager : Research and Emerging Technologies
Oxford Instruments

Sundaram, Ravi

Abstract
Two dimensional materials are gaining a lot of interest as a possible strategy for pushing the scaling limits as well as for heterogeneous integration in micro/nano electronics. Fabrication of 2D materials and electronic devices require tailored solutions for the deposition and etch of these atomically thin materials. In this talk, I will present the technology and processes developed at Oxford Instruments for the atomic scale processing and quality control of 2D materials. This will include equipment and processing for deposition and etching of 2D materials by CVD, ALD and ALE as well as deposition of high k dielectrics on such materials for optimum device performance. In addition, the possibility of creating novel functional architectures by in situ deposition of 2D heterostructures will also be outlined.

Biografie
Dr Ravi Sundaram is the Market manger for emerging technologies at Oxford Instruments Plasma Technology. He has been involved in 2D materials research in several institutions such as EPFL, Switzerland, Max Planck Institute Stuttgart, Germany, IBM T.J Watson Research Labs, NY and Cambridge University where he worked on several aspects of graphene and 2D materials from synthesis, fundamental science to prototype applications in optoelectronics and electronics. He joined Oxford Instruments to lead and coordinate efforts towards 2D materials R&D and is now responsible for scoping out and developing a strategy for emerging technology markets.

TechARENA: Advanced Materials Session2
P To top
Panasonic Automotive & Industrial Sales Europe GmbH Panasonic Automotive & Industrial Sales Europe GmbH Windemuth, Reinhard
Plasma Dicing 4 Thin Wafers
Windemuth, Reinhard

Windemuth, Reinhard
Sales Director Microelectronics Europe
Panasonic Automotive & Industrial Sales Europe GmbH

Windemuth, Reinhard

Abstract
Abstract: “Plasma Dicing 4 Thin Wafers” Recently many issues came up when using conventional dicing methods. Such conventional methods are mechanical sawing (blade dicing) or laser dicing or stealth dicing. Relevant applications are thin wafers, brittle materials and wafer singulation for very small devices or LED or discretes. Plasma dicing is a recommended method to overcome many challenges of wafer separation. Damage free, water free, particle free and high throughput dicing can be realized by using plasma trench etch (dry etch) technology for dicing. Several technical and equipment aspects will be presented and discussed accordingly. Plasma dicing technology can provide solutions for high rate dicing, beautiful chip shape without any chipping and high bonding strength. Cost aspects: The throughput of a plasma chamber depends mainly on wafer thickness and is quite independent from wafer size or chip size. By using plasma for dicing the throughput can achieve more than 4 or 5 wafers per hour. Such cannot be achieved by any line-by-line dicing method as long as small chips are required. Significant cost savings can be expected. Advantages of plasma dicing are described in detail such as a. Damage Free / Chipping Free. b. Increase quantity of chips per wafer c. Water Free process d. Flexible Chip Shape e. Etching speed and characterisation f. Total Dicing Process Flow New materials for semiconductor devices are recently coming up on the market. Such as SiC base material and GaN-on-Silicon for power devices and discretes. Future challenges such as SiC dicing or GaN-on-Silicon dicing will be discussed. Typical topics on Plasma Dicing equipment are explained

Biografie
Degree of Diplom-Ingenieur in Process Engineering on Technical University in Munich / Germany in 1988. Since then Project Management & Sales for different kinds of Industy, mainly in chemical Industry. Since 1998 Sales & Project management in Microelectronics & Semiconductor Industry for F&K Delvotec, Wirebonding and Diebonding Technology. Profund experience in handling packaging projects in both Semiconductor and Device-Manufacturing Industry. Since 2006 Sales Director for Microelectronics Equipment at Panasonic Factory Solutions Europe (PFSE). Main target is to establish new PFSE business fields in the Backend and Frontend Industry in Europe: Dieattach, Flipchip, Plasma Cleaning and Plasma Etch Technolgies.

2017FLEX Europe
Philips Lighting Philips Lighting van Asselt, Rob
Hyb-Man: Hybrid 3D Manufacturing of Smart Systems
van Asselt, Rob

van Asselt, Rob
Project leader
Philips Lighting

van Asselt, Rob

Abstract
The current way of mass producing consumer electronics products poses challenges to industries like Philips Lighting. New flexible hybrid manufacturing methods and 3D integration of electronics enable faster product realization, product customization and new products with improved design and performance. Moreover, the integration of functions will result in less parts and easier assembly, which facilitates local and on-demand product manufacturing. The successful implementation of hybrid manufacturing methods requires a wide range of competences and parallel development of technologies and markets for materials, processes, production equipment and products. Therefore we started the Hyb-Man project with the goal to develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems. Together with 11 partners from Germany and the Netherlands we will develop and integrate technologies for additive manufacturing, 3D electrical structures, assembly and interconnect. First time right manufacturing will be achieved by creating design rules based on understanding of product-process relationships and by developing in-line testing and quality monitoring as integral part of the complete production chain. In parallel we will develop two innovative product cases covering different applications and sectors (LED luminaires, automotive adaptive sensors) to demonstrate the hybrid 3D manufacturing approach.

Biografie
Dr. Rob van Asselt has a PhD in chemistry from the University of Amsterdam. In 1994 he joined Philips Research, where he has been involved in a variety of product and process development projects. Since 2011 he is project leader and system architect for LED lighting products. In this role he is also leading the Penta funded cooperation project Hyb-Man.

TechARENA: Semiconductor Nano-electronics - The Power of Collaboration
PragmatIC PragmatIC Alkhalil, Feras
Towards Scalable CMOS Flexible Electronics
Alkhalil, Feras

Alkhalil, Feras
Research Manager
PragmatIC

Alkhalil, Feras

Abstract
The proliferation of smart objects required to truly harness the full capability of the Internet-of-Things (IoT) is enabled by the form-factor and cost-structure of flexible oxide electronics. In this sector, state-of-the-art is based on unipolar n-type transistors (NMOS) and is close to full commercialisation. PragmatIC is currently commissioning its FlexLogIC™ fab-in-a-box system, developed under the EU Horizon 2020 SME Instrument Programme (grant agreement No 696266). FlexLogIC™ transfers PragmatIC’s proven end-to-end flexIC production process into a self-contained, fully automated, modular “fab-in-a-box” for high throughput manufacturing. FlexLogIC offers capacity for billions of flexICs at a capital cost between 100 and 1000 times lower than a silicon fab. This will address many emergent application spaces e.g. proximity RFID tags, although the high static power consumption of unipolar logic precludes ultra low power applications and very complex circuit designs. Broadening the accessible applications requires complementary (CMOS) logic, where static power consumption is negligible. Here, we report on key considerations in moving PragmatIC’s flexible electronics technology from R&D to mass manufacture, wider market adoption and the ongoing advancement of oxide based CMOS logic (COSMOS, Innovate UK project Ref: 132201) to further extend the opportunities for this technology.

Biografie
Feras joined PragmatIC in September 2015 and leads PragmatIC’s research team. He received his MSc and PhD from the University of Southampton in Microelectronics System Design and Solid State Electronics, respectively. From 2013 to 2015, he worked as a Research Fellow at the University of Southampton developing single electron transistor and quantum dot architectures with research laboratories and universities in the UK and Japan. He also held a lectureship, teaching Solid State Physics and Semiconductor Devices at the University of Southampton Malaysia Campus.

2017FLEX Europe
R To top
RECIF Technologies RECIF Technologies Delpu, Guilhem
The power of collaboration in Europe
Delpu, Guilhem

Delpu, Guilhem
Collaborative programs manager
RECIF Technologies

Delpu, Guilhem

Abstract
Small and Medium sized Enterprises (SME) can sometime face problems to connect to the right stakeholders of the semiconductor industry and tackle the challenges they have to. Reasons such as protection of IP’s (among others) make that dialog can be difficult to establish between several parties around a common goal. We, in Europe, have multiple frameworks that simplify the set-up of basis for collaborative programs; this is a chance! Within such appropriate environments, all contributors of the value chain can find their interest around a common goal and major road blocks can be lifted. From RECIF point of view, as an SME, this is the power of collaboration in Europe! In its presentation, RECIF will provide insights of achievements obtained in its TSV-HANDY project, currently running under CATRENE framework. RECIF will also illustrate why such collaborative frameworks are key to maintain leadership of European stakeholders in a worldwide market.

Biografie
Guilhem Delpu works for RECIF Technologies as collaborative programs and product marketing manager. RECIF is specialized in robotics wafer handling systems. He joined the company in 2004 and has held several positions in the company. Throughout the past 7 years, he has managed the positioning of RECIF in 12 collaborative programs build under various frameworks (H2020 / ENIAC / CATRENE). He has also build and led 2 projects for RECIF under CATRENE framework. One is currently running. Guilhem Delpu graduated in mechanical engineering as well as marketing, in Toulouse.

TechARENA: Semiconductor Nano-electronics - The Power of Collaboration
Robert Bosch GmbH Robert Bosch GmbH Guyenot, Michael
Requirement to Automotive Packaging Technologies
Guyenot, Michael

Guyenot, Michael
Manager
Robert Bosch GmbH

Guyenot, Michael

Abstract
Until till now, there is the trend of more consumer packages in automotive applications. The main motivation is the reduction of the cost and integration of new functions, e.g. entertainment or car to car communication. Consumer packages are optimized for miniaturization, high volume production and low cost. On the other side the reliability of consumer packages is often not specified and tested for automotive requirements. Cars are long life products with a durability of more than 15 years or 300.000 km or 6.000 hours of operation. With the change to electro mobility there are more permanent working units with up to 100.000 hours of operation in the car, e.g. charger, battery management. The improvement of these higher request and necessary reliability tests are the issue for consumer packages in automotive applications. Especially the need of front load development and simulation capability for higher product quality, e.g. autonomic driving, have to be solved for the consumer packages.

Biografie
Dr. Michael Guyenot studied Technical Physics and Economy at University of Bayreuth, Germany. He holds a PhD degree as engineer in materials science from the University of Bremen, Germany. Michael started 2002 at Robert Bosch GmbH in the business unit “Automotive Electronic” as a Senior Expert for reliability testing of automotive electronics. Since 2007 he works as Senior Manager in Corporate Research of Bosch and is leading a research group for electronic packaging and interconnection technology. Michael is involved as specialist for automotive and power electronics in public funding projects.

Advanced Packaging Conference
Robert Bosch GmbH Robert Bosch GmbH Giersbeck, Martin
Potentials of System-in-Package Technologies for Future Bosch Products
Giersbeck, Martin

Giersbeck, Martin
Vice President
Robert Bosch GmbH

Giersbeck, Martin

Abstract
The pace of the increase in transistor counts for one processor unit generally described by Moore’s law holds on until today. However the growing complexity raises challenges on the energy supply, thermal management and reliability of these components. Aspects which are not only influenced by the processor architecture itself but by the technologies dealing with the packaging and the electrical interconnection with further peripheral units as well. Since these technologies do not scale by Moore’s law, they are often described by the term “More than Moore”. In order to address the above challenges System-in-Package (SiP) concepts are being developed integrating several electric components in a single unit. These new approaches help to fabricate compact circuits with enhanced features such as integrated user interfaces, sensors and actuators. Within Corporate Research of Bosch concepts to embed and interconnect various electric components in a flexible circuit carrier have been developed in strong cooperation with European research institutes. Since many processes were already established in the CE field, extensive studies have been performed to investigate the suitability of such integration technologies for the automotive and the industrial sector. The studies have been focusing on reliability issues of the packaging and the electrical interconnections under cyclic thermo-mechanical loading. Besides the integration of conventional electrical components new transducer technologies especially suitable for flexible packaging have been treated as well. Current research activities are focusing on technologies integrating sensor components such as projected capacitive and resistive touch sensors with transparent, electroactive polymer-based haptic transducers in one package together with the display unit.

Biografie
Martin Giersbeck studied Mechanical Engineering at Bochum University and at Aachen Technical University. From 1995 until 1999 he was a scientific research assistant at the Institute for Plastics Processing (IKV) at Aachen. In 1999 Martin Giersbeck joined Bosch. Entering as a trainee he held several leadership positions at the Bosch subsidiary Blaupunkt at Hildesheim for a period of 10 years. Within the field of navigation systems his scope moved from mechanical design via project management and customer acquisition to a general responsibility for aftermarket products. In 2009 Martin Giersbeck changed position to join Corporate Research and Advance Development of Bosch. Within this organization he has been responsible for Plastics Engineering from April 2010 on. The department used to be located in Waiblingen, but is now part of the Research Campus of Bosch at Renningen.

2017FLEX Europe
RoodMicrotec GmbH RoodMicrotec GmbH Sallenhag, Martin
Wafer & Final Test in the new era of electronics
Sallenhag, Martin

Sallenhag, Martin
CEO
RoodMicrotec GmbH

Sallenhag, Martin

Abstract
The shift in automotive, industrial and healthcare markets towards a higher content of electronics puts a new set of demands on wafer and final test solutions. Moving into more complex and miniaturized solutions makes the implementation of test solutions much more important including being part of the design phase from the beginning. We at RoodMicrotec see new demands from the market to do multiple temperature and voltage tests both at wafer level as well as on packaged parts. This requires additional equipment to be able to do it in conjunction with partnerships with both the design houses as well as the packaging houses. This to find the optimal solution for all different applications. The evaluation of test data, from PCM to final test, is also a challenge for the test houses. Installation of tools such as YieldMann helps getting the data in a format that enables us to cooperate with the wafer fab to get the optimal yield for a specific product. It is also very important to have a well-defined name structure for all the data that is generated to be able to quickly analyze and take measures to improve the yield. Being part of the complete supply chain, as RoodMicrotec is with its Turnkey solutions, improves the possibilities to ramp a product to high volume production in a short time with good yield from the beginning.

Biografie
Martin Sallenhag, CEO and Managing Director RoodMicrotec N.V. Martin Sallenhag joined RoodMicrotec in March 2015 as CTO and was appointed CEO and Managing Director in June 2016. He is responsible for the overall management of the company together with COO Reinhard Pusch and specifically managing the engineering departments, quality, human resources, purchasing and IT. He has over 25 years of experience in the semiconductor business in various management positions within Samsung Electronics, Dialog Semiconductor and Ericsson. He holds a Master of Science degree in Electrical Engineering from Lund University with focus on Mixed Signal ASIC design.

Advanced Packaging Conference
S To top
SEMI SEMI Dieseldorff, Christian Gregor
Industry Outlook and Forecast for Fab spending and Capacity
Dieseldorff, Christian Gregor

Dieseldorff, Christian Gregor
Director Industry Research & Analysis
SEMI

Dieseldorff, Christian Gregor

Abstract
These are exciting times! Great sales outlook and historic highs in fab spending for equipment and construction of new fabs in 2017 and 2018. These unprecedented high numbers are not only driven by a handful of well-known, established companies, but also by several new Chinese companies entering the scene. While Korea and China are leading regions, Europe makes a big leap.

Biografie
Chris has over 30 years of industry experience. For 15 years he was engaged in various engineering and management position in R&D and pilot lines at Siemens (Munich), IBM (New York), I300I & International Sematech (Austin, Texas), and Infineon in San Jose, California. Since 2002 he worked as senior industry analyst and director of market research first for Strategic Marketing Associates and since 2007 for SEMI.

TechARENA: Market Briefing
Fab Management Forum
Siliconware Precision Industries Co. Ltd. Siliconware Precision Industries Co. Ltd. Tsai, Mike
Innovation 3D Stacking Structure of System in Package for IoT and Wearable Devices Application
Tsai, Mike

Tsai, Mike
Engineer
Siliconware Precision Industries Co. Ltd.

Tsai, Mike

Abstract
Recently, the electronics industry is moved maturely on the mobile/tablet market. The next fast growing opportunity market will be the Internet of Things (IoT), 5G connectivity and Wearable Deivces in the near future. This advanced technology/package need to provide the ideal solution for small form factor, thin profile, high electrical performance, multi-function integration and low cost are the most critical requirements. To approach these requirements, the System in Package (SiP) is a combination of one or more semiconductor devices plus optionally passive components that define a certain functional block within a small package, mounted onto the system’s main board assembly. In this paper, an alternative 3D small form factor SiP methodology will use surface mount technology (SMT) and 3D structure of stacking die on passives to shrink the package size. The calculation of package size can be shrunk around 25% area and package size reduced from 11.5 x 11.5mm to 10x10mm. And also for another double side SiP module technology by utilizing super high integraton package technology to shrink 45% PKG size from 8x8mm to 6x6mm. SiP also can integrated an antenna inside SiP module as antenna in SiP technology to get small form factor. The SiP module provide a unique opportunity to address cost, performance, and time-to-market. Considering the limitations of power consumption and form factor, such as Bluetooth Low Energy (BLE), and wireless connectivity module (RF, FEM) will become the major requirements for SiP platforms in near marketing. The characterization analysis will utilize simulation methodology & typical reliability testing (Temperature Cycle Test, High Temperature Storage Test, unbias HAST) results as a verification for 3D stacking die on passives of SiP feasibility structure. Finally, this paper will find out the suitable 3D stacking die on passives of SiP structure and feasibility data for future IoT, 5G Connectivity and wearable devices application.

Biografie
Mike Tsai Senior Engineer Engineering Center SPIL Siliconware Precision Industries Co. Ltd. Education: Master of mechanical engineering department, National Chung Hsing University, Taiwan. Experience: Over 5 years of job experience on semiconductor industry, especially focus on flip chip and SiP (System in Package) advanced assembly technology. Now: Senior Engineer of Engineering Center of SPIL (Siliconware, Taiwan), which is 3rd biggest assembly house in the world now.

Advanced Packaging Conference
Siltronic AG Siltronic AG Storck, Peter
Epitaxial Growth of Low Defect SiGe Buffer Layers for Integration of New Materials on 300 mm Silicon Wafers
Storck, Peter

Storck, Peter
Senior Manager Innovation Projects
Siltronic AG

Storck, Peter

Abstract
Strain-relaxed SiGe buffer layers are attracting renewed interest as an important platform for integration of high-mobility channel materials in advanced CMOS device nodes. A number of options are explored to either extend the life of FinFETs or use GAA devices. Different approaches are under investigation involving monolithic integration of SiGe, Ge and III-V materials. A common challenge is the need to manage layer strain and crystal defects especially misfit and threading dislocations. The relaxed SiGe lattice can be used to combine control of strain in the active areas with low defect density and is therefore attractive as starting template for strained-layer growth. The various aspects of epitaxial growth of strain-relaxed SiGe buffer layers with different Ge Content on 300mm wafers will be discussed.

Biografie
Peter Storck received his PhD in Physical Chemistry from the TU Darmstadt, Germany, and has more than 20 years of experience in semiconductor epitaxy. Starting in 1996, he worked three years for Wacker Siltronic in Portland, Oregon, focusing on Epi process technology for Power Applications. From 1999 to 2003, he was responsible for the start-up of 300mm Epi technology at Siltronic, Germany. Since 2004 he is the manager of Siltronic’s Innovation Projects group developing advanced materials. His research topics include Si, SiGe, rare-earth oxide and III-N epitaxy. He is the author or co-author of more than 40 publications and 20 patents.

TechARENA: Advanced Materials Session1
Solmates B.V. Solmates B.V. Janssens, Arjen
Solmates Pulsed Laser Deposition systems enable the integration of critical novel thin film materials for the MEMS & 5G market
Janssens, Arjen

Janssens, Arjen
CEO
Solmates B.V.

Janssens, Arjen

Abstract
Solmates is increasing its installed base of PLD systems worldwide at well-established research institutes and noted CMOS, MEMS and Sensors manufactures. After the introduction of Atomic Layer Deposition in thin film manufacturing it is now Solmates PLD to challenge the limits of thin film deposition of novel materials in a production environment. It is well known that Pulsed Laser Deposition (PLD) is a very flexible and versatile technique allowing fast optimization of new and complex material thin films. The unique features of PLD allow for the integration of “Beyond Moore” materials in CMOS, MEMS and sensors. Up to now, the developed materials and processes in PLD only just make it into demonstrator devices. In order to make it into commercial applications, next generation PLD equipment is needed to bridge the gap between demonstrator and the prototype to production. Since 2006 Solmates developed PLD systems for large substrate dimensions and stable processing. The current Solmates PLD platform is the next step beyond fundamental PLD research. The reliable hardware is flexible for fast process optimization and allows uniform thin film deposition up to 200 mm wafers or 200 mm2 glass panels with high reproducibility. The automated software ensures easy operation and stable performance. These characteristics enable the integration of PLD thin films in applications for (pilot) production and commercialization. In this contribution the Solmates core technology will be presented. As a first example wafer-level integration of epitaxial PZT and PMN-PT thin films on silicon is demonstrated. The results of this work are the first milestone in the development of a piezoelectric memory. In another example, the PZT is integrated in silicon photonics for strain-optical modulators. These devices are a key component for phased-array antennas that will enable 5G data communication. Production of these devices that rely on PLD-deposited piezo materials is scheduled for 2019.

Biografie
Solmates is a fast growing and ambitious OEM company, with its mission to position PLD as a mainstream deposition technology equal to ALD and sputtering. Solmates is a spin-off company of the MESA+ Institute for Nanotechnology, located at Science Park Twente, in Enschede, the Netherlands. It was founded from a specialized PLD research group (IMS) chaired by prof. Dave Blank and prof. Guus Rijnders. Its employees are highly recognized specialists in PLD of which many have a semiconductor industry background. Since Solmates was established in 2007 it has generated multiple patents and has brought pulsed laser deposition from lab scale to production level. Currently Solmates has over half a dozen development and pilot production systems running at various customers worldwide. Arjen Janssens is responsible for the overall leadership and strategy of the company. He started his career as strategic consultant at Arthur D. Little, after one year he became shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he enrolled into his PhD. at the University of Twente focussing on Piezo materials and pulsed laser deposition. During his PhD. he assisted MESA+ in business development, completed the Executive MBA at TSM business school of technology, and co-founded Solmates.

TechARENA: Advanced Materials Session1
SPTS Technologies Ltd SPTS Technologies Ltd Carpenter, Jo
Latest advances in Si DRIE for MEMS Manufacturing – focusing on feature tilt and wafer throughput
Carpenter, Jo

Carpenter, Jo
Etch Product Management Engineer
SPTS Technologies Ltd

Carpenter, Jo

Abstract
For many years equipment makers have been continuously improving the capability of deep reactive ion etching (DRIE),also known as the Bosch Process, used to etch high aspect ratio features required for silicon MEMS manufacturing. With the demand for smaller, faster, cheaper, and stronger MEMS, there is a constant drive to further improve the silicon etch rate while maintaining a smooth sidewall profile and reducing feature “tilt” characteristics across a wafer. While all MEMS manufacturers want to optimize silicon etch rate to increase throughput, this is particularly true for device makers who want to etch large, deep cavities. While large cavities may not experience the etch-rate-limiting issues associated with transporting reactive species and reaction products in and out of narrow, high aspect ratio features often found in MEMS structures, generally speaking there is still a trade-off between etch rate and cavity sidewall quality. This presentation will describe how we have developed techniques to significantly increase etch rate in a number of applications, while maintaining sidewall roughness and profiles within the required specifications. The causes of varying feature tilt across a wafer are very complex, involving hardware and process variables which affect the uniformity of the plasma above the wafer. Control of tilt across the whole wafer is essential to increase yields in volume manufacturing. This presentation will help the audience understand the difference between constant tilt, fine tilt and edge tilt, and the effect of source design and process variables on the plasma, or more precisely the plasma sheath, which determines the ion density and directionality of the ion bombardment during each etch step. This presentation will show the latest results from the “next generation” of silicon DRIE equipment and describe possible upgrade routes where applicable to existing users.

Biografie
Joanne Carpenter is Etch Product Management Engineer at SPTS, and has over 15 years’ experience in the semiconductor and electronics manufacturing industries. Prior to her current role, Joanne has worked for European Semiconductor Manufacturers Ltd (ESM) and ZBD displays Ltd. Joanne joined Surface Technology Systems (STS) in 2007 as an Etch Process Engineer. When STS and Aviza merged in 2009 to form SPTS, she joined the etch samples division as a Senior Etch Engineer, specialising in development of innovative etch process solutions and supporting SPTS customers on critical advanced packaging technologies in China, Taiwan and North America. In 2016 Joanne joined SPTS's Etch Product Management team.

TechARENA: MEMS
STATS ChipPAC Pte Ltd STATS ChipPAC Pte Ltd Yoon, Seung Wook
eWLB (FO-WLP) as an Innovative Integration Solution of SiP
Yoon, Seung Wook

Yoon, Seung Wook
Director
STATS ChipPAC Pte Ltd

Yoon, Seung Wook

Abstract
New and emerging applications in the consumer and mobile space, the growing impact of the Internet of Things (IoT) and wearable electronics (WE), and the complexities in sustaining Moore's Law have been driving many new trends and innovations in advanced packaging technology. Advanced embedded Wafer Level Ball Grid Array (eWLB) technology provides a versatile platform for the semiconductor industry’s technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations. This presentation reports developments that advanced eWLB/FO-WLP technology, including integration of multi-die, discretes, embedded passives and crystals. This will also discuss the adoptions and new features available for mobile, IoT and WE. This advanced technology is well designed for MEMS/sensors SiP modules as well as thin, highly integrated packaging. Innovative 2.5D/3D packaging features will be also introduced with the merits and characterization data for specific applications. To enable higher interconnection density and signal routing, packages with multi layer redistribution (RDL) and fine line/width spacing are fabricated and implemented on the eWLB platform. This presentation will describe the new manufacturing module approach and the results of process characterization for products produced in the module. Also there will be discussion of large panel level fan-out WLP including current development status and technical challenges ahead.

Biografie
Name: Seung Wook Yoon, Ph.D, MBA Title/ Position: Director Company: STATS ChipPAC Pte Ltd. Dr. YOON is currently working as director of Advanced Products & Technology Marketing , STATS ChipPAC Pte. Ltd in Singapore. His major interests are for wafer level products including eWLB/Fanout WLP, WLCSP, IPD, bumping, TSV (Through Silicon Via) technology, flipchip and integrated 3D IC packaging. Prior to joining STATS CHIPPAC LTD, He was deputy lab director of IME (Institute of Microelectronics), A*STAR (Agency of Singapore Technology and Research), Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 250 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging.

Advanced Packaging Conference
STMicroelectronics STMicroelectronics Herard, Laurent
Packaging challenges for robust miniaturization
Herard, Laurent

Herard, Laurent
Group VP - Head of packaging R&D
STMicroelectronics

Herard, Laurent

Abstract
The computing power embarked in latest generation cars keeps increasing in terms of content and complexity. This is typically the situation for microcontrollers and ADAS chips, for which interconnection requirements are on par with consumers advanced computing products in terms of miniaturization, signal integrity, power dissipation and cost. Recent improvements in packaging materials and equipment lead to higher package level reliability of the recent interconnection technologies, becoming compatible with quality requirement requirements for automotive include higher temperature storage conditions. The main challenge remains on more severe board level reliability with tough thermal cycling and vibration conditions. This paper gives an overview of the challenges driven by automotive mission profile for adoption of some advanced packaging innovation such WLCSP, flip chip, QFN. The focus is on packaging design, material.

Biografie
Laurent Herard is Group VP – Head of the Back End Manufacturing & Technology R&D at STMicroelectronics. He is located in Singapore. He received an Engineering Degree in physics of semiconductor from the INP Grenoble. In 1991 he joined the advanced packaging department of Bull France as a process engineer for development of high performance Multi Chip Modules. In 1994 he joined STMicroelectronics packaging department. He pioneered the development and industrialization of BGA design and manufacturing at ST. For the past 12 years, he has worked as Technical and Engineering Director at ST Back End manufacturing plants in Morocco, Singapore and Malaysia. During this experience, he led design, process optimization and automation activity for ST packaging portfolio.

Advanced Packaging Conference
SUNY Polytechnic Institute/AIM Photonics SUNY Polytechnic Institute/AIM Photonics Liehr, Michael
AIM Photonics – Manufacturing Challenges for Photonic Integrated Circuits
Liehr, Michael

Liehr, Michael
CEO AIM Photonics
SUNY Polytechnic Institute/AIM Photonics

Liehr, Michael

Abstract
Abstract: The American Institute for Manufacturing Photonics (AIM Photonics) is a manufacturing consortium headquartered in NY, with funding from the US Department of Defense, New York State, California and Massachusetts, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. The institute has focused its 1st year activities on providing a turn-key capability to industrial customers with a primary focus on SMEs, university researchers and government agencies. To that effect, a multi-project wafer (MPW) offering was established including a service broker, a Process Design Kit (PDK) and a suite of component library elements. The design component strategically support the migration from a full custom design environment to a hierarchical methodology expected to provide significant productivity enhancements. Using NY State funding, AIM Photonics is establishing a Test, Assembly and Packaging (TAP) facility that complements its leading-edge silicon photonics wafer capability. The TAP facility is expected to open in 3Q2017 and be fully operational early 2018. We have established AIM Academy, an organization under the institute that fosters education. A key tenet for AIM Photonics is to develop and ensure a well-trained workforce through the AIM Photonics Academy. This effort is designed to provide a unified learning, training, knowledge, technology and workforce deployment platform. Lastly, we have merged with the prior integrated photonics road mapping activity and have published two yearly updates to the roadmap which are publicly available.

Biografie
Michael Liehr is the Chief Executive Officer of the American Institute for Manufacturing (AIM) Photonics. Michael focuses on the creation of new AIM business opportunities, and is responsible for the effective and efficient operation of AIM’s programs including SUNY Poly’s strategic 300mm integrated photonic semiconductor and 3D packaging. He is also SUNY Polytechnic Institute’s Vice President for Research and Executive Vice President for Technology and Innovation. Prior to this assignment, he led the Global 450mm Consortium through the start-up phase as the General Manager and was an IBM Distinguished Engineer.

TechARENA: Photonics
System Plus Consulting System Plus Consulting Barbarini, Elena
Si vs SiC Power modules in HEV intergration: a cost analysis
Barbarini, Elena

Barbarini, Elena
Senior Cost Engineer
System Plus Consulting

Barbarini, Elena

Abstract
When converting an existing petrol vehicle to a hybrid version, the available space in the engine compartment is often so limited that it is difficult to accommodate a PCU. Thus it is necessary that the PCU has a higher power density and a smaller size. To achieve both of these targets, manufacturers have developed different solution for the powers modules of the PCU. Some innovations are on the die point of view such as redesign IGBT structure to decrease the die size (Infineon) and others are on packaging, like eliminates the wire bonding and uses a double-side cooling structure. These innovations lead to a redesign of the breakdown cost of the modules. The cost of Silicon devices is continuously decreasing until it will reach its lower limit while the new innovations in terms of packaging materials and method shows an increase of the cost of backend. At the same time, the introduction of WBG materials, such as SiC, offers the possibility to decrease die size while increasing the power density and this is effective for PCU downsizing. However, the new wide-band gap devices still present some technical and economical limitations. The higher breakdown field strength of SiC places greater demands on the package insulation system and the market size of wide band-gap power device is still quite small because of the device cost. The objective of the presentation is to define which are the cost drivers of the new technologies in Hybrid Electric Vehicles and understand if on the long term SiC devices will substitute Si devices for technical and economic reasons. Different devices have been opened and analyzed to understand the technology innovations applied in HEV PCU’s inverters and IGBT power modules and a breakdown cost analysis of the manufacturing process has been developed. Finally, a study of the economic impact of replacement of IGBT with SiC devices in the most innovative automotive PCU’s inverter has been performed.

Biografie
After a bachelor’s degree in Electronic Engineer from Politecnico di Torino, Elena obtained a master's degree in Nanotechnologies for the ICT and a PhD in Electronic Devices at Vishay Semiconductors. After different experience in research and manufacturing of electronics components, she is actually Activity Leader for Power Electronics and Semiconductor Compounds at System Plus Consulting where she is managing and developing costing models and analyses of power devices.

Power Electronics Conference
T To top
Texas Instruments Deutschland GmbH Texas Instruments Deutschland GmbH Pelzmann, Arthur
Proactive scrap risk reduction in a grown high complexity 200mm Wafer Fab
Pelzmann, Arthur

Pelzmann, Arthur
Project Mgr
Texas Instruments Deutschland GmbH

Pelzmann, Arthur

Abstract
One common challenge for Analog Wafer Fabs is the large variety of technologies, products and process steps. Due to the usually long lifetime of analog products the product-mix and therefore the complexity of manufacturing processes increase over the years. The high complexity leads to a high risk of misprocessing due to overlooked or weak equipment and process controls. In most cases this especially affects newer products in the Fab portfolio. Traditional FMEA is aimed to cover all possible failure modes and provide corrective actions to lower the risk. In the case of risk reduction solely focused on process and equipment controls an easier method is desired. For this reasons we at Texas Instruments Deutschland developed the EPCA process (Equipment and Process Control Assessment). EPCA approach is dedicated to prevent quality issues caused exclusively by insufficient equipment- and process-parameter controls. Especially in ramp phases of new fab products the method can be beneficial if equipment-and process requirements have changed. EPCA is among other methods one of our elements for pro-active risk reduction and finally completes existing FMEA. In the presentation the workflow, the fab wide implementation of the method, key learnings and examples will be discussed.

Biografie
Dr.-Ing. Arthur Pelzmann Born:1967 Education: Physics Diplom, University of Ulm, PhD in EE (Optoelectronics, GaN LEDs) University of Ulm 1998 – 2000 Process Engineer at STEAG RTP Systems GmbH, Dornstadt 2000 – 2002 Project Manger, Product Manager at GFD Gesellschaft fuer Diamantprodukte mbH, Ulm (Startup, MEMS, medical) 2002 – 2016 Process Engineering Section Manager Diffusion/Surface Preparation TI Freising Wafer Fab 2016 – Mgr. Process Yield/SFC/Tool-Stability Projects TI Freising Wafer Fab

Fab Management Forum
Texas Instruments GmbH Texas Instruments GmbH Riester, Bernhard
Vacuum Pump Condition Monitoring
Riester, Bernhard

Riester, Bernhard
Engineering Manager
Texas Instruments GmbH

Riester, Bernhard

Abstract
The reliability of the vacuum system in semiconductor equipment, especially in a furnace (due to the high number of wafers) is very important to prevent unexpected failures and therefor the risk of significant loss of process wafers. As the cost for a pump refurbishment is high an early exchange of the pump is normally not the case. In many cases the risk is taken to use the pump in the run-to-fail mode. To overcome this conflict we evaluated methods to predict the failing out of the pump with sensors and mathematic methods. A system will be introduced which uses several sensors (temperature, vibration) to monitor the pump performance and predict pump failures before they occur.

Biografie
Education: Master in photo-engineering from the University of applied sciences in Cologne 1985 – 1988 Process engineer at Siemens with responsibility for Exposure Equipment Evaluation 1988 – 1996 Process engineer At TI Freising with various responsibilities in the Photo Module 1996 – 1998 WW Deputy Lithography Technology Mgr. in Dallas 1999 – 2002 Module Mgr. Epi/Implant Freising Wafer Fab. 2002 – 2015 Equipment Engineering Mgr. Freising Wafer Fab 2016 – Engineering Mgr. Automation/Cost Freising Wafer Fab

Fab Management Forum
Toshiba Corporation Toshiba Corporation Suguro, Kyoichi
Advanced Cu Plating Technology for High Performance Power Devices
Suguro, Kyoichi

Suguro, Kyoichi
Project Manager and Chief Reasearch Scientist for Advanced Process Development
Toshiba Corporation

Suguro, Kyoichi

Abstract
The strong requirements for advanced power devices are lower ON resistance (RON) and more reliability for Ids-Vds characteristics as compared with current power devices. Cu metallization can satisfy both requirements due to lower electric resistivity, higher thermal conductivity and higher yield strength. In order to obtain better power device performance, it is necessary to plate 10-50 micron on semiconductor substrates. Among Cu film formation methods, newly developed Cu plating is most promising due to lower process cost and higher productivity in mass production. Cu films of 10 micron to 50 micron in thickness can reduce 15% to 40% of the temperature rise of transisters at the timing of high electric current is passed in power devices. However, thicker Cu films cause larger wafer warpage. Therefore, Cu film stress is required to be reduced while keeping lower resistivity of the Cu film. In our study the Cu film stress was successfully reduced to 10MPa or below. Double side Cu plating is more effective to minimize the Si wafer warpage and very thin Si membrane wafer can be successfully metallized with Cu films by controlling Cu thicknesses of frontside and backside by using simultaneously plating (multiplating Cu). In this paper a new Cu plating process and the advantage of Cu plating for power devices are discussed.

Biografie
Dr. Kyoichi Suguro, Chief Research Scientist and Project Leader, Advanced Discrete Development Center, Toshiba Corporation Storage and Electronic Devices Solutions Company, Japan

Power Electronics Conference
Trelic Ltd Trelic Ltd Frisk, Laura
Corrosion behaviour of printed circuit board surface finishes in mixed flowing gas testing
Frisk, Laura

Frisk, Laura
CEO
Trelic Ltd

Frisk, Laura

Abstract
Corrosion resistance is vital for the reliability of many electronics devices especially in industrial use. Corrosion may cause both open and short circuits and therefore, especially for products having long use lives, corrosion may be a major reliability issue. Corrosion can be caused by different environmental contaminants and impurities due to manufacturing processes. The corrosion resistance can be tested using several test methods. In mixed flowing gas (MFG) testing the effect of high temperature, humidity and several different corrosive gases can be studied simultaneously. Such testing can be used to imitate different corrosive environments. In printed circuit boards (PCB) several different metal materials are typically used close to each other which makes them especially vulnerable to corrosion. For example, it is common that copper tracks on PCBs are covered using metallic surface finishes to both protect them and ensure good solderability. Typical surface finishes include electroless nickel immersion gold (ENIG), hot air solder leveling (HASL), immersion tin and immersion silver. Additionally, non-metallic organic solderability preservative (OSP) is commonly used. Even though the aim of the surface finishes is to protect the copper tracks, they may also make them more vulnerable to corrosion. For demanding use environments understanding the corrosion behaviour of the surface finishes is critical. In this study corrosion resistance of copper tracks with the five above-mentioned surface finishes were studied. No additional coatings were used. Surface insulation resistance test structures (SIR) were used to assess the corrosion behaviour. The test PCBs were tested in a MFG test and their SIR structures were periodically measured. Additionally, visual inspection was used and after testing detailed analysis of the corrosion process was conducted. Considerable differences between the surface finishes were seen with ENIG having the worst electrical performance.

Biografie
Laura Frisk received her M.Sc. degree in materials sciences and her Ph.D. degree in electronics from Tampere University of Technology (TUT), Finland, in 2000 and 2007 respectively. In 2013 she was granted Adjunct professorship (TUT) in the field of Reliability issues in electrical engineering. She worked for several years in TUT, Department of Electrical Engineering as the head Reliability Research Group. From 2013 to 2015 she worked as an EU Marie Curie Visiting Research Fellow in Imperial College London (ICL). Dr. Frisk has authored over 90 papers in peer-reviewed journals and conference proceedings. In 2016 Laura Frisk started as a CEO of TReliC Ltd, a company which offers consultation and solutions for challenging electronics packaging, materials and reliability issues. Trelic (Ltd) is a spin-off company from Tampere University of Technology. Trelic offers services in electronics packaging, materials characterisation and reliability analysis including planning of reliability testing, failure analysis and accelerated life testing. Additionally, the company offers courses in several areas. The company works in many industrial areas including, for example, consumer electronics, industrial electronics, medical electronics and power electronics.

2017FLEX Europe
Advanced Packaging Conference
Trinity College Dublin Trinity College Dublin Coleman, Jonathan
All-printed thin-film transistors from networks of liquid-exfoliated nanosheets
Coleman, Jonathan

Coleman, Jonathan
Professor of Chemical Physics
Trinity College Dublin

Coleman, Jonathan

Abstract
The development of printed electronics (PE) is becoming increasingly important, with much research focusing on new materials. A number of material sets have been studied, including organics, inorganic nanoparticles and nanotube/nanowire networks. High operating voltages (up to 50V), low mobility (< 10 cm2/Vs) and poor current injection are still challenges for organic thin film transistors (OTFTs). Networks of inorganic nanoparticles or nanotubes have demonstrated mobilities and on:off ratios of >10 cm2/Vs and >106 respectively, but may face problems with scalability and integration. These problems have led a number of researchers in the field of 2D materials to attempt to produce printed transistors where the channel material is a network of semiconducting nanosheets. Because of the relatively high mobility of 2D materials, such a network might display mobilities which are competitive or even superior to those achievable with printed organics. In addition, one could envisage all-printed transistors consisting of interconnected networks of semiconducting, conducting and insulating 2D nanosheets. However, switchable nanosheet networks have not been demonstrated. Here, using electrolytic-gating, we demonstrate all-printed, vertically-stacked transistors with graphene source, drain and gate electrodes, a transition metal dichalcogenide channel and a BN separator, all formed from nanosheet networks. The BN network contains an ionic liquid within its porous interior that allows electrolytic gating in a solid-like structure. Nanosheet network channels display on-off ratios of up to 600, transconductances exceeding 5 mS and mobilities of >0.1 centimeters squared per volt per second. The on-currents scaled with network thickness and volumetric capacitance as well as the network mobility. In contrast to other devices with comparable mobility, large capacitances, while hindering switching speeds, allow these devices to carry higher currents at relatively low drive voltages.

Biografie
Jonathan Coleman is the Professor of Chemical Physics in the School of Physics and the CRANN and AMBER Research centres, all at Trinity College Dublin. His research involves liquid exfoliation of layered compounds such as graphene, boron nitride and molybdenum disulphide. Exfoliation of these materials gives 2D nanosheets which can easily be processed into thin films or composites from applications from energy storage to sensing to electronics. He has published approximately 250 papers in international journals including Nature and Science, has a h-index of 72 and has been cited ~30000 times. He was recently listed by Thomson Reuters among the world’s top 100 materials scientists of the last decade and was named as the Science Foundation Ireland researcher of the Year in 2011. Prof Coleman has been involved in a number of industry-academic collaborative projects with companies including Hewlett-Packard, Intel, SAB Miller, Nokia-Bell Labs and Thomas Swan.

TechARENA: Advanced Materials Session1
Tyndall National Institute Tyndall National Institute Elliott, Simon
Simulating mechanism at the atomic-scale for atomically precise deposition and etching
Elliott, Simon

Elliott, Simon
Head of Group
Tyndall National Institute

Elliott, Simon

Abstract
Ongoing scaling in the semiconductor industry is increasingly dependent on the rapid introduction of processes for novel materials at sub-nanometre precision - every atom counts. To solve many of these processing challenges the industry is looking to atomic layer deposition (ALD) and atomic layer etch (ALE), and especially to area-selective versions of these processes that can add or remove material only from the substrate of choice. Some important advances have recently been made in area-selective ALD and substrate-selective thermal ALE, but this research has also illustrated how our lack of understanding hampers development. Here we present our recent computational studies of area-selective deposition of Si-based materials and of the mechanism of ALE of oxides, using density functional theory to establish the chemical mechanism, limiting factors and growth/etch rates. In particular, we compute relative reaction kinetics on various substrates, which ultimately determines selectivity. We illustrate how simulations can narrow down options for laboratory studies and provide mechanistic insight that is difficult to deduce experimentally, thus helping to accelerate the introduction of novel processes.

Biografie
Dr Simon Elliott leads the Materials Modelling for Devices group at Tyndall National Institute, Ireland. He studied chemistry in Trinity College Dublin (B. A. Mod., 1995) and theoretical chemistry in Karlsruhe Institute of Technology (Dr. rer. nat., 1999), and carried out postdoctoral research in Trinity College (1999-2001) before joining Tyndall in 2001. He has 75 publications, has been an invited speaker at meetings of the American Vacuum Society, Electrochemical Society, European Materials Research Society, China-ALD and American, Canadian and Finnish chemical societies, as well as communicating science to wider audiences on TV, radio, stage and online. He is a Fellow of the Royal Society of Chemistry and a member of the Project Management Institute. He was co-chair of the 16th International Conference on Atomic Layer Deposition (2016) and is chair of the European COST Action on ALD (2014-2018).

TechARENA: Advanced Materials Session1
Tyndall National Institute Tyndall National Institute Corbett, Brian
Enabling integrated active photonics with transfer printing
Corbett, Brian

Corbett, Brian
Group Leader
Tyndall National Institute

Corbett, Brian

Abstract
The talk discusses the emergence of silicon photonics as a scalable high performance platform for photonic integration enabling applications in communications and sensing. This platform needs III-V materials and devices to achieve its full potential. We show that transfer printing can address this problem with examples from the EU-TOPHIT project, the Irish Photonics Integration Centre and from X-Celeprint.

Biografie
Brian Corbett is leading the III-V materials and devices group at Tyndall, University College Cork Ireland. He received degrees in Physics and in Mathematics from Trinity College Dublin. His research is in the physics and technology of III-V based semiconductors with special emphasis on the use of advanced structuring and printing technologies to permit integration and add additional functionality. He has over 150 publications and 4 granted patents. His research achievements include the invention of a low cost method to obtain single frequency semiconductor lasers and a structure to significantly enhance the directionality of light from LEDs. He is the coordinator of the EU-funded TOP-HIT project and has been a partner in many European projects. He is a principal investigator in the Science Foundation Ireland funded Irish Photonic Integrated Centre (IPIC).

TechARENA: Photonics
U To top
University at Buffalo University at Buffalo Goyal, Amit
Low-cost, flexible, single-crystal-like substrates for high-performance device layers for wide-ranging electrical and electronic applications
Goyal, Amit

Goyal, Amit
Director
University at Buffalo

Goyal, Amit

Abstract
For many electrical and electronic applications, single-crystal-like materials offer the best performance. However, in almost all cases, fabrication of single-crystal form of the relevant material is too expensive. In addition, for many applications, very long or wide materials are required, a regime not accessible by conventional single-crystal growth. This necessitates the use of artificially fabricated, large-area, single-crystal-like substrates suitable for heteroepitaxial growth of the relevant advanced material for the electronic or energy application in question. In this talk, details of the fabrication of such substrates will be provided. Heteroepitaxial growth of nanolaminate multilayers and devices on such substrates using a variety of deposition techniques such as pulsed laser ablation, sputtering, e-beam evaporation, MBE, MOCVD, and chemical solution deposition will be reported upon. Application areas that have been demonstrated via the use of such artificial substrates include – oxide high-temperature superconductors, semiconductor materials (Si, Ge, GaAs, CdTe, Cu2O), ferroelectrics (BaTiO3), multiferroics (BiFeO3), etc. In addition, strain-driven self-assembly of second phase nanomaterials at nanoscale spacings has been demonstrated within device layers. Control of heteroepitaxy in lattice-mismatched systems and the effects of strain on self-assembly will be discussed. Such heteroepitaxial device layers on large-area, single-crystal-like artificial substrates are quite promising for a range of electrical and electronic applications and can revolutionize flexible electronics by offering high-performance, low-cost options.

Biografie
Dr. Amit Goyal joined UB in January 2015 as Director of RENEW, the University at Buffalo’s new interdisciplinary institute dedicated to research and education on globally pressing problems in energy, environment and water. One of the most expansive initiatives launched by UB in recent years, RENEW (Research and Education in eNergy, Environment and Water) will harness the expertise of more than 100 faculty members across six schools and colleges and add more than 20 new faculty members. Further information can be found at – www.buffalo.edu/renew. Goyal has developed clean energy technologies for over two decades. He has authored more than 350 technical publications and has 85 issued patents comprising 68 US and 17 International patents, and over 20 patents pending. He was the most cited author worldwide in the field of high-temperature superconductivity from 1999-2009. He has received numerous accolades including the presidential level DOE’s E. O. Lawrence Award in the inaugural category of Energy Science & Innovation. The US Department of Energy (DOE) Secretary on behalf of the President of the United States bestows the award. Other key honors include: Nine R&D100 Awards which are widely regarded as the Oscars for innovation; Three Federal Laboratory Consortium (FLC) Awards for Technology Transfer; the 2012 World Technology Award in the category of “Materials”; 2010 R&D 100 Magazine’s Innovator of the Year Award; 2010 Distinguished Alumnus Award from the Indian Institute of Technology; the 2008 Nano50TM Innovator Award; the 2007 Pride of India Gold Award; University of Rochester’s Distinguished Scholar Medal in 2007; the U.S. Department of Energy Exceptional Accomplishment Award in 2005; the UT-Battelle Inventor-of-the-Year Awards in 2005 and 1999; the 2005 Global Indus Technovator Award; in 2001 the Energy-100 Award for the finest 100 scientific accomplishments of the U.S. Department of Energy since it opened its doors in 1977; the Massachusetts Institute of Technology’s Technical Review TR100 Award; and the Lockheed-Martin NOVA Award for technical achievement in 1999. He has been elected Fellow of nine professional societies: the National Academy of Inventors, the American Association for Advancement of Science, the Materials Research Society, the American Physical Society, the World Innovation Foundation, the American Society of Metals, the Institute of Physics, the American Ceramic Society and the World Technology Network. He concurrently holds the title of Empire Innovation Professor at UB in the departments of Chemical & Biological Engineering, Electrical Engineering, Physics & Materials Design and Innovation. He is also Emeritus Corporate Fellow and Distinguished Scientist at Oak Ridge National Laboratory. In addition, he is the Founder, President & CEO of TapeSolar Inc., a private-equity funded company and also the Founder, President & CEO of TexMat LLC, an IP holding and consulting company. Dr. Goyal received a B.Tech.(Honors) in Metallurgical Engineering from the Indian Institute of Technology, Kharagpur (India), a MS in Mechanical and Aerospace Engineering from the University of Rochester, NY and a PhD in Materials Science & Engineering from the University of Rochester, NY, executive business training from the Sloan School of Management, MIT and an executive MBA from Purdue University and an international executive MBA Tilburg University (The Netherlands).

2017FLEX Europe
University of Duisburg-Essen University of Duisburg-Essen Kühnel, Laura
Silicon Nanoparticle inks for electronic applications
Kühnel, Laura

Kühnel, Laura
PhD student
University of Duisburg-Essen

Kühnel, Laura

Abstract
Today´s printable electronics applications are limited by the electronic performance of available semiconductor functional inks, mainly based on organic or metal oxide semiconductors. While this aspect can be tolerated for DC applications or applications with low switching speeds; high frequency or ultra-high frequency applications, which will play an important role in the future of the internet of things, will require low cost manufacturing, such as printing, and an electronic semiconductor thin film performance going beyond the state of the art. Our approach to address this issue is the use of silicon (Si) made printable. To achieve this, we have developed inks based on Si nanoparticles electrostatically stabilized in organic solvents. The nanoparticle doping type can be freely chosen between n- and p-type, and the doping levels well controlled ranging from intrinsic Si to concentrations of above 1%. To obtain electronic functionality from thin films printed with our inks, a temperature step is required to reduce the number of thin film grain boundaries. For our purposes, the layers are laser treated using a KrF2 excimer laser emitting at 248 nm and with a pulse duration of ca. 7 ns. Here we discuss a self-organized cone shaped Si µ-structure formed by this process, with its growth being controlled by such parameters as laser energy density and nanoparticle thin film thickness. The Si µ-cones are highly crystalline as substantiated using TEM and µ-Raman analysis and allow us to introduce a novel type of Schottky diode, where the cone structure is embedded in a polymer matrix between an ohmic and a rectifying contact. The technology exhibits true mechanical flexibility and electronic properties, which will allow for ultra-high frequency operation. Therefore, it combines the advantages of classical Si with printability, without the disadvantages of material systems typically used for printable electronics, such as short lifetime and low electronic performance.

Biografie
Laura Kühnel has received her M.Sc. degree in Nanoengineering from the University of Duisburg-Essen (Germany) in January 2017, placing an emphasis on Nanoelectronics/Nanooptoelectronics. During her master studies she has spent three months at the Purdue University (USA) working on nanoelectronic modeling. Currently, Laura Kühnel is pursuing her PhD at the Institute of Technology for Nanostructures (NST) at the University of Duisburg-Essen, researching the topic “Silicon µ-cone diodes for RFID applications”.

2017FLEX Europe
W To top
Würth Elektronik GmbH & Co. KG Würth Elektronik GmbH & Co. KG Schreivogel, Alina
Novel Printed Circuit Boards - Innovative Solutions for flexible and stretchable Systems
Schreivogel, Alina

Schreivogel, Alina
R&D Manager
Würth Elektronik GmbH & Co. KG

Schreivogel, Alina

Abstract
In recent years great progress has been made regarding the development und realization of flexible and stretchable solutions. It is expected that flexible and stretchable technologies will especially find use in medical electronics, wearables, soft/smart robotics and bionics. Numerous functions and performances could be realized through integration of electronic components. High flexibility, stretchability, as well as freedom of forms make the novel technologies essential for the future electronics in smart applications. Würth Elektronik has researched novel technologies within several research projects. ECT (embedded component technology) with integrated silicon chips into thin foils and Stretchable Technology called TWINflex-Stretch are presented based on principles and examples. With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultrathin flexible silicon chips are getting more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly processes. Those activities mainly have been driven by the means of miniaturization and the increasing integration density of outer layer assembly of PCBs. Novel assembly concepts like ECT are used to assemble these thin ICs having a thickness of less than 20 µm onto flexible substrates and to manufacture System-in-Foils. Stretchable electronic Systems enable new degrees of mechanical freedom in electronics and provide a new level for developers and product designers. The stretchability of the novel printed circuit boards can be realized by use of Polyurethane as a base material in combination with meander shaped copper conducting paths between the components. The innovative Stretchable Technology is based on conventional circuit board processes and is completely compatible with machinery and materials in the production.

Biografie
Alina Schreivogel studied Chemistry at the University of Stuttgart and received the Diploma in 2004. In 2008 she was awarded Ph.D. from University of Stuttgart in the field of Organic Chemistry. After several years as Scientist and Academic Councillor she changed 2010 to Würth Elektronik GmbH & Co KG, Circuit Board Division. Since then she is a senior scientist and project manager in the Research and Development Department and responsible for different research focuses like Flex- and Stretch Foil Systems, Printingtechnologies, Embedding Technologies in Foils, Medical and Textile Electronics.

2017FLEX Europe
X To top
Xcerra Xcerra Bursian, Andreas
Test Floor Automation – is it finally due, after years of talking?
Bursian, Andreas

Bursian, Andreas
Director InStrip & InMEMS Products
Xcerra

Bursian, Andreas

Abstract
While semiconductor front end automation took place years ago, the back end test floor material handling is still barely automated. The semiconductor back end has had to deal with a variety of different package types and form factors, resulting in different transport media, such as bulk, tube, metal magazine, tray and reel. Even though SEMI has started to standardize this media, there are still many different form factors to consider. This has made it impossible to come up with a global material loading and unloading standard for all equipment. To offset this lack of automation, and still achieve their cost targets, semiconductor manufacturers moved backend test operations into countries with low labor costs. After decades of just talking about backend automation, there are now signs on the horizon that the industry is getting serious about automating the backend test floor. This presentation will analyze what mechanisms are driving this trend to automation and what conditions changed to generate the current momentum. It will further show how the suppliers and some test floor managers are preparing for this process enhancement.

Biografie
Dipl. Ing. Andreas Bursian is Director InStrip & InMEMS Products at Multitest the Handler Group of Xcerra. He got his degree at the University of Applied Sciences and Arts of Dortmund in Electrical Engineering. After University he spent 10 years in SPICE based simulation and characterization of semiconductor devices as well as in electromagnetic field simulation. In 1997 he joined Multitest working as a Software Engineer for Pick&Place handlers and as a specialist for software interfaces. Since 2013, he has been responsible for InStrip & InMEMS Products at Multitest.

Advanced Packaging Conference
Y To top
Yole Developpement Yole Developpement Buisson, Thibault
Advanced Packaging: A very dynamic ecosystem!
Buisson, Thibault

Buisson, Thibault
Business Unit Manager, Advanced Packaging & Manufacturing
Yole Developpement

Buisson, Thibault

Abstract
To be announced

Biografie
Thibault Buisson is a Business Unit Manager of the Advanced Packaging & Semiconductor Manufacturing activities at Yole Développement, the “More than Moore” market research and strategy consulting company. Thibault graduated from Grenoble Institute of Technology (INP) with a Master’s degree of Research in Micro and Nano electronics and from Polytech Grenoble with an engineering degree in Material Sciences. He then joined NXP Semiconductors as an R&D process engineer in the thermal treatment area to develop CMOS technology devices from the 65 to 45nm nodes. Afterwards, he joined IMEC Leuven and worked for over 5 years as a process integration engineer in the field of 3D technology. He has authored or co-authored fifteen international publications in the semiconductor field and has spoken at several conferences and symposiums, including keynotes, related to Advanced Packaging.

Advanced Packaging Conference
Yole Developpement Yole Developpement Rosina, Milan
How technology development will shape the power electronics market in the next 5 years
Rosina, Milan

Rosina, Milan
Senior Analyst, Energy Conversion and Emerging Materials
Yole Développement

Rosina, Milan

Abstract
The power electronics represents a healthy market driven mainly by the CO2 emission reduction targets. In 2016, the power device market was worth $16B and it will grow steadily for the next five years. Within this presentation, Yole Développement will highlight the latest material and technology trends and the impact they will have on the power electronics supply chain. The needs for lower CO2 emissions have led power electronic industry to develop more efficient and smaller solutions. Increased power density results in strong technology challenges calling for innovations on different levels: semiconductor material, packaging materials, device design… Several new power device designs have emerged in the last years, principally driven by the severely challenging requirements for high power density and integration from the electric and hybrid electric vehicles (EV/HEV). The high manufacturing volumes observed in automotive industry help and accelerate the implementation of these new technologies. All these technology trends are creating opportunities for some material suppliers, but at the same time, they are threatening some of today’s businesses for power electronics. In recent years, we have seen consolidation among power semiconductor market leaders with several acquisitions, such as Infineon buying International Rectifier and ON Semiconductor buying Fairchild. These moves were intended to strengthen positions in the overall power semiconductor business. Nevertheless, in coming years the market leaders will face strong competition from Tier-1 automotive manufacturers and new entrants from China. Outsourced Semiconductor Assembly and Test companies (OSATs) could also propose services to provide advanced packaging technologies to power device manufacturers. This will define a new business model that diverges from the traditional power device supplier business.

Biografie
Dr. Milan Rosina is a Senior Analyst for Energy Conversion and Emerging Materials at Yole Développement. Dr. Rosina has more than 15 years of scientific and industrial experience with prominent research institutions, an equipment maker, and a utility company. His expertise includes new equipment and process development, due diligence, technology, and market surveys in in the fields of power electronics, renewable energies, energy storage, batteries, and innovative materials and devices.

Power Electronics Conference
Yole Developpement Yole Developpement Mukish, Pars
MicroLED Displays: Global Trends & Opportunities for Equipment and Material Suppliers
Mukish, Pars

Mukish, Pars
Business Unit Manager
Yole Developpement

Mukish, Pars

Abstract
With the increasing success of OLED, and mounting interest in QLED, emissive technologies have already proven their worth and enabled a variety of consumer products with stunning display performance. But MicroLED could very be another disruptive display technology for a variety of applications. Since the acquisition of startup Luxvue by Apple in 2014 and that of InfiniLED by Facebook-Oculus last year, inorganic LEDs have generated a lot of attention. Compared to existing LCD and OLED displays, microLEDs offer the promise of high brightness, dramatically reduced power consumption and improved image quality. MicroLED displays could serve the needs of and benefit most applications, spanning from wearable and mobile devices to AR/VR, TVs and even large video displays as demonstrated recently by Sony. So what’s missing? The science is here, but the success of the technology will depend on overcoming a variety of engineering and manufacturing challenges. This presentation will provide an overview of microLED display technologies, key benefits and drawbacks, technology challenges, industry landscape and market opportunity. Objective will also to understand which opportunities such emerging technology could offer for equipment and material supplier.

Biografie
Pars MUKISH holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).

TechARENA: Market Briefing
Z To top
Zinergy UK Ltd. Zinergy UK Ltd. Hiralal, Pritesh
Flexible Energy Storage: Factors affecting the flexibility of a battery
Hiralal, Pritesh

Hiralal, Pritesh
CEO
Zinergy UK Ltd.

Hiralal, Pritesh

Abstract
Flexible electronics requires flexible energy to power it. A growing number of applications such as medical devices, logistics, wearables and smart cards require a suitable energy source. However, there is no standard forms or sizes for flexible batteries, as there are in the bulk counterparts, and requirements for both electrical and mechanical characteristics vary significantly from application to application. Printing batteries naturally allows for this flexibility and we will share some of the experience and possibilities from our developments so far. For instance, flexibility requirements of vary with applications and we show how mechanical flexibility can be tuned with parameters such as formulation and layer thickness. This has resulted in what we believe to be the thinnest printed battery. Examples of integration with other devices will also be shown.

Biografie
Dr. Pritesh Hiralal, CEO/CTO, studied Physics and completed his Ph.D. in Engineering at the University of Cambridge. He has spent time in business in Spain and set up Casa Hiralal S.L. and Zendal Backup. He has spent time in industry at the Nokia Research Centre working on high power energy storage, and has published 30+ papers and 8 patents in the field. He has consulted for materials as well as energy storage device companies. He spent time as a Research Associate as well as an adjunct lecturer at the University of Cambridge and is now a founder and CEO at Zinergy.

2017FLEX Europe